CN112607017A

CN112607017A - Unmanned plane

Info

Publication number: CN112607017A
Application number: CN202011345824.4A
Authority: CN
Inventors: 王刚; 高焓; 郜奥林; 陆宏伟; 姜欣宏; 刘宝俊; 吴振凯; 毛一年; 初征
Original assignee: Beijing Airlango Technology Co ltd
Current assignee: Beijing Airlango Technology Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-04-06

Abstract

The utility model relates to an unmanned aerial vehicle, which is characterized in that the unmanned aerial vehicle comprises a machine shell, wherein the machine shell limits a machine room, the machine room is provided with a closed sub-chamber, a first ventilation opening and a second ventilation opening which are communicated with the sub-chamber and a first machine room air opening and a second machine room air opening which are communicated with the space outside the sub-chamber in the machine room are formed on the machine shell; a first electronic component disposed in the nacelle; the first heat dissipation assembly comprises a heat dissipation structure and a first heat dissipation fan, the heat dissipation structure is arranged in the sub-cavity and is used for exchanging heat with the first electronic component, the first heat dissipation fan is used for generating airflow flowing through the heat dissipation structure in the sub-cavity, and the airflow enters from one of the first ventilation opening and the second ventilation opening and flows out from the other one of the first ventilation opening and the second ventilation opening; and the second heat dissipation assembly comprises a second heat dissipation fan arranged at the air inlet of the first machine cabin, and the second heat dissipation fan is used for enabling the space outside the sub-cavity in the machine cabin to generate airflow.

Description

Unmanned plane

Technical Field

The utility model relates to an unmanned air vehicle technique field specifically relates to an unmanned air vehicle.

Background

When unmanned aerial vehicle during operation, the electronic component in its cabin (for example computer printed circuit board and set up computer chip, the power control board on computer printed circuit board and set up power chip etc. on the power control board) can produce the heat, if can not dispel the heat to the electronic component effectively, then can lead to the electronic component to damage because of the high temperature, and then influence unmanned aerial vehicle's normal work. In the prior art, the purpose of dissipating heat of an electronic component is usually achieved by dissipating heat of a space inside a cabin, but for the case that the electronic component with a high heat dissipation requirement is arranged in the cabin, the manner of dissipating heat of the space inside the cabin cannot ensure that airflow entering the cabin flows through the electronic component and takes away heat of the electronic component, that is, the prior art cannot effectively and purposefully dissipate heat of the electronic component with a high heat dissipation requirement, and ensure that the temperature of the electronic component can be controlled within a certain range.

Disclosure of Invention

The utility model aims at providing an unmanned aerial vehicle, this unmanned aerial vehicle can satisfy the heat dissipation requirement of its inside higher electron component of requirement of dispelling the heat that sets up.

In order to realize above-mentioned purpose, this disclosure provides an unmanned aerial vehicle, includes:

the air conditioner comprises a machine shell, a fan blade;

a first electronic component disposed in the nacelle;

the first heat dissipation assembly comprises a heat dissipation structure and a first heat dissipation fan, wherein the heat dissipation structure and the first heat dissipation fan are arranged in the sub-chamber, the heat dissipation structure is used for exchanging heat with the first electronic component, the first heat dissipation fan is used for generating airflow flowing through the heat dissipation structure in the sub-chamber, and the airflow enters from one of the first ventilation opening and the second ventilation opening and flows out from the other ventilation opening;

and the second heat dissipation assembly comprises a second heat dissipation fan arranged at the first cabin air opening, the second heat dissipation fan is used for enabling the space outside the sub-cavity in the cabin to generate air flow, and the air flow enters from one of the first cabin air opening and the second cabin air opening and flows out from the other one of the first cabin air opening and the second cabin air opening.

Optionally, the first ventilation opening and the second ventilation opening are located on the same side of the casing, the first cooling fan includes a casing and a fan body located in the casing, two ends of the casing are both open, one open end of the casing is connected with the first ventilation opening, the other open end of the casing is communicated with a space outside the casing in the sub-chamber, and the second ventilation opening is located outside the casing.

Optionally, a seal is provided between the housing and the casing.

Optionally, first radiator unit still includes first heat-conducting plate, heat radiation structure is for forming a plurality of fin on the first heat-conducting plate, first electronic component sets up first heat-conducting plate deviates from a plurality of one side of fin, be formed with annular flange on the internal surface of casing, first heat-conducting plate lid closes on the annular flange and seal the opening of annular flange, first heat-conducting plate with the annular flange is injectd jointly the subchamber.

Optionally, the first heat dissipation assembly further includes a second heat conduction plate disposed opposite to the first heat conduction plate, the first heat conduction plate and the second heat conduction plate are in heat conduction contact through a heat conduction portion, and the first electronic component is clamped between the first heat conduction plate and the second heat conduction plate.

Optionally, the first electronic component includes a first printed circuit board and a first electronic component disposed on a side of the first printed circuit board close to the first heat conducting plate, a first accommodating cavity is formed on the first heat conducting plate, the first printed circuit board is clamped between the first heat conducting plate and the second heat conducting plate, and the first electronic component is accommodated in the first accommodating cavity;

first electronic component includes first printed circuit board and sets up first printed circuit board is close to second electronic components on one side of second heat-conducting plate, be formed with the second on the second heat-conducting plate and hold the chamber, first printed circuit board centre gripping is in first heat-conducting plate with between the second heat-conducting plate, just second electronic components holds in the second holds the chamber.

