TWM537248U - 顯示卡之散熱裝置 - Google Patents
顯示卡之散熱裝置 Download PDFInfo
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- TWM537248U TWM537248U TW105215332U TW105215332U TWM537248U TW M537248 U TWM537248 U TW M537248U TW 105215332 U TW105215332 U TW 105215332U TW 105215332 U TW105215332 U TW 105215332U TW M537248 U TWM537248 U TW M537248U
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- heat
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Description
本新型為提供一種顯示卡之散熱裝置,特別是指一種增進散熱效果以提升效能的顯示卡之散熱裝置。
按,各種電子設備於使用時會因電流流通、及電流阻抗等因素產生熱能,且此熱能除了可能會造成電子設備的效能下降外,更可能會造成電子設備的損壞,甚至導致發生火災,所以對於電子設備來說降溫是相當重要的課題。
其中,一般電腦內常見的獨立顯示卡係都會加裝有習用散熱構件,而習用散熱構件包含有一設於顯示晶片上之散熱鰭片、及一設於散熱鰭片上之風扇,藉由散熱鰭片吸收顯示晶片的熱能後,由風扇引導空氣與散熱鰭片接觸以帶走熱能。
不過光靠習用散熱構件所能提供的散熱效果係有所不足,且獨立顯示卡除了顯示晶片外係有更多元件會發熱,但是習用散熱構件卻未能對其他元件進行散熱,所以會發生獨立顯示卡效能降低之情事。
是以,要如何解決上述習用之問題與缺失,即為本新型之申請人與從事此行業之相關廠商所亟欲研究改善之方向所在者。
故,本新型之申請人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種增進散熱效果以提升效能的顯示卡之散熱裝置之新型專利者。
本新型之主要目的在於:透過加強散熱的能力,使顯示卡的效能可以完全發揮。
為達上述目的,本新型包括有至少一供設於顯示卡的電源供應迴路上之氣冷裝置,氣冷裝置側處設有至少一供設於顯示卡的運算處理元件上之水冷裝置,並水冷裝置鄰近顯示卡側處設有至少一輔助裝置,而輔助裝置係與水冷裝置及運算處理元件位置對應形成有至少一開孔,且往背離開孔方向延伸形成有至少一延伸部,延伸部係供設於顯示卡之記憶體上。
因此,當使用本新型時電源供應迴路係透過氣冷裝置散熱,且運算處理元件透過水冷裝置散熱,並記憶體透過輔助裝置、及延伸部散熱,輔助裝置、及延伸部的熱能則由過水冷裝置帶走,所以能同時對顯示卡之電源供應迴路、運算處理元件、及記憶體進行散熱以加強散熱效果,且使顯示卡的效能可完全發揮護,藉由上述技術,可針對習用散熱構件所存在之散熱效果不足,且散熱目標單一無法對其他元件散熱的問題點加以突破,達到增進散熱效果以提升效能之實用進步性。
1‧‧‧氣冷裝置
11‧‧‧散熱鰭片
12‧‧‧風扇組
2‧‧‧水冷裝置
21‧‧‧熱交換殼體
211‧‧‧延展部
212‧‧‧第一安裝部
213‧‧‧熱交換部
22‧‧‧泵浦
23‧‧‧入液管
24‧‧‧出液管
3‧‧‧輔助裝置
31‧‧‧開孔
32‧‧‧延伸部
33‧‧‧第二安裝部
4‧‧‧顯示卡
41‧‧‧電源供應迴路
42‧‧‧運算處理元件
43‧‧‧記憶體
第一圖 係為本新型較佳實施例之結構示意圖。
第二圖 係為本新型較佳實施例之分解示意圖(一)。
第三圖 係為本新型較佳實施例之分解示意圖(二)。
第四圖 係為本新型較佳實施例之作動示意圖。
為達成上述目的及功效,本新型所採用之技術手段及構造,茲繪圖就本新型較佳實施例詳加說明其特徵與功能如下,俾利完全了解。
請參閱第一圖至第三圖所示,係為本新型較佳實施例之結構示意圖、分解示意圖(一)、及分解示意圖(二),由圖中可清楚看出本新型包括有至少一氣冷裝置1、至少一水冷裝置2、及至少一輔助裝置3,而氣冷裝置1供設於一顯示卡4之至少一電源供應迴路41上,且氣冷裝置1包含有至少一設於電源供應迴路41上之散熱鰭片11、及至少一設於散熱鰭片11上之風扇組12。
水冷裝置2設於氣冷裝置1側處,且供設於顯示卡4之運算處理元件42上,並水冷裝置2包含有至少一設於運算處理元件42上之熱交換殼體21、
至少一設於熱交換殼體21上之泵浦22、至少一界定於熱交換殼體21與泵浦22間之儲液空間、至少一與儲液空間通連設置之入液管23、及至少一與儲液空間通連設置之出液管24,其中熱交換殼體21鄰近運算處理元件42之側處具有至少一包含銅材質之熱交換部213。
