CN219420891U - Shooting device and shooting equipment thereof - Google Patents

Abstract

The present utility model relates to a photographing apparatus and a photographing device thereof. The shooting device is used for shooting equipment, the shooting equipment comprises a shell, and the shooting device comprises a heat dissipation base, a camera module and a heat dissipation ring. The heat dissipation base is provided with a containing groove. Part of the camera module is accommodated in the accommodating groove, and the circuit board of the camera module is in heat conduction connection with the bottom of the accommodating groove. The radiating ring is sleeved with the lens of the camera module, one end of the radiating ring is in heat conduction connection with the radiating base, and the other end of the radiating ring surrounds the periphery of the mirror surface of the lens and is exposed out of the shell. This shooting device is through setting up heat dissipation base and the heat dissipation ring that heat conduction is connected, and the circuit board of camera module is connected to heat dissipation base heat conduction, and the heat dissipation ring exposes the casing setting, and the heat that the circuit board produced is conducted to the heat dissipation ring through the heat dissipation base to through the outside of heat dissipation ring direct radiation to the casing, improved heat conduction efficiency, can satisfy the heat dissipation demand of great camera module under compact appearance and the low weight condition.

Description

Shooting device and shooting equipment thereof

Technical Field

The present utility model relates to the field of imaging technologies, and in particular, to a photographing apparatus and a photographing device thereof.

Background

The camera module of shooting equipment generates a large amount of heat under severe working conditions, and if heat dissipation is not timely carried out, the imaging image quality of an image sensor of the camera module is reduced after a certain temperature is reached. In order to ensure imaging image quality, a heat dissipation design needs to be considered for the camera module.

Generally, a heat sink or a heat conductive copper foil is disposed above a circuit board of the camera module, so as to conduct heat to a side wall of the housing or a low temperature area inside the device. Because the shell of plastic material heat conduction efficiency is low, and the wall thickness of shell still needs to satisfy intensity requirement, consequently, the heat that the camera module derived still mostly concentrates in the appearance intracavity of equipment inside, and heat conduction efficiency is not high.

Disclosure of Invention

Based on the above, a photographing device and photographing equipment thereof are provided, which aim to improve the heat conduction efficiency of conducting heat generated by a camera module to the outside of the equipment.

A photographing apparatus for a photographing device, the photographing device including a housing, the photographing apparatus comprising:

the heat dissipation base is provided with a containing groove;

the camera module is partially accommodated in the accommodating groove, and a circuit board of the camera module is in heat conduction connection with the bottom of the accommodating groove; and

the radiating ring is sleeved with the lens of the camera module, one end of the radiating ring is in heat conduction connection with the radiating base, and the other end of the radiating ring surrounds the periphery of the mirror surface of the lens and is exposed out of the shell.

In one embodiment, the circuit board is provided with a chip, and the chip is in heat conduction connection with the bottom of the accommodating groove through a first heat conduction layer.

In one embodiment, the heat dissipation base includes:

the heat dissipation substrate is in heat conduction connection with the circuit board; and

and one end of the heat dissipation bracket is in heat conduction connection with the heat dissipation substrate to form the accommodating groove, and the other end of the heat dissipation bracket is in heat conduction connection with the heat dissipation ring.

In one embodiment, the heat dissipation substrate includes a bottom, a side, and a first connection portion, where the bottom is connected to the side and the first connection portion, respectively, and forms a bottom of the accommodating groove; the heat dissipation support comprises a support body and a second connecting portion, wherein the support body is connected with the second connecting portion, the second connecting portion is connected with the first connecting portion, and the support body and the side portion form the side wall of the accommodating groove.

In one embodiment, one end of the bracket main body is in heat conduction connection with the bottom through a second heat conduction layer; or the other end of the bracket main body is in heat conduction connection with the heat dissipation ring through a third heat conduction layer.

In one embodiment, the photographing device further includes: the heat dissipation ring is sleeved with the heat dissipation ring, and one end of the heat dissipation ring corresponds to the other end of the heat dissipation ring and is exposed out of the shell.

A photographing apparatus, comprising:

a housing;

the heat dissipation base is arranged in the shell and is provided with a containing groove;

the camera module is partially accommodated in the accommodating groove, and a circuit board of the camera module is in heat conduction connection with the bottom of the accommodating groove; and

the heat dissipation ring is sleeved with the lens of the camera module, one end of the heat dissipation ring is in heat conduction connection with the heat dissipation base, and the other end of the heat dissipation ring is exposed out of the shell.