Optionally, the first heat conducting plate includes a first plate body and a first side plate formed around the first plate body, the first side plate and the first plate body together enclose the first accommodating cavity, the heat sink is formed on the first plate body, the second heat conducting plate includes a second plate body and a second side plate formed around the second plate body, the second side plate and the second plate body together enclose the second accommodating cavity, and the first printed circuit board is clamped between the first side plate and the second side plate;

the heat conducting part comprises a first heat conducting part, at least part of the first side plate extends towards the second side plate and forms the first heat conducting part, and the first heat conducting part is attached to the second side plate or attached to the second side plate;

the heat conducting portion comprises a second heat conducting portion, at least part of the second side plate extends towards the first side plate to form the second heat conducting portion, and the second heat conducting portion is attached to the first side plate.

Optionally, a first boss is formed on the first heat conducting plate, and the first boss is located in the first accommodating cavity and abuts against the first electronic component, and/or;

and a second boss is formed on the second heat conduction plate, is positioned in the second accommodating cavity and abuts against the second electronic component.

Optionally, at least a part of the plurality of heat sinks is formed with a recess portion recessed toward the first electronic component, and the first heat sink fan is disposed in the recess portion.

Optionally, the unmanned aerial vehicle further comprises a mounting bracket disposed in the cabin, a leg connected to the mounting bracket, the leg extending from the mounting bracket toward the exterior of the housing and extending outward from the housing, the first electronic component connected to the mounting bracket, the mounting bracket and the leg both made of a heat conductive material.

Optionally, the drone further comprises a second electronic component disposed in the nacelle, the second electronic component being mounted on the mounting bracket, and the second electronic component and the first electronic component being arranged in an up-down direction of the drone.

Through above-mentioned technical scheme, because be provided with the heat radiation structure with first electronic component heat exchange among the unmanned aerial vehicle that this disclosure provided, and this heat radiation structure sets up in inclosed subchamber, most heat of the first electronic component that heat radiation structure absorbs will concentrate in the subchamber, because the subchamber is relative airtight for the outdoor space of the subchamber in the cabin, most heat of the first electronic component that heat radiation structure absorbs can not spread in the outdoor space of the subchamber in the cabin, influence the outdoor space's of the subchamber temperature in the cabin, lead to the outdoor space's of the subchamber in the cabin temperature too high, and first radiator fan also sets up in the subchamber, when first radiator fan during operation, the inside air current of first radiator fan introduction subchamber only flows in the subchamber, do not flow to the outdoor space of the subchamber in the cabin, that is to say, the inside air current of first radiator fan introduction subcavity only takes away heat radiation structure and subchamber to flow in-process The heat in indoor space cools the space in heat radiation structure and the subchamber to the radiating effect and the radiating efficiency to first electron component are higher, can reach effectively, have pertinence to carry out radiating purpose to first electron component, guarantee that first electron component obtains the cooling, satisfy the heat dissipation demand of first electron component.

For the space outside the sub-chamber in the cabin, a first cabin air opening and a second cabin air opening which are communicated with the space outside the sub-chamber in the cabin are formed in the shell, and a second cooling fan is arranged at the first cabin air opening.

That is to say, in the unmanned aerial vehicle that this disclosure provided, most heat that first electronic component produced will transmit to heat radiation structure, because heat radiation structure and first radiator fan set up in inclosed subchamber, the air current that gets into in the subchamber from one of first vent and second vent only takes away the heat in heat radiation structure and the subchamber in the flow process, and can not take away the heat in the outdoor space of subchamber in the cabin, thereby can dispel the heat to heat radiation structure effectively, and then reach the radiating purpose to first electronic component, guarantee the cooling of first electronic component, and the outdoor space of subchamber in the cabin then dispels the heat through the air current that second radiator fan introduced.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

fig. 1 is a front view of a drone provided by an exemplary embodiment of the present disclosure;

fig. 2 is a rear view of a drone provided by an exemplary embodiment of the present disclosure;

fig. 3 is a schematic structural view of the interior of a drone provided by an exemplary embodiment of the present disclosure, in which a partial housing is shown;

fig. 4 is a schematic structural view of the interior of a drone provided by an exemplary embodiment of the present disclosure, with a partial housing shown and with the mounting bracket and second electronic components not shown;

FIG. 5 is a schematic cross-sectional view taken along the line A-A in FIG. 4;

fig. 6 is a schematic structural diagram of an annular convex plate formed on a housing of a drone provided by an exemplary embodiment of the present disclosure;

fig. 7 is a schematic perspective view of a first electronic component and a first heat sink assembly of the drone provided by an exemplary embodiment of the present disclosure, wherein the first heat sink fan is not shown;

fig. 8 is an assembly schematic view of a first electronic component and a first heat sink assembly of a drone provided by an exemplary embodiment of the present disclosure;

fig. 9 is a schematic perspective view of a first heat conducting plate and a heat sink of the unmanned aerial vehicle provided in an exemplary embodiment of the present disclosure

Fig. 10 is an assembly schematic diagram of a first electronic component, a second electronic component, a mounting bracket, and a first heat dissipation assembly of a drone provided by an exemplary embodiment of the present disclosure.

Description of the reference numerals

1-a machine shell; 11-a first vent; 12-a second vent; 13-a first nacelle air port; 14-a second cabin tuyere; 15-annular convex plate; 2-a cabin; 3-a sub-chamber; 41-a first electronic component; 411 — first printed circuit board; 412-a first electronic component; 413-a second electronic component; 42-a second electronic component; 421-power control board; 422-power supply chip; 5-a first heat dissipation assembly; 51-a first heat dissipation fan; 511-a housing; 512-fan body; 52-a first thermally conductive plate; 521-a first containing cavity; 522-a first plate body; 523-a first side panel; 524-a first boss; 53-a heat sink; 531-a recess; 54-a second thermally conductive plate; 541-a second receiving cavity; 542-a second plate body; 543-a second side plate; 544-a second heat conducting portion; 55-a first thermally conductive pad; 56-second thermally conductive gasket; 61-a second heat dissipation fan; 7-mounting a bracket; 8-support leg.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless otherwise stated, the use of directional words such as "up and down" is generally defined in terms of the normal flight state of the drone, and specifically, in the normal flight of the drone, the direction pointing to the sky is up, and the direction pointing to the ground is down. "inner and outer" refer to the inner and outer of the corresponding structure or component profile.

