CN111836519A - Heat sink for power device - Google Patents
Heat sink for power device Download PDFInfo
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- CN111836519A CN111836519A CN202010646922.5A CN202010646922A CN111836519A CN 111836519 A CN111836519 A CN 111836519A CN 202010646922 A CN202010646922 A CN 202010646922A CN 111836519 A CN111836519 A CN 111836519A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 83
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat dissipation device for a power device. The heat dissipation device comprises a first heat conduction element and a first heat dissipation element. The first heat conducting element is in an open U-shaped shape, the first heat conducting element is provided with a first heat conducting portion, a second heat conducting portion and a third heat conducting portion, the first heat conducting portion and the second heat conducting portion are arranged in opposite directions, the first heat conducting portion and the second heat conducting portion are connected through the third heat conducting portion, and one side, away from the opening, of the third heat conducting portion is used for placing the power device; the first heat dissipation element is located below the first heat conduction element, and the power device is placed above the first heat dissipation element. The heat dissipation device can conduct and dissipate heat in more directions, so that the heat dissipation effect is improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device for a power device.
Background
At present, the requirement for the output power of electronic components (especially power amplifiers) is higher and higher, and along with the higher and higher energy consumption and heating condition of the electronic components, the heat dissipation problem becomes a difficulty in the corresponding field.
The known heat dissipation device adopts a liquid cooling technology to solve the heat dissipation problem, and a liquid cooling system generally comprises a water cooling plate, a circulating liquid, a water pump, a circulating pipeline and a heat exchange device. The liquid cooling system has many components, so that the application occasions of the liquid cooling system are limited, such as the occasions of an onboard vehicle or a vehicle and the like are not suitable for using the liquid cooling system. Furthermore, the liquid cooling system contains many components, and once one of the components fails, the whole system cannot be used.
In order to solve the above problem, patent document CN106879230A proposes a heat dissipation system for a three-dimensional power amplifier, which includes two C-shaped heat sinks symmetrically arranged left and right and surrounding the periphery of the three-dimensional power amplifier, wherein a plurality of first heat pipes are embedded in the outer surface of the C-shaped heat sinks. By means of the heat dissipation system, the heat of the three-dimensional power amplifier is conducted to the bottom of the C-shaped heat sink through the first heat pipe along the outer surface of the cylinder of the three-dimensional power amplifier, and the heat at the bottom of the C-shaped heat sink is dissipated through the heat dissipation plane. However, the effect of the heat dissipation system to dissipate heat still needs to be further improved.
Disclosure of Invention
The main object of the present invention is to provide a heat dissipating device for a power device, which improves heat dissipation.
Embodiments of the present invention provide a heat dissipation apparatus for a power device. The heat dissipating device includes:
the first heat conducting element is in a U-shaped shape with an opening, the first heat conducting element is provided with a first heat conducting portion, a second heat conducting portion and a third heat conducting portion, the first heat conducting portion and the second heat conducting portion are arranged in opposite directions, the first heat conducting portion and the second heat conducting portion are connected through the third heat conducting portion, and one side, away from the opening, of the third heat conducting portion is used for placing the power device; and
the first heat dissipation element is positioned below the first heat conduction element, and the power device is placed above the first heat dissipation element.
The heat dissipation element is positioned below the power device, so that heat can be conducted and dissipated downwards. On this basis, the first heat conducting element is placed on one side of the power device in the left-right direction or the front-back direction, so that heat can be conducted also in one of the left-right direction or the front-back direction. Therefore, the heat of the power device can be dissipated not only in the downward direction but also in one direction perpendicular to the downward direction, and the heat dissipation effect is improved.
In some embodiments, the number of the first heat-conducting elements is two, and the openings of the two first heat-conducting elements face away from each other.
The two first heat conducting elements are arranged away from each other, and the heat of the power device can be released and diffused outwards at least in opposite directions, so that the heat dissipation effect is further improved.
In some embodiments, the heat dissipation device further includes a second heat conduction element, the second heat conduction element has an open U shape, and the openings of the second heat conduction element and the first heat conduction element are away from each other.
