WO2018053872A1

WO2018053872A1 - Heat dissipation mechanism, and unmanned aerial vehicle provided with heat dissipation mechanism

Info

Publication number: WO2018053872A1
Application number: PCT/CN2016/100205
Authority: WO
Inventors: 熊荣明; 唐尹; 熊贤武; 周震昊
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2016-09-26
Filing date: 2016-09-26
Publication date: 2018-03-29
Also published as: CN110139544A; CN110139544B; CN107113997B; CN107113997A

Abstract

A heat dissipation mechanism (30). The heat dissipation mechanism (30) is used for dissipating heat from a circuit board (20) in a movable device. The heat dissipation mechanism (30) comprises a heat dissipation plate (331). The heat dissipation plate (331) forms a partially-exposed housing (11) of the movable device and is connected to the circuit board (20), so that heat of the circuit board (20) is transmitted to the heat dissipation plate (331), and is taken away by an air flow passing through the heat dissipation plate (331). Also provided is an unmanned aerial vehicle (100) provided with the heat dissipation mechanism (30).

Description

Heat dissipation mechanism and unmanned aerial vehicle having the same

Technical field

The invention relates to a heat dissipation mechanism and an unmanned aerial vehicle having the same.

Background technique

With the development of electronic technology, the degree of integration of circuit boards is getting higher and higher, the size of circuit boards is getting smaller and smaller, and the heat flux density of circuit boards is also getting higher and higher. When these boards are applied to miniaturized products (such as unmanned aerial vehicles), the narrow internal space structure of the product is not conducive to heat dissipation of the board. Temperature is a key factor affecting the reliability of the board. As the temperature increases, the board's failure rate increases geometrically. Therefore, how to quickly and efficiently dissipate the board is an important factor in determining the reliability of the product.

Summary of the invention

In view of the above circumstances, it is necessary to provide a heat dissipating mechanism having a high heat dissipation efficiency and an unmanned aerial vehicle having the heat dissipating mechanism.

A heat dissipating mechanism for dissipating heat treatment of a circuit board in a movable device, the heat dissipating mechanism comprising a heat dissipating plate constituting a partially exposed outer casing of the movable device and connected to the circuit board So that the heat of the circuit board is conducted to the heat sink and carried away by the airflow flowing through the heat sink.

An unmanned aerial vehicle includes a body, a circuit board mounted on the body, and a heat dissipation mechanism, wherein the heat dissipation mechanism is configured to dissipate heat treatment on the circuit board, and the heat dissipation mechanism includes a heat dissipation plate, and the heat dissipation plate is used Forming a portion of the exposed outer casing of the unmanned aerial vehicle and connecting to the circuit board to conduct heat of the circuit board to the heat dissipation plate and carried away by the airflow flowing through the heat dissipation plate.

An unmanned aerial vehicle comprising: a fuselage; an arm coupled to the fuselage; a controller disposed within the fuselage; a rotor assembly mounted on the arm, the rotor assembly including a propeller And a motor for driving the propeller to rotate; a fan mounted in the fuselage; wherein the controller is electrically connected to the fan for controlling an operating state of the fan; when the propeller is not rotating, The controller controls the fan to begin operation to dissipate heat from the electrical components within the fuselage or fuselage.

The heat dissipating mechanism is configured to adhere the heat dissipating member to the circuit board having the electronic component, and under the pushing action of the fan, the external airflow is introduced into the heat dissipating component through the flow guiding member to perform heat dissipation processing, and the unmanned aerial vehicle is effectively improved. Cooling efficiency.

DRAWINGS

1 is a perspective view of an unmanned aerial vehicle according to an embodiment of the present invention.

2 is a perspective exploded view of the unmanned aerial vehicle shown in FIG. 1.

Figure 3 is a cross-sectional view of the UAV shown in Figure 1 taken along line III-III.

