CN210093797U

CN210093797U - Thermal imaging device structure

Info

Publication number: CN210093797U
Application number: CN201822159050.0U
Authority: CN
Inventors: 王浩
Original assignee: Hangzhou Mission Infrared Electro Optics Technology Co Ltd
Current assignee: Hangzhou Mission Infrared Electro Optics Technology Co Ltd
Priority date: 2017-12-21
Filing date: 2018-12-21
Publication date: 2020-02-18
Anticipated expiration: 2028-12-21

Abstract

The utility model relates to a thermal image device structure, including the first lobe that sets up the thermal image detector, set up the second lobe of processing circuit, its characterized in that is provided with the third lobe between first lobe and second lobe, through the setting of third lobe and the heat abstractor of third lobe for first lobe and second lobe do not conduct heat each other, or the heat transfer as little as possible; the processing circuit which avoids a large amount of heat generation in the second compartment 2 and transfers the heat to the first compartment 1 can ensure the temperature balance inside the first compartment 1, thereby improving the imaging quality and the temperature measurement accuracy.

Description

Thermal imaging device structure

Technical Field

The utility model relates to a thermal imagery device structure especially relates to a thermal imagery device structure that the radiating effect is good.

Background

Hardware circuits in the thermal imager in the conventional portable thermal imager device can be divided into a detector circuit part and a processing circuit part; since the function of the processing circuit portion is, for example, processing of an image, heat dissipation amount is large. Because the thermal imager is very sensitive to heat, especially for a portable thermal imager with a small size, the heat generated by the processing part of the thermal imager in the working process has a great influence on the detector in the thermal imager. Therefore, it is necessary to improve the structure of the thermal imager device, so that the hardware circuit inside the thermal imager is as small as possible or even does not affect the imaging of the internal detector, thereby improving the performance of the thermal imager, such as the accuracy of temperature measurement.

Disclosure of Invention

To the technical problem, the utility model provides a thermal imagery device structure.

In order to solve the technical problem, the technical scheme of the utility model is as follows;

a thermal image device structure comprises a first bulkhead provided with a thermal image detector and a second bulkhead provided with a processing circuit, and is characterized in that a third bulkhead is arranged between the first bulkhead and the second bulkhead and provided with a heat dissipation device.

Further, the first compartment includes a front housing and a first diaphragm; the second compartment comprises a rear shell and a second clapboard, and the third compartment is formed by the first clapboard, the second clapboard and a connecting piece.

Furthermore, the front shell, the connecting piece or the rear shell are all or two-by-two integrally formed.

Furthermore, the first bulkhead is provided with an assembly structure of the thermal image detector, and the assembly structure is provided with a heat dissipation plate for dissipating heat of the thermal image detector; the heat sink is in contact with the mounting structure.

Further, the second partition plate is provided with heat radiating fins facing the third compartment.

The thermal image detector is connected with the thermal image detector, the analog-to-digital conversion circuit is arranged on the first bulkhead, the thermal image detector is connected with the analog-to-digital conversion circuit, and the thermal image detector is connected with the analog-to-digital conversion circuit through a wire or a flexible flat cable; the connecting thermal image detector part is used for connecting the acquisition circuit with the thermal image detector and is a welding circuit or a plug-in circuit.

Further, the third compartment contains a plurality of compartments; among the plurality of compartments, at least one compartment is provided with a heat dissipating device.

Furthermore, the first partition plate, the second partition plate and the connecting piece are integrally formed, and the heat dissipation device is a heat dissipation hole.

Further, the connecting member is composed of a heat insulating material in contact with the first partition plate and a heat conductive material in contact with the second partition plate.

Furthermore, the processing circuit is assembled on a second partition plate, the connecting piece is of a columnar structure, the front shell, the first partition plate, the rear shell and the second partition plate are connected in a sealing mode, and rubber pads are arranged at the joints of the first partition plate, the front shell and the second partition plate and the rear shell.

The beneficial effects of the utility model reside in that: the thermal imager device is divided into two compartments, a third compartment is arranged between the two compartments, and the first compartment and the second compartment are not mutually heat-conducting or heat-transfer as little as possible through the arrangement of the third compartment and the heat dissipation device of the third compartment; the processing circuit which avoids a large amount of heat generation in the second compartment 2 and transfers the heat to the first compartment 1 can ensure the temperature balance inside the first compartment 1, thereby improving the imaging quality and the temperature measurement accuracy.