In the case that the power device has a non-hexahedral structure such as a cylindrical shape, heat is conducted from the outer surface of the non-hexahedral structure such as a cylindrical shape to the first heat dissipating element and the first heat conducting element through the U-shaped second heat conducting element, whereby heat can be dissipated on two planes perpendicular to each other. The radiating area is increased, and thus the radiating effect is improved.
In some embodiments, the number of the second heat-conducting elements is two, and the two second heat-conducting elements are arranged to face each other in a left-right direction or a front-rear direction.
The two second heat conducting elements are arranged oppositely, and the heat of the power device can be conducted outwards at least along the opposite direction, so that the heat dissipation effect is further improved.
In some embodiments, the number of the first heat dissipation elements is two, and two first heat dissipation elements are arranged in the up-down direction, and the power device is placed between the two first heat dissipation elements.
The two first heat dissipation elements are arranged in the vertical direction, and the heat of the power device can be dissipated in the vertical direction, so that the heat dissipation effect is further improved.
In some embodiments, the heat dissipation device further comprises a first fan assembly, an impeller of the first fan assembly facing the first heat dissipation element.
The air-cooled heat dissipation device can be used in more occasions (including onboard or vehicle-mounted occasions). The use of liquid cooling for heat dissipation is limited to some occasions.
In some embodiments, the first heat conducting element is made of copper or aluminum, and a heat pipe is further disposed on a surface of the first heat conducting element.
The heat pipe has the function of transferring heat of the concentrated heating area of the power device to more areas of the first heat conducting element, so that the first heat radiating element and the second heat radiating element can radiate heat conveniently.
In some embodiments, the first heat conducting element is made of a temperature-uniforming plate. As mentioned above, the vapor chamber has better heat diffusion effect.
In some embodiments, the third heat conduction portion is provided with a first connection hole for fixed connection.
The third heat conducting part is provided with a first connecting hole, so that the whole heat dissipation device is convenient to assemble and disassemble.
In some embodiments, the first heat conducting element has a fourth heat conducting portion, a fifth heat conducting portion and a sixth heat conducting portion, the fourth heat conducting portion and the fifth heat conducting portion are arranged in an opposite direction, the fourth heat conducting portion and the fifth heat conducting portion are connected through the sixth heat conducting portion, and the sixth heat conducting portion is provided with a second connecting hole, and the second connecting hole is aligned with the first connecting hole.
Through setting up two connecting holes that align each other in sixth heat conduction portion and third heat conduction portion, be convenient for with first heat conduction component and second heat conduction component fixed connection, the dismouting is also more convenient.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for a power device according to some embodiments of the present invention.
FIG. 2 is a schematic structural diagram of a second heat-conducting element shown in FIG. 1;
fig. 3 is a schematic structural diagram of a heat dissipation apparatus for a power device according to another embodiment of the present invention.
In the figure, 10-heat sink; 100-a first heat conducting element, 110-a first heat conducting part, 120-a second heat conducting part, 130-a third heat conducting part, 131-a first connection hole; 200-a first heat dissipating element; 300-a second heat dissipating element; 400-a first fan assembly; 500-a second fan assembly; 600-a second heat conducting element, 640-a fourth heat conducting portion, 650-a fifth heat conducting portion, 660-a sixth heat conducting portion; 20-power amplifier.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", and "left", "right", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, and may be, for example, a fixed connection and a movable connection, a detachable connection and a non-detachable connection, or an integral connection; may be mechanically or electrically connected or may be in communication with each other. And "fixedly connected" includes detachably connected, non-detachably connected, integrally connected, and the like.
The use of terms like "first" or "second" in this disclosure are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance or implicit to the technical feature indicated.
The technical solutions between the embodiments of the present invention can be combined with each other, but must be based on the realization of those skilled in the art. Where combinations of features are mutually inconsistent or impractical, such combinations should not be considered as being absent and not within the scope of the present invention as claimed.
It should be noted that although the following description takes a power amplifier as an example, the heat dissipation device in the present application is not limited to be applied only to the power amplifier, and the heat dissipation device in the embodiment of the present application can be applied to heat dissipation of other power devices as well.