Main component symbol description

无人飞行器Unmanned aerial vehicle	100100
机身 body	1010
外壳 shell	1111
壳体 case	111111
进气口 Air inlet	11111111
进气格栅 Intake grille	11121112
上盖 Upper cover	112112
容置空间 Housing space	113113
机臂 Arm	1212
安装座Mount	1313
电路板 Circuit board	2020
第一电路板First board	21twenty one
第二电路板Second circuit board	22twenty two
电子元件 Electronic component	201201
散热机构 Heat dissipation mechanism	3030
风扇 fan	3131
导流件 Guide	3232
导流通道 Diversion channel	321321
散热件 Heat sink	3333
散热板 Radiating plate	331331
避位孔Avoiding hole	33113311
散热鳍片 Heat sink fin	332332

The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component or a component that may have a central setting at the same time. When a component is considered to be "set up" to another component, it can be a component that is set directly on another component or that may have a centered setting at the same time.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 1 to FIG. 3 , an unmanned aerial vehicle 100 according to an embodiment of the present invention includes a body 10 , a circuit board 20 mounted on the body 10 , and a heat dissipation mechanism 30 . A plurality of electronic components 201 are disposed on the circuit board 20, and the heat dissipation mechanism 30 is configured to perform heat dissipation processing on the plurality of electronic components 201 on the circuit board 20.

In the present embodiment, the number of the circuit boards 20 is two, that is, the first circuit board 21 and the second circuit board 22. The first circuit board 21 and the second circuit board 22 are disposed in parallel, and the area of the second circuit board 22 is smaller than the area of the first circuit board 21, and the plurality of electronic components 201 are respectively disposed on the first circuit board 21 away from the second circuit. On one side of the board 22, the heat dissipation mechanism 30 performs heat dissipation processing on the plurality of heat-generating electronic components 201 on the first circuit board 21; electronic components that are not heated or components that generate less heat (not shown) are mounted on The second circuit board 22 is disposed on the second circuit board 22 without performing heat dissipation processing. But it is not limited to this.

It can be understood that the plurality of electronic components 201 include, but are not limited to, MOS transistors mounted on the circuit board 20 to provide a stable voltage to other electrical components in the UAV 100 while generating a large amount of heat.

It can be understood that the UAV 100 of the present embodiment should also include other electronic components mounted on the body 10, such as a power source, a capacitor, a warning light, a processor, a controller, etc., to facilitate the implementation of each of the UAVs 100. The function of the item, in order to save space, will not be repeated here.

The body 10 includes a housing 11 and a plurality of arms 12. In the present embodiment, the housing 11 includes a housing 111 and an upper cover 112. The housing 111 is substantially in the shape of a ship. The upper cover 112 is disposed on the housing 111 to form an accommodation space with the housing 111. 113. The circuit board 20 is received in the accommodating space 113. The number of the arms 12 is four, and the four arms 12 are respectively fixed to the periphery of the casing 111 and extend outward. Each of the arms 12 is formed with a mount 13 for mounting a rotor assembly (not shown) of the UAV 100, which is capable of providing flight power to the UAV 100. The rotor assembly may include a motor and a propeller coupled to the motor, the motor driving the propeller to rotate to provide power for flight, the motor being fixedly disposed on the corresponding mount 13 and the motor passing A trace inside the corresponding arm 12 is electrically connected to the second circuit board 22.

It can be understood that the number of the rotor assemblies and their corresponding arms 12 may vary according to the power design of the unmanned aerial vehicle 100. For example, the number of the arms 12 may be two, three, five, six. , eight, etc. In addition, the arm 12 can also be omitted, and the rotor assembly can be directly disposed on the outer casing 11.

The front end of the housing 111 (ie, the head portion) is provided with an air inlet 1111 to allow outside air to enter the housing 11 and flow to the heat dissipation mechanism 30 to dissipate the heat dissipation mechanism 30. In the present embodiment, the intake port 1111 is provided with an intake grill 1112 for preventing foreign matter from the outside air from entering the outer casing 11, thereby ensuring the circuit board 20 inside the outer casing 11. And the stability of other electrical components (not shown).

It can be understood that the front end, upper and lower position terms in the present embodiment are referred to in the normal running posture of the unmanned aerial vehicle, and should not be considered as limiting.

