WO2017080069A1 - Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier - Google Patents

Abstract

A heat dissipation device of a heating device, mobile terminal and heat radiation assembly of a power amplifier (1), the heat radiation assembly of the power amplifier (1) comprising a PCB (10), a plurality of power amplifiers (20) and a heat-conducting plate (30), the plurality of power amplifiers (20) being distributed on a first surface (11) and a second surface (12) of the PCB (10); the heat-conducting plate (30) is disposed on the PCB (10) to absorb heat, thereby dissipating heat to the plurality of power amplifiers (20). The plurality of power amplifiers have a centralized layout, and have a simple structure and a good heat dissipation effect, improving PCB density and reducing a size of the PCB and supporting product miniaturization.

Description

Heat sink heat sink, mobile terminal and power amplifier heat sink

[Technical Field]

The present invention relates to the field of heat dissipating devices, and in particular, to a power dissipating heat dissipating component and a heat dissipating device and a mobile terminal using the same.

 【Background technique】

A new generation of professional communication products requires wide and narrow band fusion, and requires a wide frequency range. Therefore, multi-band multi-amplifiers need to coexist in product design. In addition, due to the trend of miniaturization and thinning of the terminal products, the size of the terminal products is continuously reduced and can be used for PCB (Printed Circuit Board (printed circuit board) layout space is also constantly compressed, resulting in the miniaturization of the device, high-density layout has become the design necessity.

Generally, for a power amplifier type device, a single-sided layout is generally adopted, and a separate heat dissipation space is required due to a large amount of heat generation. When designing a new generation of professional communication products, multiple power amplifier devices need to be designed in the PCB. In order to save layout space, the power amplifier device needs to realize double-sided layout on the PCB, which further aggravates the heat dissipation of the power amplifier and becomes the product design. The bottleneck of the product seriously affects the heat dissipation reliability of the product.

 [Summary of the Invention]

The invention provides a heat dissipating device for a heat generating device, a mobile terminal and a power dissipating heat dissipating component, so as to solve the problem that the power amplifier device in the prior art realizes the double-sided affixing layout on the PCB, further aggravating the heat dissipating difficulty of the power amplifier and becomes a malicious bottleneck of product design. A technical problem that seriously affects the thermal reliability of the product.

In order to solve the above technical problem, a technical solution adopted by the present invention is to provide a mobile terminal, including a power amplifier heat dissipating component, the power amplifier heat dissipating component includes: a PCB, a plurality of power amplifiers, and a heat conducting board, and a part of the plurality of power amplifiers are symmetrically disposed. The first surface and the second surface of the PCB are separately disposed on the first surface of the PCB; the heat conducting plate is disposed in the PCB to absorb heat to dissipate the plurality of power amplifiers; the heat conducting board is integrally embedded in the PCB Inside the PCB, or the thermally conductive plate has a first exposed portion that partially exposes the second surface.

The power amplifier heat dissipating assembly further includes a heat dissipating member connected to the surface of the PCB or connected to the first exposed portion to derive and dissipate heat absorbed by the heat conducting plate.

The heat dissipating member has a first contact portion and a floating portion, and the first contact portion is connected to the first exposed portion; the floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for receiving the power amplifier.

The heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion.

The second contact portion is connected to the surface of the PCB.

Wherein, the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is connected to the second contact portion.

Among them, the power amplifier is at least three.

In order to solve the above technical problem, a technical solution adopted by the present invention is to provide a power amplifier heat dissipation assembly including a PCB, a plurality of power amplifiers, and a heat conduction plate, wherein a plurality of power amplifiers are distributed on the first surface and the second surface of the PCB; A board is disposed on the PCB to absorb heat to dissipate the plurality of power amplifiers.

Wherein, the heat conducting plate is entirely embedded inside the PCB, or the heat conducting plate has a first exposed portion partially exposing the second surface.

The power amplifier heat dissipating assembly further includes a heat dissipating member connected to the surface of the PCB or connected to the first exposed portion to derive and dissipate heat absorbed by the heat conducting plate.

The heat dissipating member has a first contact portion and a floating portion, and the first contact portion is connected to the first exposed portion; the floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for receiving the power amplifier.

The heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion.

The second contact portion is connected to the surface of the PCB.

Wherein, the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is connected to the second contact portion.

Among them, the power amplifier is at least two.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a heat dissipating device heat dissipating device, which comprises the above-mentioned power amplifier heat dissipating component.

