CN212163493U

CN212163493U - Thermal imaging apparatus

Info

Publication number: CN212163493U
Application number: CN202020620178.7U
Authority: CN
Inventors: 肖达度
Original assignee: Zhejiang Dahua Technology Co Ltd
Current assignee: Zhejiang Huagan Technology Co ltd
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2020-12-15
Anticipated expiration: 2030-04-22

Abstract

The utility model relates to an imaging device technical field especially relates to a thermal imaging device. A thermal imaging device comprises a first shell, a second shell, a thermal imaging module, a mainboard module and a heat insulation assembly, wherein the first shell is in contact with and connected with the second shell, and a cavity is enclosed between the first shell and the second shell; the mainboard module and the thermal imaging module are accommodated in the cavity and are respectively arranged on the first shell and the second shell; the thermal insulation assembly is accommodated in the cavity and comprises a heat dissipation piece and a thermal insulation piece, the heat dissipation piece is installed in the first shell and used for heat dissipation of the mainboard module, the thermal insulation piece is installed in the second shell and an independent accommodating space is formed between the inner walls of the second shell in a surrounding mode, and the thermal imaging module is located in the accommodating space. The utility model has the advantages that: the thermal imaging module has higher detection precision on the temperature, and the imaging quality of the equipment is also better.

Description

Thermal imaging apparatus

Technical Field

The utility model relates to an imaging device technical field especially relates to a thermal imaging device.

Background

The thermal imaging device utilizes an infrared detector and an optical imaging objective lens to receive an infrared radiation energy distribution pattern of a detected target and reflect the infrared radiation energy distribution pattern on a photosensitive element of the infrared detector so as to obtain an infrared thermography, and the thermography corresponds to a thermal distribution field on the surface of an object. The type of the image sensor of the key device of the thermal imaging camera is generally CCD or CMOS, which belong to heat sensitive devices, and the reliability and the service life of the thermal imaging camera are directly influenced by the temperature.

Conventionally, in order to improve the temperature measurement accuracy of a thermal image sensor. It is common to add a heat sink plate between the image sensor and the PCB or to provide a plastic heat isolation ring between the front case and the rear case. In the above schemes, if the power consumption on the main board is large, the heat can be transferred to the front shell through the rear shell, so that the precision of the thermal image sensor is influenced; alternatively, other power consumption devices are located in the same chamber as the image sensor, and heat transfer to the power consumption devices may also affect the accuracy of the image sensor.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is desirable to provide a thermal imaging apparatus capable of reducing the influence of an external temperature on a thermal image sensor and improving the temperature measurement accuracy of the thermal image sensor.

In order to solve the technical problem, the utility model provides a following technical scheme:

a thermal imaging device comprises a first shell, a second shell, a thermal imaging module, a mainboard module and a heat insulation assembly, wherein the first shell is in contact with the second shell, and the first shell and the second shell are connected to enclose a cavity; the mainboard module and the thermal imaging module are accommodated in the cavity and are respectively arranged on the first shell and the second shell;

the thermal insulation assembly is accommodated in the cavity and comprises a heat dissipation piece and a thermal insulation piece, the heat dissipation piece is installed in the first shell and used for heat dissipation of the mainboard module, the thermal insulation piece is installed in the second shell and an independent accommodating space is formed between the inner walls of the second shell in a surrounding mode, and the thermal imaging module is located in the accommodating space.

In this application, through separately setting up mainboard module and thermal imaging module to and set up heat dissipation piece and heat insulating part, when improving the mainboard module heat dissipation, and surround thermal imaging module through heat insulating part, with block that thermal imaging module receives the influence of other dissipation parts heat that gives off in the cavity, and then improve the detection precision of thermal imaging module to the temperature.

In one embodiment, the thermal insulator is a plastic part, and the plastic part is detachably mounted to the second housing.

It can be understood that the plastic part is mounted in a detachable mode, so that the thermal imaging module is more convenient to disassemble and assemble and is convenient to replace.

