CN113939152A - Water-cooling heat dissipation module and electronic equipment - Google Patents
Water-cooling heat dissipation module and electronic equipment Download PDFInfo
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- CN113939152A CN113939152A CN202111162192.2A CN202111162192A CN113939152A CN 113939152 A CN113939152 A CN 113939152A CN 202111162192 A CN202111162192 A CN 202111162192A CN 113939152 A CN113939152 A CN 113939152A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application discloses water-cooling module and electronic equipment, water-cooling module includes: the first heat dissipation branch is used for guiding a heat dissipation medium to flow at a first space position; the second heat dissipation branch is communicated with the first heat dissipation branch and used for guiding a heat dissipation medium to flow at a second space position; the first space position and the second space position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of electronic equipment, at least part of a first heat generation assembly of the electronic equipment is dissipated through the first heat dissipation branch, and at least part of a second heat generation assembly of the electronic equipment is dissipated through the second heat dissipation branch. The water-cooling heat dissipation module of this application embodiment has increased the mode of water-cooling heat dissipation module, has improved the adaptability of water-cooling heat dissipation module.
Description
Technical Field
The application relates to a water-cooling heat dissipation module and electronic equipment.
Background
The water-cooling heat dissipation module is equipment frequently used by people and is used for dissipating heat of a heating structure; however, the water-cooling heat dissipation module has a single form and is poor in adaptability.
Disclosure of Invention
In view of the above, embodiments of the present disclosure are intended to provide a water-cooling heat dissipation module and an electronic device.
In order to achieve the purpose, the technical scheme of the application is realized as follows:
the embodiment of the application provides a water-cooling heat dissipation module, include:
the first heat dissipation branch is used for guiding a heat dissipation medium to flow at a first space position;
the second heat dissipation branch is communicated with the first heat dissipation branch and used for guiding a heat dissipation medium to flow at a second space position;
the first space position and the second space position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of electronic equipment, at least part of a first heat generation assembly of the electronic equipment is dissipated through the first heat dissipation branch, and at least part of a second heat generation assembly of the electronic equipment is dissipated through the second heat dissipation branch.
In some optional implementations, the method further includes:
the first heat dissipation branch circuit and the second heat dissipation branch circuit are communicated through the box body;
and the driving assembly is arranged on the first heat dissipation branch or the second heat dissipation branch and used for driving the heat dissipation medium to flow among the first heat dissipation branch, the box body and the second heat dissipation branch.
In some alternative implementations, the drive assembly includes:
a flow guide member having a first receiving chamber, at least two first outlets and at least two first inlets; the at least two first outlets are communicated with the box body through a first part of the first radiating branch; at least two first inlets are communicated with the box body through the second part of the first radiating branch;
the driving device is arranged in the first accommodating cavity and used for driving the heat dissipation medium entering from the first inlet to be output to the second part of the first heat dissipation branch through the first outlet so as to at least realize the flow of the heat dissipation medium between the box body and the radiator;
a sealing member for sealing the driving device into the first receiving cavity of the deflector.
In some optional implementations, the heat radiator further comprises a heat radiating pipe, and the heat radiating pipe is provided with a plurality of heat radiating pipes;
the box body is provided with one box body, the plurality of radiating pipes are communicated with the box body, and the plurality of radiating pipes form the first radiating branch; or the like, or, alternatively,
the box is provided with two, two boxes pass through a plurality of cooling tubes communicate each other, a plurality of cooling tubes form first heat dissipation branch road.
In some optional implementations, the plurality of heat pipes includes:
the first end of the first part of radiating pipe is communicated with the box body;
the second part of radiating pipe and the first part of radiating pipe are arranged at intervals in the first direction, the first end of the second part of radiating pipe is communicated with the box body, and the second end of the second part of radiating pipe is communicated with the second end of the first part of radiating pipe;
the first end of the third radiating pipe is communicated with the box body, and the second end of the third radiating pipe is communicated with the driving assembly;
the first end of the fourth part of radiating pipe is communicated with the driving assembly, and the second end of the fourth part of radiating pipe is communicated with the second end of the second part of radiating pipe and the second end of the first part of radiating pipe respectively;
the driving assembly is arranged in an accommodating space formed by the first radiating pipe part, the second radiating pipe part, the third radiating pipe part and the fourth radiating pipe part in a surrounding mode.
