CN220067542U - Image acquisition device and electronic equipment - Google Patents

Abstract

The utility model discloses an image acquisition device and electronic equipment. The image acquisition device comprises a shell component, a heat dissipation bracket, a camera shooting component and a control circuit board. The shell component is provided with a containing cavity and a light-transmitting area communicated with the containing cavity. The heat dissipation support is in heat dissipation fit with the shell assembly. The image pickup part comprises at least two image pickup modules, wherein an optical path is formed between the image pickup modules and the light transmission area. The control circuit board is electrically connected with the camera shooting component, and is provided with a heat generating source which is matched with the heat dissipation bracket in a heat dissipation way. The heat dissipation support is clamped between the camera shooting component and the control circuit board, and the control circuit board is matched with the shell component in a heat dissipation mode. The image acquisition device has good heat radiation performance, so that the electronic equipment has reliable image acquisition performance.

Description

Image acquisition device and electronic equipment

Technical Field

The disclosure relates to the field of electronic technology, and in particular, to an image acquisition device and an electronic device.

Background

Along with the development of scientific technology, the intelligent degree of the intelligent robot such as the cooperative robot and the household robot is higher and higher. In order to be able to better identify obstacles, intelligent robots typically use visual detection techniques to identify obstacles. For better acquisition of image information, intelligent robots are often provided with image acquisition means.

In the related art, in order to improve image capturing capability, such image capturing apparatuses are generally provided with two different types of image capturing modules (for example, binocular image capturing modules) and are compactly stacked in a housing assembly. But this may lead to uneven heat dissipation of the image acquisition device, which is likely to affect performance due to excessive local temperatures.

Disclosure of Invention

The present disclosure provides an image acquisition apparatus and an electronic device. The image acquisition device has good heat radiation performance, so that the electronic equipment has reliable image acquisition performance.

The technical scheme is as follows:

according to a first aspect of embodiments of the present disclosure, there is provided an image acquisition device including a housing assembly, a heat dissipation bracket, an image pickup section, and a control wiring board. The shell component is provided with a containing cavity and a light-transmitting area communicated with the containing cavity. The heat dissipation support is in heat dissipation fit with the shell assembly. The image pickup part comprises at least two image pickup modules, wherein an optical path is formed between the image pickup modules and the light transmission area. The control circuit board is electrically connected with the camera shooting component, and is provided with a heat generating source which is matched with the heat dissipation bracket in a heat dissipation way. The heat dissipation support is clamped between the camera shooting component and the control circuit board, and the control circuit board is matched with the shell component in a heat dissipation mode.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

when the image acquisition device is used, the heat dissipation bracket, the camera shooting component and the control circuit board are respectively arranged in the shell component, so that the heat dissipation bracket is clamped between the camera shooting component and the control circuit board. And the heat source is in heat dissipation fit with the heat dissipation bracket, and the control circuit board is in heat dissipation fit with the shell assembly. And then evenly dissipate heat to the control circuit board through the heat dissipation area of the heat dissipation support and the heat dissipation area of the shell component, so that the image acquisition performance of the image acquisition device is prevented from being influenced due to uneven heat dissipation of the image acquisition device. Thus, the image acquisition device has good heat dissipation performance, so that the image acquisition device has reliable image acquisition performance.

The technical scheme of the present disclosure is further described below:

in one embodiment, the image capturing device further includes a heat sink sandwiched between the control circuit board and an inner side wall of the housing assembly, and the control circuit board is in heat dissipating engagement with the housing assembly via the heat sink.

In one embodiment, the heat dissipation bracket comprises a first plate surface and a second plate surface, the first plate surface comprises at least two heat dissipation fins arranged in the accommodating cavity at intervals, the at least two heat dissipation pieces are arranged towards the image pickup component, and the second plate surface is in heat dissipation fit with the heating source.

In one embodiment, the image acquisition device further comprises a first heat conducting layer sandwiched between the heat generating source and the second plate surface, and the heat generating source is in heat dissipation fit with the heat dissipation bracket through the first heat conducting layer.

