CN218276854U - Image transmission device and unmanned aerial vehicle - Google Patents

Abstract

The embodiment of the application provides an image transmission device and an unmanned aerial vehicle, and relates to the field of unmanned aerial vehicles. The image transmission device provided by the embodiment of the application comprises a shell forming an accommodating cavity, and a power amplification module and an image transmission module which are arranged in the shell, wherein the power amplification module is electrically connected with the image transmission module. The image transmission device that this application embodiment provided is through in integrating the image transmission device with power amplification module for image transmission device can realize long distance transmission and the integrated level is high, stable in structure. The unmanned aerial vehicle that this application embodiment provided includes foretell image transmission device, consequently need not independent external power amplifier and also can realize long distance image transmission.

Description

Image transmission device and unmanned aerial vehicle

Technical Field

The utility model relates to an unmanned aerial vehicle field particularly, relates to an image transmission device and unmanned aerial vehicle.

Background

The existing unmanned aerial vehicle sends image information back to the ground through an image transmission device, the image transmission distance of the common unmanned aerial vehicle is short, and if long-distance transmission is to be realized, a power amplifier is usually additionally arranged independently. This results in poor device integration.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an image transmission device and unmanned aerial vehicle, image transmission device can realize long distance image transmission and the integrated level is high.

The embodiment of the utility model is realized like this:

in a first aspect, the utility model provides an image transmission device is applied to unmanned aerial vehicle, including forming the casing that holds the chamber and setting up power amplification module and the image transmission module in the casing, power amplification module is connected with the image transmission module electricity.

In an alternative embodiment, a shielding partition is disposed in the housing, and the shielding partition separates the power amplification module from the image transmission module.

In an alternative embodiment, the housing comprises a first half-shell and a second half-shell, the first half-shell and the second half-shell are spliced together to jointly enclose the accommodating cavity of the housing, and the shielding partition plate is arranged on the inner side of the first half-shell and/or the second half-shell.

In an alternative embodiment, the abutting surfaces of the first half shell and the second half shell are coated with the sealing conductive adhesive.

In an optional embodiment, the image transmission device further includes a power detection module disposed in the housing, and the power detection module is separated from the power amplification module and the image transmission module by a shielding partition.

In an optional embodiment, the inner surface of the housing is provided with a first shielding rib, and the first shielding rib is used for separating different components in the image transmission module;

and/or the inner surface of the shell is provided with a second shielding rib which is used for separating different components in the power amplification module.

In an optional implementation manner, the image transmission module includes a graph-transmission circuit board and a plurality of components arranged on the graph-transmission circuit board, a first copper exposure region is arranged on the graph-transmission circuit board, and the first copper exposure region corresponds to the first shielding rib in position and is abutted against the first shielding rib.

In an alternative embodiment, the outside of the housing is provided with a fin array comprising a plurality of spaced-apart heat dissipating fins.

In an alternative embodiment, the image transfer device further comprises a fan disposed on the fin array.

In an alternative embodiment, the fan is axially opposite to the power amplification module in its own axis.

In an alternative embodiment, the fin array is provided with heat dissipation grooves, and the depth direction of the heat dissipation grooves is consistent with the height direction of the heat dissipation fins.

In an alternative embodiment, the extension direction of the heat dissipation groove is perpendicular to the extension direction of the heat dissipation fin.

In an optional embodiment, the image transmission module includes a pattern-transmission circuit board and a plurality of components arranged on the pattern-transmission circuit board, and a first heat conduction boss is arranged on the inner side of the casing and abutted to the pattern-transmission circuit board through a heat conduction pad.

In an optional embodiment, a second copper exposing area is arranged on the picture transmission circuit board, and the first heat conduction boss abuts against the second copper exposing area of the picture transmission circuit board.

In an optional embodiment, a second heat conducting boss is disposed inside the housing, and the second heat conducting boss abuts against the heat generating device in the image transmission module through the heat conducting pad.

In an optional implementation manner, the power amplification module includes a power amplifier circuit board, and a heat conduction member and a plurality of components that are disposed on the power amplifier circuit board, and the heat conduction member is attached to the inner side of the casing.

In an optional embodiment, a heat conducting groove is formed in the inner side of the shell, and the heat conducting piece is embedded in the heat conducting groove and attached to the inner wall of the heat conducting groove through heat conducting glue.