In some optional implementations, the second heat dissipation branch includes:
the two first part pipe bodies are communicated with the box body and used for guiding the heat dissipation medium out of or into the box body;
the second part of tube bodies are communicated with the two first part of tube bodies and are used for absorbing at least part of heat in the second heating assembly;
wherein the first portion of tubing and the second portion of tubing are of different materials.
The embodiment of the application also provides electronic equipment, which comprises a body, a first heating assembly, a second heating assembly and the water-cooling heat dissipation module;
the body is provided with a second accommodating cavity; the first heat dissipation branch, the second heat dissipation branch, the first heating assembly and the second heating assembly are arranged in the second accommodating cavity;
the first radiating branch dissipates heat of at least part of the first heating assembly, and the second radiating branch dissipates heat of at least part of the second heating assembly.
In some optional implementations, the water-cooled heat dissipation module includes a heat sink; the radiator comprises a plurality of radiating pipes, and the plurality of radiating pipes form the first radiating branch;
the diapire of body has the fresh air inlet, the fresh air inlet with the first side of radiator corresponds, and external environment's air can be followed the fresh air inlet is leading-in clearance between a plurality of cooling tubes.
In some optional implementations, the electronic device further includes:
the first group of fans are arranged on the body, correspond to the first air outlet holes in the first side wall of the body in position, and are used for guiding air passing through the radiator out of the first air outlet holes; wherein the first side wall is disposed adjacent to the bottom wall;
the second group of fans are arranged on the body, correspond to the second air outlet hole in the second side wall of the body in position and are used for guiding air passing through the radiator out of the second air outlet hole; wherein the second sidewall is disposed opposite the first sidewall.
In some alternative implementations, the heat sink is affixed to a bottom wall of the body;
the electronic device further includes:
the bearing plate is arranged in the second accommodating cavity and is positioned on one side, far away from the bottom wall, of the radiator;
the first heating assembly is arranged between the bearing plate and the heat radiator and is in thermal contact with the heat radiator;
the second heating assembly is arranged on one side of the bearing plate, which is far away from the radiator;
the second heat dissipation branch is arranged on one side, away from the bearing plate, of the second heating assembly and is in contact with the second heating assembly.
The water-cooling heat dissipation module of this application embodiment includes: the first heat dissipation branch is used for guiding a heat dissipation medium to flow at a first space position; the second heat dissipation branch is communicated with the first heat dissipation branch and used for guiding a heat dissipation medium to flow at a second space position; the first space position and the second space position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of an electronic device, at least part of a first heat generation component of the electronic device is dissipated through at least the first heat dissipation branch, and at least part of a second heat generation component of the electronic device is dissipated through the second heat dissipation branch; the two heat dissipation branches can dissipate at least part of the first heating assembly and at least part of the second heating assembly; the working mode of the water-cooling heat dissipation module is increased, and the adaptability of the water-cooling heat dissipation module is improved.
Drawings
Fig. 1 is a schematic view of an alternative structure of a water-cooling heat dissipation module according to an embodiment of the present disclosure;
fig. 2 is a schematic view of an alternative structure of the water-cooling heat dissipation module according to the embodiment of the present application;
FIG. 3 is a schematic view of an alternative structure of a driving assembly of the water-cooling heat dissipation module according to the embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of an alternative structure of a driving assembly of the water-cooled heat dissipation module according to the embodiment of the present disclosure;
FIG. 5 is a schematic view of an alternative structure of a driving assembly of the water-cooling heat dissipation module according to the embodiment of the present disclosure;
FIG. 6 is an exploded view of an alternative structure of a driving component of a water-cooled heat dissipation module according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of an alternative partial structure of a water-cooling heat dissipation module according to an embodiment of the present disclosure;
fig. 8 is an alternative structural diagram of the second heat dissipation branch of the water-cooling heat dissipation module in the embodiment of the present application;
fig. 9 is an alternative structural diagram of the second heat dissipation branch of the water-cooling heat dissipation module in the embodiment of the present application;
FIG. 10 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 11 is an exploded view of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 12 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 13 is an exploded view of an alternative configuration of an electronic device in an embodiment of the present application;
FIG. 14 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;
FIG. 15 is an exploded view of an alternative partial structure of an electronic device in an embodiment of the present application;
fig. 16 is a schematic diagram of an alternative partial structure of a fan of an electronic device in an embodiment of the present application.
