CN113508571A

CN113508571A - Heat radiation structure, camera and unmanned vehicles

Info

Publication number: CN113508571A
Application number: CN202080017478.9A
Authority: CN
Inventors: 杜俊; 飯沼大
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2020-10-13
Filing date: 2020-10-13
Publication date: 2021-10-15
Also published as: WO2022077240A1

Abstract

Provided are a heat dissipation structure, a camera and an unmanned aerial vehicle. Wherein, heat radiation structure includes: the fan comprises a shell, a first circuit board, a second circuit board and a fan; the shell is provided with an inner cavity, a first air inlet communicated with the inner cavity and an air outlet communicated with the inner cavity; the first circuit board, the second circuit board and the fan are arranged in the inner cavity, the first circuit board and the second circuit board are arranged at intervals and oppositely, an air channel communicated with the air outlet is formed between the first circuit board and the second circuit board, and the fan is arranged between the first air inlet and the air channel and used for guiding air from the first air inlet to the air channel. The heat dissipation structure adopts the fan to dissipate heat for the two circuit boards simultaneously, has good heat dissipation effect, simple structure, compact structure, small heat dissipation power consumption and small weight. When the heat dissipation structure is applied to the camera of the unmanned aerial vehicle, the endurance time of the unmanned aerial vehicle can be prolonged.

Description

Heat radiation structure, camera and unmanned vehicles

Technical Field

The invention relates to the field of camera devices, in particular to a heat dissipation structure, a camera with the heat dissipation structure and an unmanned aerial vehicle with the camera.

Background

A camera in the related art includes a lens assembly and a heat dissipation structure, in which a circuit board is disposed. The camera has the following defects in specific application:

1) the circuit board of the heat dissipation structure generates heat seriously, and the temperature exceeds the optimal working temperature of the camera, thereby limiting the use temperature of the camera. If the camera is used in a high-temperature environment, the camera image is noisy, and the image quality is poor.

2) For the heat dissipation structure with two circuit boards, there are problems of large heat dissipation power consumption and difficult heat dissipation, and if each circuit board is separately provided with a heat dissipation system, the weight of the heat dissipation structure can be increased. If such a camera is applied to an unmanned aerial vehicle platform, the cruising duration of the unmanned aerial vehicle platform is reduced.

3) The heat dissipation air inlet of the heat dissipation structure is directly arranged outside, so that water drops are easily absorbed when the heat dissipation structure is used in an environment with water splashing, and the service life of an electric element inside the heat dissipation structure is influenced.

Disclosure of Invention

In a first aspect, embodiments of the present invention provide a heat dissipation structure, which can improve a heat dissipation effect, and has a simple structure and low heat dissipation power consumption.

The scheme provided by the embodiment of the invention is as follows: a heat radiation structure comprises a shell, a first circuit board, a second circuit board and a fan, wherein an inner cavity, a first air inlet communicated with the inner cavity and an air outlet communicated with the inner cavity are formed in the shell, the first circuit board, the second circuit board and the fan are arranged in the inner cavity, the first circuit board and the second circuit board are arranged at intervals and oppositely, an air channel communicated with the air outlet is formed between the first circuit board and the second circuit board, and the fan is arranged between the first air inlet and the air channel and used for guiding air to the interior of the air channel from the first air inlet.

In a second aspect, an embodiment of the present invention provides a camera, which includes a lens assembly and the heat dissipation structure described above, where the lens assembly is disposed at one end of the heat dissipation structure.

In a third aspect, the embodiment of the invention provides an unmanned aerial vehicle, which comprises a fuselage and the camera, wherein the camera is mounted on the fuselage.

