CN216012500U

CN216012500U - Thermal imaging MIPI module

Info

Publication number: CN216012500U
Application number: CN202121998157.XU
Authority: CN
Inventors: 尹文利
Original assignee: Shenzhen Maiwei Vision Technology Co ltd
Current assignee: Shenzhen Maiwei Vision Technology Co ltd
Priority date: 2021-08-23
Filing date: 2021-08-23
Publication date: 2022-03-11
Anticipated expiration: 2031-08-23

Abstract

The utility model discloses a thermal imaging MIPI module, which comprises a shell, wherein the shell comprises a front cover and a rear shell which are connected with each other, a heat dissipation clapboard is arranged in the shell, the heat dissipation clapboard divides the inner side of the shell into two independent cavities, a first image acquisition board is arranged in the cavity close to one side of the front cover, a second image acquisition board and a main control board are arranged in the cavity close to one side of the rear shell, two MIPI interfaces are welded on the main control board, and a first heat resistance piece and a second heat resistance piece are also respectively arranged on two sides of the heat dissipation clapboard; a cover plate is further arranged between the front cover and the first image acquisition plate, the first image acquisition plate is fixed on one side of the cover plate, and an infrared shutter assembly connected with the first image acquisition plate is arranged on the other side surface of the cover plate; a heat conducting pad is also abutted between the first image acquisition board and the heat dissipation partition board. The technical scheme of the utility model improves the structure of the existing thermal imaging camera, improves the heat dissipation efficiency, and improves the resolution and the transmission speed.

Description

Thermal imaging MIPI module

Technical Field

The utility model relates to the technical field of industrial cameras, in particular to a thermal imaging MIPI module.

Background

With the development of industrial technology, thermal imaging cameras are widely applied to the fields of industrial automation, automobiles, forest fire prevention, medical science and the like, the market demand range is wider, and the requirements on the resolution, the function diversity and the transmission speed of the cameras are higher. The existing thermal imaging camera has low resolution, low transmission speed and poor heat dissipation effect.

Accordingly, the prior art is deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a thermal imaging MIPI module, aiming at improving the structure of the existing thermal imaging camera, improving the heat dissipation efficiency and the resolution and the transmission speed.

In order to achieve the purpose, the thermal imaging MIPI module provided by the utility model comprises a shell, wherein the shell comprises a front cover and a rear shell which are connected with each other, a heat dissipation clapboard is arranged in the shell and divides the inner side of the shell into two independent cavities, a first image acquisition board is arranged in the cavity close to one side of the front cover, a second image acquisition board and a main control board are arranged in the cavity close to one side of the rear shell, two MIPI interfaces are welded on the main control board, and a first heat resistance piece and a second heat resistance piece are respectively arranged on two sides of the heat dissipation clapboard; a cover plate is further arranged between the front cover and the first image acquisition plate, the first image acquisition plate is fixed on one side of the cover plate, and an infrared shutter assembly connected with the first image acquisition plate is arranged on the other side surface of the cover plate; and a heat conducting pad is abutted between the first image acquisition board and the heat dissipation partition board.

Preferably, the first image acquisition board is connected with the second image acquisition board through a flexible flat cable, the second image acquisition board is connected with the main control board through a connector, and the infrared shutter assembly is connected with the first image acquisition board through a connecting wire.

Preferably, the heat dissipation partition plate is provided with a via hole for the flexible flat cable to pass through.

Preferably, the heat conducting pad is a silica gel heat conducting pad.

Preferably, the heat dissipation partition plate and the outer side surface of the rear shell are provided with a plurality of heat dissipation grooves.

Compared with the prior art, the utility model has the beneficial effects that: the structure of the existing thermal imaging camera is improved, the structural layout is optimized, the partitioned heat dissipation is realized, the heat dissipation efficiency is greatly improved, and the MIPI interface is adopted, so that the transmission speed is high, the transmission data volume is large, and the anti-interference performance is good; the device can not only measure the surface temperature and temperature display of an object, but also set a temperature measuring range, has various color modes, records videos, provides emissivity setting, corrects a blackbody furnace and other function settings; high sensitivity and high resolution; plug and play drive design, simple and easy to use

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is an exploded view of the overall structure of a thermal imaging camera according to the present invention;

