WO2017080069A1 - Dissipateur de chaleur d'un dispositif de chauffage, d'un terminal mobile et d'un ensemble de rayonnement thermique d'un<b> </b>amplificateur de puissance - Google Patents

Dissipateur de chaleur d'un dispositif de chauffage, d'un terminal mobile et d'un ensemble de rayonnement thermique d'un<b> </b>amplificateur de puissance Download PDF

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Publication number
WO2017080069A1
WO2017080069A1 PCT/CN2015/099145 CN2015099145W WO2017080069A1 WO 2017080069 A1 WO2017080069 A1 WO 2017080069A1 CN 2015099145 W CN2015099145 W CN 2015099145W WO 2017080069 A1 WO2017080069 A1 WO 2017080069A1
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WO
WIPO (PCT)
Prior art keywords
heat
power amplifier
pcb
contact portion
assembly according
Prior art date
Application number
PCT/CN2015/099145
Other languages
English (en)
Chinese (zh)
Inventor
姚凯
雷卫强
Original Assignee
海能达通信股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海能达通信股份有限公司 filed Critical 海能达通信股份有限公司
Publication of WO2017080069A1 publication Critical patent/WO2017080069A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of heat dissipating devices, and in particular, to a power dissipating heat dissipating component and a heat dissipating device and a mobile terminal using the same.
  • a new generation of professional communication products requires wide and narrow band fusion, and requires a wide frequency range. Therefore, multi-band multi-amplifiers need to coexist in product design.
  • the size of the terminal products is continuously reduced and can be used for PCB (Printed Circuit Board (printed circuit board) layout space is also constantly compressed, resulting in the miniaturization of the device, high-density layout has become the design necessity.
  • a single-sided layout is generally adopted, and a separate heat dissipation space is required due to a large amount of heat generation.
  • multiple power amplifier devices need to be designed in the PCB.
  • the power amplifier device needs to realize double-sided layout on the PCB, which further aggravates the heat dissipation of the power amplifier and becomes the product design.
  • the bottleneck of the product seriously affects the heat dissipation reliability of the product.
  • the invention provides a heat dissipating device for a heat generating device, a mobile terminal and a power dissipating heat dissipating component, so as to solve the problem that the power amplifier device in the prior art realizes the double-sided affixing layout on the PCB, further aggravating the heat dissipating difficulty of the power amplifier and becomes a malicious bottleneck of product design. A technical problem that seriously affects the thermal reliability of the product.
  • a technical solution adopted by the present invention is to provide a mobile terminal, including a power amplifier heat dissipating component, the power amplifier heat dissipating component includes: a PCB, a plurality of power amplifiers, and a heat conducting board, and a part of the plurality of power amplifiers are symmetrically disposed.
  • the first surface and the second surface of the PCB are separately disposed on the first surface of the PCB;
  • the heat conducting plate is disposed in the PCB to absorb heat to dissipate the plurality of power amplifiers;
  • the heat conducting board is integrally embedded in the PCB Inside the PCB, or the thermally conductive plate has a first exposed portion that partially exposes the second surface.
  • the power amplifier heat dissipating assembly further includes a heat dissipating member connected to the surface of the PCB or connected to the first exposed portion to derive and dissipate heat absorbed by the heat conducting plate.
  • the heat dissipating member has a first contact portion and a floating portion, and the first contact portion is connected to the first exposed portion; the floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for receiving the power amplifier.
  • the heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion.
  • the second contact portion is connected to the surface of the PCB.
  • the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is connected to the second contact portion.
  • the power amplifier is at least three.
  • a technical solution adopted by the present invention is to provide a power amplifier heat dissipation assembly including a PCB, a plurality of power amplifiers, and a heat conduction plate, wherein a plurality of power amplifiers are distributed on the first surface and the second surface of the PCB; A board is disposed on the PCB to absorb heat to dissipate the plurality of power amplifiers.
  • the heat conducting plate is entirely embedded inside the PCB, or the heat conducting plate has a first exposed portion partially exposing the second surface.
  • the power amplifier heat dissipating assembly further includes a heat dissipating member connected to the surface of the PCB or connected to the first exposed portion to derive and dissipate heat absorbed by the heat conducting plate.
  • the heat dissipating member has a first contact portion and a floating portion, and the first contact portion is connected to the first exposed portion; the floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for receiving the power amplifier.
  • the heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion.
  • the second contact portion is connected to the surface of the PCB.
  • the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is connected to the second contact portion.