The following text will describe the heat dissipation device in some embodiments with reference to the drawings of the specification.
As shown in fig. 1 and 3, an embodiment of the present invention provides a heat dissipation device 10 for a power amplifier 20. The heat dissipation device 10 includes a first heat conducting element 100 and a first heat dissipation element 200.
The first heat conducting element 100 is in a U shape with an opening, the first heat conducting element 100 has a first heat conducting portion 110, a second heat conducting portion 120 and a third heat conducting portion 130, the first heat conducting portion 110 and the second heat conducting portion 120 are arranged in opposite directions, the first heat conducting portion 110 and the second heat conducting portion 120 are connected through the third heat conducting portion 130, and a side of the third heat conducting portion 130 away from the opening is used for placing the power device 20.
Specifically, as shown in fig. 1 and 3, the first heat conduction portion 110 and the second heat conduction portion 120 extend along a horizontal surface, and the third heat conduction portion 130 extends along a vertical plane. The third heat transfer part 130 connects both the first heat transfer part 110 and the second heat transfer part 120.
The first heat dissipation element 200 is located below the first heat conduction element 100, and the power device 20 is placed above the first heat dissipation element 200. The first heat dissipation member 200 is disposed below the power device 20.
Specifically, the first heat dissipation element 200 is a finned heat sink. The finned radiator is provided with fins on the base pipe to realize the purpose of heat transfer enhancement. The base pipe can be made of steel pipe, stainless steel pipe, copper pipe, etc. The fins can be made of steel belts, stainless steel belts, copper belts or aluminum belts.
The first heat conduction part 110 is used to transfer heat to the first heat dissipation member 200, and the second heat conduction part 120 is used to transfer heat to the second heat dissipation member 300. It is understood that the first heat dissipation element 200 may be in direct contact with the first heat conduction portion 110, or may be in indirect contact with the first heat conduction portion; similarly, the second heat dissipation element 300 also includes both direct contact and indirect contact with the second heat conduction portion 120.
The U-shaped first heat conducting element is used for converting heat distributed in space of the power amplifier with a small size into heat distributed on three surfaces of the first heat conducting part, the second heat conducting part, the third heat conducting part and the like, and the heat radiating element does not need to be arranged around the power amplifier. The heat dissipating element in this embodiment is provided corresponding to the first heat conduction portion, thereby facilitating the mounting arrangement of the heat dissipating element. Moreover, the arrangement also reduces the distribution area of the radiating elements, so that the whole radiating device is miniaturized, and the radiating device in the embodiment can be used in the occasions of onboard or vehicle-mounted and the like. The whole heat dissipation device has simple structure and less used parts, thereby having reliable work.
The heat dissipation element is positioned below the power device, so that heat can be conducted and dissipated downwards. On this basis, the first heat conducting element is placed on one side of the power device in the left-right direction or the front-back direction, so that heat can be conducted also in one of the left-right direction or the front-back direction. Therefore, the heat of the power device can be radiated downwards and can be conducted along a direction vertical to the downward direction, and the heat radiation effect is improved.
It is noted that the first heat conducting element is of an open U-shaped configuration, rather than a complete hexahedron. Therefore, compared with a complete hexahedron, the first heat conducting element can improve the heat dissipation effect and realize a certain weight reduction.
With reference to fig. 1 and fig. 3, in some embodiments, the number of the first heat conducting elements is two, and the openings of the two first heat conducting elements are away from each other. Specifically, two first heat conductive elements are symmetrically arranged in the left-right direction shown in fig. 1.
The two first heat conducting elements are arranged away from each other, and the heat of the power device can be released and diffused outwards at least in opposite directions, so that the heat dissipation effect is further improved.
In some embodiments, the heat dissipating device 10 further includes a second heat conducting element 600, the second heat conducting element 600 has a U shape with an opening, and the openings of the second heat conducting element 600 and the first heat conducting element 100 face away from each other.
It should be noted that the corresponding shape of the present embodiment is shown in fig. 1 and 2. The embodiment shown in fig. 3 does not have the second heat conducting element 600.