In one embodiment, the image acquisition device further comprises a second heat conduction layer clamped between the heat dissipation support and the inner side wall of the shell assembly, and the heat dissipation support is in heat dissipation fit with the shell assembly through the second heat conduction layer; and/or the heat dissipation support is provided with a first supporting boss, and the heat dissipation support is arranged in the accommodating cavity through the first supporting boss.

In one embodiment, the heat dissipation bracket is fixedly connected with the shell assembly, one of the heat dissipation bracket and the shell assembly is provided with a first positioning part, and the other one of the heat dissipation bracket and the shell assembly is provided with a first matching part matched with the first positioning part in a positioning way.

In one embodiment, the camera component is in heat sink engagement with the housing assembly.

In one embodiment, the camera component further comprises a mounting bracket, the mounting bracket is provided with mounting through holes corresponding to the at least two camera modules one to one, the at least two camera modules are inserted into the mounting bracket through the mounting through holes, and the mounting bracket is in heat dissipation fit with the shell component and/or the heat dissipation bracket.

In one embodiment, the image pickup device further comprises a third heat conducting layer sandwiched between the mounting bracket and the housing assembly, and the mounting bracket is in heat dissipation fit with the housing assembly through the third heat conducting layer.

In one embodiment, the camera module comprises a depth camera and a heat conducting fin, and the depth camera is in heat dissipation fit with the mounting bracket through the heat conducting fin; and/or the mounting bracket is fixedly connected with the heat dissipation bracket.

In one embodiment, the heat conducting fin comprises a first heat conducting body in heat dissipation fit with the depth camera and a second heat conducting body in heat dissipation fit with the mounting bracket, and the first heat conducting body and the second heat conducting body are connected in a bending mode to form an avoidance space for avoiding the depth camera.

In one embodiment, the camera component further includes a first circuit board and a flexible circuit board connecting the first circuit board and the control circuit board, and the at least two camera modules are integrated on the first circuit board.

In one embodiment, the heat dissipation bracket further includes a second supporting boss for supporting the first circuit board.

In one embodiment, the image acquisition device further comprises an electric connector arranged on the control circuit board, wherein a part of the electric connector is exposed out of the shell assembly; the electrical connector includes at least one of a power connector, a communication connector, and a time synchronization connector.

In one embodiment, the housing assembly further includes at least two heat dissipation through holes communicating with the accommodating cavity, and at least two heat dissipation through holes are disposed at intervals on two sides of the heat dissipation bracket.

In one embodiment, the heat dissipation bracket further comprises at least two heat dissipation fins, and the two adjacent heat dissipation fins are arranged at intervals to form a heat dissipation gap, and the heat dissipation gap is communicated with the heat dissipation through hole to form a convection channel.

According to a second aspect of the embodiments of the present disclosure, there is also provided an electronic device, including the image capturing apparatus in any of the embodiments described above.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the electronic device is provided with the image acquisition device in any embodiment, and has reliable image acquisition performance.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings illustrate schematically the embodiments of the present utility model and their description to explain the technical solution of the present utility model and do not constitute an undue limitation on the scope of the present utility model.

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic diagram of an image capturing apparatus according to an embodiment.

Fig. 2 is a schematic exploded view of the image acquisition apparatus shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of the image acquisition device shown in fig. 1, taken half-way along a first cross-sectional line.

Fig. 4 is a front view schematically showing the image capturing apparatus shown in fig. 1.

Reference numerals illustrate:

10. an image acquisition device; 100. a housing assembly; 110. a receiving chamber; 120. a light transmission region; 130. a first mating portion; 140. a heat dissipation through hole; 150. a light-transmitting plate; 160. a connection hole; 200. a heat dissipation bracket; 201. a first panel; 202. a second panel; 203. a heat dissipation gap; 210. a heat radiation fin; 220. a first support boss; 230. a first positioning portion; 240. a second support boss; 300. an imaging unit; 310. a camera module; 311. a depth camera; 320. a mounting bracket; 321. mounting through holes; 330. a third heat conductive layer; 340. a heat conductive sheet; 341. a first heat conductor; 342. a second heat conductor; 343. an avoidance space; 350. a first circuit board; 360. a flexible circuit board; 370. a fourth heat conductive layer;

400. a control circuit board; 410. a heat source; 500. a first heat sink; 600. a first heat conductive layer; 700. a second heat conductive layer; 800. an electrical connector.