In one embodiment, the photographing apparatus further includes: the heat dissipation ring is sleeved with the heat dissipation ring and is exposed out of the shell.

In one embodiment, the housing comprises a bottom shell and a middle shell, the middle shell is covered on the bottom shell, and the heat dissipation ring and the middle shell are integrally formed.

In one embodiment, the photographing apparatus further includes: and the main board is arranged in the shell and is connected with the heat dissipation base.

Above-mentioned shooting device and shooting equipment thereof, through setting up heat dissipation base and the heat dissipation ring that heat conduction is connected, the heat dissipation base heat conduction is connected the circuit board of camera module, the heat dissipation ring exposes the casing setting, the heat that the circuit board of camera module produced is conducted to the heat dissipation ring through the heat dissipation base, and directly radiate to the outside of casing through the heat dissipation ring, compare in the heat conduction of plastic casing heat dissipation mode, the heat that the circuit board of camera module produced can directly radiate to external environment through the conduction, need not with the help of the casing, heat conduction efficiency has been improved, the heat dissipation design has been optimized, can satisfy the heat dissipation demand of great camera module under compact appearance and the low weight condition, slow down or avoided the heat to gather at the inside phenomenon that leads to the temperature to rise of equipment.

Drawings

Fig. 1 is a schematic structural diagram of a photographing apparatus according to an embodiment of the present utility model;

fig. 2 is an exploded view of the photographing apparatus of fig. 1;

FIG. 3 is a schematic view of a camera and other structures of the photographing apparatus of FIG. 1;

FIG. 4 is a schematic view of a camera and other structures of the photographing apparatus of FIG. 1 from another view;

FIG. 5 is an exploded view of the camera and other structures of FIG. 3 from a perspective;

FIG. 6 is an exploded view of the camera and other structures of FIG. 3 from another perspective;

FIG. 7 is a schematic diagram of a heat dissipation substrate of the camera of FIG. 3;

FIG. 8 is a top view of the camera and other structures of FIG. 3;

fig. 9 is a cross-sectional view of the camera and other structures of fig. 8 taken along line I-I.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1 to 4, fig. 1 shows a schematic structural diagram of a photographing apparatus according to an embodiment of the present utility model, fig. 2 shows an exploded view of the photographing apparatus according to fig. 1, fig. 3 shows a schematic structural diagram of a view angle of a photographing device, a motherboard and a heat sink of the photographing apparatus according to fig. 1, and fig. 4 shows a schematic structural diagram of a view angle of the photographing device, the motherboard and the heat sink of the photographing apparatus according to fig. 1, the photographing apparatus 100 according to an embodiment of the present utility model includes a housing 110 and a photographing device 200, and the photographing device 200 is disposed on the housing 110. The photographing device 200 includes a camera module 300, and a lens 302 of the camera module 300 is exposed out of the housing 110 for photographing and image capturing. In this embodiment, the photographing apparatus 100 may be, but is not limited to, a moving camera. In other embodiments, the photographing device 100 may also be a mobile phone, a tablet computer, a camera, or other electronic devices with photographing functions.

The housing 110 includes a bottom shell 112, a middle shell 114, and a cover 116, wherein the middle shell 114 is covered on the bottom shell 112 to form an inner cavity of the housing 110. The cover 116 covers the surface of the middle case 114 to protect the middle case 114 and to decorate the surface of the case 110. The photographing device 200 is disposed in the inner cavity of the housing 110, however, the lens 302 of the camera module 300 is exposed out of the middle shell 114 and the cover 116, i.e. through holes corresponding to the lens 302 are formed in the middle shell 114 and the cover 116 to avoid the lens 302.

The photographing apparatus 100 further includes a main board 120, where the main board 120 is disposed on the bottom shell 112 and located in the inner cavity of the housing 110. The photographing device 200 is located above the motherboard 120, and the camera module 300 is electrically connected to the motherboard 120 through a flexible printed circuit 130 (FPC). In order to improve the heat dissipation effect of the motherboard 120, the photographing apparatus 100 further includes a heat sink 140, and the heat sink 140 is disposed between the motherboard 120 and the photographing device 200. The side of the main board 120 facing the heat sink 140 is provided with more electronic components, and the heat sink 140 receives heat generated by the main board 120 and the electronic components thereon through radiation, so that the heat dissipation effect of the main board 120 is improved. In the present embodiment, the heat sink 140 may be, but not limited to, metal, which is disposed at a distance from the motherboard 120 to avoid affecting the electrical performance of the motherboard 120.