110. A first heat dissipation branch; 120. a second heat dissipation branch; 121. a first portion of tubing; 122. a second portion of tubing; 123. a second heat-conducting member; 130. a box body; 140. a flow guide member; 141. a first accommodating chamber; 142. a first outlet; 143. a first inlet; 150. a drive device; 161. a seal member; 162. a first heat-conducting member; 170. a heat sink; 171. a first part radiating pipe; 172. a second part of radiating pipe; 173. a third part of radiating pipe; 174. the fourth part of radiating pipe; 210. a body; 211. a second accommodating chamber; 212. a bottom wall; 213. an air inlet hole; 214. a first side wall; 216. a first air outlet; 220. a first heat generating component; 230. a second heat generating component; 240. a first set of fans; 250. a second group of fans; 260. a carrier plate.
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments of the specification.
In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.
It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.
The water-cooled heat dissipation module according to the embodiment of the present application will be described in detail below with reference to fig. 1 to 9.
The water-cooling heat dissipation module comprises: a first heat dissipation branch 110 and a second heat dissipation branch 120 communicated with the first heat dissipation branch 110. The first heat dissipation branch 110 is used for guiding the heat dissipation medium to flow at a first spatial position. The second heat dissipation branch 120 is used for guiding the heat dissipation medium to flow at a second spatial position; the first spatial position and the second spatial position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of an electronic device, at least part of a first heat generation component 220 of the electronic device is dissipated through at least the first heat dissipation branch 110, and at least part of a second heat generation component 230 of the electronic device is dissipated through the second heat dissipation branch 120; through the two heat dissipation branches, heat can be dissipated to at least part of the first heat generation assembly 220 and at least part of the second heat generation assembly 230; the working mode of the water-cooling heat dissipation module is increased, and the adaptability of the water-cooling heat dissipation module is improved.
In the embodiment of the present application, the structure of the first heat dissipation branch 110 is not limited. For example, the first heat dissipation branch 110 may include at least two first tubes, and the at least two first tubes contain a heat dissipation medium therein.
In the embodiment of the present application, the structure of the second heat dissipation branch 120 is not limited. For example, the second heat dissipation branch 120 may include at least two second tubes, and the at least two second tubes contain a heat dissipation medium therein.
Here, the implementation manner of the second heat dissipation branch 120 communicating with the first heat dissipation branch 110 is not limited. For example, the second heat dissipation branch 120 directly communicates with the pipe of the first heat dissipation branch 110. For another example, the second heat dissipation branch 120 and the pipe of the first heat dissipation branch 110 may also be communicated through other structures.
Here, the first spatial position and the second spatial position may not overlap at all, or may not overlap only partially.
Here, the structures of the first and second heat generating components 220 and 230 are not limited. As long as the first and second heat generating components 220 and 230 generate heat.
In some optional implementation manners of the embodiment of the present application, the water-cooling heat dissipation module may further include: at least one housing 130 and a drive assembly. At least one box 130 is used for accommodating a heat dissipation medium, and the first heat dissipation branch 110 and the second heat dissipation branch 120 are communicated through the box 130; the driving component is disposed on the first heat dissipation branch 110 or the second heat dissipation branch 120, and the driving component is configured to drive the heat dissipation medium to flow among the first heat dissipation branch 110, the box 130, and the second heat dissipation branch 120; through the box 130, more heat dissipation media can flow between the first heat dissipation branch 110 and the second heat dissipation branch 120, so that more heat of the heating component can be taken away, and the heat dissipation performance of the water-cooling heat dissipation module is improved.
In the present implementation, the number of the cases 130 is not limited. For example, the case 130 may be provided with one. For another example, the case 130 may be provided with two.
In this implementation, the structure of the drive assembly is not limited.