輔助裝置3係設於水冷裝置2鄰近顯示卡4之側處,且與水冷裝置2及運算處理元件42位置對應處形成有至少一開孔31,並往背離開孔31方向延伸形成有至少一延伸部32,而延伸部32係供設於顯示卡4之記憶體43上,且輔助裝置3、開孔31、及延伸部32係經沖壓手段一體成形故生產快速便宜,並輔助裝置3包含有銅材質,此外,於生產時若複數顯示卡4之記憶體43的位置相互有所不同,係僅需改變延伸部32的延伸範圍使其與記憶體43的位置配合即可,氣冷裝置1和水冷裝置2仍可共用,讓生產更為方便及降低成本。
而熱交換殼體21係延伸形成有至少一延展部211,且延展部211上形成有複數第一安裝部212,並輔助裝置3上與各該第一安裝部212位置對應形成有複數第二安裝部33,以將熱交換殼體21固定於顯示卡4上,另,上述僅為本新型其中之一實施態樣,其態樣不設限於此。
請同時配合參閱第一圖至第四圖所示,係為本新型較佳實施例之結構示意圖、分解示意圖(一)、分解示意圖(二)、及作動示意圖,係因氣冷裝置1設置於電源供應迴路41上,所以可由散熱鰭片11吸收顯示卡4之電源供應迴路41的熱能,且透過風扇組12引導週遭空氣與散熱鰭片11接觸以帶走其熱能。
水冷裝置2則透過其熱交換殼體21之熱交換部213,穿過輔助裝置3之開孔31接觸吸收運算處理元件42的熱能,且泵浦22作動將液體從入液管23吸入儲液空間後從出液管24流出,藉此以帶走熱交換殼體21的熱能;輔助裝置3、及延伸部32則接觸吸收記憶體43的熱能,且將熱能經熱交換殼體21、及延展部211傳遞給液體帶走。
因此能夠達到全面性增進散熱效果之目的,進而提升顯示卡4之效能。
是以,本新型之顯示卡4之散熱裝置為可改善習用之技術關鍵在於:
一、藉由氣冷裝置1、水冷裝置2、輔助裝置3、開孔31、及延伸部32的配合設置,令本新型達到增進散熱效果以提升效能之實用進步性。
二、藉由輔助裝置3、開孔31、及延伸部32一體成形構造,且可配合改變延伸範圍之特性,本新型達到生產方便快速及降低成本之實用進步性。
惟,以上所述僅為本新型之較佳實施例而已,非因此即侷限本新型之專利範圍,故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本新型之專利範圍內,合予陳明。
綜上所述,本新型之顯示卡之散熱裝置於使用時,為確實能達到其功效及目的,故本新型誠為一實用性優異之新型,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本新型,以保障申請人之辛苦研發,倘若 鈞局審委有任何稽疑,請不吝來函指示,申請人定當竭力配合,實感公便。
1‧‧‧氣冷裝置
11‧‧‧散熱鰭片
12‧‧‧風扇組
2‧‧‧水冷裝置
21‧‧‧熱交換殼體
211‧‧‧延展部
212‧‧‧第一安裝部
22‧‧‧泵浦
23‧‧‧入液管
24‧‧‧出液管
3‧‧‧輔助裝置
31‧‧‧開孔
32‧‧‧延伸部
33‧‧‧第二安裝部
4‧‧‧顯示卡
41‧‧‧電源供應迴路
42‧‧‧運算處理元件
43‧‧‧記憶體
Claims (8)
- 一種顯示卡之散熱裝置,其包括:至少一氣冷裝置,該氣冷裝置供設於一顯示卡之至少一電源供應迴路上;至少一水冷裝置,該水冷裝置設於該氣冷裝置側處,且供設於該顯示卡之運算處理元件上;及至少一輔助裝置,該輔助裝置設於該水冷裝置鄰近該顯示卡之側處,且與該水冷裝置及該運算處理元件位置對應形成有至少一開孔,並往背離該開孔方向延伸形成有至少一延伸部,該延伸部係供設於該顯示卡之記憶體上。
- 如申請專利範圍第1項所述之顯示卡之散熱裝置,其中該氣冷裝置包含有至少一設於該電源供應迴路上之散熱鰭片、及至少一設於該散熱鰭片上之風扇組。
- 如申請專利範圍第1項所述之顯示卡之散熱裝置,其中該水冷裝置包含有至少一設於該運算處理元件上之熱交換殼體、至少一設於該熱交換殼體上之泵浦、至少一界定於該熱交換殼體與該泵浦間之儲液空間、至少一與該儲液空間通連設置之入液管、及至少一與該儲液空間通連設置之出液管。
- 如申請專利範圍第3項所述之顯示卡之散熱裝置,其中該熱交換殼體係延伸形成有至少一延展部,且該延展部上形成有複數第一安裝部,並該輔助裝置上與各該第一安裝部位置對應形成有複數第二安裝部,以將該熱交換殼體固定於該顯示卡上。
- 如申請專利範圍第3項所述之顯示卡之散熱裝置,其中該熱交換殼體鄰近該運算處理元件之側處具有至少一熱交換部。
- 如申請專利範圍第5項所述之顯示卡之散熱裝置,其中該熱交換部包含有銅材質。
- 如申請專利範圍第1項所述之顯示卡之散熱裝置,其中該輔助裝置包含有銅材質。
- 如申請專利範圍第1項所述之顯示卡之散熱裝置,其中該輔助裝置及該延伸部係經沖壓手段一體成形。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105215332U TWM537248U (zh) | 2016-10-07 | 2016-10-07 | 顯示卡之散熱裝置 |
US15/381,131 US9946314B1 (en) | 2016-10-07 | 2016-12-16 | Heat dissipation device for display card |
DE202016107386.3U DE202016107386U1 (de) | 2016-10-07 | 2016-12-27 | Die Kühleinrichtung der Grafikkarte |