In an optional implementation mode, the power amplifier circuit board comprises a first surface and a second surface which are opposite, the heat conducting piece is arranged on the first surface of the power amplifier circuit board, the components of the power amplification module are arranged on the second surface of the power amplifier circuit board, and the first surface of the power amplifier circuit board is paved with copper and is attached to the inner side of the shell through heat conducting glue.

In an alternative embodiment, the thermally conductive member is a copper block.

In an alternative embodiment, the image transmission device further comprises a filter disposed outside the housing, the filter being electrically connected to the image transmission module.

In an alternative embodiment, a mounting seat is provided on the outer side of the housing, and the filter is provided on the mounting seat.

In an optional embodiment, a fixing column is arranged on the mounting seat and used for connecting the body of the unmanned aerial vehicle.

In a second aspect, the present invention provides an unmanned aerial vehicle, comprising the image transmission device of any one of the preceding embodiments.

The embodiment of the utility model provides a beneficial effect is:

the image transmission device provided by the embodiment of the application comprises a shell forming an accommodating cavity, and a power amplification module and an image transmission module which are arranged in the shell, wherein the power amplification module is electrically connected with the image transmission module. The image transmission device that this application embodiment provided is through in integrating the image transmission device with power amplification module for image transmission device can realize long distance transmission and the integrated level is high, stable in structure. The unmanned aerial vehicle that this application embodiment provided includes foretell image transmission device, consequently need not independent external power amplifier and also can realize long distance image transmission.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of an image transmission apparatus in a first viewing angle according to an embodiment of the present disclosure;

FIG. 2 is a diagram illustrating an image transmission apparatus according to an embodiment of the present disclosure from a second viewing angle;

FIG. 3 is a schematic view of the interior of the housing in one embodiment of the present application;

FIG. 4 is a diagram illustrating an image transmission apparatus with a filter removed according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a fan mounted to a first housing half according to an embodiment of the present application;

FIG. 6 is an outside view of the first housing half in accordance with an embodiment of the present application;

FIG. 7 is a schematic view of the inside of a first housing half according to an embodiment of the present application;

FIG. 8 is an outside view of the second housing half in accordance with an embodiment of the present application;

FIG. 9 is a schematic view of the inside of the second housing half in an embodiment of the present application;

FIG. 10 is a diagram illustrating an image transmission module in a first viewing angle according to an embodiment of the present disclosure;

FIG. 11 is a diagram illustrating an image transmission module in a second view according to an embodiment of the present disclosure;

fig. 12 is a schematic diagram of a power amplification module according to an embodiment of the present application.

Icon: 010-image transmission means; 100-a housing; 101-external connector; 102-a radio frequency connector; 103-an indicator light; 104-frequency-contrast key; 110-a first half-shell; 111-a second screw hole; 112-a second via; 113-a fan wire through hole; 114-a first shielding spacer; 115-a first shielding rib; 116-a second thermally conductive boss; 117-third screw hole; 118-a fourth screw hole; 119-a fifth screw hole; 120-sixth screw hole; 121-a seventh screw hole; 122-eighth screw hole; 123-a third via; 124-fourth via; 125-heat conducting groove; 126-avoidance groove; 130-heat dissipation fins; 131-a heat sink; 140-a second half-shell; 141-a second shielding separator; 142-a wire-passing groove; 143-second shielding ribs; 144-a first thermally conductive boss; 145-fifth via; 146-a flange; 200-an image transmission module; 210-a graph-borne circuit board; 211-a first copper exposed area; 212-a second copper exposed area; 300-a power amplification module; 310-power amplifier circuit board; 311-a thermally conductive member; 400-power detection module; 500-a fan; 600-a filter; 610-a mount; 611-a first screw hole; 612-a first via; 613-fixing hole; 614-weight reduction slots; 620-fixed column.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Fig. 1 is a schematic diagram of an image transmission apparatus 010 under a first viewing angle according to an embodiment of the present application;