The photographing device 200 further includes a heat dissipation base 400 and a heat dissipation ring 500. The heat dissipation base 400 is disposed in the housing 110 through the motherboard 120, that is, the heat dissipation base 400 connects the heat sink 140 and the motherboard 120 and is located above the heat sink 140. The heat dissipation base 400 is provided with a containing groove 402, a part of the camera module 300 is contained in the containing groove 402, and the circuit board 310 of the camera module 300 is in heat conduction connection with the bottom of the containing groove 402. The heat dissipation ring 500 is sleeved with the lens 302 of the camera module 300, one end of the heat dissipation ring 500 is in heat conduction connection with the heat dissipation base 400, and the other end of the heat dissipation ring 500 is exposed out of the shell 110.

Through setting up heat dissipation base 400 and the heat dissipation ring 500 that heat conduction connects, wherein, the circuit board 310 of camera module 300 is connected in the heat dissipation base 400 heat conduction, the heat dissipation ring 500 exposes casing 110 setting, the heat that the circuit board 310 of camera module 300 produced is conducted to the heat dissipation ring 500 through the heat dissipation base 400, and directly radiate the outside to casing 110 through the heat dissipation ring 500, compare in the heat conduction heat dissipation mode of plastic casing 110, the heat that the circuit board 310 of camera module 300 produced can directly radiate to external environment through the conduction, need not with the help of casing 110, heat conduction efficiency has been improved, the heat dissipation design has been optimized, can satisfy the heat dissipation demand of great camera module under compact appearance and the low weight condition, slow down or avoided the heat accumulation to lead to the phenomenon of temperature rising in the equipment inside. In addition, the heat dissipation base 400 is further connected with the main board 120 and the heat dissipation fins 140, and heat on the main board 120 and the heat dissipation fins 140 can be directly conducted to the outside of the equipment in the same way. It should be noted that, the "heat-conducting connection" may be realized by direct connection or indirect connection through a good heat-conducting medium.

In order to realize the exposed arrangement of the heat dissipation ring 500, the end of the heat dissipation ring 500 away from the heat dissipation base 400 surrounds the periphery of the mirror 304 of the lens 302, and since the mirror 304 of the lens 302 must be exposed to the housing 110, the end face of the end of the heat dissipation ring 500 is located at the front side of the periphery of the mirror 304, so that the end face of the heat dissipation ring 500 is always exposed to the external environment. In this embodiment, the lens 302 and the heat dissipation ring 500 are both protruding from the cover 116, as shown in fig. 1, so that the area for heat exchange with the external environment is increased, which is beneficial to improving the heat dissipation effect. It will be appreciated that in other embodiments, the lens 302 and heat dissipation ring 500 may be flush or slightly recessed within the outer surface of the face cover 116, which is also in direct contact with the external environment.

In order to further enhance the heat dissipation effect, the photographing device 200 further includes a heat dissipation ring 600, the heat dissipation ring 600 is sleeved with the heat dissipation ring 500 and is exposed out of the housing 110, the heat dissipation area contacting with the external environment is further increased by the heat dissipation ring 600, and the heat conducted to the heat dissipation ring 500 can be directly radiated to the outside of the housing 110, and meanwhile, the heat can also be conducted to the heat dissipation ring 600, and is directly radiated to the external environment through the heat dissipation ring 600.

In order to realize the exposed arrangement of the heat dissipation ring 600, one end of the heat dissipation ring 600 is arranged corresponding to one end of the heat dissipation ring 500 away from the heat dissipation base 400, so that one end of the heat dissipation ring 600 is always exposed to the external environment. In this embodiment, the end face of the outer end of the heat dissipation ring 600 is flush with the end face of the outer end of the heat dissipation ring 500. It will be appreciated that in other embodiments, the end face of the outer end of heat dissipation ring 600 may be lower than the end face of the outer end of heat dissipation ring 500 and disposed higher than the outer surface of face cap 116; the end face of the outer end of the heat dissipation ring 600 may also be slightly higher than the end face of the outer end of the heat dissipation ring 500.

