WO2018157476A1

WO2018157476A1 - Heat dissipation system for use with three-dimensional power amplifier

Info

Publication number: WO2018157476A1
Application number: PCT/CN2017/084813
Authority: WO
Inventors: 贾鹏程
Original assignee: 广州程星通信科技有限公司
Priority date: 2017-03-02
Filing date: 2017-05-18
Publication date: 2018-09-07
Also published as: CN106879230B; CN106879230A

Abstract

A heat dissipation system for use with a three-dimensional power amplifier (6), comprising: two C-shaped heat sinks (1) which may surround an outer circumference of the three-dimensional power amplifier (6) after being bilaterally symmetrically arranged; a plurality of first heat pipes (2) are embedded on an outer surface of a C-shaped heat sink (1), and each first heat pipe (2) is C-shaped and is arranged along the C-shaped profile of the C-shaped heat sink (1). The heat dissipation system is small in size, easy to assemble, meets heat dissipation requirements, and may also be applied in communications systems that may only dissipate heat in a single plane without requiring major changes to the communications system, being easy to operate, and having high application compatibility and flexibility. The heat dissipation system for use with the three-dimensional power amplifier (6) may be widely applied in the field of communications.

Description

Heat dissipation system for three-dimensional power amplifier

Technical field

The present invention relates to a heat dissipation system, and more particularly to a heat dissipation system that can be applied to a miniaturized three-dimensional power amplifier.

Background technique

In the field of communications, in order to achieve high power output, power synthesis of multiple amplifiers is required. The traditional planar power synthesis method occupies a large area, and the design of the three-dimensional power amplifier can greatly reduce the area occupied by the power amplifier. As shown in FIG. 1, a three-dimensional power amplifier can be understood as a planar power amplifier that is rolled up to form a three-dimensional cylindrical shape, and the power amplifier device in the original planar power amplifier is distributed in the outer surface of the cylinder. For this three-dimensional power synthesis method, it has more and more applications due to its higher synthesis efficiency and smaller size.

For the above three-dimensional power amplifier, the problem faced by the internal power device is that since the heat source for generating heat is three-dimensionally distributed around the circumference of the cylinder, that is, the heat source distribution is three-dimensionally distributed, an effective heat dissipation method is required. The heat from the heat source can be dissipated. In response to this problem, the heat sink is installed on the outer surface of the power amplifier for heat dissipation. However, the disadvantage is that the three-dimensional heat dissipation method requires the heat sink to be mounted on the upper, lower, left and right surfaces of the power amplifier. This leads to an increase in the size and weight of the installed machine and increases the assembly complexity. Moreover, for a communication system capable of only single-plane heat dissipation and strict requirements on the size of the installed machine, the three-dimensional heat dissipation method is too large to meet the requirements of small size and heat dissipation.

Summary of the invention

In order to solve the above technical problems, an object of the present invention is to provide a heat dissipation system that can be applied to a miniaturized three-dimensional power amplifier, which not only satisfies the heat dissipation requirement, but also has a small size and can greatly save installation space.

The technical solution adopted by the present invention is: a heat dissipation system of a three-dimensional power amplifier, comprising two C-type heat sinks which are disposed symmetrically around the periphery of the three-dimensional power amplifier, and the outer surface of the C-type heat sink is embedded There are a plurality of first heat pipes, each of which is C-shaped and disposed along a C-shaped profile of the C-type heat sink.

Further, a planar heat sink is further disposed, and a plurality of second heat pipes are embedded on the heat conducting plane of the planar heat sink, and the two C-type heat sinks are disposed on a heat conducting plane of the planar heat sink.

Further, the inner walls of the two C-type heat sinks are covered with a graphite sheet or an indium sheet.

Further, the two C-type heat sinks are symmetrically arranged left and right and then spliced into a cubic heat sink.

Further, a graphite sheet or a thermal grease layer is disposed between the bottom of the two C-type heat sinks and the heat transfer plane of the planar heat sink.

Further, an outer surface of the first heat pipe is flush with an outer surface of the C-type heat sink.

Further, the body of the C-type heat sink is made of aluminum or copper.

Further, the first heat pipe is made of a heat equalizing plate.

Further, the body of the planar heat sink is made of aluminum or copper.

Further, the second heat pipe is made of a soaking plate.