For example, as shown in fig. 3 and 4, the driving assembly may include: a baffle 140 and a drive 150. The flow guide 140 has a first receiving chamber 141, at least two first outlets 142, and at least two first inlets 143; the at least two first outlets 142 are communicated with the box body 130 through a first part of the first radiating branch 110; at least two first inlets 143 are communicated with the case 130 through a second portion of the first radiating branch 110; the driving device 150 is disposed in the first accommodating cavity 141, and the driving device 150 is configured to drive the heat dissipation medium entering from the first inlet 143 to be output to the second portion of the first heat dissipation branch 110 through the first outlet 142, so as to at least realize the flow of the heat dissipation medium between the box 130 and the heat sink 170; the heat dissipation medium can be introduced from the at least two first outlets 142 and be extracted from the at least two first outlets 142 by the flow guide 140 and the driving device 150; the at least two first outlets 142 are capable of being simultaneously communicated with at least two tubes of the first heat dissipation branch 110, and the at least two first outlets 142 are capable of being simultaneously communicated with at least two tubes of the first heat dissipation branch 110; the quantity of the leading-in pipe bodies and the leading-out pipe bodies is greatly increased; the working mode of the water-cooling heat dissipation module is increased.
In this example, the structure of the driving device 150 is not limited. For example, the driving device 150 may be a pump. Of course, the drive assembly may also comprise only the drive means 150, where the drive assembly has one inlet and one outlet.
In this example, the drive means 150 has a second outlet and a second inlet; flow guide 140 has at least two first outlets 142 and at least two first inlets 143; by providing the driving means 150 in the first receiving chamber 141, the guide member 140 can increase the number of inlets and outlets of the driving assembly.
Here, the sectional area of the at least two first outlets 142 may be greater than that of the second outlets, and the sectional area of the at least two first inlets 143 may be greater than that of the second inlets; so that the cross-sectional area of the drive assembly inlet and outlet can also be increased by the baffle 140; under the condition that the power of the driving device 150 is the same, the flow speed of the heat-dissipating medium can be reduced through the large-area inlet and outlet, so that the heat-dissipating medium can perform heat exchange more sufficiently, and the heat-dissipating capacity of the water-cooling heat-dissipating module can be improved under the condition that the power of the driving device 150 is not changed; in addition, in the case of providing the same heat dissipation capability, the driving device 150 herein can reduce the input power, so that the noise of the driving device 150 for the water-cooling heat dissipation module during high power operation can also be reduced.
In this example, as shown in fig. 4 and 6, the driving assembly may further include: a sealing member 161, wherein the sealing member 161 is used for sealing the first side of the driving device 150 into the first accommodating cavity 141 of the guide member 140; to prevent the heat-dissipating medium from flowing out of the first side of the driving device 150; here, the first side of the driving device 150 may be a side where the rotational axis of the driving device 150 is located.
In this example, the structure of the baffle 140 is not limited. For example, the material of the flow guiding element 140 may be aluminum or copper. The first heat dissipation branch 110 can also dissipate heat of the first heat generating component 220 based on the flow guiding element 140. For example, as shown in fig. 5 and 6, the driving assembly may further include: the first heat conduction member 162 is attached to one side of the air guiding member 140, and the first heat conduction member 162 is used for contacting with the first heat generating assembly 220, so that the first heat dissipation branch 110 dissipates heat based on the first heat conduction member 162 and the air guiding member 140 in the driving assembly. Of course, the driving assembly may not be provided with the first heat conduction member 162, and the air guiding member 140 may be directly contacted with the first heat generating assembly 220. Here, since the first receiving cavity 141 receives a large amount of heat dissipation medium therein, the heat dissipation capability of the first heat dissipation branch 110 can be improved by the contact between the flow guiding member 140 receiving a large amount of heat dissipation medium and the first heat generating component 220.
In this implementation, the water-cooling heat dissipation module may further include a heat sink 170, where the heat sink 170 has a plurality of heat dissipation pipes; the plurality of heat dissipation pipes form the first heat dissipation branch 110. Here, the case 130 may be provided with one, and the plurality of radiating pipes communicate with the one case 130. Of course, the tank body 130 may be provided in two, and the two tank bodies 130 are communicated with each other through the plurality of radiating pipes.