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

Referring to fig. 1, the thermal imaging MIPI module provided in this embodiment includes a housing, where the housing includes a front cover 11 and a rear shell 12 that are connected to each other, a heat dissipation partition plate 2 is installed in the housing, the heat dissipation partition plate 2 divides the inside of the housing into two separate cavities, a first image acquisition board 31 is installed in the cavity close to one side of the front cover 11, a second image acquisition board 32 and a main control board 33 are installed in the cavity close to one side of the rear shell 12, two MIPI interfaces are welded on the main control board 33, and a first heat blocking piece 41 and a second heat blocking piece 42 are further installed on two sides of the heat dissipation partition plate 2; a cover plate 5 is further installed between the front cover 11 and the first image acquisition plate 31, the first image acquisition plate 31 is fixed on one side of the cover plate 5, and an infrared shutter assembly 6 connected with the first image acquisition plate 31 is installed on the other side surface of the cover plate 5; a heat conducting pad 7 is further abutted between the first image acquisition board 31 and the heat dissipation partition board 2.

This implementation has improved the structure of thermal imaging camera, the structural layout has been optimized, divide the casing inside through heat dissipation baffle 2, thereby realize the subregion heat dissipation, mutual noninterference, the radiating efficiency is greatly improved, first image acquisition board 31 passes through heat conduction pad 7 and heat dissipation baffle 2 butt, in this embodiment, heat conduction pad 7 sets up to silica gel heat conduction pad 7, can transmit its heat to heat dissipation baffle 2 fast, thereby disperse to the outside, first thermal-insulated piece 41 and the second of hindering of installation respectively in heat dissipation baffle 2 both sides hinder thermal-insulated and heat dissipation of piece 42 further carrying out the subregion independently.

Further, first image acquisition board 31 with connect through the soft arranging wire between the second image acquisition board 32, second image acquisition board 32 with connect through the connector between the main control board 33, infrared shutter subassembly 6 pass through the connecting wire with first image acquisition board 31 is connected, makes things convenient for the electrical connection between the circuit board, makes things convenient for assembly and dismantlement, makes things convenient for the later stage to overhaul the change.

Furthermore, the heat dissipation partition plate 2 is provided with a via hole for the flexible flat cable to pass through, so that the flexible flat cable can be far away from the shell, a sufficient distance is kept, the sensor is prevented from being damaged by static electricity, the first image acquisition plate 31 can also dissipate heat through the heat dissipation partition plate 2, and the heat dissipation does not interfere with the heat dissipation of the rear end part.

Furthermore, a plurality of heat dissipation grooves 8 are formed in the outer side faces of the heat dissipation partition plate 2 and the rear shell 12, so that the contact area between the heat dissipation partition plate 2 and the rear shell 12 and the outside air is increased, and heat dissipation is further accelerated.

Furthermore, a blocking piece is arranged on the infrared shutter assembly 6, and when sunlight irradiates, the blocking piece can be automatically closed, so that the sensor detection surface is protected, and the RDAC can be periodically corrected.

Furthermore, all the components of the camera are fixedly connected through screws, so that the mounting stability between the structures is improved, the shaking is prevented, and the optical precision is effectively guaranteed.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A thermal imaging MIPI module is characterized by comprising a shell, wherein the shell comprises a front cover and a rear shell which are connected with each other, a heat dissipation partition plate is installed in the shell and divides the inner side of the shell into two independent cavities, a first image acquisition plate is installed in the cavity close to one side of the front cover, a second image acquisition plate and a main control plate are installed in the cavity close to one side of the rear shell, two MIPI interfaces are welded on the main control plate, and a first heat resistance piece and a second heat resistance piece are further installed on two sides of the heat dissipation partition plate respectively; a cover plate is further arranged between the front cover and the first image acquisition plate, the first image acquisition plate is fixed on one side of the cover plate, and an infrared shutter assembly connected with the first image acquisition plate is arranged on the other side surface of the cover plate; and a heat conducting pad is abutted between the first image acquisition board and the heat dissipation partition board.

2. The thermal imaging MIPI module of claim 1, wherein the first image acquisition board and the second image acquisition board are connected by a flexible flat cable, the second image acquisition board and the main control board are connected by a connector, and the infrared shutter assembly is connected with the first image acquisition board by a connection wire.

3. The thermal imaging MIPI module of claim 2, wherein the heat dissipation spacer is provided with a via hole for the flexible flat cable to pass through.

4. The thermal imaging MIPI module of claim 1, wherein the thermal pad is configured as a silicone thermal pad.

5. The thermal imaging MIPI module of claim 1, wherein the heat dissipation partition and the outer side of the rear housing are formed with a plurality of heat dissipation grooves.