CN219917147U

CN219917147U - Heat radiation structure and electronic device installation assembly

Info

Publication number: CN219917147U
Application number: CN202321288208.9U
Authority: CN
Inventors: 李思源; 罗羽钊; 孙盼盼
Original assignee: Midea Group Co Ltd; GD Midea Heating and Ventilating Equipment Co Ltd; Chongqing Midea General Refrigeration Equipment Co Ltd
Current assignee: Midea Group Co Ltd; GD Midea Heating and Ventilating Equipment Co Ltd; Chongqing Midea General Refrigeration Equipment Co Ltd
Priority date: 2023-05-24
Filing date: 2023-05-24
Publication date: 2023-10-27
Anticipated expiration: 2033-05-24

Abstract

The utility model discloses a heat dissipation structure and an electronic device mounting assembly, wherein the heat dissipation structure comprises: a heat radiation mounting member formed with a mounting surface for mounting an electronic device, and formed with a mounting groove open toward the mounting surface; and the cooling piece comprises a cooling pipe part which is arranged at the mounting groove and used for cooling the electronic device. According to the heat radiation structure, the open mounting groove is formed in the heat radiation mounting piece, and the mounting cooling pipe part is arranged in the mounting groove, so that heat generated by an electronic device can be quickly transferred to the cooling pipe part, and the cooling efficiency of the electronic device is improved.

Description

Heat radiation structure and electronic device installation assembly

Technical Field

The present utility model relates to the field of electronic device cooling technology, and in particular, to a heat dissipation structure and an electronic device mounting assembly having the same.

Background

The traditional micro-channel is that a flat tube is attached to the back of an aluminum plate, heat generated by an IGBT or a single tube is conducted to a heat dissipation flat tube through a thick aluminum plate, and the heat is taken away by a low-temperature refrigerant in the heat dissipation flat tube; one aluminum plate is added for heat transfer, so that the heat conduction efficiency is reduced, the requirement on the joint of the flat tube and the aluminum plate is higher, and there is room for improvement.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the heat dissipation structure which can better dissipate heat of the electronic device and improve the heat dissipation efficiency.

According to an embodiment of the present utility model, a heat dissipation structure includes: a heat radiation mounting member formed with a mounting surface for mounting an electronic device, and formed with a mounting groove open toward the mounting surface; and the cooling piece comprises a cooling pipe part which is arranged at the mounting groove and used for cooling the electronic device.

According to the heat radiation structure provided by the embodiment of the utility model, the open mounting groove is formed in the heat radiation mounting piece, and the mounting cooling pipe part is arranged in the mounting groove, so that heat generated by an electronic device can be quickly transferred to the cooling pipe part, and the cooling efficiency of the electronic device is improved.

According to the heat dissipation structure of some embodiments of the present utility model, the cooling element further includes a water inlet pipe portion and a water outlet pipe portion, the water inlet pipe portion and the water outlet pipe portion are respectively connected to two ends of the cooling pipe portion, and the water inlet pipe portion and the water outlet pipe portion are both located outside the installation groove.

According to the heat dissipation structure of some embodiments of the present utility model, the cooling pipe portions and the mounting grooves are all plural and mounted in one-to-one correspondence, and the plural cooling pipe portions are connected between the water inlet pipe portion and the water outlet pipe portion at intervals.

According to some embodiments of the utility model, the heat dissipation device is configured in a flat plate shape, and the mounting surface is configured in a flat plane, and the mounting surface is suitable for being attached to the electronic device.

According to the heat dissipation structure of some embodiments of the present utility model, the plurality of mounting grooves are arranged in parallel and spaced apart in the width direction of the heat dissipation mounting piece.

According to some embodiments of the utility model, the cooling tube portion includes an embedded portion and an external portion, the embedded portion is located in the mounting groove, the external portion is connected to the embedded portion and located outside the mounting groove, and the external portion is adapted to exchange heat with the electronic device.

According to some embodiments of the utility model, the external portion is formed with a bonding plane for connecting with the electronic device on a side facing away from the mounting groove, and the bonding plane is formed by extrusion after the cooling pipe portion is mounted in the mounting groove.

According to some embodiments of the utility model, a filling material is disposed between the cooling pipe portion and the inner wall of the mounting groove.

According to some embodiments of the utility model, the heat dissipating device is formed by extrusion.

The utility model also provides an electronic device mounting assembly, which comprises an electronic device and the heat dissipation structure of any embodiment, wherein the electronic device is detachably connected with the heat dissipation mounting piece.

