CN218977134U - Small-sized frequency converter - Google Patents

Abstract

The utility model relates to a small-size converter, including mainboard and casing, be equipped with in the casing and be used for holding the accommodation space of mainboard, the bottom of casing is equipped with the heat dissipation base, be equipped with the heating panel that a plurality of parts are exposed on the heat dissipation base, a plurality of the heating panel sets up along first direction interval, the heat dissipation base with be equipped with the heat conduction silica gel pad between the mainboard, first direction with the plane that the heating panel is located is perpendicular. The heat that the mainboard during operation produced is conducted to the outer space through the heating panel on the radiating base to reduce the temperature of mainboard, and can not produce the noise at the cooling in-process, be favorable to promoting the cooling and the noise reduction performance of small-size converter. In addition, because the heat conduction silica gel piece that is located between heat dissipation base and the mainboard has heat conductivity and insulativity, can be under the condition that avoids mainboard and heat dissipation base electrically conductive, with the heat quick conduction to the heat dissipation base that the mainboard during operation produced, be favorable to further promoting the cooling effect to the mainboard.

Description

Small-sized frequency converter

Technical Field

The application relates to the technical field of frequency converters, in particular to a small-sized frequency converter.

Background

The frequency converter is a core component of a time-varying speed regulating system and is used for controlling power control equipment of an alternating current motor by changing the working power supply frequency of the motor. With the increasing degree of industrial automation, frequency converters are becoming more and more widely used in the fields of industrial control and daily life. Because the core circuit module of the frequency converter has the characteristics of high integration level, high frequency, high voltage, high speed and the like, the loss of the power devices in the main loop can generate heat, so that the heat is seriously generated during the working of the main loop, and the working effect of the frequency converter is influenced. If the frequency converter works at high temperature for a long time, the service life of the frequency converter can be influenced, and even serious consequences such as burning, explosion and the like are caused.

Therefore, as the frequency converter is increasingly widely used, in order to improve the working performance and reliability thereof, methods of adopting external heat dissipation measures, such as air cooling heat dissipation, water cooling heat dissipation, oil cooling heat dissipation, and the like, in the frequency converter system are mostly adopted in the field. The method of air cooling and heat dissipation is easy to cause larger wind speed and larger noise, and influences the use experience; the water cooling method is adopted to lead the heat of the shell to be taken away in the water channel passing process, but the occurrence of water leakage and other conditions is completely eradicated in the use process, and the water cooling method has certain potential safety hazard; the frequency converter is soaked in mineral oil by adopting an oil cooling heat dissipation method, and although the heat dissipation effect is good, oil stains cover the frequency converter when operations such as taking out and detecting are needed due to the fact that the frequency converter is soaked in the oil, the operation is inconvenient, the workload of taking out the oil stains is increased, and the working efficiency is reduced.

Along with the development of technology and the limitation of the internal space of a cabinet, the existing industrial products are increasingly miniaturized, but the working performance of the frequency converter is required to be higher, so that the existing small frequency converter is urgently required to solve the problems of high working temperature, high noise and the like so as to meet the demands of users.

Disclosure of Invention

Based on this, the present utility model needs to provide a small-sized frequency converter to improve the cooling and noise reduction performance of the small-sized frequency converter.

The utility model provides a small-size converter, includes mainboard and casing, be equipped with in the casing and be used for holding the accommodation space of mainboard, the bottom of casing is equipped with the heat dissipation base, be equipped with the heating panel that a plurality of parts are exposed on the heat dissipation base, a plurality of the heating panel sets up along first direction interval, the heat dissipation base with be equipped with the heat conduction silica gel pad between the mainboard, first direction with the plane that the heating panel is located is perpendicular.

The small-sized frequency converter comprises a shell, a main board, a heat dissipation base, a heat dissipation plate, a noise reduction device and a temperature control device, wherein the main board is arranged in the accommodating space of the shell and connected with the heat dissipation base, heat generated during operation of the main board is conducted to an external space through the heat dissipation plate on the heat dissipation base, so that the temperature of the main board is reduced, the heat dissipation plate arranged along a first direction at intervals can increase the contact area between the heat dissipation plate and the environment, noise cannot be generated in the cooling process, and the cooling and noise reduction performances of the small-sized frequency converter are improved. In addition, because the heat conduction silica gel piece that is located between heat dissipation base and the mainboard has heat conductivity and insulativity, can be under the condition that avoids mainboard and heat dissipation base electrically conductive, with the heat quick conduction to the heat dissipation base that the mainboard during operation produced, be favorable to further promoting the cooling effect to the mainboard.

In one embodiment, the small-sized transformer further comprises a surface shell, wherein the surface shell is detachably connected with the shell and is arranged on one side, away from the heat dissipation base, of the main board.

In one embodiment, the small-sized frequency converter further comprises a light guide column, one end of the light guide column is connected to the patch on the main board, and the other end of the light guide column is connected to a side face of the face shell, which faces the main board.

