WO2018053871A1

WO2018053871A1 - Heat dissipation mechanism, electronic governor provided with heat dissipation mechanism, and electronic device

Info

Publication number: WO2018053871A1
Application number: PCT/CN2016/100204
Authority: WO
Inventors: 肖乐; 刘炜刚; 邱贞平
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2016-09-26
Filing date: 2016-09-26
Publication date: 2018-03-29
Also published as: CN107006136A; CN107006136B

Abstract

A heat dissipation mechanism (30), used for dissipating heat from a circuit board (20) and an electronic element (40) disposed on the circuit board. The heat dissipation mechanism comprises a first heat dissipation member (31) and a second heat dissipation member (32). The first heat dissipation member is attached to one surface of the circuit board to dissipate heat from the circuit board, and the second heat dissipation member is attached to the other surface of the electronic element back to the circuit board to dissipate heat from the electronic element. Also provided is an electronic governor (400) provided with the heat dissipation mechanism, and an electronic device (100).

Description

Heat dissipation mechanism and electronic governor and electronic device having the same

Technical field

The invention relates to a heat dissipation mechanism and an electronic governor and an electronic device having the same.

Background technique

With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially integrated circuit boards) are constantly increasing. However, the high-frequency high-speed causes the heat generated by the electronic components to increase, causing an increase in temperature, affecting the performance of the electronic components during operation, and in order to ensure the normal operation of the electronic components, it is necessary to discharge a large amount of heat generated in time. Traditionally, people use a single-sided heat dissipation method, that is, a heat sink or a heat sink is attached to one side of an integrated circuit board to heat-dissipate the integrated circuit board. However, the heat dissipation efficiency of the above method is low, which is not conducive to rapid export integration. Excessive heat generated by the board shortens the life of the integrated circuit board.

Summary of the invention

In view of the above circumstances, it is necessary to provide a heat dissipating mechanism having high heat dissipation efficiency and an electronic governor and an electronic device having the same.

A heat dissipating mechanism for dissipating heat treatment on a circuit board and an electronic component mounted on the circuit board, the heat dissipating mechanism comprising a first heat dissipating component and a second heat dissipating component, the first heat dissipating component being attached to the circuit One surface of the board for heat-dissipating the circuit board; the second heat sink is attached to the other surface of the electronic component facing away from the circuit board to perform heat dissipation processing on the electronic component.

An electronic governor includes a circuit board and electronic components mounted on the circuit board, the electronic governor further includes a heat dissipation mechanism, and the heat dissipation mechanism includes a first heat dissipation component and a second heat dissipation component. The first heat dissipating member is attached to one surface of the circuit board to perform heat dissipation processing on the circuit board; the second heat dissipating member is attached to the other surface of the electronic component facing away from the circuit board to The electronic component is subjected to heat dissipation processing.

An electronic device includes a circuit board, a heat dissipation mechanism, and an electronic component. The electronic component is mounted on the circuit board, and the heat dissipation mechanism includes a first heat dissipation component and a second heat dissipation component, and the first heat dissipation component Bonding to one surface of the circuit board to heat-dissipate the circuit board; the second heat sink is attached to the other surface of the electronic component facing away from the circuit board to perform the electronic component Heat treatment.

The heat dissipating mechanism heats the circuit board by attaching the first heat dissipating member to the circuit board, and the second heat dissipating member is attached to a side of the plurality of electronic components facing away from the circuit board to face a plurality of electrons disposed on the circuit board The components are cooled, which effectively improves the heat dissipation efficiency of the electronic device and the electronic governor.

DRAWINGS

1 is a perspective view of an electronic device according to a first embodiment of the present invention.

Fig. 2 is a cross-sectional view of the electronic device shown in Fig. 1 taken along line II-II.

3 is a cross-sectional view of an electronic device according to a second embodiment of the present invention.

Figure 4 is a cross-sectional view showing an electronic device according to a third embodiment of the present invention.

Figure 5 is a cross-sectional view of an electronic governor in accordance with a fourth embodiment of the present invention.