Detailed Description

For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the drawings and specific language will be used to describe the same. It should be understood that the detailed description is presented herein only to illustrate the present disclosure and not to limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

For ease of understanding, technical terms involved in the embodiments of the present disclosure are explained and described below.

A Vapor Chamber (VC) also called Vapor Chamber, etc., has a vacuum cavity with a fine structure, and has a good heat dissipation function, and the materials include but are not limited to copper, stainless steel, titanium alloy, etc.

Semiconductor refrigeration (Thermal Electric Cooler, abbreviated TEL), also known as peltier refrigeration.

A thermally conductive layer, also called a thermally conductive interface material (Thermal Interface Material, abbreviated to TIM), is used to coat between a heat dissipating device and a heat generating device, and is a generic term for materials used to reduce the thermal contact resistance therebetween. All the surfaces have roughness, so that when the two surfaces are contacted together, some air gaps are always mixed in the surfaces, and the heat conductivity coefficient of the air is very small, so that a relatively large contact thermal resistance is caused. The heat conducting layer has good heat conducting performance, can fill the air gap, reduces contact thermal resistance and improves heat radiating performance. Specific implementations of the thermally conductive layer include, but are not limited to, thermally conductive silicone grease, thermally conductive glue, thermally conductive gaskets, and the like.

Loop Heat Pipe (LHP) is a closed Loop Heat Pipe with good Heat dissipation.

The passive heat dissipation structure is provided with sheet-shaped heat dissipation teeth and/or heat dissipation fins.

The technical scheme of the present disclosure is further described below with reference to the accompanying drawings.

Fig. 1 to 4 are structural views of an image acquisition apparatus shown in some embodiments. Fig. 1 is a schematic structural diagram of an image capturing device according to an embodiment. Fig. 2 is a schematic exploded view of the image acquisition apparatus shown in fig. 1. Fig. 3 is a schematic cross-sectional view of the image acquisition device shown in fig. 1, taken half-way along a first cross-sectional line. Fig. 4 is a front view schematically showing the image capturing apparatus shown in fig. 1.

As shown in fig. 1-3, in some embodiments of the present disclosure, an image capture device is provided that includes a housing assembly, a heat dissipating bracket, a camera component, and a control circuit board. The shell component is provided with a containing cavity and a light-transmitting area communicated with the containing cavity. The heat dissipation support is in heat dissipation fit with the shell assembly. The image pickup part comprises at least two image pickup modules, wherein an optical path is formed between the image pickup modules and the light transmission area. The control circuit board is electrically connected with the camera shooting component, and is provided with a heat generating source which is matched with the heat dissipation bracket in a heat dissipation way. The heat dissipation support is clamped between the camera shooting component and the control circuit board, and the control circuit board is matched with the shell component in a heat dissipation mode.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

when the image acquisition device is used, the heat dissipation bracket, the camera shooting component and the control circuit board are respectively arranged in the shell component, so that the heat dissipation bracket is clamped between the camera shooting component and the control circuit board. And the heat source is in heat dissipation fit with the heat dissipation bracket, and the control circuit board is in heat dissipation fit with the shell assembly. And then evenly dissipate heat to the control circuit board through the heat dissipation area of the heat dissipation support and the heat dissipation area of the shell component, so that the image acquisition performance of the image acquisition device is prevented from being influenced due to uneven heat dissipation of the image acquisition device. Thus, the image acquisition device has good heat dissipation performance, so that the image acquisition device has reliable image acquisition performance.

In addition, the heat dissipation support also carries out heat dissipation cooperation with the casing subassembly for the heat that the source of generating heat produced can evenly transmit to the shell subassembly through heat dissipation support and control circuit board and dispel the heat, avoids the local overheated user experience that influences of shell subassembly.

It is understood that the heat dissipation bracket separates the imaging component from the heating source, so that the influence of the heating source on the imaging component can be reduced, and the imaging quality of the imaging component is ensured.

It should be noted that the specific implementation manner of the heat dissipation bracket may be various, including but not limited to a graphite bracket, a metal bracket, and the like, which have a support member with good heat conduction property.