The invention has the beneficial effects that the heat dissipation system of the invention comprises two C-type heat sinks which can be disposed around the periphery of the three-dimensional power amplifier after being symmetrically disposed, so that the heat cannot be conducted due to the direct gap of the C-type heat sink. At the same time, the outer surface of the C-type heat sink is embedded with a plurality of first heat pipes, and each of the first heat pipes is C-shaped and disposed along the C-shaped profile of the C-type heat sink, so the heat of the three-dimensional power amplifier Along the outer surface of the cylinder, heat is conducted to the bottom of the C-type heat sink through the first heat pipe on the C-type heat sinks on both sides, and the heat at the bottom of the C-type heat sink is radiated through the heat dissipation plane in the communication system. Compared with the conventional three-dimensional space heat dissipation method, the heat dissipation system of the invention not only has a small size, is easy to assemble, meets heat dissipation requirements, but is also applicable to a communication system capable of only radiating heat in a single plane, and does not need to be used for a communication system. Large changes, easy to implement, application compatibility and flexibility.

DRAWINGS

1 is a schematic diagram of the principle of a conventional three-dimensional power amplifier;

2 is a schematic structural view of a heat dissipation system of a three-dimensional power amplifier according to the present invention;

3 is a schematic exploded view showing the structure of a C-type heat sink in a heat dissipation system of a three-dimensional power amplifier according to the present invention;

4 is a schematic exploded view showing the structure of a planar heat sink in a heat dissipation system of a three-dimensional power amplifier according to the present invention;

FIG. 5 is a schematic structural view of a specific embodiment of a heat dissipation system of a three-dimensional power amplifier according to the present invention.

1. C-type heat sink; 2. First heat pipe; 3. Planar heat sink; 4. Second heat pipe; 5. Graphite sheet or indium sheet; 6. Three-dimensional power amplifier.

detailed description

A heat dissipation system for a three-dimensional power amplifier includes two C-type heat sinks disposed symmetrically around the periphery of the three-dimensional power amplifier, and a plurality of first heat pipes are embedded on the outer surface of the C-type heat sink. The first heat pipe is C-shaped and is disposed along the C-profile of the C-type heat sink.

For the above heat dissipation system, the working principle is: when assembling, the three-dimensional power amplifier with the heat dissipation system of the invention is placed on the heat dissipation plane of the communication system, and the heat of the three-dimensional power amplifier is along the outer surface of the cylinder, and passes through both sides. The first heat pipe on the C-type heat sink conducts heat to the bottom of the C-type heat sink, and the heat at the bottom is dissipated through the heat dissipation plane of the communication system. Therefore, the heat dissipation system of the present invention is a miniaturized space-to-plane heat dissipation system, and the heat sink is not required to be installed on the upper, lower, left and right surfaces at the same time, and the volume is small, and the heat dissipation requirement can also be met, and the utility model can also be applied to only the heat dissipation requirement. In the single-plane heat dissipation communication system, there is no need to make major changes to the communication system, and the compatibility and flexibility of operations and applications are high.

Further, as a preferred embodiment of the present invention, a planar heat sink is further disposed, and a plurality of second heat pipes are embedded on the heat conduction plane of the planar heat sink, and the two C-type heat sinks are disposed on a heat conduction plane of the planar heat sink. That is, the bottom of the two C-type heat sinks is provided with a flat heat sink. The heat at the bottom of the two C-type heat sinks is transmitted to the entire planar heat sink through the planar heat sink mounted on the bottom, which increases the heat dissipation area between the three-dimensional power amplifier and the communication system and improves the heat dissipation performance.

A specific embodiment of the invention

In this embodiment, the C-type heat sink 1 is a C-type average temperature heat sink, and the planar heat sink 3 is a planar average temperature heat sink.

As shown in FIG. 2 to FIG. 4, a heat dissipation system of a three-dimensional power amplifier includes a planar heat sink 3 and two C-type heat sinks 1 which are disposed symmetrically around the periphery of the three-dimensional power amplifier 6, and the type C a plurality of first heat pipes 2 are embedded in the outer surface of the heat sink 1, and each of the first heat pipes 2 is C-shaped and disposed along a C-shaped profile of the C-type heatsink 1;

A plurality of second heat pipes 4 are embedded in the heat conducting plane of the planar heat sink 3, and the two C-type heat sinks 1 are disposed on a heat conducting plane of the planar heat sink. As shown in the figure, the two C-type heat sinks 1 are symmetrically disposed on both sides of the three-dimensional power amplifier 6 and then spliced into a cubic heat sink, and the cube heat sink is disposed on the heat conducting plane of the planar heat sink 3.