In one embodiment, the light guide column and the face shell are elastically fixed by plastic.

In one embodiment, the face shell is provided with a plurality of connecting holes, and the light guide column is inserted into the connecting holes and is in interference fit with the connecting holes.

In one embodiment, at least two rows of guide ribs are provided on the face shell, and the guide ribs are matched with the main board to guide the face shell to be mounted.

In one embodiment, a side surface of the face shell facing the main board is provided with a plurality of abutting parts for abutting against the main board, and the abutting parts are arranged at intervals on a plane where the face shell is located.

In one embodiment, the face shell is provided with a plurality of heat dissipation holes, and the heat dissipation holes communicate the accommodating space with the outside.

In one embodiment, a plurality of the heat dissipation holes are arranged in a honeycomb shape.

In one embodiment, the small-sized frequency converter further comprises a surface cover, and the surface cover is arranged on one side surface of the shell, which is away from the heat dissipation base, through a cover.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is an exploded view of the overall structure of a small-sized frequency converter according to an embodiment of the present application;

fig. 2 is a schematic diagram of an overall structure of a small-sized frequency converter according to an embodiment of the present application;

fig. 3 is a schematic diagram of a part of a structure of a small-sized frequency converter according to an embodiment of the present application;

fig. 4 is a schematic diagram of the overall structure of the panel and the motherboard in the embodiment of the present application.

Description of the reference numerals

10. A small-sized frequency converter; 100. a main board; 200. a housing; 300. a heat dissipation base; 310. a heat dissipation plate; 400. a thermally conductive silicone pad; 500. a face shell; 520. guiding the bone; 530. an abutting portion; 540. a heat radiation hole; 600. a light guide column; 700. and (5) a face cover.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.

As shown in fig. 1-4, the present application provides a miniature frequency converter 10 comprising a motherboard 100 and a housing 200. The housing 200 is provided with a receiving space for receiving the motherboard 100. The bottom of the case 200 is provided with a heat dissipation base 300. The heat dissipation base 300 is provided with a plurality of partially exposed heat dissipation plates 310. The plurality of heat dissipation plates 310 are disposed at intervals in a first direction (any direction indicated by a T arrow in fig. 1). A heat conductive silica gel pad 400 is provided between the heat dissipation base 300 and the main board 100. The first direction is perpendicular to the plane of the heat dissipation plate 310.

Therefore, in the small-sized frequency converter 10 of the present application, the main board 100 is installed in the accommodating space of the housing 200 and is connected with the heat dissipation base 300, and the heat generated during the operation of the main board 100 is conducted to the external space through the heat dissipation plate 310 on the heat dissipation base 300, so that the temperature of the main board 100 is reduced, the heat dissipation plates 310 arranged along the first direction at intervals can increase the contact area between the heat dissipation plates 310 and the environment, no noise is generated during the cooling process, and the cooling and noise reduction performance of the small-sized frequency converter 10 is improved. In addition, since the heat conducting silica gel piece between the heat dissipation base 300 and the main board 100 has heat conductivity and insulativity, the heat generated during the operation of the main board 100 can be quickly conducted to the heat dissipation base 300 under the condition of avoiding the electric conduction between the main board 100 and the heat dissipation base 300, which is beneficial to further improving the cooling effect of the main board 100.

It should be noted that, the heat-conducting silica gel pad 400 is also called a heat-conducting silica gel pad, has good heat-conducting property, insulating property and pressure-resistant property, is a heat-conducting material with very good manufacturability and practicality, can not corrode metal components and parts even when used for a long time, and can effectively improve the heat-conducting effect and the protection effect on the main board 100.

The number of heat dissipation plates 310 and the distance between the heat dissipation plates 310 may be adjusted according to actual needs, and are not limited herein.

Further, since aluminum has high heat conduction efficiency, good heat dissipation effect, and light weight, the heat dissipation base 300 in the present application is an aluminum die-cast molding.

In one embodiment, as shown in fig. 1, the miniature frequency converter 10 further comprises a face housing 500. The panel shell 500 is detachably connected with the housing 200, and is disposed on a side of the motherboard 100 facing away from the heat dissipation base 300. The panel case 500, the heat dissipation base 300, and the case 200 firmly fix the motherboard 100.

In addition, as shown in fig. 1, the compact frequency converter 10 in the present application further includes a light guiding column 600. One end of the light guide column 600 is connected to the patch on the motherboard 100, and the other end is connected to a side of the face shell 500 facing the motherboard 100. The light guide column 600 can guide the light emitted from the patch on the main board 100 to the outer side of the main board 100 for viewing and recognition. The light guide column 600 and the panel 500 are elastically fixed by plastic. Therefore, compared with the prior art that the light guide column 600 and the face shell 500 are fixed by hot wax, the elastic fixation is realized by plastic, so that the process and the installation time can be saved, and the installation efficiency can be improved.