fig. 2 is a schematic diagram of the image transmission device 010 in a second viewing angle according to an embodiment of the present application; fig. 3 is a schematic internal view of the housing 100 according to an embodiment of the present disclosure. As shown in fig. 1 to 3, the image transmission device 010 provided in the present embodiment includes a case 100 forming an accommodation chamber, a fan 500 and a filter 600 provided outside the case 100, and an image transmission module 200 and a power amplification module 300 provided inside the case 100. The case 100 serves to fix and protect the image transmission module 200 and the power amplification module 300. The image transmission module 200 is used for transmitting image information, and the power amplification module 300 is electrically connected to the image transmission module 200 and is used for implementing a power amplification function, so that the image transmission module 200 can implement long-distance image transmission. Since the image transmission module 200 and the power amplification module 300 generate heat during operation, the fan 500 is used to enhance the air convection on the surface of the housing 100 to enhance the heat dissipation capability. The filter 600 is electrically connected to the image transmission module 200 and is used for filtering or obtaining a specific signal frequency to improve the quality of image transmission. In alternative embodiments of the present application, filter 600 or fan 500 may be omitted.

As shown in fig. 3, the housing 100 in this embodiment includes a first housing half 110 and a second housing half 140, and the first housing half 110 and the second housing half 140 are spliced together to form a receiving cavity of the housing 100. The casing 100 is provided with a pair of external connectors 101 and a pair of rf connectors 102 on the outside, and in this embodiment, the number of the external connectors 101 and the number of the rf connectors 102 are two. Specifically, each of the connectors is fixed to the first housing half 110.

Referring to fig. 1 and fig. 2, a mounting seat 610 is disposed on an outer side of the housing 100, and the filter 600 is disposed on the mounting seat 610. In particular, in the present embodiment, the mounting seat 610 and the filter 600 are disposed at the outer side of the second half case 140, and thus disposed at both sides of the case 100 with the fan 500, respectively. The mount 610 has a plate shape, one surface of which faces the case 100, and the other surface of which is provided with the filter 600. Be provided with fixed column 620 on mount pad 610, fixed column 620 is used for connecting unmanned aerial vehicle's fuselage. Specifically, the mounting base 610 is provided with a plurality of fixing holes 613, and the fixing posts 620 are fixed to the mounting base 610 by being engaged with the fixing holes 613. In this embodiment, the number of the fixing posts 620 is four, and the number of the fixing holes 613 is greater than that of the fixing posts 620, so that the fixing posts 620 can be selectively installed in different fixing holes 613, thereby adapting to different fuselages.

Fig. 4 is a schematic diagram of the image transmission apparatus 010 without the filter 600 according to an embodiment of the present application. As shown in fig. 4, the mounting seat 610 is provided with a first through hole 612 for connection with the housing 100, a first screw hole 611 for connection with the filter 600, and a fixing hole 613 for connection with the fixing post 620. In addition, the mounting seat 610 is further provided with a weight-reducing slot 614, and the weight-reducing slot 614 is specifically located on a face of the mounting seat 610 facing the filter 600.

FIG. 5 is a schematic view of the fan 500 mounted to the first housing half 110 according to an embodiment of the present invention;

fig. 6 is an outside view of the first housing half 110 according to an embodiment of the present invention. As shown in fig. 5 and 6, a fan 500 is installed at an outer side of the first half-shell 110 for blowing air toward the first half-shell 110 to enhance convection heat dissipation. The first half-shell 110 is further provided with a frequency-matching key 104, and the frequency-matching key 104 is mounted in a corresponding hole on the first half-shell 110 and attached to a patch switch on the image transmission module 200. By pressing the frequency-matching key 104, the patch switch can be triggered to realize the frequency-matching function. The counter frequency key 104 can be covered with a waterproof sticker to play a role of sealing and waterproofing, and the waterproof sticker can be printed to play a role of prompting. The first half shell 110 is further provided with an indicator light 103, and the indicator light 103 is connected with the image transmission module 200 and is used for displaying the state of the image transmission module 200. The indicator light 103 may be a light guide bar capable of guiding light emitted from the light emitting device in the image transmission module 200 to the surface of the first half shell 110.