The utility model has the beneficial effects that the heat-dissipating device heat-dissipating device, the mobile terminal and the power-dissipating heat-dissipating component of the heat-dissipating device of the present invention have a plurality of power amplifiers disposed on the PCB board in a concentrated manner, and the heat-dissipating board is disposed in the PCB to absorb the difference. The heat thus dissipates the plurality of power amplifiers, the structure is simple, the heat dissipation effect is good, the density of the PCB is increased, the PCB size is reduced, and the product is miniaturized.

 [Description of the Drawings]

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings may be obtained according to these drawings without any creative work, wherein:

1 is a schematic block diagram showing the structure of a power amplifier heat dissipation assembly according to a preferred embodiment of the present invention;

1a is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention;

2 is a schematic structural diagram of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention;

3 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention;

4 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention;

FIG. 5 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention; FIG.

Figure 6 is a schematic block diagram showing the structure of a power amplifier heat dissipating assembly in accordance with another preferred embodiment of the present invention.

【detailed description】

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

The invention will now be described in detail in conjunction with the drawings and embodiments.

Referring to FIG. 1 and FIG. 1a, FIG. 1 is a schematic structural diagram of a power amplifier heat dissipating assembly according to a preferred embodiment of the present invention, and FIG. 1a is a schematic structural diagram of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention. A power amplifier heat dissipation assembly 1 of the present invention includes a PCB 10. A plurality of power amplifiers 20 and a heat conducting plate 30.

The power amplifier 20 of the present invention has opposite first and second surfaces 11 and 12, and a plurality of power amplifiers 20 are distributed on the PCB. The first surface 11 and the second surface 12 of 10. Specifically, as shown in FIG. 1 , at least one pair of power amplifiers 20 of the plurality of power amplifiers 20 may be symmetrically disposed on the PCB. The first surface 11 and the second surface 12 of 10, that is, may also be 2 pairs, 3 pairs, ... n (positive integer), the power amplifier 20 is symmetrically disposed on the PCB The first surface 11 and the second surface 12 of 10. As shown in FIG. 1a, two power amplifiers 20 respectively disposed on the first surface 11 and the second surface 12 of the PCB 10 are on the PCB. The projections on the 10 may also be partially coincident. Of course, the projections of the two power amplifiers 20 respectively disposed on the first surface 11 and the second surface 12 of the PCB 10 on the PCB 10 may also be offset from each other.

For example, as shown in FIG. 1 , when the power amplifier 20 is two, the first power amplifier 21 is disposed on the PCB. The intermediate position of the first surface 11 of the 10, the second power amplifier 22 is disposed at an intermediate position of the second surface 12 of the PCB 10, and the first power amplifier 21 is symmetrically disposed with the second power amplifier 22, and the layout can be greatly reduced by using the layout. PCB The size of 10 is good for product miniaturization. As shown by the arrow in FIG. 1, the heat conducting plate 30 absorbs the heat generated by the first power amplifier 21 and the second power amplifier 22 to dissipate heat from the first power amplifier 21 and the second power amplifier 22.

Referring to FIG. 2, FIG. 2 is a schematic diagram showing the structure of a power amplifier heat dissipating component according to another preferred embodiment of the present invention. This embodiment is substantially the same as the above embodiment, except that the number and setting positions of the power amplifier 20 are different. In this embodiment, a part of the plurality of power amplifiers 20 are symmetrically disposed on the PCB. The first surface 11 and the second surface 12 of the 10 are either partially overlapped on the projected portion of the PCB 10 and the other portion is separately provided on the first surface 11 of the PCB 10.

As shown in FIG. 2, when the power amplifier 20 is three, the first power amplifier 21 is disposed on the first surface 11 of the PCB 10, and the second power amplifier 22 is disposed on the PCB. The second surface 12 of 10, and the first power amplifier 21 is symmetrically disposed with the second power amplifier 22, and the third power amplifier 23 is also disposed on the first surface 11, but on the PCB The second surface 12 of the 10 has no other power amplifier 20 symmetrical thereto, and the layout can greatly improve the heat dissipation effect of the power amplifier 20. Specifically, as shown by the direction of the heat conduction arrow of the power amplifier 20 of FIG. 1, the first power amplifier 21, The heat emitted by the two power amplifiers 22 and the third power amplifier 23 is conducted in the hot plate 30, due to the relative power of the third power amplifier 23 The second surface 12 of the 10 is not provided with the power amplifier 20, and the heat is low, so most of the heat received by the heat conducting plate 30 goes to the PCB of the powerless 20 The second surface 12 of 10 is delivered. Of course, the power amplifier 20 of the present invention may also be five, seven, nine or more, and the arrangement is the same as that of the three power amplifiers 20, that is, only one power amplifier 20 is on the PCB. There is no amp 20 symmetry on the second surface 12 of the 10, and the other power amplifiers 20 are symmetrically disposed on the PCB one by one. The first surface 11 and the second surface 12 of 10. Of course, in other embodiments, a part of the power amplifier 20 may be symmetrically disposed on the first surface 11 and the second surface 12, and then more than two power amplifiers 20 may be disposed on the PCB. The first surface 11 of 10 and the second surface 12 are not provided with a power amplifier 20 symmetrical thereto.