Main component symbol description

电子装置 Electronic device	100、200、300100, 200, 300
电子调速器 Electronic governor	400400
外壳 shell	10、210、310、41010, 210, 310, 410
下壳体 Lower housing	411411
第一凸起 First bulge	41114111
上壳体 Upper housing	412412
第二凸起 Second bump	41214121
电路板 Circuit board	20、220、320、42020, 220, 320, 420
第一电路板First board	321、421321,421
第二电路板Second circuit board	322、422322,422
散热机构 Heat dissipation mechanism	30、230、33030, 230, 330
第一散热件 First heat sink	31、231、33131, 231, 331
第二散热件 Second heat sink	32、232、33232, 232, 332
电子元件 Electronic component	40、240、340、44040, 240, 340, 440
第一电子元件First electronic component	441441
第二电子元件Second electronic component	442442
导热片Thermal sheet	233、450233,450
延伸部 Extension	2331、4512331, 451
接触部 Contact	2332、4522332,452
插接件 Connector	460460
电容 capacitance	470470

The invention will be further illustrated by the following detailed description in conjunction with the accompanying drawings.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component or a component that may have a central setting at the same time. When a component is considered to be "set up" to another component, it can be a component that is set directly on another component or that may have a centered setting at the same time.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items. The terms "up, down, left, right" and the like as used herein do not limit the specific positional relationship and are mainly used to distinguish the names of the components.

Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The features of the embodiments and examples described below can be combined with each other without conflict.

Referring to FIG. 1 and FIG. 2 , an electronic device 100 according to the first embodiment of the present invention includes a housing 10 , a circuit board 20 received in the housing 10 , a heat dissipation mechanism 30 , and a plurality of electronic components 40 . On the circuit board 20, and electrically connected to the circuit board 20 through traces inside and/or on the surface of the circuit board 20, the electronic component 40 and the circuit board 20 together form a module having a specific function. The heat dissipation mechanism 30 is attached to the circuit board 20 and the plurality of electronic components 40 to heat-dissipate the circuit board 20 and the plurality of electronic components 40.

It can be understood that a plurality of the electronic components 40 can be electrically connected to each other to realize signal transmission, exchange, processing, and the like.

It can be understood that the electronic device 100 of the present embodiment should also include other electronic components, such as a power source, a capacitor, an LED lamp, etc., installed in the housing 10 to facilitate various functions of the electronic device 100, thereby saving space. I will not repeat them one by one. In the present embodiment, the electronic device 100 is a motor controller (for example, an electronic governor), which can be applied to an aircraft, an automobile, a factory automation device, etc., and controls the motor according to the active operation of the integrated circuit. The direction, speed, angle, and response time work.

In the present embodiment, the plurality of electronic components 40 are respectively disposed on the same surface of the circuit board 20, and each of the electronic components 40 has a substantially rectangular block shape. The plurality of electronic components 40 include, but are not limited to, MOS transistors mounted on the circuit board 20 to provide a stable voltage to other components of the electronic device 100, which may generate a large amount of heat during operation.

In the embodiment, the heat dissipation mechanism 30 includes a first heat dissipation member 31 and a second heat dissipation member 32. The first heat dissipation member 31 and the second heat dissipation member 32 respectively correspond to two sides of the circuit board 20. It can be understood that the shape and size of the first heat dissipating member 31 and the second heat dissipating member 32 are matched with the shape and size of the circuit board 20; in other embodiments, the shape and size of the first heat dissipating member 31 and the second heat dissipating member 32 can be matched with the circuit. The shape or size of the portion of the board 20 where heat is required to be dissipated or the position (for example, a portion or position where heat is generated) is matched.

The first heat sink 31 is attached to the circuit board 20 to perform heat dissipation processing on the circuit board 20. The second heat sink 32 is attached to a side of the plurality of electronic components 40 facing away from the circuit board 20 to heat-dissipate the plurality of electronic components 40.

It should be noted that the outer surfaces of the first heat dissipating member 31 and the second heat dissipating member 32 are respectively provided with heat dissipating fins. Specifically, the outer surfaces of the first heat dissipating member 31 and the second heat dissipating member 32 are respectively provided with recesses, the heat dissipating fins are disposed in the recesses, and the top end of the heat dissipating fins and the first heat dissipating member 31 are respectively provided. And the outer surface of the second heat sink 32 is flush.

When the electronic device 100 is working normally, the circuit board 20 and the plurality of electronic components 40 generate a large amount of heat. The heat generated by the circuit board 20 is dissipated through the first heat dissipating member 31; the heat generated by the plurality of electronic components 40 is dissipated through the second heat dissipating member 32, respectively. Further, rapid heat dissipation processing of the circuit board 20 and the plurality of electronic components 40 in the electronic device 100 is realized.

It can be understood that the first heat dissipating member 31 and the second heat dissipating member 32 include, but are not limited to, a thermal conductive adhesive layer, a thermal conductive metal sheet, a heat dissipating fin, a metal housing of the electronic device, and the like.