  • the power amplifier is at least two.
  • another technical solution adopted by the present invention is to provide a heat dissipating device heat dissipating device, which comprises the above-mentioned power amplifier heat dissipating component.
  • the utility model has the beneficial effects that the heat-dissipating device heat-dissipating device, the mobile terminal and the power-dissipating heat-dissipating component of the heat-dissipating device of the present invention have a plurality of power amplifiers disposed on the PCB board in a concentrated manner, and the heat-dissipating board is disposed in the PCB to absorb the difference.
  • the heat thus dissipates the plurality of power amplifiers, the structure is simple, the heat dissipation effect is good, the density of the PCB is increased, the PCB size is reduced, and the product is miniaturized.
  • FIG. 1 is a schematic block diagram showing the structure of a power amplifier heat dissipation assembly according to a preferred embodiment of the present invention
  • 1a is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • FIG. 3 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • Figure 6 is a schematic block diagram showing the structure of a power amplifier heat dissipating assembly in accordance with another preferred embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a power amplifier heat dissipating assembly according to a preferred embodiment of the present invention
  • FIG. 1a is a schematic structural diagram of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • a power amplifier heat dissipation assembly 1 of the present invention includes a PCB 10.
  • the power amplifier 20 of the present invention has opposite first and second surfaces 11 and 12, and a plurality of power amplifiers 20 are distributed on the PCB.
  • at least one pair of power amplifiers 20 of the plurality of power amplifiers 20 may be symmetrically disposed on the PCB.
  • the first surface 11 and the second surface 12 of 10, that is, may also be 2 pairs, 3 pairs, ... n (positive integer), the power amplifier 20 is symmetrically disposed on the PCB
  • two power amplifiers 20 respectively disposed on the first surface 11 and the second surface 12 of the PCB 10 are on the PCB.
  • the projections on the 10 may also be partially coincident.
  • the projections of the two power amplifiers 20 respectively disposed on the first surface 11 and the second surface 12 of the PCB 10 on the PCB 10 may also be offset from each other.
  • the first power amplifier 21 is disposed on the PCB.
  • the intermediate position of the first surface 11 of the 10 is disposed at an intermediate position of the second surface 12 of the PCB 10
  • the first power amplifier 21 is symmetrically disposed with the second power amplifier 22, and the layout can be greatly reduced by using the layout.
  • PCB The size of 10 is good for product miniaturization.
  • the heat conducting plate 30 absorbs the heat generated by the first power amplifier 21 and the second power amplifier 22 to dissipate heat from the first power amplifier 21 and the second power amplifier 22.
  • FIG. 2 is a schematic diagram showing the structure of a power amplifier heat dissipating component according to another preferred embodiment of the present invention.
  • This embodiment is substantially the same as the above embodiment, except that the number and setting positions of the power amplifier 20 are different.
  • a part of the plurality of power amplifiers 20 are symmetrically disposed on the PCB.
  • the first surface 11 and the second surface 12 of the 10 are either partially overlapped on the projected portion of the PCB 10 and the other portion is separately provided on the first surface 11 of the PCB 10.
  • the first power amplifier 21 is disposed on the first surface 11 of the PCB 10
  • the second power amplifier 22 is disposed on the PCB.
  • the second surface 12 of 10 and the first power amplifier 21 is symmetrically disposed with the second power amplifier 22, and the third power amplifier 23 is also disposed on the first surface 11, but on the PCB
  • the second surface 12 of the 10 has no other power amplifier 20 symmetrical thereto, and the layout can greatly improve the heat dissipation effect of the power amplifier 20. Specifically, as shown by the direction of the heat conduction arrow of the power amplifier 20 of FIG.
  • the first power amplifier 21, The heat emitted by the two power amplifiers 22 and the third power amplifier 23 is conducted in the hot plate 30, due to the relative power of the third power amplifier 23
  • the second surface 12 of the 10 is not provided with the power amplifier 20, and the heat is low, so most of the heat received by the heat conducting plate 30 goes to the PCB of the powerless 20
  • the second surface 12 of 10 is delivered.
  • the power amplifier 20 of the present invention may also be five, seven, nine or more, and the arrangement is the same as that of the three power amplifiers 20, that is, only one power amplifier 20 is on the PCB. There is no amp 20 symmetry on the second surface 12 of the 10, and the other power amplifiers 20 are symmetrically disposed on the PCB one by one.
  • a part of the power amplifier 20 may be symmetrically disposed on the first surface 11 and the second surface 12, and then more than two power amplifiers 20 may be disposed on the PCB.
  • the first surface 11 of 10 and the second surface 12 are not provided with a power amplifier 20 symmetrical thereto.
  • the heat conducting plate 30 of the present invention is disposed on the PCB