In the case where the power device has a non-hexahedral structure such as a cylindrical shape (as shown in fig. 1), heat is conducted from the outer surface of the non-hexahedral structure such as a cylindrical shape to the first heat dissipating element and the first heat conducting element through the U-shaped second heat conducting element, whereby heat can be dissipated in two planes perpendicular to each other. The radiating area is increased, and thus the radiating effect is improved. In case the power device itself is a regular hexahedron (as shown in fig. 3, the power device is in the shape of a rectangular parallelepiped), it is not necessary to provide the second heat conducting element.
Further, referring to fig. 1 and fig. 2, in some embodiments, the number of the second heat conducting elements 600 is two, and the two second heat conducting elements 600 are arranged oppositely in the left-right direction or the front-back direction. In the case that the power device has a non-hexahedral structure such as a cylindrical shape, the two second heat conducting elements are arranged in opposition to each other, and the heat of the power device can be conducted outward at least in the opposite directions, thereby further improving the heat dissipation effect.
Specifically, two second heat conducting elements 600 are symmetrically arranged in the left-right direction, and the shapes of the two second heat conducting elements 600 are the same; the shape of the two first heat-conducting elements 100 is also the same; the shape of the second heat-conducting element 600 is similar or identical to the shape of the first heat-conducting element 100. The two first heat conductive elements 100 are also symmetrically arranged in the left and right direction, and the two second heat conductive elements 600 are located between the two first heat conductive elements 100. The openings of the two second heat conducting elements 600 are disposed opposite to each other, and the second heat conducting elements 600 are disposed back to back with the adjacent first heat conducting elements 100 and are in contact with each other. The two second heat conducting elements 600 are symmetrically arranged, and at least four surfaces (e.g., four surfaces, such as a top surface, a bottom surface, a left side surface, and a right side surface) of the power amplifier 20 can be covered after being spliced, so that the heat of the power amplifier 20 can be conducted to the outside at least from the four surfaces of the power amplifier 20.
Referring to fig. 1 and fig. 3, in some embodiments, the number of the first heat dissipation elements 200 is two, and the two first heat dissipation elements 200 are arranged in the vertical direction, and the power device 20 is placed between the two first heat dissipation elements 200. Specifically, the two first heat dissipation elements 200 have the same structure, and are arranged symmetrically with respect to the center plane of the power device 20 in the up-down direction.
The two first heat dissipation elements are arranged in the vertical direction, and the heat of the power device can be dissipated in the vertical direction, so that the heat dissipation effect is further improved. The heat dissipation elements are arranged in the vertical direction, so that the heat dissipation elements are more convenient to mount and fix, and the whole heat dissipation device is also facilitated to be compact. It is to be understood that, according to need, the first heat conduction portion and the second heat conduction portion may be arranged to be opposed to each other in the left-right direction or in the front-rear direction.
In some embodiments, referring to fig. 1 and fig. 3, the heat dissipation device 10 further includes a first fan assembly 400, and an impeller of the first fan assembly 400 faces the first heat dissipation element 200.
Liquid cooling heat dissipation is only suitable for some occasions because of the need for numerous components and the high requirement for sealing. The air-cooled heat dissipation can be used in more occasions (including onboard or vehicle-mounted occasions). The fan assembly can take away heat at the radiating element as soon as possible.
Specifically, the number of the first fan assemblies 400 is two, and the two first fan assemblies 400 have the same structure and are arranged symmetrically with respect to the central plane of the power device 20 in the up-down direction.
In some embodiments, the heat dissipation device 10 further includes a third heat conducting element located between the first heat conducting portion 110 and the first heat dissipation element 200. Two opposite surfaces of the third heat conducting element are respectively in contact with the first heat conducting portion 110 and the first heat dissipating element 200. Further, the number of the third heat conducting elements is two, and the two third heat conducting elements are arranged symmetrically with respect to the central plane of the power device in the up-down direction.
The transition by providing an intermediate heat conducting element helps to transfer heat from the surroundings of the power amplifier to a larger area of space, thereby facilitating adequate heat dissipation.