As shown in fig. 1 to 10, the present disclosure provides an unmanned aerial vehicle including a housing 1, a first electronic component 41, a first heat dissipation assembly 5, and a second heat dissipation assembly. The machine shell 1 defines a machine room 2, the machine room 2 is provided with a closed sub-chamber 3, a first ventilation opening 11 and a second ventilation opening 12 which are communicated with the sub-chamber 3 are formed on the machine shell 1, and a first machine room air opening 13 and a second machine room air opening 14 which are communicated with the space outside the sub-chamber 3 in the machine room 2 are also formed on the machine shell 1; the first electronic component 41 is disposed in the nacelle 2; the first heat dissipation assembly 5 comprises a heat dissipation structure and a first heat dissipation fan 51 which are both arranged in the sub-chamber 3, the heat dissipation structure is used for exchanging heat with the first electronic component 41, the first heat dissipation fan 51 is used for generating airflow flowing through the heat dissipation structure in the sub-chamber 3, and the airflow enters from one of the first ventilation opening 11 and the second ventilation opening 12 and flows out from the other, so that the first heat dissipation fan 51 can blow air to the heat dissipation structure, thereby cooling the heat dissipation structure and further cooling the first electronic component 41; the second heat dissipation assembly includes a second heat dissipation fan 61 disposed at the first nacelle air opening 13, the second heat dissipation fan 61 is configured to generate an air flow in a space outside the sub-chamber 3 in the nacelle 2, and the air flow enters from one of the first nacelle air opening 13 and the second nacelle air opening 14 and exits from the other, thereby reducing the temperature in the nacelle 2.

Here, the cabin 2 mentioned above and below having a closed sub-chamber 3 means that the sub-chamber 3 is relatively closed with respect to the space outside the sub-chamber 3 in the cabin 2, that is, the air flow generated in the sub-chamber 3 flows inside the sub-chamber 3 and does not flow to the space outside the sub-chamber 3 in the cabin 2, and the air flow generated in the space outside the sub-chamber 3 in the cabin 2 flows in the space outside the sub-chamber 3 in the cabin 2 and does not flow in the sub-chamber 3.

Furthermore, the first electronic component refers to an electronic component comprising an electronic component and/or a printed circuit board supporting the electronic component, providing electrical connection for the electronic component. The first electronic component may be an electronic component with high heat dissipation requirements and high temperature control requirements, such as a high power consumption electronic component (e.g., a computer printed circuit board and/or a computer chip, a memory, etc. disposed on the computer printed circuit board).

Through the technical scheme, as the heat dissipation structure which exchanges heat with the first electronic component 41 is arranged in the unmanned aerial vehicle provided by the disclosure, and the heat dissipation structure is arranged in the sealed sub-chamber 3, most of heat of the first electronic component 41 absorbed by the heat dissipation structure is concentrated in the sub-chamber 3, as the sub-chamber 3 is relatively sealed relative to the space outside the sub-chamber 3 in the cabin 2, most of heat of the first electronic component 41 absorbed by the heat dissipation structure cannot be diffused into the space outside the sub-chamber 3 in the cabin 2, and the temperature of the space outside the sub-chamber 3 in the cabin 2 is affected, so that the temperature of the space outside the sub-chamber 3 in the cabin 2 is too high, and the first heat dissipation fan 51 is also arranged in the sub-chamber 3, when the first heat dissipation fan 51 works, the airflow introduced into the sub-chamber 3 by the first heat dissipation fan 51 only flows in the sub-chamber 3, and does not flow to the space outside the sub-chamber 3 in the cabin 2, that is to say, the airflow introduced into the sub-chamber 3 by the first cooling fan 51 only takes away the heat of the heat dissipation structure and the space in the sub-chamber 3 in the flowing process, and cools the heat dissipation structure and the space in the sub-chamber 3, so that the heat dissipation effect and the heat dissipation efficiency of the first electronic component 41 are higher, the purpose of effectively and specifically dissipating heat of the first electronic component 41 can be achieved, the first electronic component 41 is guaranteed to be cooled, and the heat dissipation requirement of the first electronic component 41 is met.

For the space outside the sub-chamber 3 in the nacelle 2, since the casing 1 is further provided with the first nacelle air inlet 13 and the second nacelle air inlet 14 which are communicated with the space outside the sub-chamber 3 in the nacelle 2, and the second cooling fan 61 is arranged at the first nacelle air inlet 13, when the second fan works, the air flow enters the space outside the sub-chamber 3 in the nacelle 2 from one of the first nacelle air inlet 13 and the second nacelle air inlet 14 and flows out from the other, so that the heat of the space outside the sub-chamber 3 in the nacelle 2 is taken away in the flowing process of the air flow, and the space outside the sub-chamber 3 in the nacelle 2 is cooled.

That is to say, in the unmanned aerial vehicle that this disclosure provided, most heat that first electronic component 41 produced will transmit to heat radiation structure, because heat radiation structure and first radiator fan 51 set up in inclosed subchamber 3, the air current that gets into in subchamber 3 from one of first vent 11 and second vent 12 only takes away the heat in heat radiation structure and the subchamber 3 at the flow in-process, and can not take away the heat in the cabin 2 except the space of subchamber 3, thereby can dispel the heat to heat radiation structure effectively, and then reach the radiating purpose to first electronic component 41, guarantee the cooling of first electronic component 41, the air current that the space outside the subchamber 3 in the cabin 2 then introduced through second radiator fan 61 dispels the heat.

