USD979571S1 - Board card - Google Patents

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Publication number
USD979571S1
USD979571S1 US29/699,562 US201929699562F USD979571S US D979571 S1 USD979571 S1 US D979571S1 US 201929699562 F US201929699562 F US 201929699562F US D979571 S USD979571 S US D979571S
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United States
Prior art keywords
board card
view
card
board
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/699,562
Inventor
Xiaobing Feng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambricon Technologies Corp Ltd
Original Assignee
Cambricon Technologies Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Cambricon Technologies Corp Ltd filed Critical Cambricon Technologies Corp Ltd
Priority to US29/699,562 priority Critical patent/USD979571S1/en
Assigned to CAMBRICON TECHNOLOGIES CORPORATION LIMITED reassignment CAMBRICON TECHNOLOGIES CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, XIAOBING
Application granted granted Critical
Publication of USD979571S1 publication Critical patent/USD979571S1/en
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Description

FIG. 1 is a perspective view of a board card in accordance with the present invention;
FIG. 2 is another perspective view of a board card thereof;
FIG. 3 is a front view of a board card thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left view thereof;
FIG. 6 is a right view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The features shown in broken lines in the various Figures are for illustrating environmental structure and form no part of the claimed design. The surfaces of the board card are not limited to any color designations.
Generally, the invention pertains to an ornamental design for an article of manufacture. The article is not limited to the scale shown herein. As indicated in the title, the article of manufacture to which the ornamental design has been applied is a board card, a printed circuit board (PCB) card, etc.

Claims (1)

    CLAIM
  1. The ornamental design for a board card, as shown and described.
US29/699,562 2019-07-26 2019-07-26 Board card Active USD979571S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/699,562 USD979571S1 (en) 2019-07-26 2019-07-26 Board card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/699,562 USD979571S1 (en) 2019-07-26 2019-07-26 Board card

Publications (1)

Publication Number Publication Date
USD979571S1 true USD979571S1 (en) 2023-02-28

Family

ID=85279018

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/699,562 Active USD979571S1 (en) 2019-07-26 2019-07-26 Board card

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1006015S1 (en) * 2021-01-26 2023-11-28 Samsung Electronics Co., Ltd. Solid state drive memory device

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338214A (en) * 1992-10-27 1994-08-16 Steffes Karl M Expansion card/riser card module for desktop computers
US20030016496A1 (en) * 2001-07-23 2003-01-23 Kim David K.J. PCI riser card bracket assembly
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
US20050061477A1 (en) * 2003-09-24 2005-03-24 Heatscape, Inc. Fan sink heat dissipation device
US20070047211A1 (en) * 2005-08-31 2007-03-01 Ati Technologies, Inc. Variable spring rate thermal management apparatus attachment mechanism
USD539275S1 (en) * 2005-08-12 2007-03-27 Mitsumi Electric Co., Ltd. Wireless module
US20070133178A1 (en) * 2005-12-14 2007-06-14 Evga Corporation Graphics card apparatus with improved heat dissipating assemblies
US20070280818A1 (en) * 2006-06-01 2007-12-06 Chih-Heng Yang Heat-Dissipating Fan
US7382621B2 (en) * 2006-01-24 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Video graphics array (VGA) card assembly
US20090059525A1 (en) * 2007-09-05 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US7990712B2 (en) * 2008-12-31 2011-08-02 Cooler Master Co., Ltd. Heat sink used in interface card
US20120087088A1 (en) * 2008-08-05 2012-04-12 Pipeline Micro, Inc. Microscale heat transfer systems
US20120268890A1 (en) * 2011-04-19 2012-10-25 Michael Stock Apparatus and method for cooling electrical components of a computer
US9036348B2 (en) * 2011-11-11 2015-05-19 Asustek Computer Inc. Heat dissipating module
US20150346783A1 (en) * 2014-06-02 2015-12-03 Corsair Memory, Inc. Graphics card cooler
US9471115B2 (en) * 2012-02-13 2016-10-18 Hewlett-Packard Development Company, L.P. Processor card housing with fan
US9946314B1 (en) * 2016-10-07 2018-04-17 Evga Corporation Heat dissipation device for display card
USD916706S1 (en) * 2019-01-28 2021-04-20 Cambricon Technologies Corporation Limited Graphics card
USD928161S1 (en) * 2019-03-14 2021-08-17 Cambricon Technologies Corporation Limited Graphics card

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338214A (en) * 1992-10-27 1994-08-16 Steffes Karl M Expansion card/riser card module for desktop computers
US20030016496A1 (en) * 2001-07-23 2003-01-23 Kim David K.J. PCI riser card bracket assembly
US6772246B2 (en) * 2001-07-23 2004-08-03 Sun Microsystems, Inc. PCI riser card bracket assembly
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
US20050061477A1 (en) * 2003-09-24 2005-03-24 Heatscape, Inc. Fan sink heat dissipation device
USD539275S1 (en) * 2005-08-12 2007-03-27 Mitsumi Electric Co., Ltd. Wireless module
US20070047211A1 (en) * 2005-08-31 2007-03-01 Ati Technologies, Inc. Variable spring rate thermal management apparatus attachment mechanism
US20070133178A1 (en) * 2005-12-14 2007-06-14 Evga Corporation Graphics card apparatus with improved heat dissipating assemblies
US7382621B2 (en) * 2006-01-24 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Video graphics array (VGA) card assembly
US20070280818A1 (en) * 2006-06-01 2007-12-06 Chih-Heng Yang Heat-Dissipating Fan
US20090059525A1 (en) * 2007-09-05 2009-03-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US20120087088A1 (en) * 2008-08-05 2012-04-12 Pipeline Micro, Inc. Microscale heat transfer systems
US7990712B2 (en) * 2008-12-31 2011-08-02 Cooler Master Co., Ltd. Heat sink used in interface card
US20120268890A1 (en) * 2011-04-19 2012-10-25 Michael Stock Apparatus and method for cooling electrical components of a computer
US9036348B2 (en) * 2011-11-11 2015-05-19 Asustek Computer Inc. Heat dissipating module
US9471115B2 (en) * 2012-02-13 2016-10-18 Hewlett-Packard Development Company, L.P. Processor card housing with fan
US20150346783A1 (en) * 2014-06-02 2015-12-03 Corsair Memory, Inc. Graphics card cooler
US9946314B1 (en) * 2016-10-07 2018-04-17 Evga Corporation Heat dissipation device for display card
USD916706S1 (en) * 2019-01-28 2021-04-20 Cambricon Technologies Corporation Limited Graphics card
USD928161S1 (en) * 2019-03-14 2021-08-17 Cambricon Technologies Corporation Limited Graphics card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1006015S1 (en) * 2021-01-26 2023-11-28 Samsung Electronics Co., Ltd. Solid state drive memory device

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