Optionally, the heat dissipation support is a graphite support.

It should be noted that the "at least two camera modules" may be flexibly selected according to actual needs, and the camera modules include, but are not limited to, at least two of a monochrome camera, a color camera, and a depth camera.

Optionally, the camera component includes at least one monochrome camera, at least one color camera, and at least one depth camera.

It should be noted that the specific implementation forms of the heat generating source may be various, including but not limited to a controller, a sensor, an impedance unit, and the like.

Optionally, the heat generating source is a controller. Therefore, the heat generated by the operation of the controller is conveniently and rapidly dissipated through the heat dissipation support, the performance of the controller is prevented from being influenced due to overheat of the controller, and the performance of the image acquisition device is further influenced.

It should be noted that the specific implementation forms of the controller may be various, including but not limited to a micro control unit, a processor, a programmable device, a field programmable gate array (FPGA chip), and so on.

Based on any of the above embodiments, as shown in fig. 2, in some embodiments, the image capturing device further includes a heat sink sandwiched between the control circuit board and an inner side wall of the housing assembly, and the control circuit board is in heat-dissipating fit with the housing assembly through the heat sink. Therefore, the control circuit board is utilized to be matched with the shell component in a heat dissipation way through the heat dissipation fins, so that the heat dissipation efficiency of the control circuit board is improved, and the control circuit board is avoided

It should be noted that the specific implementation manner of the heat sink may be various, including but not limited to at least one of a temperature equalizing plate, a semiconductor refrigerating member, a loop heat pipe, a heat conducting layer, etc.

Optionally, the heat sink is a temperature equalizing plate, and is sandwiched between the control circuit board and the housing assembly.

On the basis of any of the above embodiments, as shown in fig. 2, in some embodiments, the heat dissipation bracket includes a first plate surface and a second plate surface, where the first plate surface includes at least two heat dissipation fins that are disposed in the accommodating cavity at intervals, the at least two heat dissipation elements are disposed towards the image capturing component, and the second plate surface is in heat dissipation fit with the heat source. Therefore, the radiating surface of the radiating bracket can be further increased by arranging the radiating fins, so that the heat of the heating source can be conveniently and rapidly radiated through the radiating bracket, and the performance of the heating source is prevented from being influenced due to overheat of the heating source.

On the basis of any of the above embodiments, as shown in fig. 2, in some embodiments, the image acquisition device further includes a first heat conducting layer sandwiched between the heat source and the second board, and the heat source is in heat dissipation fit with the heat dissipation bracket through the first heat conducting layer. Therefore, the first heat conduction layer is respectively and tightly attached to the heating source and the heat dissipation support in a radiating manner, so that contact thermal resistance is effectively reduced, heat conduction efficiency between the heating source and the heat dissipation support can be improved, and heat generated by the heating source is conveniently and rapidly transferred to the heat dissipation support for heat dissipation.

Based on any of the above embodiments, as shown in fig. 2, in some embodiments, the image capturing device further includes a second heat conducting layer sandwiched between the heat dissipating bracket and an inner side wall of the housing assembly, and the heat dissipating bracket is in heat dissipating fit with the housing assembly through the second heat conducting layer. Therefore, the second heat conduction layer is respectively and tightly attached to the shell assembly and the heat dissipation support in a radiating manner, so that contact thermal resistance is effectively reduced, heat conduction efficiency between the shell assembly and the heat dissipation support can be improved, and heat of the heat dissipation support is conveniently and rapidly transferred to the shell assembly for outward heat dissipation.

On the basis of any of the above embodiments, as shown in fig. 2 and 3, in some embodiments, the heat dissipation bracket is provided with a first supporting boss, and the heat dissipation bracket is disposed in the accommodating cavity through the first supporting boss. Therefore, the first support boss is used for supporting the heat dissipation support to form preliminary positioning, and then the heat dissipation support is fixedly connected with the shell assembly, so that the heat dissipation support is reliably matched with the heating source in a heat conduction manner, and the control circuit board can be protected by utilizing the heat dissipation support and the shell assembly.

