WO2018053871A1 - Mécanisme de dissipation de chaleur, régulateur électronique pourvu d'un mécanisme de dissipation de chaleur, et dispositif électronique - Google Patents

Mécanisme de dissipation de chaleur, régulateur électronique pourvu d'un mécanisme de dissipation de chaleur, et dispositif électronique Download PDF

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Publication number
WO2018053871A1
WO2018053871A1 PCT/CN2016/100204 CN2016100204W WO2018053871A1 WO 2018053871 A1 WO2018053871 A1 WO 2018053871A1 CN 2016100204 W CN2016100204 W CN 2016100204W WO 2018053871 A1 WO2018053871 A1 WO 2018053871A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
heat
electronic
heat dissipating
electronic component
Prior art date
Application number
PCT/CN2016/100204
Other languages
English (en)
Chinese (zh)
Inventor
肖乐
刘炜刚
邱贞平
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2016/100204 priority Critical patent/WO2018053871A1/fr
Priority to CN201680004129.7A priority patent/CN107006136B/zh
Publication of WO2018053871A1 publication Critical patent/WO2018053871A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Definitions

  • the invention relates to a heat dissipation mechanism and an electronic governor and an electronic device having the same.
  • a heat dissipating mechanism for dissipating heat treatment on a circuit board and an electronic component mounted on the circuit board comprising a first heat dissipating component and a second heat dissipating component, the first heat dissipating component being attached to the circuit One surface of the board for heat-dissipating the circuit board; the second heat sink is attached to the other surface of the electronic component facing away from the circuit board to perform heat dissipation processing on the electronic component.
  • An electronic governor includes a circuit board and electronic components mounted on the circuit board, the electronic governor further includes a heat dissipation mechanism, and the heat dissipation mechanism includes a first heat dissipation component and a second heat dissipation component.
  • the first heat dissipating member is attached to one surface of the circuit board to perform heat dissipation processing on the circuit board; the second heat dissipating member is attached to the other surface of the electronic component facing away from the circuit board to The electronic component is subjected to heat dissipation processing.
  • An electronic device includes a circuit board, a heat dissipation mechanism, and an electronic component.
  • the electronic component is mounted on the circuit board, and the heat dissipation mechanism includes a first heat dissipation component and a second heat dissipation component, and the first heat dissipation component Bonding to one surface of the circuit board to heat-dissipate the circuit board; the second heat sink is attached to the other surface of the electronic component facing away from the circuit board to perform the electronic component Heat treatment.
  • the heat dissipating mechanism heats the circuit board by attaching the first heat dissipating member to the circuit board, and the second heat dissipating member is attached to a side of the plurality of electronic components facing away from the circuit board to face a plurality of electrons disposed on the circuit board
  • the components are cooled, which effectively improves the heat dissipation efficiency of the electronic device and the electronic governor.
  • FIG. 1 is a perspective view of an electronic device according to a first embodiment of the present invention.
  • Fig. 2 is a cross-sectional view of the electronic device shown in Fig. 1 taken along line II-II.
  • FIG 3 is a cross-sectional view of an electronic device according to a second embodiment of the present invention.
  • Figure 4 is a cross-sectional view showing an electronic device according to a third embodiment of the present invention.
  • Figure 5 is a cross-sectional view of an electronic governor in accordance with a fourth embodiment of the present invention.
  • Electronic device 100, 200, 300 Electronic governor 400 shell 10, 210, 310, 410 Lower housing 411 First bulge 4111 Upper housing 412 Second bump 4121 Circuit board 20, 220, 320, 420 First board 321,421 Second circuit board 322,422 Heat dissipation mechanism 30, 230, 330 First heat sink 31, 231, 331 Second heat sink 32, 232, 332 Electronic component 40, 240, 340, 440 First electronic component 441 Second electronic component 442 Thermal sheet 233,450 Extension 2331, 451 Contact 2332,452 Connector 460 capacitance 470
  • a component when a component is considered to be “connected” to another component, it can be directly connected to another component or a component that may have a central setting at the same time.
  • a component When a component is considered to be “set up” to another component, it can be a component that is set directly on another component or that may have a centered setting at the same time.
  • an electronic device 100 includes a housing 10 , a circuit board 20 received in the housing 10 , a heat dissipation mechanism 30 , and a plurality of electronic components 40 .
  • the electronic component 40 and the circuit board 20 together form a module having a specific function.
  • the heat dissipation mechanism 30 is attached to the circuit board 20 and the plurality of electronic components 40 to heat-dissipate the circuit board 20 and the plurality of electronic components 40.
  • a plurality of the electronic components 40 can be electrically connected to each other to realize signal transmission, exchange, processing, and the like.