Drawings

FIG. 1 is a structural cross-sectional view of the thermal imager device of the present invention;

FIG. 2 is a schematic structural view of the thermal imager device of the present invention;

FIG. 3 is an exploded view of FIG. 2;

FIG. 4 is a schematic structural diagram of another embodiment of the present invention;

FIG. 5 is a structural diagram of the portable thermal imager of the present invention;

FIG. 6 is a cross-sectional view of the structure of FIG. 5;

FIG. 7 is a block diagram of another embodiment of the present invention applied to a portable thermal imager;

FIG. 8 is a schematic structural view of the inner cable of FIG. 5;

FIG. 9 is a block diagram of a portable thermal imager with a columnar structure;

fig. 10 is another internal wiring diagram of the present invention applied to a portable thermal imager.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments.

Example one

As shown in fig. 1 to 4, a thermal image device structure includes an outer casing, the casing includes a front casing 5 and a rear casing 6, the front casing and a first partition 7 form a first compartment 1, the rear casing 6 and a second partition 8 form a second compartment 2, and a third compartment 3 is disposed between the first compartment 1 and the second compartment 2.

The front and rear housings may be constructed of a variety of materials, such as plastic, metal, some plastic and some metal, and are generally preferably constructed of a material that dissipates heat well, such as a metal material.

The first compartment 1 includes a front housing 5 and a first partition 7, in which an imaging portion may be configured, the imaging portion may include at least a thermal image detector, and may further include a lens, a part or all of an acquisition circuit, a calibration barrier structure, a corresponding fixing structure, and the like as required. When the lens is arranged, the lens and the thermal image detector are connected through a structural part with good heat conduction, such as a heat dissipation structure, and the like to be in contact with the shell made of the metal material, so that mutual heat balance is facilitated.

The thermal image detector can be welded or spliced with the acquisition circuit, so that the acquisition circuit can be divided into a part welded or spliced with the thermal image detector and a part provided with an analog-digital conversion circuit, and the two parts are connected through a lead or a flexible flat cable such as an FPC (flexible printed circuit) cable. If the collection circuit dissipates less heat, it may be disposed entirely within the first compartment 1. As shown in fig. 2 and 4, when the heat dissipation of the acquisition circuit is large, the portion of the acquisition circuit welded or plugged into the thermal image detector may be disposed in the first compartment 1. And a part of the analog-to-digital conversion circuit is arranged in the second compartment 2, and the two are connected through a lead wire or a flexible flat cable 10 such as an FPC (flexible printed circuit) line.

The second compartment 2 includes a rear case 6 and a second partition 8, and the second compartment 2 is used for placing processing circuits having a large amount of heat generation, such as a compression circuit, a video recording circuit, and a transmission circuit. Preferably, the processing circuit is provided with a heat sink plate which is in contact with the rear housing 6 of metal material to facilitate heat dissipation.

The heat of the second compartment 2 is prevented from being transferred to the first compartment 1 through the partition plate, a third compartment 3 is arranged between the first compartment 1 and the second compartment 2, the third compartment 3 is formed by a first partition plate 7, a second partition plate 8 and a connecting piece 9, and a vent hole 4 is arranged outside the third compartment 3 and is used for being communicated with the outside air, so that the heat of the second compartment 2 is difficult to be transferred through the partition plate. The connecting member 9 may be a housing that is joined to the front housing 5 and the rear housing 6, or may be integrally formed with the front housing 5 or/and the rear housing 6. The portion to be used for connecting the first partition 7 and the second partition 8 is referred to as a connecting member 9. When the connector is part of the housing, the heat dissipation hole 4 is now provided at the connector 9. The connecting piece 9 is used as a connecting part between the first compartment 1 and the second compartment 2, and holes or grooves for passing wires are reserved on the first partition plate 1, the connecting piece 9 and the second partition plate 2.

Preferably, the connecting member 9 may be made of different materials having good thermal insulation and good thermal conductivity, wherein the portion in contact with the first partition 7 is made of a material having good thermal insulation, such as a plastic material, and the portion in contact with the second partition 8 is made of a material having good thermal conductivity, such as a magnesium alloy.