It can be understood that the thermal conductive adhesive layer is a thermal conductive silicone layer or a thermal conductive silicone layer, and the thermal conductive adhesive layer directly covers the plurality of electronic components 40 .

It can be understood that the heat conductive metal piece, the metal heat sink, or the metal casing of the electronic device is provided with an anodized film.

It can be understood that since the surface of the circuit board 20 itself has a solder resist layer, other embodiments can directly use the solder resist layer as a heat conductive insulating material, which further reduces the heat treatment cost of the circuit board 20.

It can be understood that the electronic component 40 is not limited to a plurality of ones, and may be one.

The first heat dissipating member 31 and the second heat dissipating member 32 respectively correspond to the two sides of the circuit board 20 , and further, the first heat dissipating member 31 is attached to the circuit board 20 to dissipate heat to the circuit board 20 . The second heat sink 32 is attached to a side of the plurality of electronic components 40 facing away from the circuit board 20 to heat-dissipate the plurality of electronic components 40 disposed on the circuit board 20 , thereby effectively improving the heat dissipation efficiency of the electronic device 100 .

Referring to FIG. 3 , the electronic device 200 of the second embodiment of the present invention is similar to the electronic device 100 of the first embodiment. The electronic device 200 includes a housing 210 , a circuit board 220 received in the housing 210 , and a heat dissipation mechanism 230 . A plurality of electronic components 240. The heat dissipating mechanism 230 includes a first heat dissipating member 231 and a second heat dissipating member 232 respectively corresponding to two sides of the circuit board 220. The difference is that the heat dissipation mechanism 230 further includes a plurality of heat conduction sheets 233 , and the plurality of heat conduction sheets 233 are in one-to-one correspondence with the plurality of electronic components 240 . Each of the heat conducting sheets 233 is substantially L-shaped, and includes an extending portion 2331 and a contact portion 2332 extending along a side of the corresponding electronic component 240 to the circuit board 220 and disposed with the circuit board 220 The surface of the electronic component 40 is in contact with the surface of the circuit board 220. Alternatively, the extension 2331 can be abutted only on the surface of the circuit board 220 without being fixedly connected to the circuit board 220. 2332 is connected to one end of the extending portion 2331 away from the circuit board 220, and is attached to a side of the electronic component 240 facing away from the circuit board 220, so as to conduct heat generated by the electronic component 240 to the second heat sink 232, and then There is a second heat sink 232 that dissipates heat. Preferably, the heat conductive sheet 233 in the present embodiment is a metal heat conductive sheet, but is not limited thereto.

It can be understood that since the heat of the electronic component 240 is transmitted to the surface on which the electronic component 240 is mounted on the circuit board 220, the temperature of the surface is increased, and the heat is easily concentrated. Therefore, the heat conductive sheet 233 in the present embodiment can further conduct heat of the side surface of the circuit board 220 on which the electronic component 240 is mounted to the second heat sink 232 to achieve heat dissipation to the circuit board 220.

In this embodiment, the contact portion 2232 is interposed between the circuit board 220 and the electronic component 240. It can be understood that in other embodiments, the contact portion 2232 may be located at a side of the electronic component. The second heat sink 232 directly conforms to the electronic component 240.

The electronic device 200 of the second embodiment of the present invention further improves the electrons by bonding the heat conductive sheets 233 to the plurality of electronic components 240 to facilitate the rapid conduction of heat generated by the plurality of electronic components 240 to the second heat sink 232. The heat dissipation efficiency of the device 200.

Referring to FIG. 4 , the electronic device 300 of the third embodiment of the present invention is similar in structure to the electronic device 100 of the first embodiment. The electronic device 200 includes a housing 310 , a circuit board 320 received in the housing 310 , and a heat dissipation mechanism 330 . A plurality of electronic components 340. The heat dissipation mechanism 330 includes a first heat dissipation member 331 and a second heat dissipation member 332. The difference is that the number of the circuit boards 320 is two, that is, the first circuit board 321 and the second circuit board 322. The first circuit board 321 and the second circuit board 322 are arranged in parallel, and the area of the first circuit board 321 is smaller than the area of the second circuit board 322. The plurality of electronic components 340 are respectively disposed on a side of the second circuit board 322 facing away from the first circuit board 321 . The first heat dissipation component 331 is disposed between the first circuit board 321 and the second circuit board 322 for simultaneous use. The heat generated by the first circuit board 321 and the second circuit board 322 is dissipated; the second heat sink 332 is attached to a side of the plurality of electronic components 340 facing away from the second circuit board 322 for using the plurality of electronic components The heat generated by 340 is emitted.