Here, it should be noted that the first electronic component 41 may be disposed in a space outside the sub-chamber 3 in the nacelle 2, or may be disposed in the sealed sub-chamber 3. Since the heat dissipation structure that exchanges heat with the first electronic component 41 is provided, most of the heat generated by the first electronic component 41 will be transferred to the heat dissipation structure, and in the case where the first electronic component 41 is disposed in the space outside the sub-chamber 3 in the nacelle 2, only a small portion of the heat of the first electronic component 41 will be dissipated into the space outside the sub-chamber 3 in the nacelle 2, and most of the heat will be concentrated in the closed sub-chamber 3, and the flow of the airflow introduced by the first heat dissipation fan 51 will be dissipated into the atmosphere; for the case where the first electronic component 41 is disposed within the sub-chamber 3, the heat generated by the first electronic component 41 is substantially entirely concentrated within the closed sub-chamber 3, and the present disclosure does not limit whether the first electronic component 41 is disposed within the sub-chamber 3 or within a space outside the sub-chamber 3 in the nacelle 2. In addition, the number of the first electronic components 41 may be one or more, and the number of the first electronic components 41 is not limited in the present disclosure. For embodiments in which the first electronic component 41 is multiple, the sub-chamber 3 may be multiple, each first electronic component 41 is disposed in the sub-chamber 3 corresponding thereto, and each first electronic component 41 has a heat dissipation structure in heat exchange therewith, or multiple first electronic components 41 may be in heat exchange with the same heat dissipation structure, and multiple first electronic components 41 are disposed in the same sub-chamber 3.

Alternatively, as an embodiment, the above-mentioned first ventilation opening 11 and the second ventilation opening 12 may be oppositely disposed, and the first ventilation opening 11 and the second ventilation opening 12 are located at two opposite sides of the rotation axis of the first cooling fan 51, and the cooling structure may be located between the first cooling fan 51 and the first ventilation opening 11, or between the first cooling fan 51 and the second ventilation opening 12, so that when the first cooling fan 51 rotates, air outside the casing 1 may flow into the sub-chamber 3 through the first ventilation opening 11 and flow out of the sub-chamber 3 through the second ventilation opening 12, or flow into the sub-chamber 3 through the second ventilation opening 12 and flow out through the first ventilation opening 11, and during the flow of the air, the air can flow through the cooling structure to take away heat of the cooling structure.

As another embodiment, as shown in fig. 5 and 6, the first ventilation opening 11 and the second ventilation opening 12 are located on the same side of the casing 1, in order to better guide the air outside the casing 1 to flow from one of the first ventilation opening 11 and the second ventilation opening 12 into the sub-chamber 3 and from the other into the sub-chamber 3, the first cooling fan 51 includes a casing 511 and a fan body 512 located inside the casing 511, both ends of the casing 511 are open, one open end of the casing 511 is connected to the first ventilation opening 11, the other open end of the casing 511 is communicated with the space outside the casing 511 in the sub-chamber 3, and the second ventilation opening 12 is located outside the casing 511. Here, the heat dissipation structure may be entirely located in the sub-chamber 3 in the space outside the housing 511, or may be partially located in the housing 511 and partially located in the sub-chamber 3 in the space outside the housing 511, which is not limited in the present disclosure.

Thus, for the case that the first heat dissipation fan 51 exhausts air to the outside of the enclosure 1 during operation, when the fan body 512 rotates, the air inside the housing 511 is exhausted to the atmosphere through the first ventilation opening 11, the air pressure inside the sub-chamber 3 is reduced, so that the air in the atmosphere flows into the space outside the housing 511 in the sub-chamber 3 from the second ventilation opening 12, an air flow flowing from the second ventilation opening 12 to the first ventilation opening 11 is generated inside the sub-chamber 3, the air flow flows into the housing 511 from the space outside the housing 511 in the sub-chamber 3 through the open end of the housing 511 away from the first ventilation opening 11, the air inside the housing 511 is exhausted to the atmosphere from the inside of the housing 511 under the action of the fan body 512, and flows through the heat dissipation structure during the air flow, and takes away the heat of the heat dissipation structure; in the case where the first heat dissipation fan 51 draws air outside the cabinet 1 into the sub-chamber 3 during operation, when the fan body 512 rotates, the air outside the cabinet 1 enters the inside of the housing 511 through the first ventilation opening 11, flows into the space outside the housing 511 in the sub-chamber 3 through the open end of the housing 511 away from the first ventilation opening 11, and finally flows out of the sub-chamber 3 through the second ventilation opening 12 outside the housing 511.

In both the case where the first heat dissipation fan 51 discharges air to the outside of the cabinet 1 during operation and the case where the first heat dissipation fan 51 draws air from the outside of the cabinet 1 into the sub-chamber 3 during operation, since the housing 511 is disposed inside the sub-chamber 3, and one open end of the housing 511 is communicated with the first ventilation opening 11, the housing 511 of the first heat dissipation fan 51 divides the inside of the sub-chamber 3 into two air channels, one air channel is formed inside the housing 511, the space outside the housing 511 in the sub-chamber 3 is another air channel, therefore, when the fan body 512 rotates, the airflow can flow into one of the two air channels and flow out of the other air channel, one of the first ventilation opening 11 and the second ventilation opening 12 is an air inlet, the other one is an air outlet, and the shell 511 guides the airflow to flow in the sub-chamber 3 according to a certain path, so that the condition of airflow disorder is avoided.