In one embodiment, the heat insulation piece is U-shaped, an installation part is arranged on the outer side wall of the opening end of the heat insulation piece, a supporting part is arranged in the second shell, and the installation part is supported against the supporting part and locked through a fastening piece.

In one embodiment, the abutting portion is provided with a groove, the open end of the heat insulation piece can extend into the groove, and the mounting portion abuts against the abutting portion.

In one embodiment, the heat insulation member and the second shell are provided in an integrated structure.

It can be understood that the arrangement of the integrated structure is beneficial to improving the sealing performance of the accommodating space; meanwhile, the whole second shell is convenient to process.

In one embodiment, the first housing is a plastic housing and the second housing is a metal housing.

It can be understood that the second housing is provided as a plastic housing, so that the heat transfer from the first housing to the second housing can be greatly reduced to reduce the influence of the heat at the first housing on the thermal imaging module.

In one embodiment, the motherboard module includes a motherboard and a first power consumption element, the motherboard is fixed to the heat dissipation element, and the first power consumption element is installed on the motherboard and located between the motherboard and the heat dissipation element.

In one embodiment, a heat conduction element for conducting heat of the first power consumption element to the heat dissipation element is disposed between the first power consumption element and the heat dissipation element.

It can be appreciated that by providing the heat conductive member, the heat dissipation of the first power consumption member is facilitated.

In one embodiment, the first housing has a mounting hole communicating with the chamber, and the heat sink is received in the mounting hole and fixed to the first housing.

It can be understood that, by forming the mounting hole, the heat sink is directly contacted with the air for heat exchange, thereby reducing the heat transfer from the first casing to the second casing.

In one embodiment, the thermal imaging apparatus further comprises a second power consumption member located in the chamber and detachably mounted to the second housing.

Compared with the prior art, the thermal imaging device that this application provided is through separately setting up mainboard module and thermal imaging module to and set up heat dissipation piece and heat insulating part, when improving mainboard module's heat dissipation, and surround thermal imaging module through the heat insulating part, in order to block that thermal imaging module receives the influence of other dissipation spare heat that dispel in the cavity, and then improve the detection precision of thermal imaging module to the temperature.

Drawings

Fig. 1 is a schematic cross-sectional structural view of a thermal imaging apparatus provided by the present invention.

Fig. 2 is a schematic perspective view of the first housing according to the present invention.

Fig. 3 is a schematic cross-sectional structural diagram of the first housing according to the present invention.

Fig. 4 is a schematic view of a perspective three-dimensional structure of the second housing according to the present invention.

Fig. 5 is a schematic view of another perspective three-dimensional structure of the second housing according to the present invention.

Fig. 6 is a schematic cross-sectional structural view of the second housing according to the present invention.

Main element number description:

100. a thermal imaging device; 10. a first housing; 101. a chamber; 11. mounting holes; 20. a second housing; 21. a cavity; 22. an abutting portion; 221. a groove; 23. a through hole; 24. an accommodating space; 30. a thermal imaging module; 40. a motherboard module; 41. a main board; 42. a first power consumption element; 43. a heat conductive member; 50. an insulating assembly; 51. a heat sink; 52. a thermal insulation member; 521. an installation part; 60. a second power consumption element; 61. a visible light module; 62. and a light supplement lamp module.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the utility model provides a thermal imaging device 100, this thermal imaging device 100 mainly used research and development or industrial detection and equipment maintenance to reach fields such as fire prevention, night vision, human temperature measurement field. Here, the thermal imaging device 100 is a thermal imaging camera or other device utilizing the thermal imaging principle.

Preferably, in the present invention, the thermal imaging device 100 is a thermal imaging camera, and the structure and the principle of the present invention are mainly explained by the thermal imaging camera, as follows.

Referring to fig. 1, the thermal imaging apparatus 100 includes a first housing 10, a second housing 20, a thermal imaging module 30, a motherboard module 40, and a thermal insulation assembly 50, wherein the first housing 10 contacts the second housing 20, and the first housing 10 and the second housing 20 are connected to form a chamber 101; the main board module 40 and the thermal imaging module 30 are accommodated in the cavity 101 and respectively mounted on the first casing 10 and the second casing 20, and the heat insulation assembly 50 is accommodated in the cavity 101 and used for reducing the influence of heat generated by the main board module 40 or other power consumption components on the thermal imaging module 30, so that the temperature measurement accuracy of the thermal imaging module 30 is improved, and the service life of the thermal imaging module 30 is prolonged.