  • the electronic device 100 of the present embodiment should also include other electronic components, such as a power source, a capacitor, an LED lamp, etc., installed in the housing 10 to facilitate various functions of the electronic device 100, thereby saving space. I will not repeat them one by one.
  • the electronic device 100 is a motor controller (for example, an electronic governor), which can be applied to an aircraft, an automobile, a factory automation device, etc., and controls the motor according to the active operation of the integrated circuit. The direction, speed, angle, and response time work.
  • the plurality of electronic components 40 are respectively disposed on the same surface of the circuit board 20, and each of the electronic components 40 has a substantially rectangular block shape.
  • the plurality of electronic components 40 include, but are not limited to, MOS transistors mounted on the circuit board 20 to provide a stable voltage to other components of the electronic device 100, which may generate a large amount of heat during operation.
  • the heat dissipation mechanism 30 includes a first heat dissipation member 31 and a second heat dissipation member 32.
  • the first heat dissipation member 31 and the second heat dissipation member 32 respectively correspond to two sides of the circuit board 20. It can be understood that the shape and size of the first heat dissipating member 31 and the second heat dissipating member 32 are matched with the shape and size of the circuit board 20; in other embodiments, the shape and size of the first heat dissipating member 31 and the second heat dissipating member 32 can be matched with the circuit.
  • the shape or size of the portion of the board 20 where heat is required to be dissipated or the position is matched.
  • the first heat sink 31 is attached to the circuit board 20 to perform heat dissipation processing on the circuit board 20.
  • the second heat sink 32 is attached to a side of the plurality of electronic components 40 facing away from the circuit board 20 to heat-dissipate the plurality of electronic components 40.
  • the outer surfaces of the first heat dissipating member 31 and the second heat dissipating member 32 are respectively provided with heat dissipating fins.
  • the outer surfaces of the first heat dissipating member 31 and the second heat dissipating member 32 are respectively provided with recesses, the heat dissipating fins are disposed in the recesses, and the top end of the heat dissipating fins and the first heat dissipating member 31 are respectively provided.
  • the outer surface of the second heat sink 32 is flush.
  • the circuit board 20 and the plurality of electronic components 40 When the electronic device 100 is working normally, the circuit board 20 and the plurality of electronic components 40 generate a large amount of heat.
  • the heat generated by the circuit board 20 is dissipated through the first heat dissipating member 31; the heat generated by the plurality of electronic components 40 is dissipated through the second heat dissipating member 32, respectively. Further, rapid heat dissipation processing of the circuit board 20 and the plurality of electronic components 40 in the electronic device 100 is realized.
  • first heat dissipating member 31 and the second heat dissipating member 32 include, but are not limited to, a thermal conductive adhesive layer, a thermal conductive metal sheet, a heat dissipating fin, a metal housing of the electronic device, and the like.
  • the thermal conductive adhesive layer is a thermal conductive silicone layer or a thermal conductive silicone layer, and the thermal conductive adhesive layer directly covers the plurality of electronic components 40 .
  • the heat conductive metal piece, the metal heat sink, or the metal casing of the electronic device is provided with an anodized film.
  • solder resist layer since the surface of the circuit board 20 itself has a solder resist layer, other embodiments can directly use the solder resist layer as a heat conductive insulating material, which further reduces the heat treatment cost of the circuit board 20.
  • the electronic component 40 is not limited to a plurality of ones, and may be one.
  • the first heat dissipating member 31 and the second heat dissipating member 32 respectively correspond to the two sides of the circuit board 20 , and further, the first heat dissipating member 31 is attached to the circuit board 20 to dissipate heat to the circuit board 20 .
  • the second heat sink 32 is attached to a side of the plurality of electronic components 40 facing away from the circuit board 20 to heat-dissipate the plurality of electronic components 40 disposed on the circuit board 20 , thereby effectively improving the heat dissipation efficiency of the electronic device 100 .
  • the electronic device 200 of the second embodiment of the present invention is similar to the electronic device 100 of the first embodiment.
  • the electronic device 200 includes a housing 210 , a circuit board 220 received in the housing 210 , and a heat dissipation mechanism 230 .
  • the heat dissipating mechanism 230 includes a first heat dissipating member 231 and a second heat dissipating member 232 respectively corresponding to two sides of the circuit board 220.
  • the heat dissipation mechanism 230 further includes a plurality of heat conduction sheets 233 , and the plurality of heat conduction sheets 233 are in one-to-one correspondence with the plurality of electronic components 240 .
  • Each of the heat conducting sheets 233 is substantially L-shaped, and includes an extending portion 2331 and a contact portion 2332 extending along a side of the corresponding electronic component 240 to the circuit board 220 and disposed with the circuit board 220 The surface of the electronic component 40 is in contact with the surface of the circuit board 220.