Further, in some embodiments, the heat dissipation bracket is fixedly connected with the housing assembly, one of the heat dissipation bracket and the housing assembly table is provided with a first positioning portion, and the other one of the heat dissipation bracket and the housing assembly table is provided with a first matching portion matched with the first positioning portion in a positioning manner. Therefore, the first positioning part is matched with the first matching part in a positioning way, so that the radiating bracket is convenient to be preliminarily fixed on the first supporting boss, and the radiating bracket and the first supporting boss are fixed. Meanwhile, the heat dissipation support can be limited to move by means of positioning and matching of the first positioning part and the first matching part, so that the heat dissipation support and the heating source are reliably matched in heat dissipation.

It should be noted that specific implementation forms of the first positioning portion and the first matching portion may be multiple, and the two may form a limit. For example, one of the first positioning portion and the first mating portion is a positioning protrusion, and the other is a positioning recess.

In some embodiments, the camera component is in heat dissipating engagement with the housing assembly. Therefore, the generated heat of the image pickup component can be transferred to the shell component for heat dissipation, and the overheat phenomenon of the image pickup component caused by long-time use can be avoided.

Further, as shown in fig. 2 and 3, in some embodiments, the image capturing component further includes a mounting bracket, the mounting bracket is provided with mounting through holes corresponding to at least two image capturing modules one to one, the at least two image capturing modules are inserted into the mounting bracket through the mounting through holes, and the mounting bracket is in heat dissipation fit with the housing assembly and/or the heat dissipation bracket. Thus, the camera shooting component is mounted on the mounting bracket through the mounting through hole, so that the modular assembly is convenient. Meanwhile, the mounting bracket is utilized to be matched with the shell component and/or the heat dissipation bracket in a heat dissipation mode, and then generated heat of the image pickup component is better transferred to the shell component through the mounting bracket to dissipate heat, so that the image pickup component can be prevented from being overheated due to long-time use.

It will be appreciated that the mounting bracket may be adapted to the inner side wall of the receiving cavity such that the camera component is not subject to differences in camera module size but is difficult to thermally engage with the housing assembly.

Still further, as shown in fig. 2 and 3, in some embodiments, the image capturing component further includes a third heat conducting layer sandwiched between the mounting bracket and the housing assembly, and the mounting bracket is in heat dissipation fit with the housing assembly through the third heat conducting layer. Therefore, the third heat conduction layer is respectively and tightly attached to the shell assembly and the mounting bracket in a scattered way, so that contact thermal resistance is effectively reduced, heat conduction efficiency between the shell assembly and the mounting bracket can be improved, and heat of the mounting bracket is conveniently and rapidly transmitted to the shell assembly for outward heat dissipation.

On the basis of any one of the embodiments of the mounting bracket, as shown in fig. 2 and 3, in some embodiments, the camera module includes a depth camera and a heat conducting fin, and the depth camera is in heat dissipation fit with the mounting bracket through the heat conducting fin. So, the radiating surface of depth camera passes through the heat-conducting strip and installs the cooperation of dispelling the heat of support, can increase the heat conduction efficiency of depth camera and installing support, is convenient for dispel the heat to the installing support with the quick transmission of the heat that the depth camera produced, avoids the overheated and influence its shooting performance of depth camera.

On the basis of any of the above embodiments, as shown in fig. 2, in some embodiments, the heat conducting strip includes a first heat conducting body in heat dissipation fit with the depth camera and a second heat conducting body in heat dissipation fit with the mounting bracket, where the first heat conducting body and the second heat conducting body are connected in a bending manner to form an avoidance space for avoiding the depth camera. Therefore, the first heat conductor and the second heat conductor are connected in a bending mode, so that an avoidance space for avoiding the depth camera is formed, at least part of the depth camera is conveniently wrapped, and then heat conduction matching is conducted with the inner side face of the mounting support. The heat dissipation distance is convenient to shorten, and heat is quickly transferred to the shell assembly for heat dissipation.

The heat radiation surface of the depth camera includes copper foil and the like.

On the basis of any of the embodiments of the mounting bracket, as shown in fig. 3, in some embodiments, the mounting bracket is fixedly connected with the heat dissipation bracket. Therefore, the installation of the shooting part, the heat dissipation bracket and the shell component is realized in a lamination mode, and the assembly efficiency is improved.