In some embodiments, the first heat dissipating element 200 is provided with a wind tunnel plate at a side away from the first heat conducting element 100. Specifically, the lower part of the first heat dissipation element 200 located below the power device 20 is the side far away from the first heat conduction element 100, and an air duct plate is provided below the first heat dissipation element 200; the upper side of the first heat dissipation element 200 above the power device 20 is also the side away from the first heat conduction element 100, and a wind channel plate is also provided above the first heat dissipation element 200.
The air duct plate can prevent the air from the fan assembly from blowing to the area outside the heat radiating element, so that the air can be blown to the heat radiating element as much as possible. The air duct plate is used to make the wind blow to the first heat dissipation elements 200 below the air duct plate as much as possible, or to make the wind blow to the first heat dissipation elements 200 above the air duct plate as much as possible.
In some embodiments, the third heat conducting element is a vapor chamber.
The temperature equalizing plate can transfer heat as soon as possible and prevent the heat from being concentrated on a heat source, so the temperature equalizing plate is equivalent to a heat diffuser. Specifically, the inner wall surface of the temperature equalization plate is provided with a closed vacuum cavity with a microstructure. When the heat flow is conducted to the evaporation zone of the temperature-equalizing plate from the heat source, the liquid phase vaporization phenomenon is generated at a certain specific temperature of the working fluid in the cavity of the temperature-equalizing plate under the vacuum condition, so that the working fluid absorbs heat energy and is rapidly evaporated. The vapor phase will fill the entire cavity, and heat conduction on two-dimensional surfaces is realized by two modes of the flow of the capillary structure in liquid state and the latent heat in evaporation.
Compared with the one-dimensional linear heat conduction of the heat pipe, the heat in the temperature equalizing plate is conducted on a two-dimensional surface, so that the heat conduction efficiency is higher.
In some embodiments, the material of the first heat conducting element 100 is copper or aluminum, and a heat pipe is further disposed on the surface of the first heat conducting element 100. Copper or aluminum has excellent heat conductivity.
Compared with the traditional air cooling or water cooling, the heat conduction speed of the heat pipe has obvious advantages. The heat pipe can transfer the heat in the concentrated heating area of the power amplifier 20 to more areas of the first heat conducting element as soon as possible, so that the first heat radiating element can radiate heat conveniently.
In some embodiments, the first heat conducting element 100 is made of a temperature-uniforming plate. As mentioned above, the vapor chamber has better heat diffusion effect.
In some embodiments, referring to fig. 1 and fig. 3, the third heat conduction portion 130 is provided with a first connection hole 131 for fixed connection. The third heat conducting part is provided with a first connecting hole, so that the whole heat dissipation device is convenient to assemble and disassemble.
Specifically, the first connection holes 131 are screw holes, and the number of the screw holes of the first connection holes 131 is two or more. Under the condition that the number of the screw holes is more than three, the screw holes are distributed at equal intervals. It will be appreciated that other means of securing attachment may be used as desired.
In some embodiments, referring to fig. 3, the second heat conducting element 600 has a fourth heat conducting portion 640, a fifth heat conducting portion 650 and a sixth heat conducting portion 660, the fourth heat conducting portion 640 and the fifth heat conducting portion 650 are disposed opposite to each other, the fourth heat conducting portion 640 and the fifth heat conducting portion 650 are connected through the sixth heat conducting portion 660, and a second connecting hole (not shown) is disposed on the sixth heat conducting portion, and the second connecting hole is aligned with the first connecting hole 131.
Through setting up two connecting holes that align each other in sixth heat conduction portion and third heat conduction portion, be convenient for with first heat conduction component and second heat conduction component fixed connection, the dismouting is also more convenient. It is obvious that compared with the solution of patent document CN106879230A, the number of the fixed connecting elements of the present application is reduced, so that the heat sink can be assembled and disassembled more conveniently.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A heat sink for a power device, comprising:
the first heat conducting element is in a U-shaped shape with an opening, the first heat conducting element is provided with a first heat conducting portion, a second heat conducting portion and a third heat conducting portion, the first heat conducting portion and the second heat conducting portion are arranged in opposite directions, the first heat conducting portion and the second heat conducting portion are connected through the third heat conducting portion, and one side, away from the opening, of the third heat conducting portion is used for placing the power device; and
the first heat dissipation element is positioned below the first heat conduction element, and the power device is placed above the first heat dissipation element.