In this embodiment, the outer side of the first half shell 110 is provided with a fin array, the fin array includes a plurality of heat dissipation fins 130 spaced from each other, and the heat dissipation fins 130 increase the heat dissipation area, thereby improving the heat dissipation efficiency. The fan 500 is disposed on the fin array, and in particular, the fan 500 is disposed on the fin array of the first housing half 110. Since the power amplification module 300 has a large amount of heat generation, the fan 500 is opposite to the power amplification module 300 in the axial direction thereof, thereby enhancing heat dissipation to the power amplification module 300. In this embodiment, the fan 500 is an axial fan 500, the air outlet side faces the first half shell 110, and the air outlet direction of the fan 500 is parallel to the height direction of the heat dissipation fins 130, so that the air outlet of the fan 500 can be directly blown into the gaps between the heat dissipation fins 130, thereby enhancing the surface heat dissipation of the heat dissipation fins 130. The fin array is provided with heat dissipation grooves 131, the depth direction of the heat dissipation grooves 131 is consistent with the height direction of the heat dissipation fins 130, and the extension direction of the heat dissipation grooves 131 is perpendicular to the extension direction of the heat dissipation fins 130. The heat dissipation grooves 131 can further enhance the heat dissipation performance of the first half shell 110. As shown in fig. 6, the first half shell 110 is provided with four second screw holes 111 for fixing the fan 500; in addition, the first half case 110 is further provided with two second through holes 112 for fixing a heat conduction member 311 (see fig. 12) on the power amplification module 300. The first half shell 110 is further provided with a fan wire through hole 113 for passing a power wire of the fan 500.

Referring to fig. 3, in the present embodiment, a shielding partition is disposed in the casing 100, and the shielding partition separates the power amplification module 300 from the image transmission module 200. The shielding partitions divide the accommodation chamber into a plurality of regions, and the power amplification module 300 and the image transmission module 200 are respectively disposed in different regions. In this embodiment, the image transmission device 010 further includes a power detection module 400, and the power detection module 400 is separated from the power amplification module 300 and the image transmission module 200 by shielding partitions. Therefore, the shielding partition in the present embodiment approximately divides the accommodating chamber of the housing 100 into three regions for accommodating the power amplification module 300, the image transmission module 200, and the power detection module 400, respectively.

The shielding partitions may separate different modules to avoid interference between the modules. It should be understood that the arrangement of the shielding partitions may be determined according to the installation position and size of each module. The shielding partition is disposed inside the first half-shell 110 and/or the second half-shell 140, that is, the shielding partition may be disposed inside the first half-shell 110 or inside the second half-shell 140. In the present embodiment, shielding partitions are disposed on the first half shell 110 and the second half shell 140, and the shielding partitions on the first half shell 110 and the second half shell 140 jointly partition the image transmission module 200, the power amplification module 300 and the power detection module 400. For convenience of description, the shielding partition disposed inside the first half case 110 is expressed as a first shielding partition 114, and the shielding partition inside the second half case 140 is expressed as a second shielding partition 141 (see fig. 9).

Fig. 7 is a schematic view of the inside of the first housing half 110 according to an embodiment of the present invention. As shown in fig. 7, the first shielding partition 114 divides the inner side surface of the first half shell 110 into three regions, wherein the left region corresponds to the image transmission module 200, the upper right region corresponds to the power amplification module 300, and the lower right region corresponds to the power detection module 400. The shielding partition plates are used for separating the modules, so that mutual influence among the modules is avoided, and mutual influence among all components in the modules can still exist. Therefore, in this embodiment, the first shielding rib 115 is disposed on the inner side of the first half shell 110, the first shielding rib 115 is located at a position corresponding to the image transmission module 200 and is protruded on the inner surface of the first half shell 110, and the first shielding rib 115 is used for separating different components in the image transmission module 200 to avoid electromagnetic interference between the components.

Some components in the image transmission module 200 are heat generating devices with larger heat generation amount, and therefore, the inner side of the casing 100 is provided with the second heat conducting boss 116, specifically, the inner side of the first half shell 110 is provided with the second heat conducting boss 116, and the second heat conducting boss 116 abuts against the heat generating devices in the image transmission module 200 through the heat conducting pad. The second heat conduction boss 116 can transfer heat of the heat generating device of the image transmission module 200 to the first half shell 110, and the heat conduction pad eliminates an air gap and enhances the heat conduction effect. The inner side of the casing 100 is provided with a heat conduction groove 125 and an avoidance groove 126, specifically, the area of the inner side of the first half shell 110 corresponding to the power amplification module 300 is provided with the heat conduction groove 125 and the avoidance groove 126, the heat conduction groove 125 is used for embedding the heat conduction member 311 in the power amplification module 300 and plays a role of stabilizing the heat conduction member 311, and the avoidance groove 126 can avoid components in the power amplification module 300.