The electronic device mounting assembly and the heat dissipation structure have the same advantages compared with the prior art, and are not described herein.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is an assembly diagram of a heat dissipating structure and an electronic device according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a heat dissipating structure according to an embodiment of the present utility model;

fig. 3 is an end view of a heat dissipation mount of a heat dissipation structure in accordance with an embodiment of the utility model.

Reference numerals:

the heat dissipation structure 100 is configured such that,

a heat radiation mounting member 1, a mounting groove 11, a cooling member 2, a water inlet pipe portion 21, a water outlet pipe portion 22, a cooling pipe portion 23,

an electronic device 200.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The following describes the heat dissipation structure 100 according to the embodiment of the present utility model with reference to fig. 1 to 3, where the heat dissipation structure 100 can achieve more direct cooling of the electronic device 200, which is beneficial to reduce heat loss, thereby improving the cooling efficiency of the heat dissipation structure 100 for the electronic device 200.

As shown in fig. 1 to 3, a heat dissipation structure 100 according to an embodiment of the present utility model includes: a heat sink mounting 1 and a cooling element 2.

The heat dissipation installation piece 1 is formed with a mounting surface, and the mounting surface is used for installing the electronic device 200, namely, when in actual installation, the electronic device 200 and the mounting surface of the heat dissipation installation piece 1 can be connected and fixed, so that the electronic device 200 and the heat dissipation installation piece 1 form an integral structure, and therefore, in the use process of the electronic device 200, the electronic device 200 is always connected with the heat dissipation structure 100, and the heat dissipation structure 100 is convenient for cooling and reducing the temperature of the electronic device 200. Wherein the electronic device 200 may be an IGBT or a single tube.

The heat dissipation device 1 is formed with a mounting groove 11 open toward a mounting surface, the cooling device 2 includes a cooling tube portion 23, the cooling tube portion 23 is mounted at the mounting groove 11 and is used for cooling the electronic device 200, that is, after the cooling tube portion 23 is mounted at the mounting groove 11, the cooling tube portion 23 can be exposed at a side of the heat dissipation device 1 facing the electronic device 200, so that the cooling tube portion 23 can be directly and rapidly absorbed, the distance between the cooling tube portion 23 and the electronic device 200 is reduced, and shielding between the two is reduced. The cooling tube portion 23 may be a copper tube, and has good thermal conductivity.

In other words, when the electronic device 200 is cooled by the heat dissipation structure 100, no thick plate is blocked between the cooling tube portion 23 and the electronic device 200, i.e. the heat generated by the electronic device 200 can be directly transferred to the peripheral wall of the cooling tube portion 23 without being blocked by a larger barrier in the heat transfer process, so that the intermediate heat transfer layer is effectively reduced, the cooling loss is reduced, and the heat dissipation efficiency is improved.

According to the heat dissipation structure 100 of the embodiment of the utility model, the open mounting groove 11 is arranged on the heat dissipation mounting piece 1, and the mounting cooling pipe part 23 is arranged in the mounting groove 11, so that heat generated by the electronic device 200 can be quickly transferred to the cooling pipe part 23, and the cooling efficiency of the electronic device 200 is improved.

In some embodiments, as shown in fig. 1 and 2, the cooling element 2 further includes a water inlet pipe portion 21 and a water outlet pipe portion 22, where the water inlet pipe portion 21 and the water outlet pipe portion 22 are respectively connected to two ends of the cooling pipe portion 23, so that an external water source can be introduced from the water inlet pipe and flow to the cooling pipe portion 23 to exchange heat with the electronic device 200 in the mounting groove 11, and then carry heat to be discharged from the water outlet pipe.

Wherein, inlet tube portion 21 and outlet pipe portion 22 all are located outside mounting groove 11, can make inlet tube portion 21 and outlet pipe portion 22 all be located outside the heat dissipation installed part 1, can not occupy the inner space of heat dissipation installed part 1 promptly, in other words, need not design and process solitary installation space for inlet tube portion 21 and outlet pipe portion 22, do benefit to the processing degree of difficulty that reduces heat dissipation installed part 1.