The heat dissipation mechanism 30 includes a fan 31, a flow guide 32, and a heat sink 33. The fan 31 is disposed in the accommodating space 113 and located at the head portion of the body 10 and corresponds to the air inlet 1111 on the housing 111. One end of the flow guiding member 32 is disposed adjacent to the fan 31, and the other end of the flow guiding member 32 is connected to the heat dissipating member 33 for guiding the airflow entering the air inlet 1111 to the heat sink 33, and the first circuit board 21 is Perform heat dissipation. The heat sink 33 is fixedly connected to a side of the housing 111 facing away from the upper cover 112 and is attached to the first circuit board 21 .

In the present embodiment, the fan 31 should at least include a driving mechanism and a blade (not shown) for rotating the blade to blow the airflow entering through the air inlet 1111 into the flow guide 32. A flow guiding passage 321 is disposed in the flow guiding member 32. The flow guiding passage 321 is connected between the fan 31 and the heat sink 33 to introduce the airflow blown through the fan 31 to the heat sink 33.

The flow guide 32 can also be provided separately or together with the body 10. Specifically in the illustrated embodiment, the flow guide 32 is integrally formed with the body 10. The flow guiding passage 321 extends along a side wall of the housing 111 of the body 10. In other words, the fuselage 10 can be directly provided with a flow guiding channel 321 .

The heat dissipating member 33 includes a heat dissipating plate 331 and a plurality of heat dissipating fins 332. The heat dissipating plate 331 is fixed to a side of the casing 111 facing away from the upper cover 112, and is attached to the first circuit board 21 to make the Heat on a circuit board 21 is conducted to the heat dissipation plate 331. A plurality of avoidance holes 3311 are formed in the heat dissipation plate 331 for escaping the plurality of electronic components 201 on the first circuit board 21 to facilitate the mounting of the circuit board 20 and the heat dissipation plate 331.

The plurality of heat dissipation fins 332 are parallel to each other and are arranged in an array at intervals on a side of the heat dissipation plate 331 facing away from the first circuit board 21. The length direction of each of the heat dissipation fins 332 is consistent with the flow direction of the airflow, and a heat dissipation flow path is formed between the plurality of heat dissipation fins 332. The heat dissipation flow channel communicates with the flow guiding channel 321 to facilitate the airflow. The heat dissipation process on the first circuit board 21 and the plurality of electronic components 201 is realized by smoothly passing through the flow path between the plurality of heat dissipation fins 332 and carrying away a large amount of heat on the plurality of heat dissipation fins 332.

It can be understood that, in the present embodiment, the flow direction of the airflow is sequentially the air inlet 1111, the fan 31, the flow guide 32, and the heat sink 33.

When the unmanned aerial vehicle 100 is activated, a plurality of electronic components 201 on the first circuit board 21 generate a large amount of heat. Since the heat dissipation plate 331 is bonded to the first circuit board 21, heat is conducted from the first circuit board 21 to the heat dissipation. Plate 331. Under the urging action of the fan 31, the external airflow enters the outer casing 11 through the air inlet 1111, and is introduced between the plurality of heat dissipation fins 332 by the flow guiding passage 321 to take away the heat on the heat dissipation plate 331 to realize the pair. Heat dissipation processing of the plurality of electronic components 201.

When the UAV 100 is normally flying in a predetermined direction, the fan 31 can be stopped, and the external airflow automatically enters the flow guiding channel 321 from the air inlet 1111 at the front end of the casing 11, and then flows through the plurality of heat radiating fins 332. The flow path is formed to take away the heat on the heat dissipation plate 331 to further heat-dissipate the plurality of electronic components 201.

It can be understood that the plurality of electronic components 201 are exposed outside the heat dissipation plate 331 by the plurality of avoidance holes 3311, and the airflow flowing between the plurality of heat dissipation fins 332 can directly heat-dissipate the plurality of electronic components 201. But it is not limited to this.

It can be understood that a heat conductive insulating layer is coated between the heat dissipation plate 331 and the first circuit board 21, and the heat conductive insulating layer includes, but is not limited to, a thermal conductive insulating silicone grease, a thermal conductive insulating silica gel, and an aluminum alloy anodized film. Good thermal conductivity and electrical insulation properties.

It can be understood that the heat dissipation plate 331 is provided with an abutting boss (not shown), and a heat conductive insulating layer is disposed between the abutting boss and the first circuit board 21.

It can be understood that since the surface of the circuit board 20 itself has a solder resist layer, the other embodiment can also directly use the solder resist layer as a heat conductive insulating layer, which further reduces the heat treatment cost of the circuit board 20.