Here, the driving assembly may be disposed at one side of the heat sink 170. Of course, the driving assembly may also be disposed within the heat sink 170; here, the driving assembly is disposed in the heat sink 170 to reduce a space in which the water-cooling heat dissipation module is disposed, and thus, a volume of the water-cooling heat dissipation module can be reduced.
As an example, as shown in fig. 7, the plurality of radiating pipes may include: a first partial heat pipe 171, a second partial heat pipe 172, a third partial heat pipe 173 and a fourth partial heat pipe 174. A first end of the first partial radiating pipe 171 is communicated with the tank body 130; the second partial radiating pipe 172 is spaced apart from the first partial radiating pipe 171 in the first direction, a first end of the second partial radiating pipe 172 is communicated with the tank body 130, and a second end of the second partial radiating pipe 172 is communicated with a second end of the first partial radiating pipe 171; the first end of the third partial radiating pipe 173 is communicated with the tank body 130, and the second end of the third partial radiating pipe 173 is communicated with the driving assembly; a first end of the fourth partial radiating pipe 174 is communicated with the driving assembly, and a second end of the fourth partial radiating pipe 174 is communicated with a second end of the second partial radiating pipe 172 and a second end of the first partial radiating pipe 171 respectively; wherein, the driving unit is disposed in the receiving space defined by the first portion of heat dissipation tube 171, the second portion of heat dissipation tube 172, the third portion of heat dissipation tube 173 and the fourth portion of heat dissipation tube 174.
Here, the first direction is not limited. For example, the first direction may be a width direction of the first partial heat pipe 171.
Here, one of the third and fourth partial heat pipes 173 and 174 is communicated with the inlet of the driving unit, and the other is communicated with the outlet of the driving unit. As an example, the third partial radiating pipe 173 is in corresponding communication with at least two first outlets 142, and the fourth partial radiating pipe 174 is in corresponding communication with at least two first inlets 143.
Here, the second ends of the first partial radiating pipe 171, the second end of the second partial radiating pipe 172 and the second end of the fourth partial radiating pipe 174 may be communicated through a pipe body, and may also be communicated through the tank body 130.
In some optional implementations of the embodiment of the present application, as shown in fig. 8 and 9, the second heat dissipation branch 120 may include: two first partial tubes 121 and two second partial tubes 122. The two first partial pipe bodies 121 are communicated with the box body 130, and the two first partial pipe bodies 121 are used for guiding a heat dissipation medium out of or into the box body; the second partial tube 122 is communicated with the two first partial tubes 121, and the second partial tube 122 is used for absorbing at least part of heat in the second heat generating component 230; wherein the first partial tube 121 and the second partial tube 122 are made of different materials; so as to improve the heat dissipation capability of the second heat dissipation branch 120.
In this implementation, the material of the first partial pipe 121 may be a material with a low thermal conductivity. As an example, the material of the first partial pipe 121 may be rubber.
In this implementation, the material of the second partial pipe 122 may be a material with high thermal conductivity. As an example, the material of the second portion of the tube 122 may be copper or aluminum.
In this implementation, the second partial tube 122 may directly contact the second heat generating component 230, or may contact the second heat generating component 230 through another structure.
As an example, as shown in fig. 8 and 9, the second heat dissipation branch 120 may include: the second partial pipe body 122 is arranged in the second heat conducting member 123 in a penetrating manner, and the second heat conducting member 123 is in contact with the second heating component 230; the area of the second heat-conducting member 123 is larger than that of the second partial pipe 122, so that more heat of the second heat-generating component 230 can be absorbed by the larger area of the second heat-conducting member 123.
Here, the second heat-conducting member 123 may have a plate-like structure, and may have a block-like structure.
Here, the material of the second heat conduction member 123 may be aluminum or copper.
The water-cooling heat dissipation module of this application embodiment includes: the first heat dissipation branch 110 is used for guiding a heat dissipation medium to flow at a first spatial position; a second heat dissipation branch 120 communicated with the first heat dissipation branch 110, for guiding a heat dissipation medium to flow at a second spatial position; the first spatial position and the second spatial position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of an electronic device, at least part of a first heat generation component 220 of the electronic device is dissipated through at least the first heat dissipation branch 110, and at least part of a second heat generation component 230 of the electronic device is dissipated through the second heat dissipation branch 120; through the two heat dissipation branches, heat can be dissipated to at least part of the first heat generation assembly 220 and at least part of the second heat generation assembly 230; the working mode of the water-cooling heat dissipation module is increased, and the adaptability of the water-cooling heat dissipation module is improved.