It can be understood that, in the present embodiment, the main board module 40 and the thermal imaging module 30 are respectively installed in the first casing 10 and the second casing 20, that is, the main board module 40 and the thermal imaging module 30 are independently installed at the positions in the cavity 101, and the heat blocking/dissipating paths of the heat blocking/dissipating module and the thermal imaging module 30 are respectively independent through the heat blocking/dissipating module of the heat insulation assembly 50, so that the influence of the heat generated by the main board module 40 on the thermal imaging module 30 is reduced to the maximum extent, and the temperature measurement accuracy of the thermal imaging module 30 is further improved, thereby the imaging quality of the thermal imaging apparatus 100 is improved.

It should be explained that the first casing 10 is in contact with the second casing 20, that is, the first casing 10 is disposed in close contact with the second casing 20. Preferably, the first casing 10 and the second casing 20 are detachably connected to each other, so that the first casing 10 and the second casing 20 can be conveniently detached from each other.

Preferably, the first housing 10 and the second housing 20 can be detachably connected by a snap structure, a screw, or the like. In the present embodiment, the detachable connection between the first housing 10 and the second housing 20 is achieved by screws. Here, the screw may be a screw, a bolt, or the like.

As shown in fig. 2 and 3, the first housing 10 is a plastic housing, which is also called a rear case. Specifically, the first casing 10 may be made of polyethylene, polypropylene, polyethylene terephthalate, or the like. It can be understood that the plastic housing has poor thermal conductivity, so that the heat generated by the power consumption components such as the motherboard module 40 can be prevented from being transferred to the second housing 20 through the first housing 10, so as to affect the temperature measurement accuracy of the thermal imaging module 30. Of course, other materials may be used for the first housing 10, such as a metal housing, when the thermal insulation assembly 50 is capable of insulating all or most of the heat.

As shown in fig. 4 to 6, the second housing 20 is a metal housing, which is also referred to as a front case. Specifically, the second casing 20 may be a casing made of copper, aluminum, copper-aluminum alloy, or the like. The second casing 20 has a cavity 21 with an opening at one end, and the first casing 10 covers the opening of the cavity 21 to enclose the chamber 101.

Further, a through hole 23 communicating with the cavity 21 is formed in the second housing 20, and the thermal imaging module 30 is accommodated in the cavity 21 and partially extends into the through hole 23, so that the thermal imaging module 30 monitors the temperature of the outside through the through hole 23.

The thermal imaging module 30 mainly includes a thermal image sensor and some structures connected to the thermal image sensor for transmitting/receiving signals, which are conventionally used modules and will not be described herein.

As shown in fig. 2 and 3, the main board module 40 includes a main board 41 and a first power consumption element 42, the main board 41 is fixed on the heat insulation assembly 50, and the first power consumption element 42 is mounted on the main board 41 and located between the main board 41 and the heat insulation assembly 50, so that heat on the main board 41 and the first power consumption element 42 is dissipated to the outside through the heat insulation assembly 50 to avoid/shield the heat from affecting the thermal imaging module 30 in the chamber 101. That is, here, heat generated from the main board module 40 is directly heat-exchanged with the outside air through the heat insulation assembly 50, thereby achieving heat dissipation to the main board module 40.

The main board 41 is preferably a PCB board, and is mainly used for controlling the operation of the thermal imaging apparatus 100. When assembled, the main panel 41 is secured to the insulation assembly 50 by fasteners such as screws, bolts, or the like. The first power consumption member 42 is a component mounted on the main board 41 in the general thermal imaging camera, and may be 1 component or a plurality of components. Here, detailed examples are not given.