According to the heat dissipation structure, the camera and the unmanned aerial vehicle provided by the embodiment of the invention, the air channel is formed between the first circuit board and the second circuit board, and the fan drives the external air to blow into the air channel from the first air inlet, so that the hot air in the air channel is discharged from the air outlet, and therefore, the effect of simultaneously performing heat dissipation on the two circuit boards by adopting one fan is realized. When the heat dissipation structure provided by the embodiment of the invention is applied to the camera of the unmanned aerial vehicle, the endurance time of the unmanned aerial vehicle can be prolonged.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view A-A of FIG. 1;

FIG. 3 is an enlarged partial schematic view at B in FIG. 2;

fig. 4 is a first schematic assembly diagram of the first circuit board, the first heat sink, the heat conducting component and the image sensor according to the embodiment of the present invention;

fig. 5 is a second schematic assembly diagram of the first circuit board, the first heat sink, the heat conducting assembly and the image sensor according to the embodiment of the invention;

fig. 6 is an assembly diagram of a first circuit board, a first heat sink, a heat-conducting bracket, and a heat-conducting fin according to an embodiment of the present invention;

fig. 7 is an assembly view of a second circuit board and a second heat sink provided by an embodiment of the present invention;

FIG. 8 is a schematic view of an assembly of a rear housing and a third heat sink provided by an embodiment of the present invention;

fig. 9 is an exploded view illustrating a rear case and a third heat sink according to an embodiment of the present invention;

FIG. 10 is a second exploded view of the rear housing and a third heat sink provided in accordance with an embodiment of the present invention;

fig. 11 is a schematic diagram of the composition of a first circuit board and a second circuit board provided by the embodiment of the invention;

fig. 12 is a schematic perspective view of an unmanned aerial vehicle provided by an embodiment of the invention.

The reference numbers illustrate:

10. a camera; 100. a heat dissipation structure; 110. a housing; 111. an inner cavity; 112. a first air inlet; 113. an air outlet; 114. an air duct; 115. a front housing; 116. a rear housing; 1161. a housing front; 1162. the back of the shell; 1163. a housing side portion; 1164. a first cavity; 1165. a second cavity; 120. a first circuit board; 121. a first side surface; 122. a second side surface; 123. a through hole; 124. a first edge; 125. a second edge; 126. a third edge; 127. a fourth edge; 128. a first input unit; 129. a first output unit; 130. a second circuit board; 131. a third side; 132. a fourth side; 133. a second input unit; 134. a processing unit; 135. a power management unit; 136. a second output unit; 140. a fan; 150. a first heat sink; 151. a heat sink body; 152. a boss; 153. a first rib; 160. a heat conducting component; 161. a heat conducting plate; 1611. a first side portion; 1612. a second side portion; 1613. a groove; 162. a thermally conductive support; 1621. an opening; 163. a heat conductive sheet; 170. an image sensor; 180. a second heat sink; 181. a second rib; 190. a third heat sink; 191. a shielding portion; 192. a connecting portion; 1921. a second air inlet; 193. a third rib; 200. a lens assembly; 20. a fuselage.

Detailed Description

The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture, and if the specific posture is changed, the directional indicator is changed accordingly.

It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be indirectly connected to the other element through intervening elements.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

As shown in fig. 1 to 12, a heat dissipation structure 100 provided by the embodiment of the invention is applied to a camera 10, and includes a housing 110, a first circuit board 120, a second circuit board 130, and a fan 140; the housing 110 is formed with an inner cavity 111, a first air inlet 112 communicated with the inner cavity 111, and an air outlet 113 communicated with the inner cavity 111; the first circuit board 120, the second circuit board 130 and the fan 140 are disposed in the inner cavity 111, the first circuit board 120 and the second circuit board 130 are disposed at an interval and opposite to each other, an air duct 114 communicating with the air outlet 113 is formed between the first circuit board 120 and the second circuit board 130, and the fan 140 is disposed between the first air inlet 112 and the air duct 114 for guiding air from the first air inlet 112 into the air duct 114. When the heat dissipation structure 100 operates, the first circuit board 120 and the second circuit board 130 both generate heat, in this embodiment, one fan 140 is adopted to dissipate heat for the two circuit boards (i.e., the first circuit board 120 and the second circuit board 130) at the same time, which is good in heat dissipation effect, and compared with a scheme that two fans 140 are adopted to dissipate heat for the two circuit boards respectively, the heat dissipation structure 100 of this embodiment has the characteristics of compact structure, simple structure, low heat dissipation power consumption, and small weight. Specifically, when the fan 140 works, external air is drawn into the inner cavity 111 from the first air inlet 112 and is guided into the air duct 114 between the first circuit board 120 and the second circuit board 130 to take away heat in the air duct 114 and blow out of the air outlet 113, so that the effect of dissipating heat for the first circuit board 120 and the second circuit board 130 is achieved.