It can be understood that the first heat dissipating member 331 and the second heat dissipating member 332 are not limited to the opposite surfaces of the second circuit board 322, and may be disposed on opposite surfaces of the first circuit board 321.

The heat dissipation mechanism 330 of the third embodiment of the present invention is suitable for heat dissipation processing of the electronic device 300 having two circuit boards 320, and further reduces the space volume of the electronic device 300 while improving heat dissipation efficiency.

Referring to FIG. 5 , an embodiment of the present invention provides an electronic governor 400 . The electronic governor 400 includes a housing 410 , a circuit board 420 received in the housing 410 , a plurality of electronic components 440 , and a plurality of thermal conductive sheets 450 . .

Specifically, in the illustrated embodiment, the number of circuit boards 420 is two, that is, the first circuit board 421 and the second circuit board 422. The first circuit board 421 and the second circuit board 422 are disposed in parallel. The area of the first circuit board 421 is smaller than the area of the second circuit board 422.

In this embodiment, the plurality of electronic components 440 include a second electronic component 442 and a first electronic component 441. The second electronic component 442 has a larger amount of heat than the first electronic component 441. The second electronic component 442 is disposed on the second circuit board 422. The first electronic component 441 is disposed on the first circuit board 421, and the first circuit board 421 and the second circuit board 422 are connected through the connector 460 ( Alternatively, the flexible board is connected to effectively prevent the first electronic component 441 located on the first circuit board 421 from being affected by the second electronic component 442 located on the second circuit board 422.

The electronic component 440 can be a desired electronic component within the electronic governor. In the illustrated embodiment, the first electronic component 441 is a control chip and the second electronic component 442 is a MOS transistor.

In the illustrated embodiment, a hollow compartment may also be provided between the first circuit board 421 and the second circuit board 422 to prevent mutual heat conduction between the first circuit board 421 and the second circuit board 422. Of course, in other embodiments, a heat insulating member may be disposed between the first circuit board 421 and the second circuit board 422.

The plurality of thermal conductive sheets 450 are in one-to-one correspondence with the plurality of second electronic components 442. Each of the heat conducting sheets 450 is substantially L-shaped and includes an extending portion 451 and a contact portion 452. The extending portion 451 is fixed on the second circuit board 422 and adjacent to the corresponding second electronic component 442. The contact portion 452 is vertically connected to the conductive portion 452. The extending portion 451 is away from one end of the second circuit board 422 and is attached to a side of the second electronic component 442 facing away from the second circuit board 422.

The outer casing 410 includes a lower casing 411 and an upper casing 412. The upper housing 412 and the lower housing 411 are spliced together to form a cavity (not shown) for receiving the first circuit board 421 and the second circuit board 422.

The lower cover 411 protrudes from the plurality of thermal conductive sheets 450 with a first protrusion 4111. The first protrusion 4111 is attached to the contact portion 452 of the corresponding thermal conductive sheet 450 to conduct the heat generated by the second electronic component 442 to The lower case 411 has a lower case 411 to dissipate heat.

A second protrusion 4121 is protruded from the upper casing 412 toward the second circuit board 422. The second protrusion 4121 is attached to the second circuit board 422 and corresponds to the second electronic component 442 to replace the second circuit board 422. The heat generated by the second electronic component 442 is received and conducted to the upper housing 412, and the heat is dissipated by the upper housing 412. Preferably, the outer casing 410 in this embodiment is made of a metal material, but is not limited thereto as long as it facilitates heat treatment of the second electronic component 442.

The first electronic component 441 may be spaced apart from the inner wall of the upper housing 412, or the first electronic component 441 may be coupled to the inner wall of the upper housing 412 by a layer of thermal adhesive.

The outer surfaces of the lower case 411 and the upper case 412 are respectively provided with heat dissipation fins. Specifically, the outer surfaces of the lower case 411 and the upper case 412 are respectively provided with recesses, the heat dissipation fins are disposed in the recesses, and the top ends of the heat dissipation fins and the lower case 411 and the upper case The outer surface of body 412 is flush. Specifically, the heat dissipating fins are located at one ends of the lower casing 411 and the upper casing 412, and simultaneously dissipate heat to a portion with relatively high heat generation under the condition that the space in the casing is large.