On the basis of any of the above embodiments, as shown in fig. 2, in some embodiments, the image capturing component further includes a first circuit board and a flexible circuit board connected to the first circuit board and the control circuit board, at least two image capturing modules are integrated on the first circuit board, and the flexible circuit board is in heat dissipation fit with the heat dissipation bracket and/or the housing assembly. Therefore, at least two camera modules are integrated on the first circuit board, and the first circuit board and the control circuit board are electrically connected through the flexible circuit board, so that interaction is facilitated. The flexible circuit board is in heat dissipation fit with the heat dissipation support and/or the shell assembly, so that the influence on transmission performance caused by local overheating of the flexible circuit board can be avoided.

On the basis of any one of the embodiments of the first circuit board, as shown in fig. 2, in some embodiments, the heat dissipation bracket further includes a second supporting boss for supporting the first circuit board. Thus, the first circuit board is supported by the second supporting boss, so that the camera shooting component is conveniently arranged on the heat dissipation bracket.

In combination with the foregoing embodiment of the mounting bracket, after the at least two camera modules are integrated on the first circuit board, the first circuit board is clamped between the mounting bracket and the heat dissipation bracket through the fixed connection between the mounting bracket and the heat dissipation bracket.

Optionally, the control circuit board is connected with the flexible circuit board through a connector, and the control circuit board is fixedly connected with the shell component so as to press the connector, so that the control circuit board is reliably electrically connected with the flexible circuit board.

It should be noted that the "second supporting boss" may be a part of the "heat dissipation bracket", that is, the "second supporting boss" and other parts of the "heat dissipation bracket, such as the second connector" are integrally formed; the second support boss may be manufactured separately from the other part of the heat dissipation bracket, such as the heat dissipation fin, and may be combined with the other part of the heat dissipation bracket, such as the heat dissipation fin, to form a whole.

Equivalently, a "certain boss", "certain body" and "certain portion" may be a part of a corresponding "member", i.e., the "certain body", "certain portion" and other portions of the "member" are integrally formed; or a separate component which is separable from the other part of the component, namely, a certain body and a certain part can be independently manufactured and then combined with the other part of the component into a whole. The expressions of "a body" and "a portion" are merely examples of one embodiment, and are not intended to limit the scope of the disclosure, so long as the features described above are included and the actions are the same, it should be understood that the utility model is equivalent.

Based on any of the above embodiments, as shown in fig. 3 and fig. 4, in some embodiments, the image capturing device further includes an electrical connector disposed on the control circuit board, and a portion of the electrical connector is exposed out of the housing assembly; the electrical connector includes at least one of a power connector, a communication connector, and a time synchronization connector. In this way, the connection is conveniently set by the control circuit board and is interacted with the external device through at least one of the power connector, the communication connector and the time synchronization connector.

Optionally, the electrical connector includes a power connector, a communication connector, and a time synchronization connector to facilitate interaction of the image capture device with an external device.

On the basis of any of the above embodiments, as shown in fig. 2 to 4, in some embodiments, the housing assembly further includes at least two heat dissipation through holes communicating with the accommodating cavity, and at least two heat dissipation through holes are disposed at two sides of the heat dissipation bracket at intervals. Therefore, convection is formed through at least two heat dissipation through holes, and heat dissipation efficiency in the accommodating cavity is improved. The heat dissipation support and the outside are convenient to conduct heat dissipation interaction, so that the heat dissipation efficiency of the heat dissipation support is improved.

Further, as shown in fig. 2 to 4, in some embodiments, the heat dissipation bracket further includes at least two heat dissipation fins, and two adjacent heat dissipation fins are disposed at intervals to form a heat dissipation gap, and the heat dissipation gap is communicated with the heat dissipation through hole to form a convection channel. Therefore, the radiating area of the radiating bracket can be further increased through the radiating fins so as to improve the radiating efficiency. And the heat dissipation gap is communicated with the heat dissipation through hole to form a convection channel, so that the heat dissipation efficiency of the heat dissipation bracket and other devices in the accommodating cavity can be further improved.