In this embodiment, the heat dissipation ring 600 and the middle shell 114 are integrally formed, as shown in fig. 2, when assembling, the middle shell 114 is covered on the bottom shell 112, and the heat dissipation ring 600 can be sleeved on the heat dissipation ring 500, and the heat dissipation ring 600 is fixed, so that assembling is simplified, and assembling efficiency is improved. In addition, in order to achieve the heat conduction connection between the heat dissipation ring 600 and the heat dissipation ring 500, the inner end of the heat dissipation ring 500 is provided with a convex ring 510, and the inner end of the heat dissipation ring 600 is connected to the convex ring 510.

Specifically, the heat dissipation ring 600 and the middle case 114 may be integrally formed by insert molding, i.e., the heat dissipation ring 600 is previously inserted into a mold for molding the middle case 114 and then injection molded. It will be appreciated that in other embodiments, the heat dissipation ring 600 is separately arranged from the middle shell 114, and when assembled, the heat dissipation ring 600 may be first sleeved on the heat dissipation ring 500, and then the middle shell 114 is installed; the heat dissipation ring 600 may be screwed with the heat dissipation ring 500 to realize heat conduction connection.

Referring to fig. 5 and 6, fig. 5 is an exploded view of a photographing device, a motherboard and a heat sink of the photographing apparatus according to the present embodiment, fig. 6 is an exploded view of the photographing device, the motherboard and the heat sink of the photographing apparatus according to the present embodiment, and the camera module 300 includes a circuit board 310, a lens base 320 and a lens assembly 330 sequentially arranged from bottom to top. The lens assembly 330 includes a lens holder 332 and a lens 302, the lens 302 being disposed in one end of the lens holder 332. The lens holder 320 is provided with an interface 322, and the interface 322 is internally provided with internal threads, and is sleeved with external threads at the other end of the lens bracket 332.

In this embodiment, the heat dissipation ring 500 is provided with an internal thread, and an external thread is provided at an end of the lens holder 332 provided with the lens 302, and the heat dissipation ring 500 is screwed with the lens holder 332 and is sleeved with the lens 302. It will be appreciated that in other embodiments, the heat dissipation ring 500 may be coupled to the lens mount 332 by a tight fit.

In this embodiment, the heat dissipation ring 500 and the heat dissipation ring 600 may be made of metal, but not limited to metal. Moreover, an annular boss 610 is disposed between two ends of the heat dissipation ring 600, and the annular boss 610 can improve the stability of the heat dissipation ring and the middle shell 114.

The heat sink base 400 includes a heat sink base 410 and a heat sink bracket 420. The heat dissipating substrate 410 is thermally coupled to the circuit board 310. One end of the heat dissipation bracket 420 is thermally connected to the heat dissipation substrate 410 to form a receiving slot 402, and the circuit board 310 and the lens holder 320 are both accommodated in the receiving slot 402. The other end of the heat sink bracket 420 is thermally coupled to the heat sink ring 500. The heat dissipation base 400 with the accommodating groove 402 is assembled by the heat dissipation base 410 and the heat dissipation bracket 420, so that the processing difficulty of the heat dissipation base 400 can be reduced, and the cost can be reduced. It is understood that in other embodiments, the heat dissipation base 400 may be a unitary structure, i.e. the receiving groove 402 is directly formed therein, rather than being formed by a split structure combination.

Referring to fig. 7, fig. 7 shows a schematic structural diagram of a heat dissipation substrate of a photographing device of the photographing apparatus in this embodiment, the heat dissipation substrate 410 includes a bottom portion 412, a side portion 414 and a first connecting portion 416, and the bottom portion 412 is respectively connected to the side portion 414 and the first connecting portion 416 and forms a bottom of the accommodating groove 402. The heat dissipation bracket 420 includes a bracket body 421 and a second connection portion 422, the bracket body 421 is connected to the second connection portion 422, the second connection portion 422 is connected to the first connection portion 416, and the bracket body 421 and the side portion 414 form a sidewall of the accommodating groove 402. When assembled, the heat dissipation base 410 can be mounted by manipulating the side 414 of the heat dissipation base 410, improving the convenience of assembly. It should be noted that, in other embodiments, the heat dissipation substrate 410 may only form the bottom of the receiving slot 402, and the heat dissipation bracket 420 may form all the sidewalls of the receiving slot 402.