  • the extension 2331 can be abutted only on the surface of the circuit board 220 without being fixedly connected to the circuit board 220.
  • the heat conductive sheet 233 in the present embodiment is a metal heat conductive sheet, but is not limited thereto.
  • the heat conductive sheet 233 in the present embodiment can further conduct heat of the side surface of the circuit board 220 on which the electronic component 240 is mounted to the second heat sink 232 to achieve heat dissipation to the circuit board 220.
  • the contact portion 2232 is interposed between the circuit board 220 and the electronic component 240. It can be understood that in other embodiments, the contact portion 2232 may be located at a side of the electronic component.
  • the second heat sink 232 directly conforms to the electronic component 240.
  • the electronic device 200 of the second embodiment of the present invention further improves the electrons by bonding the heat conductive sheets 233 to the plurality of electronic components 240 to facilitate the rapid conduction of heat generated by the plurality of electronic components 240 to the second heat sink 232.
  • the heat dissipation efficiency of the device 200 is not limited to the above-described embodiments.
  • the electronic device 300 of the third embodiment of the present invention is similar in structure to the electronic device 100 of the first embodiment.
  • the electronic device 200 includes a housing 310 , a circuit board 320 received in the housing 310 , and a heat dissipation mechanism 330 .
  • the heat dissipation mechanism 330 includes a first heat dissipation member 331 and a second heat dissipation member 332.
  • the difference is that the number of the circuit boards 320 is two, that is, the first circuit board 321 and the second circuit board 322.
  • the first circuit board 321 and the second circuit board 322 are arranged in parallel, and the area of the first circuit board 321 is smaller than the area of the second circuit board 322.
  • the plurality of electronic components 340 are respectively disposed on a side of the second circuit board 322 facing away from the first circuit board 321 .
  • the first heat dissipation component 331 is disposed between the first circuit board 321 and the second circuit board 322 for simultaneous use.
  • the heat generated by the first circuit board 321 and the second circuit board 322 is dissipated;
  • the second heat sink 332 is attached to a side of the plurality of electronic components 340 facing away from the second circuit board 322 for using the plurality of electronic components
  • the heat generated by 340 is emitted.
  • first heat dissipating member 331 and the second heat dissipating member 332 are not limited to the opposite surfaces of the second circuit board 322, and may be disposed on opposite surfaces of the first circuit board 321.
  • the heat dissipation mechanism 330 of the third embodiment of the present invention is suitable for heat dissipation processing of the electronic device 300 having two circuit boards 320, and further reduces the space volume of the electronic device 300 while improving heat dissipation efficiency.
  • an embodiment of the present invention provides an electronic governor 400 .
  • the electronic governor 400 includes a housing 410 , a circuit board 420 received in the housing 410 , a plurality of electronic components 440 , and a plurality of thermal conductive sheets 450 . .
  • the number of circuit boards 420 is two, that is, the first circuit board 421 and the second circuit board 422.
  • the first circuit board 421 and the second circuit board 422 are disposed in parallel.
  • the area of the first circuit board 421 is smaller than the area of the second circuit board 422.
  • the plurality of electronic components 440 include a second electronic component 442 and a first electronic component 441.
  • the second electronic component 442 has a larger amount of heat than the first electronic component 441.
  • the second electronic component 442 is disposed on the second circuit board 422.
  • the first electronic component 441 is disposed on the first circuit board 421, and the first circuit board 421 and the second circuit board 422 are connected through the connector 460 ( Alternatively, the flexible board is connected to effectively prevent the first electronic component 441 located on the first circuit board 421 from being affected by the second electronic component 442 located on the second circuit board 422.
  • the electronic component 440 can be a desired electronic component within the electronic governor.
  • the first electronic component 441 is a control chip and the second electronic component 442 is a MOS transistor.
  • a hollow compartment may also be provided between the first circuit board 421 and the second circuit board 422 to prevent mutual heat conduction between the first circuit board 421 and the second circuit board 422.
  • a heat insulating member may be disposed between the first circuit board 421 and the second circuit board 422.
  • the plurality of thermal conductive sheets 450 are in one-to-one correspondence with the plurality of second electronic components 442.
  • Each of the heat conducting sheets 450 is substantially L-shaped and includes an extending portion 451 and a contact portion 452.
  • the extending portion 451 is fixed on the second circuit board 422 and adjacent to the corresponding second electronic component 442.
  • the contact portion 452 is vertically connected to the conductive portion 452.