Optionally, in some embodiments, the heat dissipating through holes are covered with a waterproof breathable film (not shown).

It should be noted that, referring to the first positioning portion, the heat dissipation bracket and the first circuit board may also be provided with a positioning structure for performing a limit fit, so as to prevent the first circuit board from easily moving.

It should be noted that, referring to the first positioning portion, the heat dissipation bracket and the control circuit board may also be provided with a positioning structure for performing a limit fit, so as to prevent the control circuit board from easily moving.

When the image acquisition device is assembled, the camera shooting module is arranged in the mounting bracket through the mounting through hole and fixed through dispensing. The second heat conduction layer is adhered to the mounting bracket. The heat conducting fin is in heat conducting fit with the depth camera and is fixedly adhered to the inner surface of the mounting bracket. The first circuit board is electrically connected with the camera module and is fixed on the mounting bracket through screws.

And then the first circuit board and the second circuit board are respectively connected through the flexible circuit board. The heat dissipation support is fixedly connected with the heat dissipation support through screws. And the heat dissipation support can be matched with the mounting support, and the first circuit board and the camera module are pressed and fixed. In addition, the first heat conduction layer is adhered to the control circuit board and fixed on the heat dissipation support through the screws, so that the heat conduction fit between the heat generation source and the heat dissipation support is reliable.

Finally, the flexible circuit board is electrically connected with the control circuit and is fixedly connected with the shell assembly through the heat dissipation bracket, and the structure is arranged in the shell assembly.

Optionally, as shown in fig. 2, in some embodiments, the light-transmitting region of the housing assembly is provided with a light-transmitting plate to protect the image pickup device.

Optionally, as shown in fig. 4, in some embodiments, the housing assembly is further provided with a connection hole for a tripod connection.

The image acquisition device includes a depth vision camera, a binocular camera, a range finding camera, an automatic recognition camera, and the like.

It should be noted that, the "mounting bracket" may be one of the parts of the module, i.e. the "camera component", and the other components of the "camera component" are assembled into a module, and then modularized assembly is performed; the present utility model may be mounted separately from the other members of the imaging device, that is, may be integrated with the other members of the imaging device.

Equivalently, the components contained in the components, devices and equipment of the disclosure can be flexibly combined, i.e. can be modularly produced according to actual practice, and can be used as an independent module for modularized assembly; or may be assembled separately to form a module in the device. The above-mentioned components are divided into only one embodiment of the present disclosure, and for convenience of reading, not limitation of the scope of protection of the present disclosure, so long as the above components are included and the same function should be understood as the equivalent technical solutions of the present disclosure.

In some embodiments, an electronic device is provided, including the image capturing apparatus of any of the embodiments described above.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the electronic device is provided with the image acquisition device in any embodiment, and has reliable image acquisition performance.

It should be noted that, the electronic device according to the embodiments of the present disclosure may include a vehicle, a ship, an electric bicycle, an electric balance car, and other mobility aids. But also handheld devices, car-mounted devices, wearable devices, computing devices, smart phones, personal digital assistants, tablet computers, laptop computers, video cameras, video recorders, cameras, distance measuring devices, smart bracelets, car-mounted computers, and other electronic devices having imaging capabilities.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first," "second," etc. can include at least one such feature, either explicitly or implicitly. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "mounted," "positioned," "secured" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one element is considered as being "fixedly connected" to another element, the two elements may be fixed by a detachable connection manner, or may be fixed by a non-detachable connection manner, for example, sleeving, clamping, integrally forming, fixing, welding, etc., which may be implemented in the conventional technology, and are not further described herein.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples merely represent several embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that variations and modifications can be made by those skilled in the art without departing from the inventive concepts of the present disclosure, which are within the scope of the present disclosure.

Claims (18)

1. An image acquisition apparatus, comprising:

the shell assembly is provided with a containing cavity and a light transmission area communicated with the containing cavity;

the heat dissipation bracket is in heat dissipation fit with the shell assembly;

the image pickup part comprises at least two image pickup modules, and an optical path is formed between the image pickup modules and the light transmission area; and

the control circuit board is electrically connected with the image pickup component, and is provided with a heating source which is in heat dissipation fit with the heat dissipation bracket;

the heat dissipation support is clamped between the camera shooting component and the control circuit board, and the control circuit board is in heat dissipation fit with the shell component.