Optionally, referring to fig. 1, fig. 2 and fig. 3, the heat dissipation structure 100 further includes a first heat sink 150, the first circuit board 120 has a first side 121 facing the air duct 114 and a second side 122 facing away from the air duct 114, the first heat sink 150 is disposed between the first side 121 and the air duct 114, and the first heat sink 150 abuts against the first side 121. Here, the first side surface 121 of the first circuit board 120 is configured to be attached to the first heat sink 150, so that heat of the first side surface 121 can be quickly conducted to the first heat sink 150, thereby improving the heat dissipation efficiency of the first circuit board 120. Specifically, when the first circuit board 120 works, the heat generated by the first side surface 121 is conducted to the first heat sink 150, and the air flowing in the air duct 114 exchanges heat with the first heat sink 150 to take away the heat from the first heat sink 150, so as to achieve the purpose of dissipating the heat of the first circuit board 120.

Optionally, the main heat generating device on the first circuit board 120 is disposed on the first side 121, which is beneficial to improve the heat dissipation effect and heat dissipation efficiency of the first circuit board 120 through the first heat sink 150.

Optionally, as shown in fig. 2 and 4, a plurality of first ribs 153 are formed at intervals on a side of the first heat sink 150 facing the air duct 114, which is beneficial to increase a contact area between the first heat sink 150 and air, and is beneficial to improve a heat dissipation effect and a heat dissipation efficiency of the first heat sink 150.

Optionally, as shown in fig. 1, fig. 2, fig. 3 and fig. 5, the heat dissipation structure 100 further includes a heat conduction assembly 160, the heat conduction assembly 160 extends from the second side 122 to connect with the first heat sink 150 for conducting heat from the second side 122 to the first heat sink 150. The first circuit board 120 is sandwiched between the heat conducting assembly 160 and the first heat sink 150, so that the heat on the front and back sides (i.e. the first side 121 and the second side 122) of the first circuit board 120 can be conducted to the first heat sink 150 for heat dissipation through the cooperation of the heat conducting assembly 160 and the first heat sink 150, thereby effectively improving the heat dissipation efficiency of the first circuit board 120.

Alternatively, referring to fig. 1, 2, 3 and 5, the heat conducting assembly 160 includes a heat conducting plate 161 and a heat conducting bracket 162, the heat conducting plate 161 having a first side 1611 facing away from the first circuit board 120 and a second side 1612 facing toward the first circuit board 120, the second side 1612 being stacked on the second side 122, and the heat conducting bracket 162 extending from the first side 1611 to connect to the first heat sink 150. Here, the heat conducting assembly 160 is stacked on the second side surface 122 through the heat conducting plate 161, and the heat conducting plate 161 and the first heat sink 150 are connected through the heat conducting bracket 162, which is beneficial to increasing the contact area of the heat conducting assembly 160 and the first circuit board 120, and thus, is beneficial to increasing the heat dissipation efficiency of the second side surface 122.

Optionally, as shown in fig. 1, 2, 3, and 5, the heat dissipation structure 100 further includes an image sensor 170, and the image sensor 170 abuts against the first side 1611. The image sensor 170 is used to collect an image signal of the lens assembly 200 and transmit the image signal to the first circuit board 120. Here, the image sensor 170 is disposed to abut against the first side 1611, so that heat generated by the image sensor 170 during operation can be conducted to the first heat sink 150 through the heat conducting assembly 160, which is beneficial to improving the heat dissipation effect and the heat dissipation efficiency of the image sensor 170, and does not need to additionally provide a separate heat dissipation device for dissipating heat of the image sensor 170.

Alternatively, as shown in fig. 1, 2, 3, and 5, the first side 1611 is formed with a recess 1613, and the image sensor 170 is mounted in the recess 1613. The arrangement of the recess 1613 is beneficial to improving the compactness of the heat dissipation structure 100, and is beneficial to improving the heat conduction effect of the heat conduction assembly 160 on the image sensor 170.

