CN101436092A - 显卡散热装置组合及使用该组合的刀锋式服务器 - Google Patents
显卡散热装置组合及使用该组合的刀锋式服务器 Download PDFInfo
- Publication number
- CN101436092A CN101436092A CN200710202480.XA CN200710202480A CN101436092A CN 101436092 A CN101436092 A CN 101436092A CN 200710202480 A CN200710202480 A CN 200710202480A CN 101436092 A CN101436092 A CN 101436092A
- Authority
- CN
- China
- Prior art keywords
- video card
- video
- card
- back side
- video memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (13)
- 【权利要求1】一种显卡散热装置组合,装设于一刀锋式服务器的主板,包括一显卡及一装设于所述显卡正面的散热器,其特征在于:所述显卡散热装置组合还包括一装设于所述显卡背面散热板,所述散热器包括一底座、一附着于所述底座正面的散热鳍片组及一夹设于所述底座与所述散热鳍片组之间的一热管,所述显卡正面设置一图形处理单元及若干显存晶片,所述显卡背面设置若干显存晶片,所述热管所在路径经过所述显卡正面的图形处理单元和至少部分的显存晶片的上方,所述散热板用以为所述显卡背面的显存晶片散热。
- 【权利要求2】如权利要求1所述的显卡散热装置组合,其特征在于:所述散热器的底座背面对应所述显卡正面的显存晶片附着若干散热垫。
- 【权利要求3】如权利要求1所述的显卡散热装置组合,其特征在于:所述散热板的正面对应所述显卡背面的显存晶片附着若干散热垫。
- 【权利要求4】如权利要求1所述的显卡散热装置组合,其特征在于:所述散热器的底座的背面对应所述显卡正面的图形处理单元附着一散热脂。
- 【权利要求5】如权利要求1或4所述的显卡散热装置组合,其特征在于:所述显卡正面设置四片显存晶片,所述四片显存晶片围绕所述图形处理单元设置并两两分列于所述图形处理单元周围的两个相邻的方向上,显卡背面也设置四片显存晶片,显卡背面的显存晶片对应设置在显卡正面的每一显存晶片的正下方;所述散热器的底座的背面对应所述显卡正面每一方向上的两片显存晶片分别设一散热垫,所述散热板正面对应所述显卡背面每一方向上的两片显存晶片也分别设一散热垫。
- 【权利要求6】如权利要求5所述的显卡散热装置组合,其特征在于:所述散热板的背面附着一绝缘片。
- 【权利要求7】一种刀锋式服务器,包括一主板、一平行设置于所述主板的显卡以及一装设于所述显卡正面的散热器,其特征在于:所述刀锋式服务器还包括一装设于所述显卡背面的散热板,所述散热器包括一底座、一附着于所述底座正面的散热鳍片组及一夹设于所述底座与所述散热鳍片组之间的一热管,所述显卡正面设置一图形处理单元及若干显存晶片,所述显卡背面设置若干显存晶片,所述热管所在路径分别经过所述显卡正面的图形处理单元和至少部分的显存晶片的上方,所述散热板用以为所述显卡背面的显存晶片散热。
- 【权利要求8】如权利要求7所述的刀锋式服务器,其特征在于:所述散热器的底座背面对应所述显卡正面的显存晶片附着若干散热垫。
- 【权利要求9】如权利要求7所述的刀锋式服务器,其特征在于:所述散热板的正面对应所述显卡背面的显存晶片附着若干散热垫。
- 【权利要求10】如权利要求7所述的刀锋式服务器,其特征在于:所述散热器的底座背面对应所述显卡正面的图形处理单元附着一散热脂。
- 【权利要求11】如权利要求7至10中任意一项所述的刀锋式服务器,其特征在于:所述散热板的背面附着一绝缘片。
- 【权利要求12】如权利要求11所述的刀锋式服务器,其特征在于:所述刀锋式服务器进一步包括一扣具,所述扣具包括一固定于所述主板上的固定部及一转动部,所述转动部的一端与所述固定部的一端相枢接,所述转动部的另一端设有一弹性件,所述弹性件上设有一卡块,所述固定部的另一端设有一壁,所述壁上开设一孔,当所述转动部转至卡合位置时,所述卡块卡合至所述孔中,所述显卡承载于所述固定部上,所述散热器的散热鳍片组上开设一凹槽,当所述转动部转至卡合位置时收容于所述凹槽中。
- 【权利要求13】如权利要求12所述的刀锋式服务器,其特征在于:所述扣具的固定部凸设两支撑柱,每一支撑柱上表面凸设一“十”字形卡块,所述显卡开设两孔,所述显卡的两孔分别卡合于所述两“十”字形卡块上。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202480.XA CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
US11/967,040 US7580262B2 (en) | 2007-11-12 | 2007-12-29 | Heat dissipation assembly for graphics card and blade server using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200710202480.XA CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101436092A true CN101436092A (zh) | 2009-05-20 |
CN101436092B CN101436092B (zh) | 2012-03-28 |
Family
ID=40623490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200710202480.XA Expired - Fee Related CN101436092B (zh) | 2007-11-12 | 2007-11-12 | 显卡散热装置组合及使用该组合的刀锋式服务器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7580262B2 (zh) |
