USD872038S1 - LED chips on a printed circuit board - Google Patents

LED chips on a printed circuit board Download PDF

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Publication number
USD872038S1
USD872038S1 US29/656,952 US201829656952F USD872038S US D872038 S1 USD872038 S1 US D872038S1 US 201829656952 F US201829656952 F US 201829656952F US D872038 S USD872038 S US D872038S
Authority
US
United States
Prior art keywords
circuit board
printed circuit
led chips
view
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/656,952
Inventor
Jianxin Pan
Lian WU
Hongbo Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haining Xincheng Electronics Co Ltd
Original Assignee
Haining Xincheng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haining Xincheng Electronics Co Ltd filed Critical Haining Xincheng Electronics Co Ltd
Priority to US29/656,952 priority Critical patent/USD872038S1/en
Application granted granted Critical
Publication of USD872038S1 publication Critical patent/USD872038S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a LED chips on a printed circuit board showing the new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof; and,
FIG. 7 is a perspective view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a LED chips on a printed circuit board, as shown and described.
US29/656,952 2018-07-18 2018-07-18 LED chips on a printed circuit board Active USD872038S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/656,952 USD872038S1 (en) 2018-07-18 2018-07-18 LED chips on a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/656,952 USD872038S1 (en) 2018-07-18 2018-07-18 LED chips on a printed circuit board

Publications (1)

Publication Number Publication Date
USD872038S1 true USD872038S1 (en) 2020-01-07

Family

ID=69058071

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/656,952 Active USD872038S1 (en) 2018-07-18 2018-07-18 LED chips on a printed circuit board

Country Status (1)

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US (1) USD872038S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD569529S1 (en) * 2006-06-20 2008-05-20 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570003S1 (en) * 2006-06-20 2008-05-27 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US20090206350A1 (en) * 2008-02-20 2009-08-20 Bily Wang LED chip package structure with different LED spacings and a method for making the same
US20090224265A1 (en) * 2008-03-05 2009-09-10 Bily Wang LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
US20120009700A1 (en) * 2009-04-17 2012-01-12 Harvatek Corporation Method of manufacturing a led chip package structure
USD673307S1 (en) * 2011-05-12 2012-12-25 Cooper Technologies Company Light bar
USD690444S1 (en) * 2011-06-06 2013-09-24 Citizen Electronics Co., Ltd. Light-emitting diode
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
US20150338041A1 (en) * 2012-12-20 2015-11-26 Tridonic Jennersdorf Gmbh Led module with led chip groups
US20160276318A1 (en) * 2014-03-12 2016-09-22 Ming Sun Package of LED Chip and Manufacturing Method Thereof
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
US20170084586A1 (en) * 2015-09-21 2017-03-23 Lextar Electronics Corporation Led chip package

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD569529S1 (en) * 2006-06-20 2008-05-20 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570003S1 (en) * 2006-06-20 2008-05-27 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US20090206350A1 (en) * 2008-02-20 2009-08-20 Bily Wang LED chip package structure with different LED spacings and a method for making the same
US20090224265A1 (en) * 2008-03-05 2009-09-10 Bily Wang LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
US20120009700A1 (en) * 2009-04-17 2012-01-12 Harvatek Corporation Method of manufacturing a led chip package structure
USD673307S1 (en) * 2011-05-12 2012-12-25 Cooper Technologies Company Light bar
USD690444S1 (en) * 2011-06-06 2013-09-24 Citizen Electronics Co., Ltd. Light-emitting diode
US20150338041A1 (en) * 2012-12-20 2015-11-26 Tridonic Jennersdorf Gmbh Led module with led chip groups
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
US20160276318A1 (en) * 2014-03-12 2016-09-22 Ming Sun Package of LED Chip and Manufacturing Method Thereof
US20170084586A1 (en) * 2015-09-21 2017-03-23 Lextar Electronics Corporation Led chip package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD920933S1 (en) 2019-11-04 2021-06-01 Putco, Inc. Surface-mount device
USD954006S1 (en) * 2020-11-03 2022-06-07 Linxens Holding Microcircuit for smart card

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