Optionally, as shown in fig. 1, 2, 3, 5, and 6, the first circuit board 120 is provided with a through hole 123 extending from the first side 121 toward the second side 122, and the first heat sink 150 includes a heat sink main body 151 located between the first side 121 and the air duct 114, and a boss 152 extending from the heat sink main body 151 through the through hole 123 and abutting against the second side 1612. The first ribs 153 are formed on the side of the heat sink main body 151 facing the air duct 114. The bosses 152 are provided to allow heat of the middle portion of the heat conductive plate 161 to be directly conducted to the first heat sink 150, thereby facilitating improvement of heat dissipation efficiency of the heat conductive plate 161.

Optionally, as shown in fig. 1, fig. 2, fig. 3 and fig. 5, the heat conducting assembly 160 further includes a heat conducting sheet 163, and two ends of the heat conducting sheet 163 abut against the first heat sink 150 and the second side surface 122 respectively for conducting heat from the second side surface 122 to the first heat sink 150. The heat dissipation efficiency of the second side surface 122 can be further improved by the arrangement of the heat conduction sheet 163.

Alternatively, as shown in fig. 1, 2, 5 and 6, the heat conductive bracket 162 and the heat conductive sheet 163 respectively wrap at least a portion of the edge of the first circuit board 120 from the periphery of the first circuit board 120. In this way, at least a portion of heat at each circumferential edge of the first circuit board 120 can be directly conducted to the first heat sink 150 through the heat conducting assembly 160 for heat dissipation, thereby facilitating to improve the heat dissipation efficiency of the first circuit board 120 and reducing the heat spreading from the edge of the first circuit board 120 to the periphery.

Alternatively, referring to fig. 1, 2, 5 and 6, the first circuit board 120 includes a first edge 124, a second edge 125, a third edge 126 and a fourth edge 127, the first edge 124 and the second edge 125 are disposed opposite to each other, the third edge 126 and the fourth edge 127 are disposed opposite to each other, the heat conductive bracket 162 covers at least a portion of the first edge 124, at least a portion of the second edge 125, and at least a portion of the third edge 126, and the heat conductive sheet 163 covers at least a portion of the fourth edge 127. Here, the heat conductive bracket 162 wraps three edges of the first circuit board 120, and the heat conductive sheet 163 wraps the other edge of the first circuit board 120, which is not only beneficial to improving the heat dissipation efficiency of the heat conductive assembly 160 to the second side surface 122, but also beneficial to assembling and disassembling the first circuit board 120 and the heat conductive assembly 160. Specifically, the heat conductive bracket 162 is formed with an opening 1621 toward the fourth edge 127, and the first circuit board 120 and the heat conductive plate 161 are mounted in and dismounted from the heat conductive bracket 162 from the opening 1621.

Alternatively, the heat conducting sheet 163 is a graphite sheet, which has high heat dissipation efficiency, small occupied space and light weight.

Optionally, as shown in fig. 1, fig. 2 and fig. 7, the heat dissipation structure 100 further includes a second heat sink 180, the second circuit board 130 has a third side 131 facing the air duct 114 and a fourth side 132 facing away from the air duct 114, the second heat sink 180 is disposed between the third side 131 and the air duct 114, and the second heat sink 180 abuts against the third side 131. Here, the third side 131 is attached to the second heat sink 180, so that the heat of the second circuit board 130 can be conducted to the second heat sink 180 for heat dissipation, thereby facilitating to improve the heat dissipation efficiency of the second circuit board 130.

Optionally, as shown in fig. 1, fig. 2 and fig. 7, the fourth side 132 abuts against an inner wall of the inner cavity 111, so that the fourth side 132 can be attached to the housing 110 for heat dissipation, thereby facilitating to improve the heat dissipation efficiency and the heat dissipation effect of the second circuit board 130.

Optionally, the heating power of the third side 131 is greater than the heating power of the fourth side 132, that is, the third side 131 is a side of the second heat sink 180 with higher heating power (the component with higher heating power is located on the third side 131), and the fourth side 132 is a side of the second heat sink 180 with lower heating power, so that the heat dissipation efficiency of the second circuit board 130 is improved by the second heat sink 180 and the air duct 114.