CN (1) | CN101436092B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101937888A (zh) * | 2009-07-01 | 2011-01-05 | 辉达公司 | 用于控制电路板上多个单元散热的电路、系统及方法 |
CN105101747A (zh) * | 2014-05-23 | 2015-11-25 | 通用电气公司 | 用于电子系统的热夹具设备 |
CN105549692A (zh) * | 2016-02-04 | 2016-05-04 | 重庆八达电子工程有限公司 | 一种主板和显卡的连接结构 |
CN106297543A (zh) * | 2016-07-27 | 2017-01-04 | 中国船舶重工集团公司第七0九研究所 | 一种用于纸质或电子地图的两用标图设备 |
CN107589803A (zh) * | 2017-09-29 | 2018-01-16 | 北京嘉楠捷思信息技术有限公司 | 集群显卡模块、装置及系统 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI342486B (en) * | 2008-04-30 | 2011-05-21 | Asustek Comp Inc | Heat-dissipation module and electronic apparatus having the same |
US7613001B1 (en) * | 2008-05-12 | 2009-11-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
TW201024982A (en) * | 2008-12-26 | 2010-07-01 | Foxconn Tech Co Ltd | Heat dissipation device |
CN201349364Y (zh) * | 2008-12-31 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | 电路板组合 |
JP5254416B2 (ja) * | 2011-09-30 | 2013-08-07 | 株式会社東芝 | 電子機器 |
CN102495663B (zh) * | 2011-11-24 | 2014-10-29 | 曙光信息产业股份有限公司 | 服务器和服务器机箱 |
CN104378949B (zh) * | 2013-08-12 | 2017-04-26 | 英业达科技有限公司 | 伺服器及其散热组件 |
US10402930B2 (en) | 2013-10-14 | 2019-09-03 | Microsoft Technology Licensing, Llc | Management of graphics processing units in a cloud platform |
US9568255B2 (en) * | 2014-04-21 | 2017-02-14 | Htc Corporation | Electronic device |
US9806003B2 (en) | 2016-01-30 | 2017-10-31 | Intel Corporation | Single base multi-floating surface cooling solution |
CN107006136B (zh) * | 2016-09-26 | 2021-11-23 | 深圳市大疆创新科技有限公司 | 散热机构及具有该散热机构的电子调速器、电子装置 |
TWM537248U (zh) * | 2016-10-07 | 2017-02-21 | Evga Corp | 顯示卡之散熱裝置 |
US10622279B1 (en) * | 2019-01-14 | 2020-04-14 | Cisco Technology, Inc. | Heatsink mounting system with overhang damping |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6778390B2 (en) * | 2001-05-15 | 2004-08-17 | Nvidia Corporation | High-performance heat sink for printed circuit boards |
TW545883U (en) * | 2002-11-20 | 2003-08-01 | Sunonwealth Electr Mach Ind Co | Heat dissipating device |
CN2731541Y (zh) * | 2004-04-05 | 2005-10-05 | 联想(北京)有限公司 | 一种计算机机箱内部散热装置 |
US7283364B2 (en) * | 2004-11-29 | 2007-10-16 | Ati Technologies Inc. | Thermal management apparatus |
CN2857414Y (zh) * | 2005-11-30 | 2007-01-10 | 於贻鹏 | 显卡散热器 |
US7321494B2 (en) * | 2005-12-14 | 2008-01-22 | Evga Corporation | Graphics card apparatus with improved heat dissipating mechanisms |
US7382621B2 (en) * | 2006-01-24 | 2008-06-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
US7369412B2 (en) * | 2006-05-02 | 2008-05-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US7443672B2 (en) * | 2006-10-03 | 2008-10-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Video graphics array (VGA) card assembly |
US7495923B2 (en) * | 2007-07-23 | 2009-02-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having fixing bracket |
