CN106879230A - A kind of cooling system of three-dimensional power amplifier - Google Patents
A kind of cooling system of three-dimensional power amplifier Download PDFInfo
- Publication number
- CN106879230A CN106879230A CN201710121463.7A CN201710121463A CN106879230A CN 106879230 A CN106879230 A CN 106879230A CN 201710121463 A CN201710121463 A CN 201710121463A CN 106879230 A CN106879230 A CN 106879230A
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- cooling system
- dimensional power
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- 238000002791 soaking Methods 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- -1 silicon lipid Chemical class 0.000 claims description 4
- 238000004891 communication Methods 0.000 abstract description 14
- 238000009434 installation Methods 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Abstract
The invention discloses a kind of cooling system of three-dimensional power amplifier, the c-type radiator for being located at three-dimensional power amplifier periphery can be enclosed after being symmetrical set including two, the outer surface of the c-type radiator is embedded with several the first heat pipes, and each first heat pipe is that C fonts and the c-type profile along c-type radiator are set.Not only volume size is small for cooling system of the invention, it is easy to assemble, and meets cooling requirements, but also can be suitably used for being only capable of the communication system of monoplane radiating, also without doing larger change to communication system, it is easy to accomplish operation, high using compatibility and flexibility.The present invention can be widely applied in communication field as a kind of cooling system of three-dimensional power amplifier.
Description
Technical field
The present invention relates to cooling system, more particularly to a kind of radiating system for being applicable to minimize three-dimensional power amplifier
System.
Background technology
In the field of communications, in order to realize high-power output, it is necessary to carry out power combing to multichannel pmultiple amplifier.Traditional is flat
Face power combing mode takes larger area, and can greatly reduce power amplifier using the design of three-dimensional power amplifier
Shared area.As shown in figure 1, three-dimensional power amplifier can be understood as rolling in planar power amplifier, one is formed
Three-dimensional cylinder, and the power amplifier element in original planar power amplifier is then distributed in the appearance of the cylinder.
And for this three-dimensional power combing mode, because it has combined coefficient and smaller volume size higher, therefore it is obtained
To increasing application.
For above-mentioned three-dimensional power amplifier, its problem encountered is internal power device, due to its generation heat
It is in that distributed in three dimensions is three-dimensional distribution in the periphery of cylinder, the i.e. distribution of its thermal source that the thermal source of amount is, is so then needed effective
Radiating mode, could shed the heat of thermal source.For this problem, use all installed in the outer surface of power amplifier at present
Radiator carries out this mode of radiating to solve, but it has the disadvantage that this three-dimensional heat dissipation mode is needed in the upper of power amplifier
Radiator is installed on lower left and right surface simultaneously, so can then cause the volume size and weight of installation to increase, while assembling can be increased
Complexity.And radiated and for the communication system that installation volume size has strict demand for being only capable of monoplane, this three
The mode of the three-dimensional radiating of dimension seems excessively huge, it is impossible to while meeting the requirement of small size size and radiating.
The content of the invention
In order to solve the above-mentioned technical problem, it is applicable to minimize three-dimensional power amplification it is an object of the invention to provide one kind
The cooling system of device, can not only meet cooling requirements, and its volume size is small, can greatly save installation placing space.
The technical solution adopted in the present invention is：A kind of cooling system of three-dimensional power amplifier, including two or so right
Claim that after setting the c-type radiator for being located at three-dimensional power amplifier periphery can be enclosed, the outer surface of the c-type radiator is embedded with some
Individual first heat pipe, each first heat pipe is that C fonts and the c-type profile along c-type radiator are set.
Further, also including planar heat spreader, several the second heat are embedded with the heat-conducting planar of the planar heat spreader
Pipe, described two c-type radiators are arranged on the heat-conducting planar of planar heat spreader.
Further, covering is provided with graphite flake or indium sheet on the inwall of described two c-type radiators.
Further, described two c-type radiators are spliced into cube radiator after being symmetrical set.
Further, be provided between the bottom of described two c-type radiators and the heat-conducting planar of planar heat spreader graphite flake or
Thermal conductive silicon lipid layer.
Further, the outer surface of first heat pipe flushes with the outer surface of c-type radiator.
Further, the main material of the c-type radiator is aluminium or copper.
Further, first heat pipe is made by soaking plate.
Further, the main material of the planar heat spreader is aluminium or copper.
Further, second heat pipe is made by soaking plate.