Optionally, as shown in fig. 1, 2 and 7, the second heat sink 180 is formed with a plurality of second ribs 181 arranged at intervals, which is beneficial to increase the contact area of the second heat sink 180 with air, and is beneficial to improve the heat dissipation effect and the heat dissipation efficiency of the second heat sink 180.

Optionally, as shown in fig. 1, fig. 2, fig. 8, fig. 9, and fig. 10, the heat dissipation structure 100 further includes a third heat sink 190, the third heat sink 190 is connected to the housing 110 and covers the first air inlet 112, the third heat sink 190 includes a shielding portion 191 opposite to the first air inlet 112 and covering the first air inlet 112 and a connecting portion 192 bent from an edge of the shielding portion 191 and extending to connect to the housing 110, and a second air inlet 1921 for communicating the first air inlet 112 to allow external air to enter the first air inlet 112 is formed on the connecting portion 192. The third heat sink 190 can shield the first air inlet 112, so that the first air inlet 112 on the housing 110 forms a hidden design, which is beneficial to improving the waterproof performance of the heat dissipation structure 100 and beautifying the appearance of the heat dissipation structure 100; on the other hand, the heat dissipation effect of the housing 110 is improved. Specifically, when the heat dissipation structure 100 operates, the external air enters a space formed by the third heat sink 190 and the housing 110 through the second air inlet 1921, then enters the housing 110 through the first air inlet 112, is guided into the air duct 114 by the fan 140, and is blown out of the air outlet 113 through the air outlet 113 after exchanging heat with the first heat sink 150 and the second heat sink 180, so that a cycle of heat exchange of the external air entering the heat dissipation structure 100 is completed.

Alternatively, as shown in fig. 1, 2, 8, 9 and 10, the outer shell 110 includes a front shell 115 and a rear shell 116, the front shell 115 and the rear shell 116 enclose to form the inner cavity 111, the first air inlet 112 and the air outlet 113 are both formed on the rear shell 116, and the connection portion 192 is connected to the rear shell 116. Here, the first air inlet 112 and the first air outlet 113 are both disposed on the rear shell 116, which is compact and convenient for production and manufacture; of course, in specific applications, as an alternative embodiment, the air outlet 113 may be disposed on the front shell 115.

Alternatively, as shown in fig. 1, 2, 8, 9, and 10, the fan 140 is a centrifugal fan that sucks fluid in an axial direction of the fan and throws the fluid out in a circumferential direction by centrifugal force. The rear shell 116 has a shell front 1161 facing the front shell 115, a shell back 1162 facing away from the front shell 115, and a shell side 1163 extending from the shell back 1162 and connecting the shell front 1161, the first air inlet 112 is formed on the shell side 1163, the shell back 1162 is formed with a first cavity 1164, the shell front 1161 is formed with a second cavity 1165, and the first air inlet 112 is formed between the first cavity 1164 and the second cavity 1165 and communicates the first cavity 1164 and the second cavity 1165; the shielding portion 191 covers the first cavity 1164, the connecting portion 192 extends from the shielding portion 191 into the first cavity 1164, and the second air inlet 1921 is used for communicating the first cavity 1164 with outside air; the front shell 115 covers the second cavity 1165 and encloses the second cavity 1165 to form the inner cavity 111. In this embodiment, the first air inlet 112 is disposed on the back 1162 of the housing, and the air outlet 113 is disposed on the side 1163 of the housing, so as to improve the compactness of the heat dissipation structure 100 and prevent the interference between the inlet air and the outlet air. In addition, the first air inlet 112 is formed between the first cavity 1164 and the second cavity 1165 of the rear case 116, and the shielding portion 191 of the third heat sink 190 shields the first air inlet 112, so that the hidden design of the first air inlet 112 is realized, on one hand, external air enters the inner cavity 111 along a bent path, so that rainwater or other water drops are prevented from splashing by the third heat sink 190, the waterproof performance of the heat dissipation structure 100 is effectively improved, and the waterproof level of IPX3 can be met; on the other hand, people cannot directly see the first air inlet 112, so that the appearance of the heat dissipation structure 100 is more integral and more beautiful.