In this embodiment, a plurality of third screw holes 117 for fixing the second half-shell 140 are further disposed on the inner side of the first half-shell 110, and the number of the third screw holes 117 in this embodiment is 8. A plurality of fourth screw holes 118 for fixing the image transmission module 200 are further disposed on the inner side of the first half shell 110, and the number of the fourth screw holes 118 in this embodiment is 6. The inner side of the first half-shell 110 is further provided with a plurality of fifth screw holes 119 for fixing the power amplification module 300, in this embodiment, the number of the fifth screw holes 119 is 9, and since the power amplification module 300 has a large heat generation amount, the power amplification module 300 can be more stable due to multi-point fixation, so that the heat deformation can be effectively resisted, and the transmission effect can be improved. A plurality of sixth screw holes 120 for fixing the power detection module 400 are further provided at the inner side of the first half shell 110.

The lateral surface of the first half-shell 110 is provided with a seventh screw hole 121 and an eighth screw hole 122, the seventh screw hole 121 is used for mounting the external connector 101, and the eighth screw hole 122 is used for mounting the rf connector 102.

The first half shell 110 is further provided with a third through hole 123 and a fourth through hole 124, the third through hole 123 is used for installing the indicator light 103, and the fourth through hole 124 is used for installing the frequency-adjusting button 104.

FIG. 8 is an outside view of the second housing half 140 according to one embodiment of the present application; fig. 9 is a schematic view of the inside of the second half-shell 140 according to an embodiment of the present application. As shown in fig. 8 and 9, a second shielding partition 141 is disposed inside the second half-shell 140, the second shielding partition 141 encloses a rectangular frame and is mainly used for isolating the power amplification module 300 from other modules, and a wire passing groove 142 is disposed on the second shielding partition 141. A second shielding rib 143 is further disposed on the inner surface of the second half-shell 140 in a region corresponding to the power amplification module 300, and the second shielding rib 143 is used for separating different components in the power amplification module 300. The second shielding rib 143 serves to separate different components of the power amplifying module 300 that may affect each other, similarly to the function of the first shielding rib 115.

The inner side of the housing 100 is provided with a first heat conduction boss 144, and specifically, the inner side of the second half shell 140 is provided with a first heat conduction boss 144, and the first heat conduction boss 144 abuts against the image transmission circuit board 210 (see fig. 10) of the image transmission module 200 through a heat conduction pad. The first heat-conducting bosses 144 can guide heat of the heat-conducting circuit board 210 to the second half case 140, and the heat-conducting pads can reduce air gaps between the first heat-conducting bosses 144 and the heat-conducting circuit board 210, thereby improving heat-conducting efficiency.

The second half-shell 140 is provided with a plurality of fifth through holes 145, the fifth through holes 145 correspond to the third screw holes 117 of the first half-shell 110 one by one, and the fifth through holes 145 are used for connecting the first half-shell 110 through screws. In this embodiment, a part of the fifth through hole 145 corresponds to the first through hole 612 of the mounting base 610, and the fifth through hole 145 is also used for fixing the mounting base 610, that is, the first through hole 612, the fifth through hole 145 and the third screw hole 117 are matched with the same screw.

In the present embodiment, the edge of the second half-shell 140 is provided with a flange 146, and the flange 146 can be embedded into the inside of the first half-shell 110 when the first half-shell 110 is spliced with the second half-shell 140, so as to achieve positioning. In this embodiment, the abutting surfaces of the first half-shell 110 and the second half-shell 140 are coated with the sealing conductive adhesive, so as to perform the functions of shielding and sealing. A sealing conductive paste may be applied between the outer side of the flange 146 and the first half-shell 110.

As shown in fig. 8, in the present embodiment, the outer side of the second half-shell 140 is also provided with heat dissipation fins 130 in an array to enhance the heat dissipation effect.