The third compartment 3 does not mean that there is only a single compartment, but a plurality of compartments may be provided in the third compartment 3, in which case the third compartment 3 means the collection of all the compartments inside.

The first partition 7 may be made of a material having good thermal insulation, such as heat insulating plastic, the second partition 8 may be made of a material having good thermal conductivity and heat dissipation, such as metal, and the second partition 8 may be made of metal having heat dissipating fins facing the third compartment 3. In this case, the circuit in the second compartment 2, which generates a large amount of heat, can be well contacted by the second separator 8, and thus heat can be dissipated more quickly. By selecting the above materials, the heat dissipation requirement of the material of the housing can be reduced, for example, the housing is changed into a plastic material, thereby reducing the cost and the weight.

Preferably, the first partition 7, the second partition 8 and the connection piece 9 with the heat dissipation holes or slots may be a single piece, for example designed as a well-insulated plastic piece, the two ends of which are connected to the front shell 5 and the rear shell 6, respectively, so as to constitute the first compartment 1 and the second compartment 2.

As shown in fig. 1 to 3, the first compartment 1 and the second compartment 2 are arranged in a front-rear configuration, but the present invention is not limited thereto, and the first compartment 1 and the second compartment 2 may be arranged in various forms. As shown in fig. 4, the first compartment 1 and the second compartment 2 are in an upper-lower structure; the configuration mode can change the size ratio of the thermal imager according to the applied space condition, and the applicability is wide. Preferably, the front housing 5 of the first compartment 1 is provided with 1 or more detachable housings or detachable and combinable housing portions on the upper, lower, left, right and rear portions thereof, and is used for replacing a first partition plate or an integral partition plate connecting piece, so that the first compartment 1 and the second compartment 2 are combined to form an upper and lower structure, a front and rear structure, a left and right structure and the like, and the thermal imager can be conveniently installed according to application conditions.

Furthermore, the first partition 7, the second partition 8, the connecting member 9 and the housing (5, 6) may be configured with various suitable materials for heat conduction, heat dissipation, heat insulation, etc., according to the requirements of the heat generating devices and applications in the first compartment 1 and the second compartment 2.

In the structure, the two compartments do not conduct heat or transfer heat as little as possible; the processing circuit which avoids a large amount of heat generation in the second compartment 2 and transfers the heat to the first compartment 1 can ensure the temperature balance inside the first compartment 1, thereby improving the imaging quality and the temperature measurement accuracy.

Example two

As shown in fig. 5 to 10, a handheld thermal imager device includes an outer housing 11, a body housing, and a display screen frame, wherein the outer housing 11 is assembled with a lens; assembling a display screen on the display screen frame; the machine body shell further comprises a handle 6, and a heat dissipation hole 4 is formed in the outer shell 11.

As shown in fig. 6 to 10, the structure of the handheld thermal imager device includes a first compartment 1, a second compartment 2, and a third compartment between the first compartment 1 and the second compartment 2.

A first compartment 1 equipped with infrared detection circuits comprising at least thermographic infrared detectors according to different applications and the performance of the detectors; the first compartment consists of the front end of the outer shell 11 and a first partition plate 7, and a part of the front end of the outer shell 11, which corresponds to the thermal image detector, is provided with a lens; preferably, the first and second liquid crystal materials are,

the first partition plate 7 is connected with the outer shell 11 in a sealing way;

a second compartment 2 provided with processing circuitry provided with thermally intensive circuit parts, such as display signal processing circuitry, memory processing circuitry, communication circuitry, analog-to-digital conversion circuitry, etc., which may be one or more of these, and which may be provided on one or more circuit boards. A second compartment 2, which is formed by the rear end of the outer shell 11 and a second partition 8, preferably, the second partition 8 is connected with the outer shell 11 in a sealing way; preferably, one end of the second compartment 2 is a display screen frame, fitted with a display screen.

A third compartment 3 comprising a first partition7A second partition plate8And an outer shell 11; preferably, the outer shell 11 is provided with through holes or an open structure, such as heat dissipation holes 4, to facilitate the circulation of the outside air; the heat of the second compartment 2 is not easily conducted to the first compartmentA compartment 1.