2. The image capture device of claim 1, further comprising a heat sink sandwiched between the control circuit board and an inner side wall of the housing assembly, the control circuit board being in heat sink engagement with the housing assembly via the heat sink.

3. The image capturing device of claim 1, wherein the heat dissipating bracket comprises a first plate surface and a second plate surface, the first plate surface comprises at least two heat dissipating fins arranged in the accommodating cavity at intervals, the at least two heat dissipating members are arranged towards the image capturing component, and the second plate surface is in heat dissipating fit with the heat generating source.

4. The image capture device of claim 3 further comprising a first thermally conductive layer sandwiched between the heat generating source and the second plate surface, the heat generating source being in heat dissipating engagement with the heat dissipating bracket via the first thermally conductive layer.

5. The image capture device of claim 1 further comprising a second thermally conductive layer sandwiched between the heat dissipating bracket and an inner sidewall of the housing assembly, the heat dissipating bracket being in heat dissipating engagement with the housing assembly via the second thermally conductive layer.

6. The image acquisition device according to claim 1, wherein the heat dissipation bracket is provided with a first supporting boss, and the heat dissipation bracket is arranged in the accommodating cavity through the first supporting boss so as to avoid the control circuit board.

7. The image capturing device according to claim 1, wherein the heat dissipating bracket is fixedly connected to the housing assembly, one of the heat dissipating bracket and the housing assembly is provided with a first positioning portion, and the other one of the heat dissipating bracket and the housing assembly is provided with a first fitting portion that is positioned and fitted with the first positioning portion.

8. The image capture device of claim 1 wherein the camera component is in heat sink engagement with the housing assembly.

9. The image capturing device according to claim 1, wherein the image capturing section further includes a mounting bracket provided with mounting through holes in one-to-one correspondence with the at least two image capturing modules, the at least two image capturing modules are inserted into the mounting bracket through the mounting through holes, and the mounting bracket is heat-dissipating fitted with the housing assembly and/or the heat-dissipating bracket.

10. The image capture device of claim 9 wherein the camera component further comprises a third thermally conductive layer sandwiched between the mounting bracket and the housing assembly, the mounting bracket being in heat-dissipating engagement with the housing assembly via the third thermally conductive layer.

11. The image acquisition device of claim 9, wherein the camera module comprises a depth camera and a thermally conductive sheet, the depth camera being in heat-dissipating engagement with the mounting bracket via the thermally conductive sheet; and/or the mounting bracket is fixedly connected with the heat dissipation bracket.

12. The image capturing device of claim 11, wherein the thermally conductive sheet comprises a first thermally conductive body in heat dissipation engagement with the depth camera and a second thermally conductive body in heat dissipation engagement with the mounting bracket, the first thermally conductive body and the second thermally conductive body being in bent connection to form an avoidance space for avoiding the depth camera.

13. The image capturing apparatus of claim 1, wherein the camera component further comprises a first circuit board and a flexible circuit board connecting the first circuit board and the control circuit board, the at least two camera modules being integrated into the first circuit board.

14. The image capture device of claim 13, wherein the heat sink bracket further comprises a second support boss for supporting the first circuit board.

15. The image capture device of claim 1, further comprising an electrical connector disposed on the control circuit board, a portion of the electrical connector being exposed to the housing assembly; the electrical connector includes at least one of a power connector, a communication connector, and a time synchronization connector.

16. The image capture device of any one of claims 1 to 15, wherein the housing assembly further comprises at least two heat dissipating through holes in communication with the receiving chamber, at least two of the heat dissipating through holes being spaced apart on either side of the heat dissipating bracket.

17. The image capture device of claim 16 wherein the heat sink bracket further comprises at least two heat sink fins, adjacent two of the heat sink fins being spaced apart to form a heat sink gap, the heat sink gap in communication with the heat sink through-hole to form a convective channel.

18. An electronic device comprising the image acquisition apparatus of any one of claims 1 to 17.