FIG. 10 is a diagram illustrating an image transmission module 200 according to an embodiment of the present disclosure from a first perspective; fig. 11 is a schematic diagram of an image transmission module 200 in a second viewing angle according to an embodiment of the present disclosure. As shown in fig. 10 and 11, the image transmission module 200 includes a circuit board 210 and several components disposed on the circuit board 210, the circuit board 210 having a first surface and a second surface opposite to each other, the first surface facing the first half-shell 110, and the second surface facing the second half-shell 140. In this embodiment, the first surface and the second surface of the circuit board 210 are both provided with components. The circuit board 210 is further provided with a first copper exposing region 211 and a second copper exposing region 212.

Fig. 10 shows a first surface of the image-through circuit board 210, wherein a first copper exposing region 211 is disposed on the first surface of the image-through circuit board 210, and the first copper exposing region 211 corresponds to and abuts against the first shielding rib 115 of the first half shell 110. The area indicated by the dotted line in fig. 10 is the first copper exposing area 211, and the first copper exposing area 211 avoids the component, and the extending path thereof corresponds to the extending path of the first shielding rib 115. By abutting the first shielding rib 115 against the first copper exposed region 211, the effects of grounding and shielding are achieved.

Fig. 11 shows the second side of the circuit board 210, and the second side of the circuit board 210 is provided with a second copper exposing region 212, and the second copper exposing region 212 of the circuit board 210 can abut against the first heat conducting protrusion 144 on the second half-shell 140 (through the heat conducting pad). The area enclosed by the dashed line in fig. 11 is the second copper-exposed area 212. The second copper exposed area 212 may transfer heat to the second half case 140 through the thermal pad and the first thermal conductive boss 144, and finally, transfer heat to the outside through the heat dissipation fins 130 outside the second half case 140.

Fig. 12 is a schematic diagram of a power amplifier module 300 according to an embodiment of the present disclosure. As shown in fig. 12, the power amplification module 300 includes a power amplifier circuit board 310, and a heat conducting element 311 and several components disposed on the power amplifier circuit board 310, wherein the heat conducting element 311 is attached to the inner side of the casing 100. In this embodiment, the power amplifier circuit board 310 also has a first side and a second side opposite to each other, wherein the first side faces the first half shell 110, and the second side faces the second half shell 140. Fig. 12 shows a first surface of the power amplifier circuit board 310, the heat conducting member 311 is disposed on the first surface of the power amplifier circuit board 310, the components of the power amplifier module 300 are disposed on a second surface of the power amplifier circuit board 310, and the first surface of the power amplifier circuit board 310 is copper-plated and attached to the inner side of the casing 100 through a heat conducting adhesive. As shown in fig. 12, in this embodiment, the first surface of the power amplifier circuit board 310 is not provided with components, but is completely plated with copper for enhancing heat dissipation. When the installation is completed, the heat conducting member 311 is embedded in the heat conducting groove 125 of the first housing half 110 and attached to the inner wall of the heat conducting groove 125 through the heat conducting glue, so as to eliminate the air gap and improve the heat conducting efficiency. Optionally, the heat conducting member 311 is a copper block; in alternative embodiments, the heat conducting member 311 may also be made of other metal or alloy with high thermal conductivity, such as aluminum, silver, steel, etc.

The embodiment of the application still provides an unmanned aerial vehicle (not shown in the figure), including fuselage and image transmission device 010, image transmission device 010 passes through fixed column 620 and connects on unmanned aerial vehicle's the fuselage. Of course, the drone should also include other components or devices for implementing basic functions of the drone, such as a power component, and the manner of setting these components or devices may refer to the drone in the prior art, which is not described herein in detail.

To sum up, the image transmission device 010 according to the embodiment of the present application includes the housing 100 forming the accommodating cavity, and the power amplification module 300 and the image transmission module 200 disposed in the housing 100, wherein the power amplification module 300 is electrically connected to the image transmission module 200. The image transmission device 010 provided by the embodiment of the application integrates the power amplification module 300 into the image transmission device 010, so that the image transmission device 010 can realize long-distance transmission and has high integration level and stable structure. The unmanned aerial vehicle that this application embodiment provided includes foretell image transmission device 010, consequently need not alone external power amplifier also can realize long distance image transmission.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (22)

1. An image transmission device is applied to an unmanned aerial vehicle and is characterized by comprising a shell forming an accommodating cavity, and a power amplification module and an image transmission module which are arranged in the shell, wherein the power amplification module is electrically connected with the image transmission module;

and a shielding clapboard is arranged in the shell and separates the power amplification module from the image transmission module.