Optionally, a sealing member is disposed between the housing 511 and the casing 1 to prevent the air flowing into the interior of the housing 511 from the first ventilation opening 11 from flowing out of the housing 511 from the open end of the housing 511 far from the first ventilation opening 11, but directly flowing into the space outside the housing 511 in the sub-chamber 3 through the gap between the housing 511 and the casing 1, or the air flowing into the space outside the housing 511 in the sub-chamber 3 from the second ventilation opening 12 does not flow into the housing 511 from the open end of the housing 511 far from the first ventilation opening 11, but directly flows into the interior of the housing 511 through the gap between the housing 511 and the casing 1, so as to reduce the occurrence of the situation that the air flowing in the sub-chamber 3 directly flows out of the sub-chamber 3 without passing through the heat dissipation structure, and improve the heat dissipation effect on the heat dissipation structure.

The sub-chamber 3 may be formed or arranged in the nacelle 2 by various embodiments. For example, as shown in fig. 4 to 8, in one embodiment provided by the present disclosure, the first heat dissipation assembly 5 further includes a first heat conduction plate 52, the heat dissipation structure is a plurality of heat dissipation fins 53 formed on the first heat conduction plate 52, the first electronic component 41 is disposed on a side of the first heat conduction plate 52 facing away from the plurality of heat dissipation fins 53, an annular convex plate 15 is formed on the inner surface of the casing 1, the first heat conduction plate 52 covers the annular convex plate 15 and closes an opening of the annular convex plate 15, and the first heat conduction plate 52 and the annular convex plate 15 together define the sub-chamber 3. In this embodiment, the annular convex plate 15 and the first heat-conducting plate 52 together define the sub-chamber 3, and when the first heat-conducting plate 52 is fitted over the opening of the annular convex plate 15, it is possible to accommodate the heat sink 53 in the sub-chamber 3, with the first electronic component 41 outside the sub-chamber 3. As mentioned above, although in this embodiment, the first electronic component 41 is located outside the sub-chamber 3, since the first electronic component 41 is disposed on the first heat conduction plate 52, most of the heat of the first electronic component 41 is transferred to the heat dissipation fins 53 through the first heat conduction plate 52, and only a small portion of the heat is dissipated into the space outside the sub-chamber 3 in the nacelle 2, most of the heat generated by the first electronic component 41 is concentrated in the closed sub-chamber 3, and the flow of the airflow introduced by the first heat dissipation fan 51 is dissipated into the atmosphere, that is, the first electronic component 41 primarily dissipates the heat through the heat dissipation fins 53 and the first heat dissipation fan 51.

Alternatively, as shown in fig. 7 and 8, at least a part of the plurality of heat radiating fins 53 is formed with a recessed portion 531 recessed toward the first electronic component 41, and the first heat radiating fan 51 is disposed in the recessed portion 531. Therefore, on one hand, the volume of the whole structure formed by the first heat dissipation fan 51 and the heat dissipation fins 53 can be reduced, so that the first heat dissipation fan 51 and the heat dissipation fins 53 can be conveniently installed in an unmanned manner with smaller volume, and on the other hand, the first heat dissipation fan 51 can be closer to the heat dissipation fins 53, so that the forced convection heat exchange effect of the first heat dissipation fan 51 on the heat dissipation fins 53 is improved.

Alternatively, the heat-dissipating structure may be a heat-dissipating coil mounted on the first plate 52, and for embodiments in which the heat-dissipating structure is a heat-dissipating coil, a cooling fluid may flow through the heat-dissipating coil.

In other embodiments (not shown), an annular protruding plate is formed on the inner surface of the casing, a cover plate covers the annular protruding plate and closes the opening of the annular protruding plate, the cover plate and the annular protruding plate define a sub-chamber, and the first heat-conducting plate, the heat sink and the first electronic component may all be installed in the sub-chamber, so that the heat generated by the first electronic component is substantially concentrated in the closed sub-chamber.

Alternatively, in order to enhance the heat dissipation effect of the first heat dissipation assembly 5 on the first electronic component 41, as shown in fig. 4 and 5, and fig. 7 and 8, the first heat dissipation assembly 5 may further include a second heat conduction plate 54 disposed opposite to the first heat conduction plate 52, the first heat conduction plate 52 and the second heat conduction plate 54 are in heat-conducting contact through a heat conduction portion, and the first electronic component 41 is sandwiched between the first heat conduction plate 52 and the second heat conduction plate 54. Because the first heat-conducting plate 52 is in heat-conducting contact with the second heat-conducting plate 54 through the heat-conducting portion, and the first electronic component 41 is clamped between the first heat-conducting plate 52 and the second heat-conducting plate 54, in this way, the heat on one side of the first electronic component 41 can be directly transferred to the first heat-conducting plate 52, the heat on the other side can be transferred to the first heat-conducting plate 52 through the second heat-conducting plate 54 and the heat-conducting portion, and finally the heat on the first heat-conducting plate 52 is transferred to the heat sink 53, and the heat is dissipated through the heat sink, so that the first electronic component 41 is cooled. Here, the heat conduction portion may be a heat conduction sheet, a heat conduction plate, a heat conduction wire, or the like connected between the first heat conduction plate 52 and the second heat conduction plate 54, and the present disclosure does not limit a specific structure and a specific type of the heat conduction portion as long as heat transfer between the second heat conduction plate 54 and the first heat conduction plate 52 can be achieved.