In some embodiments, the cooling pipe portions 23 and the mounting grooves 11 are each plural and mounted in one-to-one correspondence, and the plural cooling pipe portions 23 are connected between the water inlet pipe portion 21 and the water outlet pipe portion 22 at intervals. Thus, in actual mounting, the electronic device 200 can be mounted on the heat dissipation mounting member 1 so that the electronic device 200 can be simultaneously contacted with the plurality of cooling tube portions 23, thereby realizing the effect of the heat dissipation structure 100 on simultaneously cooling the electronic device 200 at a plurality of positions and improving the cooling efficiency; alternatively, the plurality of electronic devices 200 may be mounted on the heat dissipation structure 100 at the same time, so that the plurality of cooling pipe portions 23 cool the plurality of electronic devices 200 at the same time, and each electronic device 200 does not need to be provided with a separate heat dissipation structure 100, thereby reducing the number of the heat dissipation structures 100 and reducing the heat dissipation cost.

As shown in fig. 1 and 2, the number of cooling pipe portions 23 may be 6, and the 6 cooling pipe portions 23 are disposed in the 6 mounting grooves 11 of the heat dissipation device 1 at intervals, so that the heat dissipation structure 100 may cool the electronic device 200 at a plurality of positions, thereby improving cooling efficiency.

In some embodiments, the heat dissipation mounting member 1 is configured in a flat plate shape, and the mounting surface is configured in a flat plane, and the mounting surface is adapted to be attached to the electronic device 200, and as shown in fig. 1 and 2, the heat dissipation mounting member 1 is configured in a rectangular plate, so that the heat dissipation mounting member 1 has a larger surface area, and thus, more mounting grooves 11 can be designed for mounting the cooling tube portion 23, so that a larger area of cooling and temperature reduction of the electronic device 200 can be achieved.

In other words, the mounting groove 11 may be provided on the surface of the heat dissipation mounting member 1, and the cooling pipe portion 23 protrudes from the mounting groove 11 to contact and exchange heat with the electronic device 200 when the electronic device 200 is mounted on the heat dissipation mounting member 1, thereby securing cooling effectiveness.

In some embodiments, the plurality of mounting grooves 11 are provided, and the plurality of mounting grooves 11 are spaced apart in parallel in the width direction of the heat dissipation mounting member 1 so that the cooling tube portions 23 in the plurality of mounting grooves 11 are respectively cooled in contact with the electronic device 200.

It should be noted that, as shown in fig. 1, the electronic device 200 is configured as a block structure, and a plurality of electronic devices 200 are connected and distributed in a plate shape. In this way, after the plurality of electronic devices 200 are mounted on the heat dissipation mount 1, the shape of the plurality of electronic devices 200 is matched with the shape of the heat dissipation mount 1, so that the heat dissipation mount 1 can cool down the plurality of electronic devices 200 at the same time, thereby realizing maximized cooling.

And in actual arrangement, as shown in fig. 1 and 2, each cooling pipe portion 23 extends along the length direction of the heat dissipation installation member 1, meanwhile, the cooling pipe portions 23 are 6 and 6 cooling pipe portions 23 are distributed at intervals in parallel along the width direction of the heat dissipation installation member 1, so that the flow stroke of cooling liquid in the cooling pipe portions 23 is increased, the heat exchange amount is increased, the space of the heat dissipation installation member 1 in the width direction can be well utilized, the plurality of cooling pipe portions 23 are additionally arranged, the area of a heat exchange area is increased, and the heat exchange efficiency is improved.

In some embodiments, the cooling tube portion 23 includes an embedded portion that is located within the mounting groove 11 and an external portion that is connected to the embedded portion and located outside the mounting groove 11, the external portion being adapted to exchange heat with the electronic device 200. Thus, the embedded portion can realize the fixed connection of the cooling pipe portion 23 and the heat dissipation mounting member 1, and the external portion can realize the cooling and the temperature reduction of the electronic device 200.

In practical design, as shown in fig. 3, the mounting groove 11 may be configured to have a semicircular cross section, and the cooling tube portion 23 may be configured to have a circular shape before being mounted, so that half of the cooling tube portion 23 may be mounted in the mounting groove 11 as an embedded portion, and the other half may be located in the mounting groove 11 as an external portion, thereby ensuring mounting stability and achieving effective heat exchange with the electronic device 200.

In some embodiments, the external portion is formed with a bonding plane for connecting with the electronic device 200 on a side facing away from the mounting groove 11, and the bonding plane is formed by extrusion after the cooling tube portion 23 is mounted in the mounting groove 11, so that the cooling tube portion 23 can be in bonding contact with the electronic device 200, thereby increasing a connection area between the cooling tube portion 23 and the electronic device 200, improving a heat exchange surface of the cooling tube portion 23 and improving a cooling effect of the cooling tube portion 23 on the electronic device 200.

