CN101436092B - 显卡散热装置组合及使用该组合的刀锋式服务器 - Google Patents
显卡散热装置组合及使用该组合的刀锋式服务器 Download PDFInfo
- Publication number
- CN101436092B CN101436092B CN200710202480.XA CN200710202480A CN101436092B CN 101436092 B CN101436092 B CN 101436092B CN 200710202480 A CN200710202480 A CN 200710202480A CN 101436092 B CN101436092 B CN 101436092B
- Authority
- CN
- China
- Prior art keywords
- video card
- video
- card
- back side
- video memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202480.XA CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
US11/967,040 US7580262B2 (en) | 2007-11-12 | 2007-12-29 | Heat dissipation assembly for graphics card and blade server using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202480.XA CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101436092A CN101436092A (zh) | 2009-05-20 |
CN101436092B true CN101436092B (zh) | 2012-03-28 |
Family
ID=40623490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710202480.XA Expired - Fee Related CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7580262B2 (zh) |
CN (1) | CN101436092B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI342486B (en) * | 2008-04-30 | 2011-05-21 | Asustek Comp Inc | Heat-dissipation module and electronic apparatus having the same |
US7613001B1 (en) * | 2008-05-12 | 2009-11-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
TW201024982A (en) * | 2008-12-26 | 2010-07-01 | Foxconn Tech Co Ltd | Heat dissipation device |
CN201349364Y (zh) * | 2008-12-31 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 电路板组合 |
CN101937888B (zh) * | 2009-07-01 | 2013-01-23 | 辉达公司 | 用于控制电路板上多个单元散热的电路、系统及方法 |
JP5254416B2 (ja) * | 2011-09-30 | 2013-08-07 | 株式会社東芝 | 電子機器 |
CN102495663B (zh) * | 2011-11-24 | 2014-10-29 | 曙光信息产业股份有限公司 | 服务器和服务器机箱 |
CN104378949B (zh) * | 2013-08-12 | 2017-04-26 | 英业达科技有限公司 | 伺服器及其散热组件 |
US10402930B2 (en) | 2013-10-14 | 2019-09-03 | Microsoft Technology Licensing, Llc | Management of graphics processing units in a cloud platform |
US9568255B2 (en) * | 2014-04-21 | 2017-02-14 | Htc Corporation | Electronic device |
US9668334B2 (en) * | 2014-05-23 | 2017-05-30 | General Electric Company | Thermal clamp apparatus for electronic systems |
US9806003B2 (en) * | 2016-01-30 | 2017-10-31 | Intel Corporation | Single base multi-floating surface cooling solution |
CN105549692A (zh) * | 2016-02-04 | 2016-05-04 | 重庆八达电子工程有限公司 | 一种主板和显卡的连接结构 |
CN106297543A (zh) * | 2016-07-27 | 2017-01-04 | 中国船舶重工集团公司第七0九研究所 | 一种用于纸质或电子地图的两用标图设备 |
WO2018053871A1 (zh) * | 2016-09-26 | 2018-03-29 | 深圳市大疆创新科技有限公司 | 散热机构及具有该散热机构的电子调速器、电子装置 |
TWM537248U (zh) * | 2016-10-07 | 2017-02-21 | Evga Corp | 顯示卡之散熱裝置 |
CN107589803A (zh) * | 2017-09-29 | 2018-01-16 | 北京嘉楠捷思信息技术有限公司 | 集群显卡模块、装置及系统 |
US10622279B1 (en) * | 2019-01-14 | 2020-04-14 | Cisco Technology, Inc. | Heatsink mounting system with overhang damping |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2731541Y (zh) * | 2004-04-05 | 2005-10-05 | 联想(北京)有限公司 | 一种计算机机箱内部散热装置 |
CN2857414Y (zh) * | 2005-11-30 | 2007-01-10 | 於贻鹏 | 显卡散热器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6778390B2 (en) * | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
TW545883U (en) * | 2002-11-20 | 2003-08-01 | Sunonwealth Electr Mach Ind Co | Heat dissipating device |
US7283364B2 (en) * | 2004-11-29 | 2007-10-16 | Ati Technologies Inc. | Thermal management apparatus |
US7321494B2 (en) * | 2005-12-14 | 2008-01-22 | Evga Corporation | Graphics card apparatus with improved heat dissipating mechanisms |
US7382621B2 (en) * | 2006-01-24 | 2008-06-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
US7369412B2 (en) * | 2006-05-02 | 2008-05-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7443672B2 (en) * | 2006-10-03 | 2008-10-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
US7495923B2 (en) * | 2007-07-23 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having fixing bracket |
US7492596B1 (en) * | 2007-08-09 | 2009-02-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090080161A1 (en) * | 2007-09-26 | 2009-03-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for computer add-on card |
-
2007
- 2007-11-12 CN CN200710202480.XA patent/CN101436092B/zh not_active Expired - Fee Related
- 2007-12-29 US US11/967,040 patent/US7580262B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2731541Y (zh) * | 2004-04-05 | 2005-10-05 | 联想(北京)有限公司 | 一种计算机机箱内部散热装置 |
CN2857414Y (zh) * | 2005-11-30 | 2007-01-10 | 於贻鹏 | 显卡散热器 |
Also Published As
Publication number | Publication date |
---|---|
US20090122480A1 (en) | 2009-05-14 |
CN101436092A (zh) | 2009-05-20 |
US7580262B2 (en) | 2009-08-25 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20090520 Assignee: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Assignor: Hon Hai Precision Industry Co., Ltd. | Hong Fujin Precision Industry (Shenzhen) Co., Ltd. Contract record no.: 2014990000931 Denomination of invention: Display card heat radiation combination and blade point type server using the same Granted publication date: 20120328 License type: Exclusive License Record date: 20141216 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20151112 |
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EXPY | Termination of patent right or utility model |