2. The heat dissipating device for power devices as claimed in claim 1, wherein the number of the first heat conducting elements is two, and the openings of the two first heat conducting elements are away from each other.
3. The heat dissipating device for a power device according to claim 1, further comprising a second heat conducting element having an open U-shape, wherein the openings of the second heat conducting element and the first heat conducting element are away from each other.
4. The heat dissipating device for power devices as claimed in claim 3, wherein the number of the second heat conducting elements is two, and the two second heat conducting elements are arranged to face each other in a left-right direction or a front-rear direction.
5. The heat dissipating device for power devices as claimed in claim 1, wherein the number of the first heat dissipating elements is two, and two of the first heat dissipating elements are arranged in an up-down direction between which the power devices are placed.
6. The heat dissipating device for power devices of claim 1, further comprising a first fan assembly having an impeller facing the first heat dissipating element.
7. The heat dissipation device for power devices as claimed in claim 1, wherein the first heat conducting element is made of copper or aluminum, and a heat pipe is further disposed on a surface of the first heat conducting element.
8. The heat dissipating device for power devices of claim 1, wherein the first heat conducting element is made of a temperature-uniforming plate.
9. The heat dissipating device for power devices as claimed in claim 3, wherein the third heat conducting part is provided with a first connection hole for fixed connection.
10. The heat dissipating device for a power device according to claim 9, wherein the second heat conducting element has a fourth heat conducting portion, a fifth heat conducting portion and a sixth heat conducting portion, the fourth heat conducting portion and the fifth heat conducting portion are disposed opposite to each other, the fourth heat conducting portion and the fifth heat conducting portion are connected through the sixth heat conducting portion, and a second connecting hole is formed in the sixth heat conducting portion, and the second connecting hole is aligned with the first connecting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010646922.5A CN111836519A (en) | 2020-07-07 | 2020-07-07 | Heat sink for power device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010646922.5A CN111836519A (en) | 2020-07-07 | 2020-07-07 | Heat sink for power device |
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| CN111836519A true CN111836519A (en) | 2020-10-27 |
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| CN202010646922.5A Pending CN111836519A (en) | 2020-07-07 | 2020-07-07 | Heat sink for power device |
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| CN101304648A (en) * | 2007-05-09 | 2008-11-12 | 富准精密工业(深圳)有限公司 | Radiating device |
| JP2012212708A (en) * | 2011-03-30 | 2012-11-01 | Tamura Seisakusho Co Ltd | Coil device |
| WO2017080069A1 (en) * | 2015-11-11 | 2017-05-18 | 海能达通信股份有限公司 | Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier |
| CN106879230A (en) * | 2017-03-02 | 2017-06-20 | 广州程星通信科技有限公司 | A kind of cooling system of three-dimensional power amplifier |
| CN207568698U (en) * | 2017-11-24 | 2018-07-03 | 安徽江淮汽车集团股份有限公司 | A kind of charge air cooler assembly |
| CN212344334U (en) * | 2020-07-07 | 2021-01-12 | 广州程星通信科技有限公司 | Heat sink for power device |
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2020
- 2020-07-07 CN CN202010646922.5A patent/CN111836519A/en active Pending
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| CN101304648A (en) * | 2007-05-09 | 2008-11-12 | 富准精密工业(深圳)有限公司 | Radiating device |
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| WO2017080069A1 (en) * | 2015-11-11 | 2017-05-18 | 海能达通信股份有限公司 | Heat dissipation device of heating device, mobile terminal and heat radiation assembly ofpower amplifier |
| CN106879230A (en) * | 2017-03-02 | 2017-06-20 | 广州程星通信科技有限公司 | A kind of cooling system of three-dimensional power amplifier |
| CN207568698U (en) * | 2017-11-24 | 2018-07-03 | 安徽江淮汽车集团股份有限公司 | A kind of charge air cooler assembly |
| CN212344334U (en) * | 2020-07-07 | 2021-01-12 | 广州程星通信科技有限公司 | Heat sink for power device |
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