  • the heat is absorbed by the power amplifier 20 by absorbing heat.
  • the heat conducting plate 30 in this embodiment is entirely embedded inside the PCB 10.
  • the heat dissipation pad of the power amplifier 20 of the present invention is located at the bottom, that is, a portion in contact with the surface of the PCB 10, for quickly moving to the PCB 10 and its heat conducting plate 30 transfer heat.
  • the power amplifier 20 is a tube power amplifier 20, a transistor power amplifier 20 or an integrated circuit power amplifier 20, and may be another power amplifier 20 having an effect of amplifying a weak electrical signal from a signal source to drive a sound of the speaker, as long as the power amplifier 20 can achieve the effect. Yes, there is no limit here.
  • FIG. 3 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • the heat conducting plate 30 may also not need to be integrally embedded in the PCB 10, as shown in FIG. 2, the heat conducting plate 30 has a first exposed portion 31 partially exposing the second surface 12, so that the heat absorbed by the heat conducting plate 30 can be quickly conducted to the air by the first exposed portion 31, further Improve the heat capacity of the power amplifier cooling unit 1.
  • the first exposed portion 31 is formed at one end of the heat conducting plate 30. In other embodiments, it may be formed at both ends of the heat conducting plate 30 or at the outer edge of the heat conducting plate 30.
  • the first exposed portion 31 in this embodiment may be associated with a PCB
  • the second surface 12 of the 10 is flush, and may also form a recess with the second surface 12 of the PCB 10, and may also protrude from the PCB.
  • the second surface 12 of the 10 can increase the heat capacity of the power amplifier heat dissipating component 1 by bringing the first exposed portion 31 into contact with the air.
  • FIG. 4 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • the power amplifier heat dissipation assembly 1 in this embodiment further includes a heat sink 40, the heat sink 40 and the PCB 10 surface connections.
  • the heat sink 40 in this embodiment has a first contact portion 41 and a floating portion 42, the first contact portion 41 and the PCB
  • the second surface 12 of 10 is connected to absorb heat in the heat conducting plate 30, thereby transferring the heat conducting plate 30 and the PCB
  • the heat in 10 is sufficiently transferred to the air (see the direction of the arrow of heat transfer in Figure 4).
  • the floating portion 42 is connected to the first contact portion 41 to form an L-shaped shape, and the floating portion 42 and the first contact portion 41 further form a receiving groove 43 for accommodating the power amplifier 20.
  • FIG. 5 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • the first contact portion 41 in this embodiment is connected to the first exposed portion 31 to conduct heat dissipation from the heat absorbed by the heat conducting plate 30.
  • FIG. 6 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention.
  • the heat sink 40 in this embodiment further has a second contact portion 44, and the second contact portion 44 is connected to the floating portion 42 to form a U-shaped shape with the first contact portion 41.
  • the second contact portion 44 can be associated with the PCB
  • the second surface 12 of the 10 is joined. Of course, it can also be inserted into the second surface 12 of the PCB 10 to be placed on the PCB.
  • the inner heat conducting plate 30 of 10 is connected.
  • the first contact portion 41, the second contact portion 44, and the suspended portion 42 may be separate components and then connected, or may be integrally formed.
  • the heat conducting plate 30 also has a partial exposed PCB A second exposed portion 32 of the second surface 12 of the 10, the second exposed portion 32 is coupled to the second contact portion 44.
  • the accommodating slots 43 are two, and the intervals are formed in the heat sink.
  • the number of accommodation slots is three.
  • the number of the accommodating slots 43 is (n-1)/2, where n is the number of power amplifiers and is an odd number greater than or equal to 3, and n-1 is symmetrically disposed on the PCB.
  • the number of power amplifiers 20 on the 10, and 1 is the number of power amplifiers separately provided on the first surface 11 of the PCB 10.
  • the surface of the 10 may be made of a metal material such as copper foil
  • the heat conducting plate 30 may be made of a metal material such as copper
  • the heat dissipating member 40 may be made of a material such as metal, alumina heat conductive ceramic or silica gel.
  • the present invention also provides a mobile terminal comprising the power amplifier heat dissipation assembly 1 described above.
  • the present invention also provides a heat dissipating device heat dissipating device comprising the above-described power dissipating heat dissipating component 1.
  • the heat dissipating device heat dissipating device, the mobile terminal and the power dissipating heat dissipating component 1 of the invention have a plurality of power amplifiers 20 concentratedly arranged on the PCB 10 board, PCB
  • the heat conducting plate 30 is disposed in the 10 to absorb heat to dissipate the plurality of power amplifiers 20, the structure is simple, the heat dissipation effect is good, the density of the PCB 10 is increased, the size of the PCB 10 is reduced, and the product is miniaturized.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Amplifiers (AREA)