Alternatively, in the case where the first electronic component 41 is disposed on the first heat conduction plate 52 and outside the sub-chamber 3, in order to transfer the heat emitted from the first electronic component 41 to the heat sink 53 disposed inside the sub-chamber 3 as much as possible, and to allow most of the heat of the first electronic component 41 to be taken out of the sub-chamber 3 by the airflow flowing inside the sub-chamber 3, as shown in fig. 5 and 9, the first electronic component 41 includes a first printed circuit board 411 and a first electronic component 412 disposed on a side of the first printed circuit board 411 close to the first heat conduction plate 52, a first accommodation chamber 521 is formed on the first heat conduction plate 52, the first printed circuit board 411 is sandwiched between the first heat conduction plate 52 and the second heat conduction plate 54, and the first electronic component 412 is accommodated in the first accommodation chamber 521, and/or; the first electronic component 41 includes a first printed circuit board 411 and a second electronic component 413 disposed on a side of the first printed circuit board 411 close to the second heat conduction plate 54, the second heat conduction plate 54 is formed with a second accommodation cavity 541, the first printed circuit board 411 is sandwiched between the first heat conduction plate 52 and the second heat conduction plate 54, and the second electronic component 413 is accommodated in the second accommodation cavity 541. In other words, in the case where the electronic component is provided on one side of the first printed circuit board 411, an accommodation cavity is formed on the heat-conducting plate close to the electronic component among the first heat-conducting plate 52 and the second heat-conducting plate 54, and in the case where the electronic component is provided on both sides of the first printed circuit board 411, an accommodation cavity is formed on both the first heat-conducting plate 52 and the second heat-conducting plate 54.

Since the first heat conduction plate 52 is formed with the first accommodating cavity 521, when the first printed circuit board 411 is clamped between the first heat conduction plate 52 and the second heat conduction plate 54, the first printed circuit board 411 may close the opening of the first accommodating cavity 521, and allow the first electronic component 412 to be accommodated in the first accommodating cavity 521, so that heat emitted from the first electronic component 412 will be dissipated in the first accommodating cavity 521 and transferred to the first heat conduction plate 52, thereby preventing the heat emitted from the first electronic component 412 from being transferred to the space except the sub-cavity 3 in the nacelle 2 as much as possible, which may cause the temperature in the space except the sub-cavity 3 in the nacelle 2 to be too high and threaten components arranged in the space except the sub-cavity 3 in the nacelle 2. Also, since the second heat-conductive plate 54 is formed with the second accommodation chamber 541, when the first printed circuit board 411 is sandwiched between the first heat-conductive plate 52 and the second heat-conductive plate 54, the second printed circuit board can close the opening of the second accommodation chamber 541, and the second electronic component 413 is accommodated in the second accommodating chamber 541 so that the heat emitted from the second electronic component 413 will be emitted in the second accommodating chamber 541 and transferred to the second heat conduction plate 54, the second heat conduction plate 54 transfers the heat to the first heat conduction plate 52 and the heat radiation fins 53 provided in the sub-chamber 3 through the heat conduction portions, further, it is avoided as much as possible that heat emitted by the second electronic component 413 is transferred to the space in the nacelle 2 other than the sub-chamber 3, which may cause a threat to components disposed in the space in the nacelle 2 other than the sub-chamber 3 due to an excessively high temperature in the space in the nacelle 2 other than the sub-chamber 3.

Alternatively, the first electronic component 41 may be a computer electronic component, the first printed circuit board 411 may be a computer printed circuit board, the first electronic component 412 may be a computer chip and/or a computer memory, and the second electronic component 413 may be a computer chip and/or a computer memory. The computer chip may be, for example, a vision processing chip, an ultrasound processing chip, a laser ranging processing chip, a positioning chip (GPS chip), or the like.

Alternatively, in order to improve the heat transfer effect between the first electronic component 412 and the first heat conduction plate 52, as shown in fig. 9, a first boss 524 may be formed on the first heat conduction plate 52, and the first boss 524 is located in the first accommodating cavity 521 and abuts against the first electronic component 412, so that the first electronic component 412 can transfer heat to the first heat conduction plate 52 through the first boss 524, and/or a second boss (not shown) may be formed on the second heat conduction plate 54 and located in the second accommodating cavity 541 and abuts against the second electronic component 413, so that the second electronic component 413 can transfer heat to the second heat conduction plate 54 through the second boss.

To further enhance the heat transfer effect between the first heat conduction plate 412 and the first heat conduction plate 52 and between the second heat conduction plate 413 and the second heat conduction plate 54, as shown in fig. 5, a first heat conduction gasket 55 may be disposed between the first heat conduction plate 52 and the first electronic component 412, and a second heat conduction gasket 56 may be disposed between the second heat conduction plate 54 and the second electronic component 413. For embodiments in which the first plate body 522 of the first heat conduction plate 52 has the first bosses 524 formed thereon, the first heat conduction pad 55 may be sandwiched between the first bosses 524 and the first electronic component 412; for the embodiment in which the second plate body 542 of the second heat conduction plate 54 has the second boss formed thereon, the second heat conduction pad 56 may be sandwiched between the second boss and the second electronic component 413.

The first receiving chamber 521 and/or the second receiving chamber 541 may be formed by various embodiments. For example, in an exemplary embodiment provided by the present disclosure, as shown in fig. 5, 7 and 9, the first heat conducting plate 52 includes a first plate 522 and a first side plate 523 formed around the first plate 522, the first side plate 523 and the first plate 522 together enclose a first accommodating cavity 521, the heat sink 53 is formed on the first plate 522, the second heat conducting plate 54 includes a second plate 542 and a second side plate 543 formed around the second plate 542, the second side plate 543 and the second plate 542 together enclose a second accommodating cavity 541, and the first printed circuit board 411 is clamped between the first side plate 523 and the second side plate 543. The first plate 522 and the first side plate 523 may be welded to each other or integrally formed, and the second plate 542 and the second side plate 543 may be welded to each other or integrally formed, which is not limited in this disclosure. In other embodiments, the first accommodation chamber 521 may be formed by recessing the first thermal conductive plate 52 toward a direction away from the first electronic component 41, the second accommodation chamber 541 may be formed by recessing the second thermal conductive plate 54 toward a direction away from the first electronic component 41, and the first accommodation chamber 521 and the second accommodation chamber 541 may be of any suitable shape, for example, a cubic shape, a hemispherical shape, or the like.