As shown in fig. 10, an embodiment of the present application further describes an electronic device, where the electronic device includes a body 210, a first heat generating component 220, a second heat generating component 230, and the water-cooling heat dissipation module of the embodiment of the present application; the body 210 has a second receiving cavity 211; the first heat dissipation branch 110, the second heat dissipation branch 120, the first heat generating component 220 and the second heat generating component 230 are disposed in the second accommodating cavity 211; the first heat dissipation branch 110 dissipates heat of at least a portion of the first heat generating component 220, and the second heat dissipation branch 120 dissipates heat of at least a portion of the second heat generating component 230.
In the embodiment of the present application, the related features of the water-cooling heat dissipation module have been described above, and are not described herein again.
In the embodiments of the present application, the structure of the electronic device is not limited. For example, the electronic device may be a processor of a computer. Also for example, the electronic device may be a notebook computer.
Here, the structure of the first heat generating assembly 220 is not limited. For example, at least a portion of the first heat generating component 220 may be a Central Processing Unit (CPU).
Here, the structure of the second heat generating component 230 is not limited. For example, at least a portion of the second heat generating component 230 may be a Graphics Processing Unit (GPU).
In some optional implementations of embodiments of the present application, as shown in fig. 11 and fig. 12, the water-cooled heat dissipation module includes a heat sink 170; the heat sink 170 may include a plurality of heat dissipation pipes forming the first heat dissipation branch 110; the bottom wall 212 of the body 210 has an air inlet hole 213, the air inlet hole 213 corresponds to the first side of the heat sink 170, and the air of the external environment can be introduced into the gaps between the plurality of heat dissipation pipes through the air inlet hole 213.
Here, the first side of the heat sink 170 has a large surface. As an example, the first side of the heat sink 170 is a surface of the heat sink 170 with the largest area.
In some optional implementations of the embodiment of the present application, as shown in fig. 13 and 14, the electronic device may further include: a first set of fans 240 and a second set of fans 250. The first set of fans 240 is disposed on the body 210, the first set of fans 240 corresponds to the first air outlet 216 of the first sidewall 214 of the body 210, and the first set of fans 240 is used for guiding the air passing through the heat sink 170 out of the first air outlet 216; wherein the first sidewall 214 is disposed adjacent to the bottom wall 212; the second set of fans 250 is disposed on the body 210, and the second set of fans 250 corresponds to a second air outlet of the second sidewall of the body 210, and is used for guiding the air passing through the heat sink 170 out of the second air outlet; the air is derived from the exhaust vents of two lateral walls of body 210, can increase the area of exhaust vent, improves electronic equipment's heat-sinking capability.
Here, the second side wall and the first side wall 214 may be both disposed adjacent to the bottom wall 212. Of course, the second sidewall and the first sidewall 214 may be disposed opposite to each other, as shown in fig. 13 and 14.
Here, the structures of the first and second groups of fans 240 and 250 are not limited. As an example, the first set of fans 240 and the second set of fans 250 each include three fans as shown in FIG. 16.
In some alternative implementations of the embodiments of the present application, as shown in fig. 13 and 15, the heat sink 170 may be attached to the bottom wall 212 of the body 210; the electronic device may further include: a carrier plate 260. The carrier plate 260 is disposed in the second receiving cavity 211, and the carrier plate 260 is located on a side of the heat sink 170 away from the bottom wall 212; the first heat generating component 220 is disposed between the loading plate 260 and the heat sink 170, and the first heat generating component 220 is in thermal contact with the heat sink 170; the second heat generating component 230 is disposed on a side of the carrier plate 260 away from the heat sink 170; the second heat dissipation branch 120 is disposed on a side of the second heat generating component 230 away from the carrier 260, and the second heat dissipation branch 120 contacts the second heat generating component 230; so that the first heat dissipation branch 110, the first heat generation assembly 220, the second heat generation assembly 230 and the second heat dissipation branch 120 form a stacked structure, as shown in fig. 14, and thus the installation space of the water-cooling heat dissipation module can be reduced, so that the electronic device has a smaller volume and stronger adaptability.