CN201721041992.8U CN207301942U (zh) | 2016-10-07 | 2017-08-18 | 显示卡的散热装置 |
JP2017003944U JP3213430U (ja) | 2016-10-07 | 2017-08-29 | グラフィックカードの放熱装置 |
KR2020170004883U KR200490077Y1 (ko) | 2016-10-07 | 2017-09-15 | 그래픽 카드의 방열 장치 |
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TW105215332U TWM537248U (zh) | 2016-10-07 | 2016-10-07 | 顯示卡之散熱裝置 |
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TWM537248U true TWM537248U (zh) | 2017-02-21 |
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TW105215332U TWM537248U (zh) | 2016-10-07 | 2016-10-07 | 顯示卡之散熱裝置 |
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US (1) | US9946314B1 (zh) |
JP (1) | JP3213430U (zh) |
KR (1) | KR200490077Y1 (zh) |
CN (1) | CN207301942U (zh) |
DE (1) | DE202016107386U1 (zh) |
TW (1) | TWM537248U (zh) |
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CN108980549A (zh) * | 2018-10-18 | 2018-12-11 | 成都共同进步信息技术有限公司 | 一种便于固定广播终端设备的辅助装置 |
USD979571S1 (en) * | 2019-07-26 | 2023-02-28 | Cambricon Technologies Corporation Limited | Board card |
GB2597525A (en) * | 2020-07-27 | 2022-02-02 | Nexalus Ltd | Cooling device for cooling components of a circuit board |
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US4935864A (en) * | 1989-06-20 | 1990-06-19 | Digital Equipment Corporation | Localized cooling apparatus for cooling integrated circuit devices |
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-
2016
- 2016-10-07 TW TW105215332U patent/TWM537248U/zh unknown
- 2016-12-16 US US15/381,131 patent/US9946314B1/en active Active
- 2016-12-27 DE DE202016107386.3U patent/DE202016107386U1/de active Active
-
2017
- 2017-08-18 CN CN201721041992.8U patent/CN207301942U/zh active Active
- 2017-08-29 JP JP2017003944U patent/JP3213430U/ja active Active
- 2017-09-15 KR KR2020170004883U patent/KR200490077Y1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR200490077Y1 (ko) | 2019-09-20 |
JP3213430U (ja) | 2017-11-09 |
CN207301942U (zh) | 2018-05-01 |
DE202016107386U1 (de) | 2017-01-17 |
US20180101202A1 (en) | 2018-04-12 |
US9946314B1 (en) | 2018-04-17 |
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