The beneficial effects of the invention are as follows：Cooling system of the invention include two be symmetrical set after can enclose and be located at three
The c-type radiator of dimension power amplifier periphery, so will not cannot then conduct because the direct gap of c-type radiator causes heat,
Meanwhile, the outer surface of the c-type radiator is embedded with several the first heat pipes, and each first heat pipe for C fonts and along c-type
The c-type profile of radiator is set, thus three-dimensional power amplifier heat along its cylindrical outer surface, can be by the C of both sides
The first heat pipe on type radiator conducts heat to the bottom of c-type radiator, and the heat of c-type radiator bottom can be by logical
Radiating plane in letter system is distributed, so compared to traditional three dimensions heat dissipating method, cooling system of the invention
Not only volume size is small, it is easy to assemble, and meets cooling requirements, but also can be suitably used for being only capable of the communication system of monoplane radiating
In, it is high using compatibility and flexibility also without doing larger change to communication system, it is easy to accomplish operation.
Brief description of the drawings
Fig. 1 is the principle schematic of conventional three-dimensional power amplifier；
Fig. 2 is a kind of structural representation of the cooling system of three-dimensional power amplifier of the present invention；
Fig. 3 is the structural decomposition diagram of c-type radiator in a kind of cooling system of three-dimensional power amplifier of the present invention；
Fig. 4 is a kind of structural decomposition diagram of the cooling system midplane radiator of three-dimensional power amplifier of the present invention；
Fig. 5 is an a kind of specific embodiment structural representation of the cooling system of three-dimensional power amplifier of the present invention.
1st, c-type radiator；2nd, the first heat pipe；3rd, planar heat spreader；4th, the second heat pipe；5th, graphite flake or indium sheet；6th, it is three-dimensional
Power amplifier.
Specific embodiment
A kind of cooling system of three-dimensional power amplifier, including two be symmetrical set after can enclose and be located at three-dimensional power and put
The c-type radiator of big device periphery, the outer surface of the c-type radiator is embedded with several the first heat pipes, each first heat pipe
Set for C fonts and along the c-type profile of c-type radiator.
For above-mentioned cooling system, its operation principle is：During assembling, the three-dimensional power with cooling system of the present invention is put
Big device is placed in the radiating plane of communication system, and the heat of three-dimensional power amplifier can pass through along its cylindrical outer surface
The first heat pipe on the c-type radiator of both sides conducts heat to the bottom of c-type radiator, and the heat of the bottom can then pass through
The radiating plane of the communication system is distributed.It can thus be concluded that, cooling system of the invention turns plane for a kind of miniaturization space
Cooling system, radiator is installed simultaneously without lower or so surface thereon, small volume, while can also meet cooling requirements, and
And also can be suitably used for being only capable of in the communication system of monoplane radiating, also without larger change is done to communication system, operate and answer
Compatibility, flexibility are all very high.
The preferred embodiment of the present embodiment is further used as, also including planar heat spreader, the heat conduction of the planar heat spreader is put down
Several the second heat pipes are embedded with face, described two c-type radiators are arranged on the heat-conducting planar of planar heat spreader, i.e., two
The bottom of c-type radiator is provided with planar heat spreader.Two heats of c-type radiator bottom are dissipated by the plane installed in bottom
Hot device, so as to heat is quickly conducted to whole planar heat spreader, can so increase three-dimensional power amplifier and communication system
Between area of dissipation, improve heat dispersion.
A specific embodiment of the invention
In the present embodiment, the c-type radiator 1 is c-type uniform-temperature radiator, and the planar heat spreader 3 is plane temperature uniforming heat radiation
Device.
As shown in Figures 2 to 4, a kind of cooling system of three-dimensional power amplifier, including planar heat spreader 3 and two or so
The c-type radiator 1 for being located at the periphery of three-dimensional power amplifier 6, the outer surface setting-in of the c-type radiator 1 can be enclosed after being symmetrical arranged
There are several the first heat pipes 2, each first heat pipe 2 is that C fonts and the c-type profile along c-type radiator 1 are set；
Several the second heat pipes 4 are embedded with the heat-conducting planar of the planar heat spreader 3, described two c-type radiators 1 are arranged on
On the heat-conducting planar of planar heat spreader.Wherein, as illustrated, described two c-type radiators 1 are symmetrical set in three-dimensional power
Cube radiator is spliced into behind the both sides of amplifier 6, the cube radiator is arranged on the heat-conducting planar of planar heat spreader 3
On.