As shown in fig. 1, 3 and 6, the heat insulation assembly 50 includes a heat dissipation member 51 and a heat insulation member 52, the heat dissipation member 51 is mounted on the first casing 10 and is used for dissipating heat of the motherboard module 40, the heat insulation member 52 is mounted on the second casing 20 and encloses an independent accommodation space 24 with an inner wall of the second casing 20, and the thermal imaging module 30 is located in the accommodation space 24, that is, the thermal imaging module 30 is enclosed by the heat insulation member 52 to block the thermal imaging module 30 from being affected by heat dissipated by other power consumption members in the chamber 101, so as to improve the detection accuracy of the thermal imaging module 30 on temperature.

Preferably, the heat sink 51 is a metal member, such as a material having good thermal conductivity, e.g., copper or aluminum. The heat sink 51 has a substantially plate shape. The main board 41 is fixed on the heat sink 51, and the first power consumption element 42 is disposed between the main board 41 and the heat sink 51 and electrically connected to the main board 41.

Further, the first housing 10 is opened with a mounting hole 11 communicating with the chamber 101, and the heat sink 51 is accommodated in the mounting hole 11 and fixed to the first housing 10. It can be understood that the heat transfer from the first casing 10 to the second casing 20 is reduced by opening the mounting hole 11 so that the heat sink 51 directly contacts the air for heat exchange.

Preferably, a heat conduction member 43 for conducting heat of the first power consumption element 42 to the heat dissipation member 51 is disposed between the first power consumption element 42 and the heat dissipation member 51. It can be understood that, by providing the heat conduction member 43, it is beneficial to extend the heat of the main board 41 and the first power consumption member 42 to the heat dissipation member 51, so as to dissipate the heat more conveniently and quickly.

Alternatively, the heat-conducting member 43 may be a silicone pad or a rubber pad. In the present embodiment, the heat conducting member 43 is a silicone pad.

The heat insulation member 52 is a plastic member, and the plastic member is detachably mounted on the second housing 20, i.e. the heat insulation member 52 and the second housing 20 are separated. It can be appreciated that the plastic member can be detachably mounted, which facilitates the assembly and disassembly of the thermal imaging module 30. Of course, in another embodiment, the heat insulation member 52 may be integrated with the second housing 20 to improve the sealing performance of the receiving space 24 and to facilitate the processing of the second housing 20 as a whole.

In the present embodiment, the thermal insulator 52 is detachably connected to the second housing 20 by bolts, screws, or the like, so as to facilitate installation, maintenance, and the like of the thermal imaging module 30.

Preferably, the thermal insulation member 52 can be a plastic member such as polyethylene, polypropylene, polyethylene terephthalate, etc. The thermal shield 52 is generally U-shaped. Of course, in other embodiments, the thermal shield 52 may have other shapes, so long as the thermal imaging module 30 is wrapped or isolated from the chamber 101 so that the thermal imaging module 30 is independent of the chamber 101.

Further, for better installation of the heat insulation member 52, an installation portion 521 is provided on an outer side wall of an opening end of the heat insulation member 52, an abutting portion 22 is provided in the second casing 20, and the installation portion 521 abuts against the abutting portion 22 and is locked by a fastener, so as to achieve installation of the heat insulation member 52. Here, the fastener may be a bolt/screw or the like.

Preferably, the abutting portion 22 is provided with a groove 221, an opening end of the heat insulating member 52 can extend into the groove 221, and the mounting portion 521 abuts against the abutting portion 22, that is, by pre-positioning the groove 221, so as to more conveniently mount the heat insulating member 52.

As shown in fig. 1, the thermal imaging apparatus 100 further includes a second power consumption member 60, and the second power consumption member 60 is located in the chamber 101 and detachably mounted to the second housing 20.

It will be appreciated that, from the purposes of providing the thermal shield 52, as will be better appreciated herein, the second energy dissipating member 60 is located within the same cavity 21 as the thermal imaging module 30; the thermal shield 52 can reduce the effect of other power consuming components on the thermal imaging module 30, and also reduce the effect of the heat generated by the second power consuming component 60 on the thermal imaging module 30.