Here, the structure of the carrier plate 260 is not limited. For example, the carrier plate 260 may be a main board of the electronic device.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A water-cooling heat dissipation module includes:
the first heat dissipation branch is used for guiding a heat dissipation medium to flow at a first space position;
the second heat dissipation branch is communicated with the first heat dissipation branch and used for guiding a heat dissipation medium to flow at a second space position;
the first space position and the second space position are at least partially not overlapped, so that when the water-cooling heat dissipation module is configured to dissipate heat of electronic equipment, at least part of a first heat generation assembly of the electronic equipment is dissipated through the first heat dissipation branch, and at least part of a second heat generation assembly of the electronic equipment is dissipated through the second heat dissipation branch.
2. The water-cooled heat dissipation module of claim 1, further comprising:
the first heat dissipation branch circuit and the second heat dissipation branch circuit are communicated through the box body;
and the driving assembly is arranged on the first heat dissipation branch or the second heat dissipation branch and used for driving the heat dissipation medium to flow among the first heat dissipation branch, the box body and the second heat dissipation branch.
3. The water-cooled heat dissipation module as set forth in claim 2, wherein the driving assembly comprises:
a flow guide member having a first receiving chamber, at least two first outlets and at least two first inlets; the at least two first outlets are communicated with the box body through a first part of the first radiating branch; at least two first inlets are communicated with the box body through the second part of the first radiating branch;
the driving device is arranged in the first accommodating cavity and used for driving the heat dissipation medium entering from the first inlet to be output to the second part of the first heat dissipation branch through the first outlet so as to at least realize the flow of the heat dissipation medium between the box body and the radiator;
a sealing member for sealing the driving device into the first receiving cavity of the deflector.
4. The water-cooled heat dissipation module of claim 2, further comprising a heat sink having a plurality of heat dissipation tubes;
the box body is provided with one box body, the plurality of radiating pipes are communicated with the box body, and the plurality of radiating pipes form the first radiating branch; or the like, or, alternatively,
the box is provided with two, two boxes pass through a plurality of cooling tubes communicate each other, a plurality of cooling tubes form first heat dissipation branch road.
5. The water cooled heat dissipation module as set forth in claim 4, wherein the plurality of heat pipes comprises:
the first end of the first part of radiating pipe is communicated with the box body;
the second part of radiating pipe and the first part of radiating pipe are arranged at intervals in the first direction, the first end of the second part of radiating pipe is communicated with the box body, and the second end of the second part of radiating pipe is communicated with the second end of the first part of radiating pipe;
the first end of the third radiating pipe is communicated with the box body, and the second end of the third radiating pipe is communicated with the driving assembly;
the first end of the fourth part of radiating pipe is communicated with the driving assembly, and the second end of the fourth part of radiating pipe is communicated with the second end of the second part of radiating pipe and the second end of the first part of radiating pipe respectively;
the driving assembly is arranged in an accommodating space formed by the first radiating pipe part, the second radiating pipe part, the third radiating pipe part and the fourth radiating pipe part in a surrounding mode.
6. The water-cooled heat dissipation module as recited in claim 2, wherein the second heat dissipation branch comprises:
the two first part pipe bodies are communicated with the box body and used for guiding the heat dissipation medium out of or into the box body;
the second part of tube bodies are communicated with the two first part of tube bodies and are used for absorbing at least part of heat in the second heating assembly;
wherein the first portion of tubing and the second portion of tubing are of different materials.
7. An electronic device, comprising a body, a first heat generating component, a second heat generating component and the water-cooling heat dissipating module set of any one of claims 1 to 6;
the body is provided with a second accommodating cavity; the first heat dissipation branch, the second heat dissipation branch, the first heating assembly and the second heating assembly are arranged in the second accommodating cavity;
the first radiating branch dissipates heat of at least part of the first heating assembly, and the second radiating branch dissipates heat of at least part of the second heating assembly.