Optionally, in order to make the first heat conducting plate 52 and the second heat conducting plate 54 connected in a heat conducting manner through a heat conducting portion, as an embodiment, the heat conducting portion includes a first heat conducting portion (not shown), at least a portion of the first side plate 523 extends toward the second side plate 543 and forms a first heat conducting portion, and the first heat conducting portion is attached to the second side plate 543.

As another embodiment, as shown in fig. 7 and 8, the heat conduction portion includes a second heat conduction portion 544, at least a portion of the second side plate 543 extends toward the first side plate 523 and forms the second heat conduction portion 544, and the second heat conduction portion 544 is attached to the first side plate 523.

As still another embodiment, the heat conducting portion may be a heat conducting sheet or a heat conducting plate connected between the first side plate 523 and the second side plate 543.

In addition, in order to further improve the heat dissipation effect on the first electronic component 41, as shown in fig. 3 and 10, the unmanned aerial vehicle may further include a mounting bracket 7 disposed in the cabin 2, and a leg 8 connected to the mounting bracket 7, wherein the leg 8 extends from the mounting bracket 7 toward the outside of the housing 1 and protrudes outward from the housing 1, the first electronic component 41 is connected to the mounting bracket 7, and both the mounting bracket 7 and the leg 8 are made of a heat conductive material. Since the mounting bracket 7 and the leg 8 are made of heat conductive material, and the leg 8 extends from the mounting bracket 7 to the outside of the cabinet 1 and extends out of the cabinet 1, a part of heat emitted by the first electronic component 41 connected to the mounting bracket 7 can be transferred to the leg 8 through the mounting bracket 7, and a part of the leg 8 extending out of the cabinet 1 can exchange heat with air outside the cabinet 1, so as to emit heat out of the cabinet 1.

The first electronic component 41 may be directly connected to the mounting bracket 7 or indirectly connected to the mounting bracket 7, for example, for embodiments in which the first heatsink assembly 5 includes a first thermally conductive plate 52 and a second thermally conductive plate 54, as shown in fig. 10, the first electronic component 41 may be connected to the mounting bracket 7 via the first thermally conductive plate 52 or the second thermally conductive plate 54.

Here, in addition to the support legs 8 being used to assist in dissipating heat from the first electronic component 41, for implementation scenarios where the drone provided by the present disclosure is used to perform a delivery task (e.g., for delivering take-away or courier), the support legs 8 may be used to secure items to be delivered.

Alternatively, the mounting bracket 7, the leg 8, the first heat-conducting plate 52, the second heat-conducting plate 54, and the heat sink 53 may be made of a material having a high heat conductivity, such as aluminum, an aluminum alloy, a heat-conducting ceramic, carbon fiber, graphene, or the like.

In addition, as mentioned above, in the unmanned aerial vehicle provided by the present disclosure, the second cooling fan 61 is used for generating an air flow in the space outside the sub-chamber 3 in the nacelle 2, and the air flow enters from one of the first nacelle air opening 13 and the second nacelle air opening 14 and exits from the other, so that the second cooling fan 61 can cool the inside of the nacelle 2. To facilitate the air flow in the space outside the sub-chamber 3 in the nacelle 2, as shown with reference to fig. 1, 2, 4, the first nacelle air opening 13 and the second nacelle air opening 14 may be oppositely disposed, for example, the first nacelle air opening 13 and the second nacelle air opening 14 may be oppositely disposed along the front-rear direction, the left-right direction, or the up-down direction of the drone. In this way, the air flow from the first nacelle air opening 13 and to the second nacelle air opening 14, or from the second nacelle air opening 14 to the first nacelle air opening 13, may flow over the second electronic component 42 and other heat generating elements disposed in the nacelle 2 to carry away the heat generated by the second electronic component 42 and other heat generating elements disposed in the nacelle 2.

Optionally, the drone may further comprise a second electronic component 42, the second electronic component 42 being arranged in the nacelle 2, the second electronic component 42 may be an electronic component with low requirements for heat dissipation, and the second electronic component 42 may be cooled by the airflow flowing into the nacelle 2. Here, the second electronic component 42 may be a power supply electronic component, and the second electronic component 42 may include a power supply control board 421 and a power supply chip 422 provided on the power supply control board 421, or the second electronic component 42 may be an electronic component with low heat generation power such as a signal lamp provided in the nacelle 2.

Alternatively, the power consumption of the first electronic component 41 may be greater than the power consumption of the second electronic component 42.

In order to perform auxiliary heat dissipation on the second electronic component 42, for an embodiment in which the unmanned aerial vehicle includes the mounting bracket 7 and the leg 8, and both the mounting bracket 7 and the leg 8 are made of a heat conductive material, as shown in fig. 3 and 10, the second electronic component 42 may be mounted on the mounting bracket 7, so that the heat of the second electronic component 42 may transfer part of the heat dissipated therefrom to the leg 8 through the mounting bracket 7, and a portion of the leg 8 extending out of the enclosure 1 may exchange heat with air outside the enclosure 1, so as to dissipate the heat out of the enclosure 1, thereby achieving auxiliary heat dissipation on the second electronic component 42.

Optionally, as shown in fig. 3 and 10, the second electronic component 42 and the first electronic component 41 may be arranged along the up-down direction of the drone so as to reasonably utilize the space inside the chassis 1, make the structure inside the chassis 1 more compact, and improve the utilization rate of the space inside the chassis 1.