Optionally, two connecting portions 192 are provided, and the two connecting portions 192 are respectively provided at two opposite sides of the shielding portion 191, so that not only is the connection reliability between the third heat sink 190 and the rear case 116 ensured, but also the third heat sink 190 is ensured to have a larger air inlet area.

Alternatively, as shown in fig. 1, 2, 8, 9 and 10, a plurality of third ribs 193 are formed at intervals on a side of the third heat sink 190 facing away from the housing 110, which is beneficial to increase a contact area of the third heat sink 190 with air, thereby being beneficial to improve a heat dissipation effect of the third heat sink 190.

Optionally, the second air inlets 1921 are hollowed out between the ends of any two adjacent third ribs 193.

Optionally, the first heat sink 150, the second heat sink 180, and the third heat sink 190 are all made of a material with a better thermal conductivity, which is beneficial to ensuring the thermal conductivity of the first heat sink 150, the second heat sink 180, and the third heat sink 190. As a preferred embodiment of this embodiment, the first heat sink 150, the second heat sink 180, and the third heat sink 190 are made of aluminum, which is beneficial to ensuring the heat conduction effect of the first heat sink 150, the second heat sink 180, and the third heat sink 190; and on the other hand, the first heat sink 150, the second heat sink 180, and the third heat sink 190 can be made to have a smaller weight.

Alternatively, as shown in fig. 11, the first circuit board 120 includes a first input unit 128 for receiving an initial image signal and a first output unit 129 for transmitting the initial image signal to the second circuit board 130, and the second circuit board 130 includes a second input unit 133 for receiving the initial image signal transmitted by the first circuit board 120, a processing unit 134 for processing the initial image signal, a power management unit 135 for managing a power signal, and a second output unit 136 for outputting a processing result of the processing unit 134. In this embodiment, the first circuit board 120 is a sensor circuit board (i.e., a sensor circuit board) for controlling transmission of an initial image signal. The second circuit board 130 is a main control circuit board for controlling processing of image signals, external output of image signals of the camera 10, and management of power supply.

Referring to fig. 12, an embodiment of the present invention further provides a camera 10, which includes a lens assembly 200 and the heat dissipation structure 100, where the lens assembly 200 is disposed at one end of the heat dissipation structure 100. The camera 10 provided in this embodiment adopts the heat dissipation structure 100, so that the adverse phenomena of noise and poor image quality of the camera 10 when the camera 10 is used in a high-temperature environment due to serious heat generation of the circuit board in the camera 10 are avoided, and the camera 10 has the characteristics of compact structure, low heat dissipation power consumption and light weight.

Optionally, the camera 10 provided in this embodiment is used to implement a mapping function, and when the heat dissipation structure 100 provided in the embodiment of the present invention is applied to the mapping camera 10, the heat dissipation effect of the mapping camera 10 can be greatly improved, and the mapping camera 10 has low heat dissipation power consumption and light weight, so as to facilitate long-time mapping.

Referring to fig. 12, an embodiment of the present invention further provides an unmanned aerial vehicle, which includes a fuselage 20 and the above-mentioned camera 10, wherein the camera 10 is mounted on the fuselage 20. The unmanned aerial vehicle provided by the embodiment adopts the camera 10, so that the endurance time of the unmanned aerial vehicle can be guaranteed on the premise of guaranteeing the heat dissipation effect of the camera 10.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A heat radiation structure applied to a camera is characterized by comprising: the fan comprises a shell, a first circuit board, a second circuit board and a fan;

the shell is provided with an inner cavity, a first air inlet communicated with the inner cavity and an air outlet communicated with the inner cavity;

the first circuit board, the second circuit board and the fan are all arranged in the inner cavity, the first circuit board and the second circuit board are arranged at intervals and oppositely, an air channel communicated with the air outlet is formed between the first circuit board and the second circuit board, and the fan is arranged between the first air inlet and the air channel and used for guiding air from the first air inlet to the air channel.

2. The heat dissipation structure of claim 1, further comprising a first heat sink, wherein the first circuit board has a first side facing the air duct and a second side facing away from the air duct, the first heat sink is disposed between the first side and the air duct, and the first heat sink abuts against the first side.

3. The heat dissipating structure of claim 2, further comprising a heat conducting component extending from the second side to connect to the first heat sink for conducting heat from the second side to the first heat sink.