As shown in fig. 6 or 9, the first compartment is provided with a mounting structure for mounting the infrared detector, and the mounting structure is made of a material with rapid heat dissipation, such as a metal material; in order to improve the anti-interference performance of the infrared detector, the assembly structure can be designed into a square cylinder type or a cylinder type. The assembly structure is provided with an opening which accords with the imaging of the detector so as to receive the light of the lens; for better heat dissipation, the assembly structure is provided with a heat dissipation plate for dissipating heat of the infrared detector, the heat dissipation plate is made of a material with good heat conduction, such as a metal material, and the heat dissipation plate can be connected with the assembly structure; so as to conduct heat to the mounting structure and facilitate thermal equilibrium of the infrared detector.

The infrared detection circuit can comprise an infrared detector and an acquisition circuit; the acquisition circuit is provided with an analog-digital conversion circuit for example, and is used for outputting AD value data of the thermal image after analog-digital conversion is carried out on an analog signal output by the infrared detector. The acquisition circuit can be provided with a heat dissipation plate; the heat dissipation plate is made of a material with good heat conduction, such as a metal material.

In other embodiments, the infrared detection circuit may only include an infrared detector, and the infrared detector has a circuit for analog-to-digital conversion therein, and directly outputs a signal of the infrared detector, such as AD value data of a thermal image, through the pin interface.

In other embodiments, the infrared detection circuit may also have the function of part of the processing circuit; such as one or more of AD value data for outputting thermal images, data for displaying, recording, etc. after thermal image processing, etc. However, the processing circuit parts with high power consumption should be arranged in the second compartment 2.

The infrared detector can be inserted into a socket for fixed connection, and the socket is welded on the acquisition circuit and penetrates through the heat dissipation plate.

The connection mode of the acquisition circuit and the infrared detector can be various configuration modes. The connection can be in a fixed mode, for example, the infrared detector can be welded or plugged into the acquisition circuit through a socket. Or may be an active connection such as connecting the detector pins and the acquisition circuitry via a flexible wire or FPC flex circuit. Or part of the connection can be fixed connection or part of the connection can be movable connection, for example, part of the connection adopts a soft wire or an FPC flexible circuit, and part of the connection adopts welding on the acquisition circuit.

The acquisition circuit can be divided into two parts, wherein the part welded with the infrared detector is assembled inside the first compartment 1; part of the analog-to-digital conversion circuit, which is mounted inside the second compartment 2, are connected by means of wires or flexible lines, such as FPC lines.

In another example, the detector is plugged into the acquisition circuit part through a socket, the infrared detector and the socket circuit are arranged in the first compartment 1, and the analog-to-digital conversion processing circuit part of the acquisition circuit generates a large amount of heat, so that the acquisition circuit can be arranged outside the first compartment 1, such as in the second compartment 2.

In one example, the acquisition circuit 013 can be divided into two parts, a part to which the detector is soldered, and a part provided with an analog-to-digital conversion circuit, connected by the FPC flex circuit 10, which is arranged outside the bay 001, for example in the bay 003;

the corresponding radiating plate of the infrared detector and the radiating plate of the acquisition circuit can be adjusted and adapted in shape and position; preferably, in order to reduce the interference of stray light on the detector, the first compartment 1 forms an enclosed space of the detector;

the part of the acquisition circuit which has small heating value and is convenient for design and realization can be considered to be connected with the infrared detector together and assembled in the first bulkhead 1; and the part with large heat productivity or large design realization difficulty is movably connected with the infrared detector and assembled outside the first bulkhead 1.

Preferably, the infrared detector is positioned on a light path of the receiving lens of the infrared detector, and is also provided with a baffle for thermal image verification, and the baffle can be arranged at the position of the opening of the lens and the detector assembling structure and the like. Preferably, a thermal image checking baffle is arranged at the opening of the assembling structure, and the assembled thermal image checking baffle is positioned between the opening and the lens.

In order to ensure good heat dissipation of the infrared detector, the front part of the assembly structure can be in good contact and conduction with a metal structural part of the lens or a metal connecting part of the metal structural part, so that the heat of the infrared detector can be transferred from the assembly structure to the lens. Or the assembly structure is in good contact conduction with the metal structural part of the shell or the metal heat dissipation part of the shell.