Preferably, the heat dissipation fins are disposed corresponding to the positions of the plurality of second electronic components 442 of the second circuit board 422 to facilitate rapid heat dissipation of the second circuit board 422 near the plurality of second electronic components 442. But it is not limited to this.

The opposite surfaces of the second circuit board 422 are in contact with the upper case 412 and the lower case 411, respectively, through a thermally conductive adhesive layer. But it is not limited to this.

The electronic governor 400 further includes a capacitor 470 received in the housing 410, the capacitor being electrically connected to the second circuit board 422 and spaced apart from the first circuit board 421. The capacitor 470 is attached to the inner surface of the lower casing 411 to facilitate conduction of heat generated by the capacitor 470 to the lower casing 411 and is dissipated by the lower casing 411.

It can be understood that the plurality of thermal conductive sheets 450 in the embodiment may also be omitted, that is, the first protrusions 4111 are directly attached to one side of the plurality of second electronic components 442 facing away from the second circuit board 422.

It can be understood that the first protrusion 4111 and the plurality of second electronic components 442 or the plurality of thermal conductive sheets 450 are respectively disposed with a heat conductive insulating material; and the second protrusions 4121 and the second circuit board 422 are also provided with heat conduction. Insulating material.

It can be understood that the first circuit board 421 and the second circuit board 422 are connected by electrical connectors or/and wires.

It can be understood that the first circuit board 421 and the second circuit board 422 are staggered so that the first circuit board 421 and the second circuit board 422 partially overlap.

The electronic governor 400 of the fourth embodiment of the present invention performs heat dissipation processing on the second electronic component 442 through the outer casing 410, thereby making the structure of the electronic governor 400 more compact.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

Claims

A heat dissipation mechanism for dissipating heat treatment on a circuit board and an electronic component mounted on the circuit board, wherein the heat dissipation mechanism includes a first heat dissipation component and a second heat dissipation component, and the first heat dissipation component Bonding to one surface of the circuit board to heat-dissipate the circuit board; the second heat sink is attached to the other surface of the electronic component facing away from the circuit board to perform the electronic component Heat treatment.
The heat dissipating mechanism according to claim 1, wherein the first heat dissipating member comprises at least one of a thermal conductive adhesive layer, a heat conductive metal sheet, a heat dissipating fin, and a metal casing of the electronic device;

Or/and the second heat dissipating member is at least one of the following: a thermal conductive adhesive layer, a thermal conductive metal sheet, a metal heat sink, and a metal housing of the electronic device.
The heat dissipation mechanism according to claim 2, wherein the thermal conductive adhesive layer is a thermal conductive silicone layer or a thermal conductive silicone layer.
The heat dissipation mechanism according to claim 3, wherein the thermal conductive adhesive layer directly covers the electronic component.
The heat dissipation mechanism according to claim 2, wherein the heat conductive metal piece, the metal heat sink, or the metal case of the electronic device is provided with an anodized film.
The heat dissipation mechanism according to claim 1, wherein the circuit board comprises a first circuit board and a second circuit board disposed in parallel with the first circuit board, the first circuit board and the first The first heat dissipating member and the second heat dissipating member are respectively disposed on opposite surfaces of at least one of the two circuit boards.
The heat dissipation mechanism according to claim 6, wherein a hollow compartment is disposed between the first circuit board and the second circuit board to block the first electronic circuit board and the second The boards are thermally conductive to each other.
The heat dissipation mechanism according to claim 6, wherein the first circuit board and the second circuit board are connected by an electrical connector or/and a wire.
The heat dissipation mechanism according to claim 6, wherein said first circuit board and said second circuit board are staggered so that said first circuit board and said second circuit board partially overlap.
The heat dissipation mechanism according to claim 6, wherein said first circuit board is provided with a first electronic component, and said second circuit board is provided with a second electronic component, said second electronic component The heat is greater than the amount of heat generated by the first electronic component, and the opposite surfaces of the second circuit board are in contact with the first heat sink and the second heat sink, respectively.
The heat dissipation mechanism according to claim 10, wherein said first electronic component is a control chip and said second electronic component is a MOS transistor.
An electronic governor comprising a circuit board and an electronic component mounted on the circuit board, wherein the electronic governor further comprises a heat dissipating mechanism, wherein the heat dissipating mechanism comprises a first heat dissipating component and a a heat dissipating member, the first heat dissipating member is attached to one surface of the circuit board to perform heat dissipation processing on the circuit board; and the second heat dissipating member is attached to the electronic component facing away from the circuit board a surface for heat-dissipating the electronic component.
The electronic governor according to claim 12, wherein the first heat dissipating member comprises at least one of: a thermal conductive adhesive layer, a heat conductive metal sheet, a heat dissipating fin, and a metal casing of the electronic governor;