  • the extending portion 451 is away from one end of the second circuit board 422 and is attached to a side of the second electronic component 442 facing away from the second circuit board 422.
  • the outer casing 410 includes a lower casing 411 and an upper casing 412.
  • the upper housing 412 and the lower housing 411 are spliced together to form a cavity (not shown) for receiving the first circuit board 421 and the second circuit board 422.
  • the lower cover 411 protrudes from the plurality of thermal conductive sheets 450 with a first protrusion 4111.
  • the first protrusion 4111 is attached to the contact portion 452 of the corresponding thermal conductive sheet 450 to conduct the heat generated by the second electronic component 442 to
  • the lower case 411 has a lower case 411 to dissipate heat.
  • a second protrusion 4121 is protruded from the upper casing 412 toward the second circuit board 422.
  • the second protrusion 4121 is attached to the second circuit board 422 and corresponds to the second electronic component 442 to replace the second circuit board 422.
  • the heat generated by the second electronic component 442 is received and conducted to the upper housing 412, and the heat is dissipated by the upper housing 412.
  • the outer casing 410 in this embodiment is made of a metal material, but is not limited thereto as long as it facilitates heat treatment of the second electronic component 442.
  • the first electronic component 441 may be spaced apart from the inner wall of the upper housing 412, or the first electronic component 441 may be coupled to the inner wall of the upper housing 412 by a layer of thermal adhesive.
  • the outer surfaces of the lower case 411 and the upper case 412 are respectively provided with heat dissipation fins.
  • the outer surfaces of the lower case 411 and the upper case 412 are respectively provided with recesses, the heat dissipation fins are disposed in the recesses, and the top ends of the heat dissipation fins and the lower case 411 and the upper case
  • the outer surface of body 412 is flush.
  • the heat dissipating fins are located at one ends of the lower casing 411 and the upper casing 412, and simultaneously dissipate heat to a portion with relatively high heat generation under the condition that the space in the casing is large.
  • the heat dissipation fins are disposed corresponding to the positions of the plurality of second electronic components 442 of the second circuit board 422 to facilitate rapid heat dissipation of the second circuit board 422 near the plurality of second electronic components 442. But it is not limited to this.
  • the opposite surfaces of the second circuit board 422 are in contact with the upper case 412 and the lower case 411, respectively, through a thermally conductive adhesive layer. But it is not limited to this.
  • the electronic governor 400 further includes a capacitor 470 received in the housing 410, the capacitor being electrically connected to the second circuit board 422 and spaced apart from the first circuit board 421.
  • the capacitor 470 is attached to the inner surface of the lower casing 411 to facilitate conduction of heat generated by the capacitor 470 to the lower casing 411 and is dissipated by the lower casing 411.
  • the plurality of thermal conductive sheets 450 in the embodiment may also be omitted, that is, the first protrusions 4111 are directly attached to one side of the plurality of second electronic components 442 facing away from the second circuit board 422.
  • first protrusion 4111 and the plurality of second electronic components 442 or the plurality of thermal conductive sheets 450 are respectively disposed with a heat conductive insulating material; and the second protrusions 4121 and the second circuit board 422 are also provided with heat conduction. Insulating material.
  • first circuit board 421 and the second circuit board 422 are connected by electrical connectors or/and wires.
  • first circuit board 421 and the second circuit board 422 are staggered so that the first circuit board 421 and the second circuit board 422 partially overlap.
  • the electronic governor 400 of the fourth embodiment of the present invention performs heat dissipation processing on the second electronic component 442 through the outer casing 410, thereby making the structure of the electronic governor 400 more compact.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un mécanisme de dissipation de chaleur (30), utilisé pour dissiper la chaleur d'une carte de circuit imprimé (20) et d'un élément électronique (40) disposé sur la carte de circuit imprimé. Le mécanisme de dissipation de chaleur comprend un premier élément de dissipation de chaleur (31) et un second élément de dissipation de chaleur (32). Le premier élément de dissipation de chaleur est fixé à une surface de la carte de circuit imprimé pour dissiper la chaleur provenant de la carte de circuit imprimé, et le second élément de dissipation de chaleur est fixé à l'autre surface de l'élément électronique à l'arrière de la carte de circuit imprimé pour dissiper la chaleur provenant de l'élément électronique. L'invention concerne également un régulateur électronique (400) pourvu du mécanisme de dissipation de chaleur, et un dispositif électronique (100).
PCT/CN2016/100204 2016-09-26 2016-09-26 Mécanisme de dissipation de chaleur, régulateur électronique pourvu d'un mécanisme de dissipation de chaleur, et dispositif électronique WO2018053871A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2016/100204 WO2018053871A1 (fr) 2016-09-26 2016-09-26 Mécanisme de dissipation de chaleur, régulateur électronique pourvu d'un mécanisme de dissipation de chaleur, et dispositif électronique
CN201680004129.7A CN107006136B (zh) 2016-09-26 2016-09-26 散热机构及具有该散热机构的电子调速器、电子装置