Preferably for above-mentioned c-type radiator 1, it is preferably realized using c-type constructed of aluminium radiating piece, such energy
Further mitigate the weight of cooling system, or can be realized using copper product, so as to further improve thermal conductivity, carry
High heat dispersion；
For the first above-mentioned heat pipe 2, after it is arranged on the outer surface of c-type radiator 1 along the c-type profile of c-type radiator 1, its
Outer surface flushes with the outer surface of c-type radiator 1, and it can be copper heat pipe, be made by soaking plate；
For above-mentioned planar heat spreader 3, it is preferably realized using constructed of aluminium radiating piece, so can further be mitigated and is
The weight of system, or can be realized using copper product, so as to further improve thermal conductivity, improve heat dispersion；
For the second above-mentioned heat pipe 4, it can be copper heat pipe, be made by soaking plate.
As shown in figure 5, covered on the inwall of described two c-type radiators 1 that graphite flake or indium sheet 5 are provided with, and described two
Graphite flake or thermal conductive silicon lipid layer are provided between the bottom of individual c-type radiator 1 and the heat-conducting planar of planar heat spreader 3.When assembling,
Two c-type radiators 1 are symmetrically arranged on the both sides of cylindrical three-dimensional power amplifier 6, c-type radiator 1 and three
Improve contact surface thermal resistance by setting graphite flake or indium sheet 5 between dimension power amplifier 6, improve heat dispersion；Then will be whole
The three-dimensional power amplifier 6 that individual both sides are provided with c-type radiator is mounted on the heat-conducting planar of planar heat spreader 3, now, is stood
It is provided with graphite flake or thermal conductive silicon lipid layer between the bottom of cube radiator and planar heat spreader 3 to improve contact surface thermal resistance, most
Afterwards again integral installation in the radiating plane of system.
Additionally preferably, for be only capable of plane radiating communication system, when designing and producing, can by planar heat spreader 3 with
Planar heat spreader in system is fabricated directly into integrated design, can so reduce three-dimensional power amplifier 6 and system radiating device
Between thermal resistance, while can also reduce volume and weight.
Obtained by above-mentioned, cooling system of the present invention has the advantage that and includes：
1st, cooling system of the invention is processed using aluminium base, is ensureing heat dispersion while also reducing whole cooling system weight
Amount, can meet airborne grade has the product of strict demand to weight；
2nd, cooling system of the invention makes three-dimensional power amplifier be no longer limited to the radiating mode of 3 D stereo, and can also be straight
Connect suitable for the plane cooling system of legacy communications system, three-dimensional power amplifier is directly applied to more tradition logical
Without doing larger change in letter system, compatibility and flexibility are high；
3rd, cooling system contrast conventional three-dimensional solid radiating mode of the invention has smaller installation volume size, can make three-dimensional
The installation of power amplifier is more flexible.
Above is preferable implementation of the invention is illustrated, but the invention is not limited to the implementation
Example, those of ordinary skill in the art can also make a variety of equivalent variations or replace on the premise of without prejudice to spirit of the invention
Change, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (10)
1. a kind of cooling system of three-dimensional power amplifier, it is characterised in that：Can be enclosed after being symmetrical set including two and be located at
The c-type radiator of three-dimensional power amplifier periphery, the outer surface of the c-type radiator is embedded with several the first heat pipes, each institute
The first heat pipe is stated for C fonts and is set along the c-type profile of c-type radiator.
2. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that：Also radiated including plane
Device, is embedded with several the second heat pipes on the heat-conducting planar of the planar heat spreader, described two c-type radiators are arranged on plane
On the heat-conducting planar of radiator.
3. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that：Described two c-types dissipate
Covering is provided with graphite flake or indium sheet on the inwall of hot device.
4. a kind of cooling system of three-dimensional power amplifier according to claim 1, it is characterised in that：Described two c-types dissipate
Hot device is spliced into cube radiator after being symmetrical set.
5. a kind of cooling system of three-dimensional power amplifier according to claim 2, it is characterised in that：Described two c-types dissipate
Graphite flake or thermal conductive silicon lipid layer are provided between the bottom of hot device and the heat-conducting planar of planar heat spreader.
6. a kind of cooling system of three-dimensional power amplifier according to claim any one of 1-5, it is characterised in that：Described
The outer surface of one heat pipe flushes with the outer surface of c-type radiator.
7. a kind of cooling system of three-dimensional power amplifier according to claim any one of 1-5, it is characterised in that：The C
The main material of type radiator is aluminium or copper.
8. a kind of cooling system of three-dimensional power amplifier according to claim any one of 1-5, it is characterised in that：Described
One heat pipe is made by soaking plate.
9. a kind of cooling system of three-dimensional power amplifier according to claim 2 or 5, it is characterised in that：The plane dissipates
The main material of hot device is aluminium or copper.