Optionally, in order to further avoid that the temperature inside the nacelle 2 is too high, which may affect the normal operation of the first and second

electronic components

41, 42 arranged inside the nacelle 2, at least part of the outer surface of the casing 1 may be covered with a material having a high reflectivity and a low absorption rate, so as to reduce the heat absorption capacity of the casing 1.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure. It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims

1. An unmanned aerial vehicle, comprising:

the air conditioner comprises a machine shell (1), wherein the machine shell (1) defines a machine cabin (2), the machine cabin (2) is provided with a closed sub-chamber (3), a first ventilation opening (11) and a second ventilation opening (12) which are communicated with the sub-chamber (3) are formed in the machine shell (1), and a first machine cabin air opening (13) and a second machine cabin air opening (14) which are communicated with the space outside the sub-chamber (3) in the machine cabin (2) are further formed in the machine shell (1);

a first electronic component (41) arranged in the nacelle (2);

a first heat dissipation assembly (5) comprising a heat dissipation structure and a first heat dissipation fan (51) both arranged in the sub-chamber (3), the heat dissipation structure being used for heat exchange with the first electronic component (41), the first heat dissipation fan (51) being used for generating an air flow in the sub-chamber (3) and flowing through the heat dissipation structure, and the air flow enters from one of the first ventilation opening (11) and the second ventilation opening (12) and flows out from the other;

a second heat dissipation assembly including a second heat dissipation fan (61) disposed at the first nacelle air opening (13), the second heat dissipation fan (61) for generating an air flow in a space outside the sub-chamber (3) in the nacelle (2), and the air flow entering from one of the first nacelle air opening (13) and the second nacelle air opening (14) and exiting from the other.

2. The unmanned aerial vehicle of claim 1, wherein the first ventilation opening (11) and the second ventilation opening (12) are located on the same side of the housing (1), the first cooling fan (51) comprises a housing (511) and a fan body (512) located in the housing (511), both ends of the housing (511) are open, one open end of the housing (511) is connected with the first ventilation opening (11), the other open end of the housing (511) is communicated with a space outside the housing (511) in the sub-chamber (3), and the second ventilation opening (12) is located outside the housing (511).

3. A drone according to claim 2, characterised in that a seal is provided between the housing (511) and the casing (1).

4. A drone according to any one of claims 1 to 3, characterised in that the first dissipating assembly (5) further comprises a first heat-conducting plate (52), the dissipating structure being a plurality of fins (53) formed on the first heat-conducting plate (52), the first electronic component (41) being arranged on the side of the first heat-conducting plate (52) facing away from the plurality of fins (53), the casing (1) having an annular flange (15) formed on its inner surface, the first heat-conducting plate (52) covering the annular flange (15) and closing the opening of the annular flange (15), the first heat-conducting plate (52) and the annular flange (15) defining together the subchamber (3).

5. A drone according to claim 4, characterised in that the first radiator assembly (5) further comprises a second heat-conducting plate (54) arranged opposite the first heat-conducting plate (52), the first heat-conducting plate (52) and the second heat-conducting plate (54) being in heat-conducting contact through a heat-conducting portion, the first electronic component (41) being clamped between the first heat-conducting plate (52) and the second heat-conducting plate (54).

6. A drone according to claim 5, characterised in that the first electronic component (41) comprises a first printed circuit board (411) and a first electronic component (412) arranged on the side of the first printed circuit board (411) close to the first heat-conducting plate (52), the first heat-conducting plate (52) having a first housing chamber (521) formed thereon, the first printed circuit board (411) being clamped between the first heat-conducting plate (52) and the second heat-conducting plate (54), and the first electronic component (412) being housed in the first housing chamber (521), and/or;

the first electronic component (41) comprises a first printed circuit board (411) and a second electronic component (413) arranged on one side of the second heat conduction plate (54) close to the first printed circuit board (411), a second accommodating cavity (541) is formed in the second heat conduction plate (54), the first printed circuit board (411) is clamped between the first heat conduction plate (52) and the second heat conduction plate (54), and the second electronic component (413) is accommodated in the second accommodating cavity (541).

7. The unmanned aerial vehicle of claim 6, wherein the first heat-conducting plate (52) comprises a first plate body (522) and a first side plate (523) formed around the first plate body (522), the first side plate (523) and the first plate body (522) jointly enclose the first accommodating cavity (521), the heat sink (53) is formed on the first plate body (522), the second heat-conducting plate (54) comprises a second plate body (542) and a second side plate (543) formed around the second plate body (542), the second side plate (543) and the second plate body (542) jointly enclose the second accommodating cavity (541), and the first printed circuit board (411) is clamped between the first side plate (523) and the second side plate (543);

the heat conducting part comprises a first heat conducting part, at least part of the first side plate (523) extends towards the second side plate (543) to form the first heat conducting part, and the first heat conducting part is attached to the second side plate (543), or;

the heat conduction part comprises a second heat conduction part (544), at least part of the second side plate (543) extends towards the first side plate (523) and forms the second heat conduction part (544), and the second heat conduction part (544) is attached to the first side plate (523).

8. An unmanned aerial vehicle according to claim 6, wherein the first heat-conducting plate (52) is formed with a first boss (524), and the first boss (524) is located in the first accommodating cavity (521) and abuts against the first electronic component (412), and/or;

and a second boss is formed on the second heat conduction plate (54), is positioned in the second accommodating cavity (541) and is abutted against the second electronic component (413).

9. A drone according to claim 4, characterised in that at least some of the fins (53) are formed with a recess (531) recessed towards the first electronic component (41), the first radiator fan (51) being arranged inside the recess (531).

10. A drone according to claim 1, further comprising a mounting bracket (7) arranged inside the nacelle (2), legs (8) connected to the mounting bracket (7), the legs (8) extending from the mounting bracket (7) towards the outside of the casing (1) and protruding outwards from the casing (1), the first electronic member (41) being connected to the mounting bracket (7), the mounting bracket (7) and the legs (8) being made of a heat-conducting material.

11. A drone according to claim 10, further comprising a second electronic component (42) provided in the nacelle (2), the second electronic component (42) being mounted on the mounting bracket (7), and the second electronic component (42) and the first electronic component (41) being arranged in an up-down direction of the drone.