2. The image transmission device according to claim 1, wherein the housing includes a first half shell and a second half shell, the first half shell and the second half shell are spliced to jointly enclose the accommodating cavity of the housing, and the shielding partition is arranged on the inner side of the first half shell and/or the second half shell.

3. The image transmission device according to claim 2, wherein a mating surface of the first half shell and the second half shell is coated with a sealing conductive adhesive.

4. The image transmission device according to claim 1, further comprising a power detection module disposed within the housing, the power detection module being separated from the power amplification module and the image transmission module by the shielding partition.

5. The image transmission device according to any one of claims 1 to 4, wherein the inner surface of the housing is provided with a first shielding rib for separating different components in the image transmission module;

and/or the inner surface of the shell is provided with a second shielding rib, and the second shielding rib is used for separating different components in the power amplification module.

6. The image transmission device according to claim 5, wherein the image transmission module comprises a picture transmission circuit board and a plurality of components arranged on the picture transmission circuit board, wherein a first copper exposure area is arranged on the picture transmission circuit board, and the first copper exposure area corresponds to the first shielding rib in position and is abutted against the first shielding rib.

7. The image transmitting device according to any one of claims 1 to 4, wherein the housing is provided on an outer side thereof with a fin array comprising a plurality of mutually spaced heat dissipating fins.

8. The image transmission device according to claim 7, further comprising a fan disposed on the fin array.

9. The image transmission apparatus according to claim 8, wherein the fan is located opposite to the power amplification module in an axial direction thereof.

10. The image transmission device according to claim 7, wherein the fin array is provided with heat dissipation grooves, and a depth direction of the heat dissipation grooves is consistent with a height direction of the heat dissipation fins.

11. The image transmission apparatus according to claim 10, wherein an extending direction of the heat dissipation groove is perpendicular to an extending direction of the heat dissipation fin.

12. The image transmission device according to any one of claims 1 to 4, wherein the image transmission module includes a pattern-transmission circuit board and a plurality of components arranged on the pattern-transmission circuit board, and a first heat-conduction boss is arranged inside the housing and abuts against the pattern-transmission circuit board through a heat-conduction pad.

13. The image transmission device according to claim 12, wherein a second copper exposed area is provided on the image-transmitting circuit board, and the first heat-conducting boss abuts against the second copper exposed area of the image-transmitting circuit board.

14. The image transmission device according to any one of claims 1 to 4, wherein a second heat conduction boss is provided inside the housing, the second heat conduction boss abutting against a heat generating device in the image transmission module through a heat conduction pad.

15. The image transmission device according to any one of claims 1 to 4, wherein the power amplification module includes a power amplifier circuit board, and a heat conduction member and a plurality of components disposed on the power amplifier circuit board, the heat conduction member being attached to an inner side of the housing.

16. The image transmission apparatus according to claim 15, wherein the housing is provided at an inner side thereof with a heat conduction groove, and the heat conduction member is embedded in the heat conduction groove and attached to an inner wall of the heat conduction groove by a heat conduction adhesive.

17. The image transmission device according to claim 16, wherein the power amplifier circuit board includes a first surface and a second surface opposite to each other, the heat conducting member is disposed on the first surface of the power amplifier circuit board, the components of the power amplifier module are disposed on the second surface of the power amplifier circuit board, and the first surface of the power amplifier circuit board is copper-plated and attached to the inner side of the casing through a heat conducting adhesive.

18. The image transmitting device according to claim 15, wherein the heat conductive member is a copper block.

19. The image transmission device according to any one of claims 1 to 4, further comprising a filter provided outside the housing, the filter being electrically connected to the image transmission module.

20. The image transmission device according to claim 19, wherein a mount is provided on an outer side of the housing, and the filter is provided on the mount.

21. The image transmission device according to claim 20, wherein a fixing post is arranged on the mounting seat, and the fixing post is used for connecting a body of the unmanned aerial vehicle.

22. An unmanned aerial vehicle comprising the image transmission device of any one of claims 1-21.

Images