It can be understood that the electronic component 201, the avoidance hole 3311, and the heat dissipation fins 332 are not limited to a plurality, and may be one.

It can be understood that in other embodiments, the second circuit board 22 may be omitted, and other circuit boards (not shown) may be added to the first circuit board 21 and the second circuit board 22.

The heat dissipating mechanism 30 is attached to the circuit board 20 having the plurality of electronic components 201 by the heat dissipating member 33, and under the urging action of the fan 31, the external airflow enters the outer casing 11 through the air inlet 1111, and is guided through the diversion flow. The member 32 is introduced into the heat sink 33 for heat dissipation treatment, thereby effectively improving the heat dissipation efficiency of the unmanned aerial vehicle 100.

It can be understood that the heat dissipating mechanism 30 is not limited to the unmanned aerial vehicle, and the heat dissipating mechanism 30 can be applied to any movable device, and the heat dissipating plate 331 of the heat dissipating mechanism 30 is used to form part of the outer casing of the movable device. The circuit board and the electronic components in the movable device are subjected to heat dissipation processing.

It can be understood that the heat dissipation plate 331 is made of a metal material, and the airflow generated by the propeller can pass through the metal heat dissipation plate 331, and the fan 31 is used to dissipate heat from the metal heat dissipation plate 331.

It can be understood that the heat dissipation plate 331 serves as a bottom cover of the body 10, and the bottom cover is a metal cover.

It can be understood that the UAV 100 can further include a controller (not shown) that is disposed in the body 10. Wherein, the controller is electrically connected to the fan 31 for controlling the working state of the fan 31; when the propeller of the unmanned aerial vehicle 100 is not rotating, the controller controls the fan 31 to start working to the fuselage 10 or the machine The electrical components inside the body 10 dissipate heat.

When the unmanned aerial vehicle 100 is in flight, the controller controls the fan 31 to stop operating or controls the fan 31 to reduce the rotational speed to reduce energy consumption and extend the endurance of the unmanned aerial vehicle 100.

When the temperature of the electrical component in the fuselage 10 or the fuselage 10 is lower than a preset temperature, the controller controls the fan 31 to stop working or controls the fan 31 to reduce the rotational speed to reduce energy consumption and extend the life of the unmanned aerial vehicle 100. ability.

It can be understood that the electrical component is a circuit board or a battery, but is not limited thereto.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

Claims

A heat dissipating mechanism for dissipating heat treatment of a circuit board in a movable device, wherein the heat dissipating mechanism comprises a heat dissipating plate, the heat dissipating plate forming a partially exposed outer casing of the movable device and The circuit board is connected such that heat of the circuit board is conducted to the heat sink and carried away by the airflow flowing through the heat sink.
The heat dissipation mechanism of claim 1 , wherein the heat dissipation mechanism further comprises a fan and a flow guiding member, the fan is disposed at one end of the flow guiding member, and a flow guiding channel is disposed in the flow guiding member The airflow blown through the fan is directed to the heat sink.
The heat dissipation mechanism according to claim 1, wherein the circuit board is provided with an electronic component, and the heat dissipation plate is provided with a avoidance hole for avoiding the electronic component.
The heat dissipation mechanism of claim 1 , wherein the heat dissipation mechanism further comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are fixed to a side of the heat dissipation plate facing away from the circuit board.
The heat dissipation mechanism according to claim 1, wherein a heat conductive insulation layer is disposed between the heat dissipation plate and the circuit board.
The heat dissipation mechanism according to claim 5, wherein the heat dissipation plate is provided with an abutment boss, and the heat conductive insulation layer is disposed between the abutment boss and the circuit board.
An unmanned aerial vehicle includes a body, a circuit board mounted on the body, and a heat dissipating mechanism, wherein the heat dissipating mechanism is configured to dissipate heat treatment on the circuit board, wherein the heat dissipating mechanism comprises a heat dissipating plate The heat sink is configured to form a partially exposed outer casing of the unmanned aerial vehicle and connected to the circuit board to conduct heat of the circuit board to the heat dissipation plate and to flow through the heat dissipation plate take away.
The unmanned aerial vehicle of claim 7, wherein the heat dissipating mechanism further comprises a fan and a flow guiding member, the fan is disposed at one end of the flow guiding member, and a flow guiding channel is disposed in the flow guiding member The airflow blown through the fan is introduced to the heat dissipation plate.
The UAV according to claim 8, wherein the airframe includes a casing, the heat dissipation plate is disposed on the casing, and forms an accommodation space together with the casing, the circuit board The container is housed in the accommodating space.
The UAV according to claim 9, wherein the casing is provided with an air inlet to facilitate the entry of outside air into the body.
The UAV according to claim 10, wherein said heat dissipating mechanism further comprises a fan, said fan being disposed corresponding to said air inlet.
The UAV according to claim 11, wherein said fan is installed in said body, and said airflow generated by said fan is guided to said heat radiating plate through said flow guiding passage.
The UAV according to claim 7, wherein said heat sink is a bottom cover of said body, and said bottom cover is a metal cover.
The unmanned aerial vehicle of claim 10, wherein the air inlet is provided at a nose portion of the body.
The UAV according to claim 10, wherein said intake port is provided with an intake grille for preventing foreign matter from the outside air from entering said fuselage.
The unmanned aerial vehicle of claim 7 , wherein the heat dissipating mechanism further comprises a plurality of heat dissipating fins, wherein the plurality of heat dissipating fins are fixedly disposed on a side of the heat dissipating plate facing away from the circuit board;