Further, as shown in fig. 1 and 4, a plurality of connection holes (not shown) are formed in the face housing 500. The light guide column 600 is inserted into the connection hole and is interference fit with the connection hole. Therefore, by using the interference fit between the light guide column 600 and the connection hole, the connection stability of the light guide column 600 can be further improved.

In one embodiment, at least two rows of guide ribs 520 are provided on the face shell 500. The guide bone 520 main plate 100 mates to guide the mounting of the face-piece 500. The guide rib 520 can be fitted to at least one side of the main board 100 during the mounting of the face housing 500 to facilitate the fixation of the face housing 500 to the housing 200.

The face case 500 is made of a mixture of PC material and ABS material. Wherein the PC material is polycarbonate, also called PC plastic, and is a high molecular polymer containing carbonate groups in the molecular chain, and has high strength, better flame retardance and oxidation resistance; the ABS material is an acronym of acrylonitrile-butadiene-styrene copolymer (Acrylonitrile Butadiene Styrene), is a thermoplastic high-molecular structural material with high strength, good toughness and easy processing and forming, is also called ABS resin, and has the characteristics of good electrical insulation and easy injection molding. Therefore, the surface shell 500 made of the mixture of PC and ABS materials has the characteristics of good dimensional stability and high flame retardant level, and can effectively protect the main board 100 from damage and promote the firm durability of the small-sized frequency converter 10.

In one embodiment, as shown in fig. 4, a side surface of the panel 500 facing the main board 100 is provided with a plurality of abutting portions 530 that abut against the main board 100. The plurality of contact portions 530 are provided at intervals on a plane on which the face case 500 is located. Because the face-piece 500 is made of plastic materials, and the plastic plane is easy to deform, the plurality of abutting portions 530 can be arranged to improve the stability of the face-piece 500, and can also improve the stability of the face-piece 500 abutting against the main board 100, so that the problem that the main board 100 is unstable to mount due to plastic deformation of the face-piece 500 and the main board 100 near the place is effectively avoided.

In one embodiment, as shown in fig. 1, a plurality of heat dissipation holes 540 are formed on the panel shell 500, and the heat dissipation holes 540 communicate the accommodating space with the outside, so as to further enhance the heat dissipation effect on the motherboard 100. The size, shape, and arrangement of the heat dissipation holes 540 may be adjusted according to practical situations, and are not limited herein. Specifically, in the present embodiment, the plurality of heat dissipation holes 540 are disposed in a honeycomb shape.

In one embodiment, as shown in fig. 1, the miniature frequency converter 10 further comprises a face cover 700. The surface cover 700 is used for covering a side surface of the shell 200, which is away from the heat dissipation base 300, and can shield the wiring terminals and wires in the accommodating space, so that the outside of the small-sized transformer 10 is more attractive, and the protection level can be improved.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

It should be readily understood that the terms "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense such that "on … …" means not only "directly on something", but also includes "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning "on something" or "above" but also the meaning "above something" or "above" without intermediate features or layers therebetween (i.e., directly on something).

Further, spatially relative terms, such as "below," "beneath," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. The utility model provides a small-size converter, its characterized in that includes mainboard and casing, be equipped with in the casing and be used for holding the accommodation space of mainboard, the bottom of casing is equipped with the heat dissipation base, be equipped with the heating panel that a plurality of parts are exposed on the heat dissipation base, a plurality of the heating panel sets up along first direction interval, the heat dissipation base with be equipped with the heat conduction silica gel pad between the mainboard, first direction with the plane that the heating panel is located is perpendicular.

2. The miniature frequency converter of claim 1, further comprising a face housing detachably connected to the housing and disposed on a side of the motherboard facing away from the heat dissipation base.

3. The miniature frequency converter of claim 2, further comprising a light guide post, wherein one end of the light guide post is connected to the patch on the motherboard, and the other end is connected to a side of the face housing facing the motherboard.

4. A miniature frequency converter according to claim 3, wherein the light guide post and the face housing are resiliently secured by plastic.

5. The small-sized converter according to claim 4, wherein the face housing is provided with a plurality of connecting holes, and the light guide column is inserted into the connecting holes and is in interference fit with the connecting holes.

6. The miniature transformer of claim 2, wherein said face housing is provided with at least two rows of guide ribs, said guide ribs cooperating with said main plate to guide said face housing for installation.

7. The small-sized converter according to claim 2, wherein a side surface of the face housing facing the main board is provided with a plurality of abutting portions for abutting against the main board, and the plurality of abutting portions are arranged at intervals on a plane on which the face housing is located.

8. The small-sized transformer according to claim 2, wherein the face housing is provided with a plurality of heat dissipation holes, and the heat dissipation holes communicate the accommodating space with the outside.

9. The miniature transformer of claim 8, wherein a plurality of said heat dissipating apertures are disposed in a honeycomb configuration.

10. The miniature frequency converter of claim 2, further comprising a cover disposed on a side of the housing facing away from the heat sink base.

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