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Application Number Priority Date Filing Date Title
PCT/CN2016/100204 WO2018053871A1 (fr) 2016-09-26 2016-09-26 Mécanisme de dissipation de chaleur, régulateur électronique pourvu d'un mécanisme de dissipation de chaleur, et dispositif électronique

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WO2018053871A1 true WO2018053871A1 (fr) 2018-03-29

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CN113543579A (zh) * 2020-11-10 2021-10-22 华为技术有限公司 一种散热组件、电子设备及芯片封装结构

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WO2020113387A1 (fr) * 2018-12-03 2020-06-11 深圳市大疆创新科技有限公司 Ensemble de communication sans fil, télécommande et aéronef
CN110896602A (zh) * 2018-12-29 2020-03-20 研祥智能科技股份有限公司 电源结构
CN110828922A (zh) * 2019-12-06 2020-02-21 联动天翼新能源有限公司 一种bms散热结构
WO2021248395A1 (fr) * 2020-06-11 2021-12-16 威刚科技股份有限公司 Dispositif électronique ayant une structure, un module et un boîtier de dissipation de chaleur
CN115474403A (zh) * 2022-08-26 2022-12-13 华为数字能源技术有限公司 电子装置及光伏功率优化器

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CN113543579A (zh) * 2020-11-10 2021-10-22 华为技术有限公司 一种散热组件、电子设备及芯片封装结构

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CN107006136A (zh) 2017-08-01

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