4. The heat dissipating structure of claim 3, wherein the heat conducting assembly comprises a heat conducting plate having a first side facing away from the first circuit board and a second side facing toward the first circuit board, the second side being laminated to the second side, and a heat conducting bracket extending from the first side to connect to the first heat sink.

5. The heat dissipation structure of claim 4, further comprising an image sensor abutting the first side.

6. The heat dissipation structure of claim 5, wherein the first side portion is formed with a groove, and the image sensor is mounted in the groove.

7. The heat dissipation structure of any one of claims 4 to 6, wherein the first circuit board is provided with a through hole extending from the first side surface toward the second side surface, and the first heat sink includes a heat sink main body located between the first side surface and the air duct, and a boss extending from the heat sink main body, penetrating through the through hole, and abutting against the second side portion.

8. The heat dissipating structure of any one of claims 4 to 7, wherein the heat conducting assembly further comprises a heat conducting sheet having both ends abutting the first heat sink and the second side surface, respectively, for conducting heat of the second side surface to the first heat sink.

9. The heat dissipating structure of claim 8, wherein the heat conductive bracket and the heat conductive sheet respectively wrap at least a portion of an edge of the first circuit board from a periphery of the first circuit board.

10. The heat dissipating structure of claim 9, wherein the first circuit board comprises a first edge, a second edge, a third edge and a fourth edge, the first edge and the second edge are disposed opposite to each other, the third edge and the fourth edge are disposed opposite to each other, the thermally conductive bracket covers at least a portion of the first edge, at least a portion of the second edge, and at least a portion of the third edge, and the thermally conductive sheet covers at least a portion of the fourth edge.

11. The heat dissipating structure of claim 8, wherein the heat conducting sheet is a graphite sheet.

12. The heat dissipation structure according to any one of claims 1 to 6, further comprising a second heat sink, wherein the second circuit board has a third side facing the air duct and a fourth side facing away from the air duct, the second heat sink is disposed between the third side and the air duct, and the second heat sink abuts against the third side.

13. The heat dissipating structure of claim 12, wherein the fourth side abuts against an inner wall of the cavity.

14. The heat dissipation structure according to any one of claims 1 to 6, further comprising a third heat sink connected to the housing and covering the first air inlet, wherein the third heat sink includes a shielding portion disposed opposite to the first air inlet and covering the first air inlet, and a connecting portion bent from an edge of the shielding portion and extending to connect to the housing, and a second air inlet formed in the connecting portion and used for communicating with the first air inlet to allow external air to enter the first air inlet.

15. The heat dissipating structure of claim 14, wherein said housing comprises a front shell and a rear shell, said front shell and said rear shell enclosing said interior cavity, said first air inlet and said air outlet being formed in said rear shell, said connecting portion being connected to said rear shell.

16. The heat dissipating structure of claim 15, wherein the rear housing has a housing front facing the front housing, a housing back facing away from the front housing, and a housing side extending from the housing back to connect the housing front, the first intake vent being formed in the housing side, the housing back being formed with a first cavity, the housing front being formed with a second cavity, the first intake vent being formed between and communicating the first cavity and the second cavity;

the shielding part covers the first cavity, the connecting part extends into the first cavity from the shielding part, and the second air inlet is used for communicating the first cavity with outside air;

the front shell covers the second cavity and encloses the second cavity to form the inner cavity.

17. The heat dissipating structure of claim 14, wherein there are two connecting portions, and the two connecting portions are respectively disposed on two opposite sides of the shielding portion.

18. The heat dissipation structure according to any one of claims 1 to 6, wherein the first circuit board includes a first input unit for receiving an initial image signal and a first output unit for transmitting the initial image signal to the second circuit board, and the second circuit board includes a second input unit for receiving the initial image signal transmitted by the first circuit board, a processing unit for processing the initial image signal, a power management unit for managing a power signal, and a second output unit for outputting a processing result of the processing unit.

19. A camera comprising a lens assembly and a heat dissipating structure according to any one of claims 1 to 18, the lens assembly being disposed at one end of the heat dissipating structure.

20. An unmanned aerial vehicle comprising a fuselage and the camera of claim 19 mounted to the fuselage.