US7492596B1 (en) * | 2007-08-09 | 2009-02-17 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20090080161A1 (en) * | 2007-09-26 | 2009-03-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device for computer add-on card |
-
2007
- 2007-11-12 CN CN200710202480.XA patent/CN101436092B/zh not_active Expired - Fee Related
- 2007-12-29 US US11/967,040 patent/US7580262B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101937888A (zh) * | 2009-07-01 | 2011-01-05 | 辉达公司 | 用于控制电路板上多个单元散热的电路、系统及方法 |
CN101937888B (zh) * | 2009-07-01 | 2013-01-23 | 辉达公司 | 用于控制电路板上多个单元散热的电路、系统及方法 |
CN105101747A (zh) * | 2014-05-23 | 2015-11-25 | 通用电气公司 | 用于电子系统的热夹具设备 |
CN105549692A (zh) * | 2016-02-04 | 2016-05-04 | 重庆八达电子工程有限公司 | 一种主板和显卡的连接结构 |
CN106297543A (zh) * | 2016-07-27 | 2017-01-04 | 中国船舶重工集团公司第七0九研究所 | 一种用于纸质或电子地图的两用标图设备 |
CN107589803A (zh) * | 2017-09-29 | 2018-01-16 | 北京嘉楠捷思信息技术有限公司 | 集群显卡模块、装置及系统 |
Also Published As
Publication number | Publication date |
---|---|
US20090122480A1 (en) | 2009-05-14 |
US7580262B2 (en) | 2009-08-25 |
CN101436092B (zh) | 2012-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101436092B (zh) | 显卡散热装置组合及使用该组合的刀锋式服务器 | |
US8159819B2 (en) | Modular thermal management system for graphics processing units | |
WO2017202252A1 (zh) | 一种电脑主机箱 | |
WO2017202250A1 (zh) | 电脑独立显卡的散热结构及其安装结构 | |
CN102842545B (zh) | 散热组件及其与芯片组的组合结构 | |
CN201327611Y (zh) | 计算机机箱、主板及具有该机箱和主板的计算机 | |
CN201846551U (zh) | 控制箱外壳用铝合金型材 | |
CN108681385A (zh) | 一种可应用于不同规格固态硬盘的散热器 | |
CN201199520Y (zh) | 全缓冲模组内存散热片 | |
CN202008991U (zh) | 集成电路散热器 | |
CN205693973U (zh) | 一种pcb板组件 | |
CN102843894B (zh) | 散热装置及其风扇固定架 | |
CN214155253U (zh) | 液冷散热器及其通用液冷头、固定装置 | |
CN101320287A (zh) | 散热板、间距可调整散热夹具及主板 | |
CN101674718A (zh) | 散热装置 | |
CN206517668U (zh) | 一种垂直安装在电路板上的散热结构 | |
CN206353283U (zh) | 主机板组件 | |
CN101312629A (zh) | 用于同时为多个表面不等高的电子组件作散热的装置 | |
CN201869494U (zh) | 一种散热片 | |
CN217181479U (zh) | 一种cpu及gpu双热源一体式新型散热器 | |
CN213206048U (zh) | 一种适用于服务器vr供电模块的散热风扇及服务器 | |
CN201229541Y (zh) | 新型散热架 | |
CN217467567U (zh) | 一种一体机电脑的散热后壳 | |
CN203378186U (zh) | 一种组合型散热模块 | |
CN216120280U (zh) | 一种太阳花散热器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20090520 Assignee: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Assignor: Hon Hai Precision Industry Co., Ltd. | Hong Fujin Precision Industry (Shenzhen) Co., Ltd. Contract record no.: 2014990000931 Denomination of invention: Display card heat radiation combination and blade point type server using the same Granted publication date: 20120328 License type: Exclusive License Record date: 20141216 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120328 Termination date: 20151112 |
|
EXPY | Termination of patent right or utility model |