Or/and the second heat dissipating member is at least one of the following: a thermal conductive adhesive layer, a thermal conductive metal sheet, a metal heat sink, and a metal housing of the electronic governor.
The electronic governor according to claim 13, wherein the thermal conductive adhesive layer is a thermal conductive silicone layer or a thermal conductive silicone layer.
The electronic governor of claim 14 wherein said thermally conductive adhesive layer directly covers said electronic component.
The electronic governor according to claim 13, wherein said thermally conductive metal piece, metal heat sink, or metal casing of the electronic device is provided with an anodized film.
The electronic governor according to claim 12, wherein said circuit board comprises a first circuit board and a second circuit board disposed in parallel with said first circuit board, said first circuit board and said The first heat dissipating member and the second heat dissipating member are respectively disposed on opposite surfaces of at least one of the second circuit boards.
The electronic governor according to claim 17, wherein a hollow compartment is disposed between said first circuit board and said second circuit board to block said first electronic circuit board from said The second circuit boards are thermally conductive to each other.
The electronic governor according to claim 17, wherein said first circuit board and said second circuit board are connected by an electrical connector or/and a wire.
The electronic governor of claim 17 wherein said first circuit board and said second circuit board are staggered such that said first circuit board and said second circuit board partially overlap.
The electronic governor according to claim 17, wherein said first circuit board is provided with a first electronic component, and said second circuit board is provided with a second electronic component, said second electronic component The heat generation amount is greater than the heat generation amount of the first electronic component, and the opposite surfaces of the second circuit board are in contact with the first heat dissipation member and the second heat dissipation member, respectively.
The electronic governor according to claim 21, wherein said first electronic component is a control chip, and said second electronic component is a MOS transistor;

Or/and the first heat dissipating member and the second heat dissipating member are respectively an upper metal casing and a lower metal casing of the electronic governor, and the opposite surfaces of the second circuit board respectively pass the thermal conductive adhesive The layer is in contact with the upper metal casing and the lower metal casing, and the upper metal casing and the lower metal casing are spliced together to form a cavity for receiving the first circuit board and the second circuit board body.
An electronic device comprising a circuit board, a heat dissipating mechanism and an electronic component, wherein the electronic component is mounted on the circuit board, wherein the heat dissipating mechanism comprises a first heat dissipating component and a second heat dissipating component, The first heat dissipating member is attached to one surface of the circuit board to perform heat dissipation processing on the circuit board; the second heat dissipating member is attached to the other surface of the electronic component facing away from the circuit board to The electronic components are subjected to heat dissipation processing.
The electronic device according to claim 23, wherein the first heat dissipating member comprises at least one of a thermal conductive adhesive layer, a heat conductive metal sheet, a heat dissipating fin, and a metal casing of the electronic device;

Or/and the second heat dissipating member is at least one of the following: a thermal conductive adhesive layer, a thermal conductive metal sheet, a metal heat sink, and a metal housing of the electronic device.
The electronic device according to claim 24, wherein the thermal conductive adhesive layer is a thermal conductive silicone layer or a thermal conductive silicone layer.
The electronic device according to claim 25, wherein said thermally conductive adhesive layer directly covers said electronic component.
The electronic device according to claim 24, wherein the heat conductive metal piece, the metal heat sink, or the metal case of the electronic device is provided with an anodized film.
The electronic device according to claim 23, wherein the first heat dissipating member and the second heat dissipating member are respectively located at two sides of the circuit board.
The electronic device according to claim 23, wherein the circuit board comprises a first circuit board and a second circuit board disposed in parallel with the first circuit board, the first circuit board and the first The first heat dissipating member and the second heat dissipating member are respectively disposed on opposite surfaces of at least one of the two circuit boards.
The electronic device according to claim 23, wherein the heat dissipating mechanism further comprises a heat conducting sheet fixed on the circuit board, the heat conducting sheet comprising an extending portion and a contact portion, the extending portion along the corresponding electron a side portion of the component extends to the circuit board and is in contact with a side surface of the circuit board on which the electronic component is disposed, and the contact portion is connected to an end of the extension portion away from the circuit board, and is attached The electronic component faces away from a side of the circuit board to conduct heat generated by the electronic component to the second heat sink.