Or/and, the plurality of heat dissipation fins are parallel to each other, and are arranged in an array at intervals on a side of the heat dissipation plate facing away from the circuit board;

Or/and, the plurality of heat dissipation fins are parallel to a forward direction when the UAV is flying.
The UAV according to claim 7, wherein the circuit board is provided with electronic components, and the heat dissipation plate is provided with a avoidance hole for avoiding the electronic components on the circuit board.
The UAV according to claim 17, wherein said circuit board comprises a first circuit board and a second circuit board, said first circuit board and said second circuit board being spaced apart in parallel.
The UAV according to claim 18, wherein said electronic component is mounted on a side of said first circuit board facing away from said second circuit board, said heat dissipating mechanism for said first circuit The electronic components on the board are cooled.
The UAV according to claim 18, wherein a heat conductive insulating layer is coated between the heat dissipation plate and the first circuit board.
The unmanned aerial vehicle according to claim 20, wherein the heat dissipation plate is provided with an abutment boss, and the heat conductive insulation layer is disposed between the abutment boss and the first circuit board.
An unmanned aerial vehicle, comprising:

body;

An arm connected to the body;

a controller disposed in the fuselage;

a rotor assembly mounted on the arm, the rotor assembly including a propeller and a motor that drives the propeller to rotate;

a fan mounted in the fuselage;

The controller is electrically connected to the fan, and is configured to control an operating state of the fan.

When the propeller is not rotating, the controller controls the fan to start operating to dissipate heat from the electrical components within the fuselage or fuselage.
The UAV according to claim 22, wherein said controller controls said fan to stop operating or to control said fan to decrease the rotational speed during flight of said unmanned aerial vehicle.
The UAV according to claim 22, wherein said controller controls said fan to stop operating or to control said temperature when said temperature of said electrical component in said body or body is lower than a preset temperature The fan reduces the speed.
An unmanned aerial vehicle according to claim 22, wherein said body is provided with a cavity for accommodating electrical components, and at least a partial outer casing of said cavity is a metal casing, and said air flow generated by said propeller can pass through a metal casing; the fan is for dissipating heat from the metal casing.
The UAV according to claim 25, wherein said electrical component is a circuit board or a battery.
The UAV according to claim 25, wherein said fan is disposed in said body and located at a nose portion of said body.
The UAV according to claim 27, wherein said head portion is provided with an air inlet.
The UAV according to claim 25, wherein said metal casing is located at a bottom of said fuselage, said bottom of said fuselage is provided with an air flow passage, and said airflow generated by said fan flows toward said airflow passage The metal casing.
The UAV according to claim 29, wherein the outer surface of the metal casing is provided with a plurality of elongated fins arranged in parallel, and a heat dissipating channel is formed between the plurality of fins. A flow passage is in communication with the air flow passage.