10. a kind of cooling system of three-dimensional power amplifier according to claim 2 or 5, it is characterised in that：Second heat
Pipe is made by soaking plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121463.7A CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
| PCT/CN2017/084813 WO2018157476A1 (en) | 2017-03-02 | 2017-05-18 | Heat dissipation system for use with three-dimensional power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121463.7A CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106879230A true CN106879230A (en) | 2017-06-20 |
| CN106879230B CN106879230B (en) | 2019-09-17 |
Family
ID=59169375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710121463.7A Active CN106879230B (en) | 2017-03-02 | 2017-03-02 | A kind of cooling system of three-dimensional power amplifier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106879230B (en) |
| WO (1) | WO2018157476A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567266A (en) * | 2017-10-25 | 2018-01-09 | 北京无线电测量研究所 | The cooling system and antenna of a kind of antenna |
| CN109471228A (en) * | 2018-11-27 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of radiator structure of coaxial packaging optical device |
| CN111836519A (en) * | 2020-07-07 | 2020-10-27 | 广州程星通信科技有限公司 | Heat sink for power device |
| CN113382613A (en) * | 2021-06-25 | 2021-09-10 | 深圳安科高技术股份有限公司 | Detector module assembly and detector |
| CN114841108A (en) * | 2022-03-25 | 2022-08-02 | 中国电子科技集团公司第二十九研究所 | Power amplifier product three-dimensional integrated design method and power amplifier product |
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| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| US7215220B1 (en) * | 2004-08-23 | 2007-05-08 | Cap Wireless, Inc. | Broadband power combining device using antipodal finline structure |
| CN101466244A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN203350795U (en) * | 2013-06-08 | 2013-12-18 | 北京立华莱康平台科技有限公司 | Radiator and host comprising same |
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| US20060076458A1 (en) * | 2004-02-19 | 2006-04-13 | Eads Astrium Ltd. | Payload module |
| CN201278625Y (en) * | 2008-08-28 | 2009-07-22 | 中兴通讯股份有限公司 | Heat radiation apparatus for power amplifier |
| CN204756557U (en) * | 2015-07-22 | 2015-11-11 | 高增军 | Embedded heat pipe cooling system and use its LED lamps and lanterns |
| CN105650613A (en) * | 2016-03-01 | 2016-06-08 | 王念忠 | Cooling device |
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- 2017-03-02 CN CN201710121463.7A patent/CN106879230B/en active Active
- 2017-05-18 WO PCT/CN2017/084813 patent/WO2018157476A1/en active Application Filing
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| JP2000040891A (en) * | 1998-07-24 | 2000-02-08 | Fujikura Ltd | Heat sink with heat pipe |
| US7215220B1 (en) * | 2004-08-23 | 2007-05-08 | Cap Wireless, Inc. | Broadband power combining device using antipodal finline structure |
| CN2777753Y (en) * | 2005-01-19 | 2006-05-03 | 富准精密工业(深圳)有限公司 | Radiator |
| CN101466244A (en) * | 2007-12-21 | 2009-06-24 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN102315506A (en) * | 2010-07-06 | 2012-01-11 | 杨健 | Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| CN203350795U (en) * | 2013-06-08 | 2013-12-18 | 北京立华莱康平台科技有限公司 | Radiator and host comprising same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567266A (en) * | 2017-10-25 | 2018-01-09 | 北京无线电测量研究所 | The cooling system and antenna of a kind of antenna |
| CN109471228A (en) * | 2018-11-27 | 2019-03-15 | 武汉光迅科技股份有限公司 | A kind of radiator structure of coaxial packaging optical device |
| CN111836519A (en) * | 2020-07-07 | 2020-10-27 | 广州程星通信科技有限公司 | Heat sink for power device |
| CN113382613A (en) * | 2021-06-25 | 2021-09-10 | 深圳安科高技术股份有限公司 | Detector module assembly and detector |
| CN114841108A (en) * | 2022-03-25 | 2022-08-02 | 中国电子科技集团公司第二十九研究所 | Power amplifier product three-dimensional integrated design method and power amplifier product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106879230B (en) | 2019-09-17 |
| WO2018157476A1 (en) | 2018-09-07 |
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Denomination of invention: A Heat Dissipation System of Three-dimensional Power Amplifier Effective date of registration: 20230228 Granted publication date: 20190917 Pledgee: China Co. truction Bank Corp Guangzhou branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2023980033711 |
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Granted publication date: 20190917 Pledgee: China Co. truction Bank Corp Guangzhou branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2023980033711 |
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