In this embodiment, the number of the first connecting portions 416 may be, but is not limited to, two, and disposed on two opposite sides of the bottom 412. Each first connecting portion 416 is a lug structure, and two first connecting holes are formed on the lug structure. In contrast, the number of the second connection parts 422 may be, but not limited to, two, provided at opposite sides of the bracket body 421. Each of the second connection portions 422 is of a convex structure, and includes a positioning post 423 and a screw post 424 connected side by side. The main board 120 is provided with a second connecting hole corresponding to the first connecting hole. The positioning post 423 of the second connecting portion 422 sequentially passes through the first connecting hole and the second connecting hole from top to bottom, and is pre-positioned and connected to the motherboard 120; then, the screws are sequentially connected with the other second connecting hole, the other first connecting hole and the screw hole of the screw column 424 of the second connecting portion 422 from bottom to top, so as to fixedly connect the first connecting portion 416 and the second connecting portion 422, i.e. fix the heat dissipation bracket 420 and the heat dissipation substrate 410 on the motherboard 120.

Since the heat sink 140 is located between the bottom 412 of the heat dissipating substrate 410 and the motherboard 120, it is also fixedly connected by the first connection portion 416 and the second connection portion 422. The first connection portion 416 penetrates through the heat sink 140, and a portion of the structure thereof is located below the heat sink 140. The heat sink 140 is provided with a corresponding third connecting hole, and a spacer (not numbered) is disposed between the motherboard 120 and the first connecting portion 416, so as to increase the height of the heat sink 140 and prevent the heat sink 140 from directly contacting the electronic components on the motherboard 120. At this time, the positioning post 423 of the second connecting portion 422 sequentially passes through the third connecting hole, the first connecting hole, the spacer and the second connecting hole from top to bottom, and the screw sequentially passes through the other second connecting hole, the spacer, the other first connecting hole, the third connecting hole and the screw hole of the screw post 424 of the second connecting portion 422 from bottom to top.

In this embodiment, the heat dissipation substrate 410 is a sheet-like structure, which may be made of, but not limited to, metal, and in order to avoid short-circuiting the circuit board 310 of the camera module 300, a sponge pad 340 is disposed between the circuit board 310 and the bottom 412 of the heat dissipation substrate 410.

In this embodiment, the bracket body 421 includes three block structures 425 connected in sequence to form three sidewalls of the accommodating groove 402, and adjacent block structures 425 are connected through a connecting block 426 to form a gap between the upper and lower parts of the connecting block 426, so as to reduce materials and cost. The material of the heat dissipation frame can be, but is not limited to, metal.

In the heat dissipation design of this embodiment, the heat dissipation substrate 410, the heat dissipation frame, the heat dissipation ring 500 and the heat dissipation ring 600 are all made of metal, and compared with the heat conduction and dissipation mode of an all-metal shell, only a part of the exposed metal structure is arranged for heat dissipation, so that the heat dissipation design of this embodiment is low in cost, small in weight, applicable to equipment with small volume and compact appearance, and the application range of the equipment is improved.

Referring to fig. 8 and 9, fig. 8 shows a top view of a photographing device, a main board and a heat sink of the photographing apparatus in this embodiment, fig. 9 shows a cross-sectional view of the photographing device, the main board and the heat sink along the line I-I in fig. 8, a circuit board 310 is provided with a chip 312, the chip 312 is thermally connected to a bottom of a receiving slot 402 through a first thermal conductive layer 700, that is, a first thermal conductive layer 700 is disposed between the chip 312 and a bottom 412 of a heat dissipating substrate 410. Since the chip 312 is the most dominant heating element on the circuit board 310, the heat generation problem on the circuit board 310 can be solved by performing heat dissipation treatment on the chip 312.

In this embodiment, the material of the first heat conducting layer 700 may be, but is not limited to, heat conducting silica gel, which is beneficial to improving the heat conducting effect. In other embodiments, the first heat conductive layer 700 may be made of other materials that meet the electrical and thermal performance requirements, such as a plastic with high thermal conductivity.

In this embodiment, the first heat conducting layer 700 is disposed on the bottom of the groove by coating, and in order to better coat the heat conducting silica gel, the groove 418 is disposed at the bottom of the groove corresponding to the chip 312. It should be noted that, in other embodiments, the thermally conductive silicone may be coated on the surface of the chip 312; alternatively, a pad of silicone is adhered to the surface of the chip 312 or to the bottom 412 of the recess 418.