That is, after the cooling tube portion 23 is mounted in the mounting groove 11, the external portion protrudes from the board surface of the heat dissipation mounting member 1, and the external portion may be flattened by the mold to form a bonding plane on the external portion, so as to facilitate increasing the contact surface between the external portion and the electronic device 200.

In some embodiments, a filler material, such as a fillable resin, is provided between the cooling tube portion 23 and the inner wall of the mounting groove 11. Thus, after the resin is filled between the cooling pipe portion 23 and the heat radiation mount 1, the free space between the cooling pipe portion 23 and the heat radiation mount 1 can be reduced, so that the cooling pipe portion 23 and the heat radiation mount 1 are more compactly mounted and more stable.

Wherein, after the resin is injected into the cooling pipe portion 23 and the heat dissipation mounting member 1, the surface can be scraped flat after drying, which is advantageous for realizing the surface contact with the electronic device 200.

In some embodiments, the heat dissipation mounting piece 1 is formed by extrusion, and the heat dissipation mounting piece 1 is simple in processing mode, easy to form quickly, and suitable for mass production. In addition, during actual processing, the mounting groove 11 can be formed in the extrusion process of the heat radiation mounting piece 1, and a separate die is not required to be arranged for processing, so that the processing steps are greatly simplified, the surface process requirements are easily met, and the forming cost is reduced.

The utility model also provides an electronic device mounting assembly.

According to the electronic device mounting assembly of the embodiment of the utility model, the electronic device 200 and the heat dissipation structure 100 of any one of the embodiments described above are included, and the electronic device 200 is detachably connected to the heat dissipation mounting member 1, so that the cooling efficiency of the electronic device 200 is improved by providing the open mounting groove 11 on the heat dissipation mounting member 1 and providing the mounting cooling tube portion 23 in the mounting groove 11, thereby facilitating the rapid transfer of the heat generated by the electronic device 200 to the cooling tube portion 23.

Wherein, can set up a plurality of connecting holes on the heat dissipation installed part 1 to install electronic device 200 on heat dissipation installed part 1 through the structure such as the bolt of wearing to locate the connecting hole, realize the nimble dismantlement of electronic device 200, be convenient for later stage dismantlement and change.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation structure, comprising:

a heat radiation mounting member formed with a mounting surface for mounting an electronic device, and formed with a mounting groove open toward the mounting surface;

and the cooling piece comprises a cooling pipe part which is arranged at the mounting groove and used for cooling the electronic device.

2. The heat radiation structure according to claim 1, wherein the cooling member further comprises a water inlet pipe portion and a water outlet pipe portion, the water inlet pipe portion and the water outlet pipe portion are respectively communicated with two ends of the cooling pipe portion, and the water inlet pipe portion and the water outlet pipe portion are both located outside the mounting groove.

3. The heat radiation structure according to claim 2, wherein the cooling pipe portions and the mounting grooves are each plural and mounted in one-to-one correspondence, and the plural cooling pipe portions are connected between the water inlet pipe portion and the water outlet pipe portion at intervals.

4. The heat dissipating structure of claim 1, wherein said heat dissipating mounting member is configured as a flat plate and said mounting surface is configured as a flat surface, said mounting surface being adapted for mating connection with said electronic device.

5. The heat dissipating structure of claim 4, wherein said plurality of mounting slots are spaced apart in parallel in a width direction of said heat dissipating mount.

6. The heat dissipating structure of claim 1, wherein the cooling tube portion comprises an embedded portion and an external portion, the embedded portion being located within the mounting slot, the external portion being connected to the embedded portion and located outside the mounting slot, the external portion being adapted to exchange heat with the electronic device.

7. The heat dissipating structure of claim 6, wherein said external portion is formed with a bonding plane for connecting to said electronic device on a side facing away from said mounting groove, said bonding plane being extruded after said cooling tube portion is mounted in said mounting groove.

8. The heat dissipating structure of claim 1, wherein a filler material is provided between the cooling tube portion and an inner wall of the mounting groove.

9. The heat dissipating structure of claim 1, wherein said heat dissipating mount is extruded.

10. An electronic device mounting assembly comprising an electronic device and the heat dissipating structure of any of claims 1-9, the electronic device being removably coupled to the heat dissipating mount.