Preferably, the second power consumption element 60 at least includes power consumption elements such as a visible light module 61 and a fill-up light module 62, and both the visible light module 61 and the fill-up light module 62 are detachably fixed in the cavity 21 by screws, bolts, and the like.

To better illustrate the advantages of the present invention, the heat dissipation path of the thermal imaging apparatus 100 is described in detail below:

the first power consumption element 42 on the main board 41 transfers heat to the heat dissipation element 51 through the heat conduction element 43, and the heat dissipation element 51 transfers most of the heat to the outside air, i.e., performs heat exchange (heat dissipation) with the outside air; a small portion of the heat is transferred to the first housing 10, and the heat is transferred from the first housing 10 to the thermal imaging module 30 in two ways, the first being thermal radiation through the air in the chamber 101, the second being thermal radiation through the second housing 20,

by providing the thermal insulation member 52 around the thermal imaging module 30, the influence of the thermal radiation of the air in the chamber 101 and the heat generated by the second power consumption member 60 on the thermal imaging module 30 is greatly reduced; meanwhile, the first shell 10 is a plastic shell, and the heat proportion is greatly reduced after the heat passes through the plastic shell.

It can be appreciated that the utility model discloses a separately set up mainboard module 40 and thermal imaging module 30 to and set up heat dissipation piece 51 and heat insulating part 52, when improving mainboard module 40's heat dissipation, and surround thermal imaging module 30 through heat insulating part 52, in order to block that thermal imaging module 30 receives the thermal influence that other consumption parts dispel in the cavity 101, and then improve thermal imaging module 30 to the detection precision of temperature.

The features of the above embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above embodiments are not described, but should be construed as being within the scope of the present specification as long as there is no contradiction between the combinations of the features.

It will be appreciated by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be taken as limiting the present invention, and that suitable modifications and variations of the above embodiments are within the scope of the invention as claimed.

Claims

1. A thermal imaging device comprises a first shell, a second shell, a thermal imaging module, a mainboard module and a heat insulation assembly, wherein the first shell is in contact with the second shell, and the first shell and the second shell are connected to enclose a cavity; the mainboard module and the thermal imaging module are accommodated in the cavity and are respectively arranged on the first shell and the second shell;

the thermal imaging module is characterized in that the thermal insulation assembly is contained in the cavity and comprises a heat dissipation piece and a thermal insulation piece, the heat dissipation piece is installed on the first shell and used for heat dissipation of the mainboard module, the thermal insulation piece is installed on the second shell and arranged in an independent containing space in a surrounding mode between the inner wall of the second shell, and the thermal imaging module is located in the containing space.

2. The thermal imaging apparatus of claim 1, wherein the thermal insulator is a plastic piece and the plastic piece is removably mounted to the second housing.

3. The thermal imaging apparatus according to claim 1, wherein the thermal insulation member is U-shaped, and a mounting portion is provided on an outer side wall of an opening end of the thermal insulation member, and an abutting portion is provided in the second housing, and the mounting portion abuts against the abutting portion and is locked by a fastener.

4. The thermal imaging apparatus according to claim 3, wherein the abutting portion has a groove formed thereon, the opening end of the heat insulating member is capable of protruding into the groove, and the mounting portion abuts against the abutting portion.

5. The thermal imaging apparatus of claim 1, wherein a unitary structure is provided between the thermal shield and the second housing.

6. The thermal imaging apparatus of claim 1, wherein the first housing is a plastic housing and the second housing is a metal housing.

7. The thermal imaging device of claim 1, wherein the motherboard module includes a motherboard secured to the heat sink and a first power dissipation element mounted to the motherboard between the motherboard and the heat sink.

8. The thermal imaging apparatus according to claim 7, wherein a heat conduction member for conducting heat of the first power consumption element to the heat dissipation member is provided between the first power consumption element and the heat dissipation member.

9. The thermal imaging apparatus according to claim 1, wherein the first housing has a mounting hole formed therein and communicating with the chamber, and the heat sink is received in the mounting hole and fixed to the first housing.

10. The thermal imaging apparatus of claim 1, further comprising a second power consumption member located within the chamber and removably mounted to the second housing.