Preferably, for the above-mentioned C-type heat sink 1, it can preferably be realized by using a C-type aluminum structure heat sink, which can further reduce the weight of the heat dissipation system, or can be realized by using a copper material, thereby further improving the thermal conductivity. Improve heat dissipation performance;

For the first heat pipe 2 described above, after the C-profile of the C-type heat sink 1 is disposed on the outer surface of the C-type heat sink 1, the outer surface thereof is flush with the outer surface of the C-type heat sink 1, and it may be Copper heat pipe made of soaking plate;

For the above-mentioned planar heat sink 3, it can be preferably realized by using an aluminum structure heat dissipating member, which can further reduce the weight of the system, or can be realized by using a copper material, thereby further improving the thermal conductivity and improving the heat dissipation performance;

For the second heat pipe 4 described above, it may be a copper heat pipe made of a soaking plate.

As shown in FIG. 5, the inner walls of the two C-type heat sinks 1 are covered with a graphite sheet or an indium sheet 5, and the bottoms of the two C-type heat sinks 1 and the heat conducting plane of the planar heat sink 3 are disposed. It is provided with a graphite sheet or a thermal grease layer. That is, when assembling, the two C-type heat sinks 1 are symmetrically mounted on both sides of the cylindrical three-dimensional power amplifier 6, and the contact between the C-type heat sink 1 and the three-dimensional power amplifier 6 is improved by providing graphite sheets or indium sheets 5. Surface thermal resistance to improve heat dissipation performance; then three-dimensional power amplifier 6 with a C-type heat sink on both sides is installed on the heat conduction plane of the planar heat sink 3, at this time, the bottom of the cube heat sink and the planar heat sink 3 A graphite sheet or a thermal grease layer is provided to improve the thermal resistance of the contact surface, and finally is integrally mounted on the heat dissipation plane of the system.

In addition, for a communication system capable of only radiating heat in a plane, the planar heat sink 3 and the planar heat sink in the system can be directly formed into an integrated design during design, which can reduce the space between the three-dimensional power amplifier 6 and the system heat sink. The thermal resistance also reduces volume and weight.

As can be seen from the above, the heat dissipation system of the present invention has advantages including:

1. The heat dissipation system of the invention is processed by an aluminum substrate, and the heat dissipation performance is ensured while reducing the weight of the entire heat dissipation system, and the product having strict requirements on weight such as air load can be satisfied;

2. The heat dissipation system of the present invention makes the three-dimensional power amplifier no longer limited to the three-dimensional heat dissipation mode, but can also be directly applied to the planar heat dissipation system of the traditional communication system, so that the three-dimensional power amplifier can be directly applied to more traditional communication systems. No major changes are required, and compatibility and flexibility are high;

3. The heat dissipation system of the present invention has a smaller installation volume size than the conventional three-dimensional heat dissipation method, and can make the installation of the three-dimensional power amplifier more flexible.

The above is a detailed description of the preferred embodiments of the present invention, but the present invention is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the invention. Such equivalent modifications or alternatives are intended to be included within the scope of the claims.

Claims

A heat dissipation system for a three-dimensional power amplifier is characterized in that it comprises two C-type heat sinks which are disposed symmetrically around the periphery of the three-dimensional power amplifier, and the outer surface of the C-type heat sink is embedded with a plurality of first The heat pipe, each of the first heat pipes is C-shaped and disposed along a C-shaped profile of the C-type heat sink.
A heat dissipation system for a three-dimensional power amplifier according to claim 1, further comprising a planar heat sink, wherein a plurality of second heat pipes are embedded in the heat transfer plane of the planar heat sink, and the two C-type heat sinks The device is placed on the thermal conduction plane of the planar heat sink.
A heat dissipation system for a three-dimensional power amplifier according to claim 1, wherein the inner walls of the two C-type heat sinks are covered with a graphite sheet or an indium sheet.
The heat dissipation system of a three-dimensional power amplifier according to claim 1, wherein the two C-type heat sinks are symmetrically arranged in a left-right direction and then spliced into a cubic heat sink.
A heat dissipation system for a three-dimensional power amplifier according to claim 2, wherein a graphite sheet or a thermal grease layer is disposed between the bottoms of the two C-type heat sinks and the heat transfer plane of the planar heat sink.
A heat dissipation system for a three-dimensional power amplifier according to any one of claims 1 to 5, characterized in that the outer surface of the first heat pipe is flush with the outer surface of the C-type heat sink.
The heat dissipation system of a three-dimensional power amplifier according to any one of claims 1 to 5, wherein the body of the C-type heat sink is made of aluminum or copper.
A heat dissipation system for a three-dimensional power amplifier according to any one of claims 1 to 5, wherein the first heat pipe is made of a heat equalizing plate.
The heat dissipation system of a three-dimensional power amplifier according to claim 2 or 5, wherein the body of the planar heat sink is made of aluminum or copper.
A heat dissipation system for a three-dimensional power amplifier according to claim 2 or 5, wherein the second heat pipe is made of a heat equalizing plate.