In this embodiment, one end of the support body 421 of the heat dissipation support 420 is thermally connected to the bottom 412 of the heat dissipation substrate 410 through the second thermal conductive layer 702. The material of the second heat conductive layer 702 may be, but not limited to, a heat conductive silica gel, which may be coated on an end surface of the end of the bracket body 421 or a surface of the bottom 412 of the heat dissipation substrate 410. It will be appreciated that in other embodiments, one end of the bracket body 421 may directly contact the bottom 412 of the heat dissipating substrate 410 to achieve a thermally conductive connection.

In this embodiment, the other end of the bracket body 421 of the heat dissipation bracket 420 is in heat conduction connection with the heat dissipation ring 500 through the third heat conduction layer 704, that is, the third heat conduction layer 704 is disposed between the convex ring 510 of the heat dissipation ring 500 and the end face of the end of the bracket body 421. The material of the third heat conducting layer 704 may be, but not limited to, a heat conducting silica gel, and the heat conducting silica gel may be coated on the end surface of the end of the bracket body 421 or the surface of the convex ring 510 of the heat dissipation ring 500. It will be appreciated that in other embodiments, one end of the bracket body 421 may directly contact the convex ring 510 of the heat dissipation ring 500 to achieve a thermally conductive connection.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A photographing apparatus for photographing equipment, the photographing equipment comprising a housing, the photographing apparatus comprising:

the heat dissipation base is provided with a containing groove;

the camera module is partially accommodated in the accommodating groove, and a circuit board of the camera module is in heat conduction connection with the bottom of the accommodating groove; and

the radiating ring is sleeved with the lens of the camera module, one end of the radiating ring is in heat conduction connection with the radiating base, and the other end of the radiating ring surrounds the periphery of the mirror surface of the lens and is exposed out of the shell.

2. The photographing device according to claim 1, wherein the circuit board is provided with a chip, and the chip is thermally connected with a bottom of the accommodating groove through a first thermal conductive layer.

3. The photographing device of claim 1, wherein the heat dissipation base comprises:

the heat dissipation substrate is in heat conduction connection with the circuit board; and

and one end of the heat dissipation bracket is in heat conduction connection with the heat dissipation substrate to form the accommodating groove, and the other end of the heat dissipation bracket is in heat conduction connection with the heat dissipation ring.

4. The photographing device as claimed in claim 3, wherein,

the heat dissipation substrate comprises a bottom, a side part and a first connecting part, wherein the bottom is respectively connected with the side part and the first connecting part and forms the bottom of the accommodating groove;

the heat dissipation support comprises a support body and a second connecting portion, wherein the support body is connected with the second connecting portion, the second connecting portion is connected with the first connecting portion, and the support body and the side portion form the side wall of the accommodating groove.

5. The photographing device as claimed in claim 4, wherein,

one end of the bracket main body is in heat conduction connection with the bottom through a second heat conduction layer; or alternatively, the process may be performed,

the other end of the support main body is in heat conduction connection with the heat dissipation ring through a third heat conduction layer.

6. The photographing device of any of claims 1 to 5, further comprising:

the heat dissipation ring is sleeved with the heat dissipation ring, and one end of the heat dissipation ring corresponds to the other end of the heat dissipation ring and is exposed out of the shell.

7. A photographing apparatus, characterized by comprising:

a housing;

the heat dissipation base is arranged in the shell and is provided with a containing groove;

the camera module is partially accommodated in the accommodating groove, and a circuit board of the camera module is in heat conduction connection with the bottom of the accommodating groove; and

the heat dissipation ring is sleeved with the lens of the camera module, one end of the heat dissipation ring is in heat conduction connection with the heat dissipation base, and the other end of the heat dissipation ring is exposed out of the shell.

8. The photographing device as claimed in claim 7, further comprising:

the heat dissipation ring is sleeved with the heat dissipation ring and is exposed out of the shell.

9. The photographing apparatus of claim 8, wherein the housing comprises a bottom case and a middle case, the middle case cover is provided on the bottom case, and the heat dissipation ring is integrally formed with the middle case.

10. The photographing apparatus as claimed in any one of claims 7 to 9, further comprising:

and the main board is arranged in the shell and is connected with the heat dissipation base.