8. The electronic device of claim 7, the water-cooled heat dissipation module comprising a heat sink; the radiator comprises a plurality of radiating pipes, and the plurality of radiating pipes form the first radiating branch;
the diapire of body has the fresh air inlet, the fresh air inlet with the first side of radiator corresponds, and external environment's air can be followed the fresh air inlet is leading-in clearance between a plurality of cooling tubes.
9. The electronic device of claim 8, further comprising:
the first group of fans are arranged on the body, correspond to the first air outlet holes in the first side wall of the body in position, and are used for guiding air passing through the radiator out of the first air outlet holes; wherein the first side wall is disposed adjacent to the bottom wall;
the second group of fans are arranged on the body, correspond to the second air outlet hole in the second side wall of the body in position and are used for guiding air passing through the radiator out of the second air outlet hole; wherein the second sidewall is disposed opposite the first sidewall.
10. The electronic device of claim 8 or 9, the heat sink being affixed to a bottom wall of the body;
the electronic device further includes:
the bearing plate is arranged in the second accommodating cavity and is positioned on one side, far away from the bottom wall, of the radiator;
the first heating assembly is arranged between the bearing plate and the heat radiator and is in thermal contact with the heat radiator;
the second heating assembly is arranged on one side of the bearing plate, which is far away from the radiator;
the second heat dissipation branch is arranged on one side, away from the bearing plate, of the second heating assembly and is in contact with the second heating assembly.
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| CN202111162192.2A CN113939152B (en) | 2021-09-30 | 2021-09-30 | Water-cooling heat dissipation module and electronic equipment |
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| CN202111162192.2A CN113939152B (en) | 2021-09-30 | 2021-09-30 | Water-cooling heat dissipation module and electronic equipment |
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| CN113939152B CN113939152B (en) | 2023-01-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114449869A (en) * | 2022-02-23 | 2022-05-06 | 上海天马微电子有限公司 | Display device |
| CN115500057A (en) * | 2022-09-30 | 2022-12-20 | 联想(北京)有限公司 | Electronic device |
| WO2023207482A1 (en) * | 2022-04-28 | 2023-11-02 | 华为数字能源技术有限公司 | Packaging structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205490097U (en) * | 2016-03-15 | 2016-08-17 | 许继集团有限公司 | Wind generating set and water cooling system of converter thereof |
| CN110494013A (en) * | 2019-07-29 | 2019-11-22 | 联想(北京)有限公司 | Electronic equipment |
| CN211061192U (en) * | 2019-12-17 | 2020-07-21 | 深圳市氢蓝时代动力科技有限公司 | Thermal test equipment |
| CN211090362U (en) * | 2019-07-31 | 2020-07-24 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN111526693A (en) * | 2019-02-01 | 2020-08-11 | 株洲中车时代电气股份有限公司 | Radiator of converter |
| CN113400086A (en) * | 2021-07-01 | 2021-09-17 | 珠海格力智能装备有限公司 | Cooling system |
-
2021
- 2021-09-30 CN CN202111162192.2A patent/CN113939152B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205490097U (en) * | 2016-03-15 | 2016-08-17 | 许继集团有限公司 | Wind generating set and water cooling system of converter thereof |
| CN111526693A (en) * | 2019-02-01 | 2020-08-11 | 株洲中车时代电气股份有限公司 | Radiator of converter |
| CN110494013A (en) * | 2019-07-29 | 2019-11-22 | 联想(北京)有限公司 | Electronic equipment |
| CN211090362U (en) * | 2019-07-31 | 2020-07-24 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN211061192U (en) * | 2019-12-17 | 2020-07-21 | 深圳市氢蓝时代动力科技有限公司 | Thermal test equipment |
| CN113400086A (en) * | 2021-07-01 | 2021-09-17 | 珠海格力智能装备有限公司 | Cooling system |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114449869A (en) * | 2022-02-23 | 2022-05-06 | 上海天马微电子有限公司 | Display device |
| WO2023207482A1 (en) * | 2022-04-28 | 2023-11-02 | 华为数字能源技术有限公司 | Packaging structure |
| CN115500057A (en) * | 2022-09-30 | 2022-12-20 | 联想(北京)有限公司 | Electronic device |
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|---|---|
| CN113939152B (en) | 2023-01-06 |
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