The heat conducting plate 30 of the present invention is disposed on the PCB The heat is absorbed by the power amplifier 20 by absorbing heat. Preferably, the heat conducting plate 30 in this embodiment is entirely embedded inside the PCB 10.

The heat dissipation pad of the power amplifier 20 of the present invention is located at the bottom, that is, a portion in contact with the surface of the PCB 10, for quickly moving to the PCB 10 and its heat conducting plate 30 transfer heat. The power amplifier 20 is a tube power amplifier 20, a transistor power amplifier 20 or an integrated circuit power amplifier 20, and may be another power amplifier 20 having an effect of amplifying a weak electrical signal from a signal source to drive a sound of the speaker, as long as the power amplifier 20 can achieve the effect. Yes, there is no limit here.

Please refer to FIG. 3 together. FIG. 3 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention. The heat conducting plate 30 may also not need to be integrally embedded in the PCB 10, as shown in FIG. 2, the heat conducting plate 30 has a first exposed portion 31 partially exposing the second surface 12, so that the heat absorbed by the heat conducting plate 30 can be quickly conducted to the air by the first exposed portion 31, further Improve the heat capacity of the power amplifier cooling unit 1.

The first exposed portion 31 is formed at one end of the heat conducting plate 30. In other embodiments, it may be formed at both ends of the heat conducting plate 30 or at the outer edge of the heat conducting plate 30. The first exposed portion 31 in this embodiment may be associated with a PCB The second surface 12 of the 10 is flush, and may also form a recess with the second surface 12 of the PCB 10, and may also protrude from the PCB. The second surface 12 of the 10 can increase the heat capacity of the power amplifier heat dissipating component 1 by bringing the first exposed portion 31 into contact with the air.

Please refer to FIG. 4 together. FIG. 4 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention. The power amplifier heat dissipation assembly 1 in this embodiment further includes a heat sink 40, the heat sink 40 and the PCB 10 surface connections.

Specifically, the heat sink 40 in this embodiment has a first contact portion 41 and a floating portion 42, the first contact portion 41 and the PCB The second surface 12 of 10 is connected to absorb heat in the heat conducting plate 30, thereby transferring the heat conducting plate 30 and the PCB The heat in 10 is sufficiently transferred to the air (see the direction of the arrow of heat transfer in Figure 4). The floating portion 42 is connected to the first contact portion 41 to form an L-shaped shape, and the floating portion 42 and the first contact portion 41 further form a receiving groove 43 for accommodating the power amplifier 20.

Further, please refer to FIG. 5 together. FIG. 5 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention. The first contact portion 41 in this embodiment is connected to the first exposed portion 31 to conduct heat dissipation from the heat absorbed by the heat conducting plate 30.

Further, please refer to FIG. 6 together. FIG. 6 is a schematic diagram showing the structure of a power amplifier heat dissipating assembly according to another preferred embodiment of the present invention. The heat sink 40 in this embodiment further has a second contact portion 44, and the second contact portion 44 is connected to the floating portion 42 to form a U-shaped shape with the first contact portion 41. The second contact portion 44 can be associated with the PCB The second surface 12 of the 10 is joined. Of course, it can also be inserted into the second surface 12 of the PCB 10 to be placed on the PCB. The inner heat conducting plate 30 of 10 is connected. The first contact portion 41, the second contact portion 44, and the suspended portion 42 may be separate components and then connected, or may be integrally formed.

Further, the heat conducting plate 30 also has a partial exposed PCB A second exposed portion 32 of the second surface 12 of the 10, the second exposed portion 32 is coupled to the second contact portion 44.

It is to be noted that only three power amplifiers and one accommodating slot 43 are shown in FIG. 6. In other embodiments, when the power amplifier 20 is five, the accommodating slots 43 are two, and the intervals are formed in the heat sink. When the power amplifier 20 is seven, the number of accommodation slots is three. In other words, the number of the accommodating slots 43 is (n-1)/2, where n is the number of power amplifiers and is an odd number greater than or equal to 3, and n-1 is symmetrically disposed on the PCB. The number of power amplifiers 20 on the 10, and 1 is the number of power amplifiers separately provided on the first surface 11 of the PCB 10.