Abstract

L'invention concerne un dispositif de dissipation de chaleur d'un dispositif de chauffage, un terminal mobile et un ensemble de rayonnement thermique d' un amplificateur de puissance (1), l'ensemble de rayonnement thermique de l' amplificateur (1) comportant une carte de circuit imprimé (10), une pluralité d'amplificateurs de puissance (20) et une plaque thermoconductrice (30), la pluralité d'amplificateurs de puissance (20) étant répartis sur une première surface (11) et une deuxième surface (12) de la carte de circuit imprimé (10) ; la plaque thermoconductrice (30) est disposée sur la carte de circuit imprimé (10) à des fins d'absorption de la chaleur, ce qui permet de dissiper la chaleur vers la pluralité d'amplificateurs de puissance (20). La pluralité d'amplificateurs de puissance ont une disposition centralisée, et ont une structure simple et un bon effet de dissipation thermique, ceci permettant d'améliorer la densité de la carte de circuit imprimé et de réduire une taille de la carte de circuit imprimé et de supporter une miniaturisation du produit.
PCT/CN2015/099145 2015-11-11 2015-12-28 Dissipateur de chaleur d'un dispositif de chauffage, d'un terminal mobile et d'un ensemble de rayonnement thermique d'un<b> </b>amplificateur de puissance WO2017080069A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520900753 2015-11-11
CN201520900753.8 2015-11-11

Publications (1)

Publication Number Publication Date
WO2017080069A1 true WO2017080069A1 (fr) 2017-05-18

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PCT/CN2015/099145 WO2017080069A1 (fr) 2015-11-11 2015-12-28 Dissipateur de chaleur d'un dispositif de chauffage, d'un terminal mobile et d'un ensemble de rayonnement thermique d'un<b> </b>amplificateur de puissance

Country Status (2)

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CN (1) CN205378459U (fr)
WO (1) WO2017080069A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107249283A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN107249285A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN107249284A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN111836519A (zh) * 2020-07-07 2020-10-27 广州程星通信科技有限公司 用于功率器件的散热装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1791133A (zh) * 2004-12-15 2006-06-21 日本电气株式会社 移动终端设备和用于从其辐射热的方法
US20080087456A1 (en) * 2006-10-13 2008-04-17 Onscreen Technologies, Inc. Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor
CN202839585U (zh) * 2012-08-21 2013-03-27 昆山美博通讯科技有限公司 功率放大模组的散热结构
CN103781273A (zh) * 2012-10-19 2014-05-07 深南电路有限公司 嵌入式金属基pcb板及其加工方法
CN203618217U (zh) * 2013-11-26 2014-05-28 广州兴森快捷电路科技有限公司 散热印制线路板及电路板
US20150108630A1 (en) * 2013-10-22 2015-04-23 Fujitsu Limited Electronic device, electronic apparatus, and method for manufacturing electronic device
US20150261265A1 (en) * 2014-03-14 2015-09-17 Sandisk Enterprise Ip Llc Self-Supporting Thermal Tube Structure for Electronic Assemblies

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1791133A (zh) * 2004-12-15 2006-06-21 日本电气株式会社 移动终端设备和用于从其辐射热的方法
US20080087456A1 (en) * 2006-10-13 2008-04-17 Onscreen Technologies, Inc. Circuit board assemblies with combined fluid-containing heatspreader-ground plane and methods therefor
CN202839585U (zh) * 2012-08-21 2013-03-27 昆山美博通讯科技有限公司 功率放大模组的散热结构
CN103781273A (zh) * 2012-10-19 2014-05-07 深南电路有限公司 嵌入式金属基pcb板及其加工方法
US20150108630A1 (en) * 2013-10-22 2015-04-23 Fujitsu Limited Electronic device, electronic apparatus, and method for manufacturing electronic device
CN203618217U (zh) * 2013-11-26 2014-05-28 广州兴森快捷电路科技有限公司 散热印制线路板及电路板
US20150261265A1 (en) * 2014-03-14 2015-09-17 Sandisk Enterprise Ip Llc Self-Supporting Thermal Tube Structure for Electronic Assemblies

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107249283A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN107249285A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN107249284A (zh) * 2017-07-12 2017-10-13 普联技术有限公司 一种移动终端
CN111836519A (zh) * 2020-07-07 2020-10-27 广州程星通信科技有限公司 用于功率器件的散热装置

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Publication number Publication date
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