Preferably, as shown in figure 10, the second compartment 2 houses the processing circuitry, which uses the second partition 8 as a heat sink; the second partition 8 is preferably provided with through-slot fins, preferably directed towards the third compartment 3; facilitating rapid conduction of heat to the third compartment 3. Thus, the weight can be reduced, the heat dissipation effect can be improved, and the processing circuit with large heat dissipation can be cooled through the second partition plate 8, so that the uncomfortable feeling of the hand of the user can be avoided.

In addition, the shell is provided with a through hole for air circulation; in addition, to provide increased strength for heat dissipation and reduced thermal radiation between the partitions, partitions may also be added in the third compartment 3; so that the third compartment 3 contains one or more compartments.

As shown in fig. 9, the first partition 7 and the second partition 8 may be connected by other structural members, such as a columnar structure 12, and the connecting member 9 in the third compartment is the columnar structure 12.

The display screen is mounted on a frame, and the frame is made of a material with good heat conduction, such as a metal material. The frame dissipates heat for the display screen.

The partition plate material can be made of various materials according to different designs and different requirements of heat dissipation, heat conduction and heat insulation, and the heat dissipation holes of the third compartment 3 can be in various forms convenient for air circulation; the heat dissipation fan is preferably arranged on the first partition board 1 or the second partition board 2, so that the heat dissipation effect is good, and the heat dissipation fan is easy to arrange and is not easy to perceive; preferably, the apertures are configured in a variety of inconspicuous configurations for aesthetic purposes.

The instrument with the structure can greatly reduce the volume and the weight and improve the heat dissipation structure. The device can be used as the whole of the instrument; furthermore, related circuits and structures, such as a housing, a partial housing and the like, can be added to form instruments of various forms, such as various handheld thermal imagers, side-holding portable thermal imagers, online thermal imagers, head-mounted thermal imagers and the like. The electric connecting line between the first compartment and the second compartment can be solved by leaving a wire passing groove in a connecting piece assembled by the first compartment and the second compartment.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the concept of the present invention, and these improvements and decorations should also be considered as the protection scope of the present invention.

Claims

1. A thermal image device structure comprises a first bulkhead provided with a thermal image detector and a second bulkhead provided with a processing circuit, and is characterized in that a third bulkhead is arranged between the first bulkhead and the second bulkhead and provided with a heat dissipation device.

2. A thermal imaging apparatus structure according to claim 1, wherein said first compartment includes a front housing and a first bulkhead; the second compartment comprises a rear shell and a second clapboard, and the third compartment is formed by the first clapboard, the second clapboard and a connecting piece.

3. A thermal imaging device structure according to claim 2, characterized in that the front housing, the connecting element or the rear housing are integrally formed wholly or in pairs.

4. A thermal imaging device structure according to claim 1, characterized in that the first compartment is provided with an assembly structure of the thermal imaging detector, which is provided with a heat dissipation plate for heat dissipation of the thermal imaging detector; the heat sink is in contact with the mounting structure.

5. A thermal imaging system structure according to claim 2, characterised in that said second partition is provided with heat-dissipating fins, said fins facing the third compartment.

6. The thermal imaging device structure of claim 2, further comprising an acquisition circuit, wherein the acquisition circuit comprises a connection thermal image detector and an analog-to-digital conversion circuit, the connection thermal image detector is arranged at a first compartment, the analog-to-digital conversion circuit is arranged at a second compartment, and the connection thermal image detector is connected with the analog-to-digital conversion circuit by a wire or a flexible flat cable; the connecting thermal image detector part is used for connecting the acquisition circuit with the thermal image detector and is a welding circuit or a plug-in circuit.

7. A thermal imaging device structure according to claim 1, wherein said third compartment contains a plurality of compartments; among the plurality of compartments, at least one compartment is provided with a heat dissipating device.

8. The thermal imaging device structure of claim 2, wherein the first partition, the second partition and the connecting member are integrally formed, and the heat dissipation device is a heat dissipation hole.

9. A thermal image system structure according to claim 2, characterized in that said connecting member is made of a heat insulating material in contact with the first partition and a heat conducting material in contact with the second partition.

10. The thermal imaging device structure of claim 2, wherein the processing circuit is mounted on the second partition board, the connecting member is a cylindrical structure, the front housing and the first partition board, the rear housing and the second partition board are hermetically connected, and rubber pads are disposed at the joints between the first partition board and the front housing, and between the second partition board and the rear housing.