PCB of the invention The surface of the 10 may be made of a metal material such as copper foil, the heat conducting plate 30 may be made of a metal material such as copper, and the heat dissipating member 40 may be made of a material such as metal, alumina heat conductive ceramic or silica gel.

The present invention also provides a mobile terminal comprising the power amplifier heat dissipation assembly 1 described above.

The present invention also provides a heat dissipating device heat dissipating device comprising the above-described power dissipating heat dissipating component 1.

The heat dissipating device heat dissipating device, the mobile terminal and the power dissipating heat dissipating component 1 of the invention have a plurality of power amplifiers 20 concentratedly arranged on the PCB 10 board, PCB The heat conducting plate 30 is disposed in the 10 to absorb heat to dissipate the plurality of power amplifiers 20, the structure is simple, the heat dissipation effect is good, the density of the PCB 10 is increased, the size of the PCB 10 is reduced, and the product is miniaturized.

It should be noted that, in the embodiment of the present invention, if the terms "first", "second", "upper", "lower", "left", "right" are mentioned, they are only used as needed. In practice, it is not limited to this, and the text symbols can be used interchangeably.

The above are only the embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the description of the present invention and the drawings are directly or indirectly applied to other related technical fields. The same is included in the scope of patent protection of the present invention.

Claims (17)

1. A mobile terminal includes a power amplifier heat dissipating component, wherein the power amplifier heat dissipating component comprises:

   PCB;

   a plurality of power amplifiers, a part of the plurality of power amplifiers are symmetrically disposed on the first surface and the second surface of the PCB, and another portion is separately disposed on the first surface of the PCB;

   a heat conducting plate disposed in the PCB to absorb heat to dissipate the plurality of power amplifiers; the heat conducting plate is integrally embedded in the PCB, or the heat conducting plate has a first portion partially exposing the second surface Exposed part.
2. The power amplifier heat dissipating assembly according to claim 1, wherein the power amplifier heat dissipating assembly further comprises a heat dissipating member connected to the PCB surface or connected to the first exposed portion to the heat conducting plate The absorbed heat is extracted and dissipated.
3. The power amplifier heat dissipation assembly according to claim 2, wherein the heat sink has:

   a first contact portion connected to the first exposed portion;

   The floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for accommodating the power amplifier.
4. The power amplifier heat dissipation assembly according to claim 3, wherein the heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion .
5. The power amplifier heat dissipation assembly according to claim 4, wherein the second contact portion is connected to the surface of the PCB.
6. The power amplifier heat dissipation assembly according to claim 4, wherein the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is coupled to the second contact portion.
7. The power amplifier heat dissipation assembly according to claim 1, wherein the power amplifier has at least three power amplifiers.
8. A power amplifier heat dissipating component, comprising:

   PCB;

   a plurality of power amplifiers, the plurality of power amplifiers are distributed on the first surface and the second surface of the PCB;

   A heat conducting plate is disposed in the PCB to absorb heat to dissipate heat from the plurality of power amplifiers.
9. The power amplifier heat dissipating assembly according to claim 8, wherein the heat conducting plate is entirely embedded inside the PCB, or the heat conducting plate has a first exposed portion partially exposing the second surface.
10. The power amplifier heat dissipation assembly according to claim 9, wherein the power amplifier heat dissipation assembly further comprises a heat dissipation member connected to the PCB surface or connected to the first exposed portion to the heat conduction plate The absorbed heat is extracted and dissipated.
11. The power amplifier heat dissipation assembly according to claim 10, wherein the heat sink has:

    a first contact portion connected to the first exposed portion;

    The floating portion is connected to the first contact portion in an L shape, and forms a receiving groove for accommodating the power amplifier.
12. The power amplifier heat dissipation assembly according to claim 11, wherein the heat sink further has a second contact portion, and the second contact portion is connected to the floating portion to form a U-shaped shape with the first contact portion. .
13. A power amplifier heat dissipating assembly according to claim 12, wherein said second contact portion is connected to said PCB surface.
14. The power amplifier heat dissipating assembly according to claim 12, wherein the heat conducting plate further has a second exposed portion partially exposing the second surface, and the second exposed portion is coupled to the second contact portion.
15. The power amplifier heat dissipation assembly according to claim 8, wherein the power amplifier has at least two power amplifiers.
16. A mobile terminal, characterized in that the heat dissipation mobile terminal comprises the power amplifier heat dissipation assembly according to any one of claims 8-15.
17. A heat dissipating device for a heat generating device, characterized in that the heat dissipating device of the heat generating device comprises the power dissipating heat dissipating assembly of claim 14.