CN114841108A - Power amplifier product three-dimensional integrated design method and power amplifier product - Google Patents
Power amplifier product three-dimensional integrated design method and power amplifier product Download PDFInfo
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
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- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
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- H—ELECTRICITY
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- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
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- H—ELECTRICITY
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Abstract
The invention discloses a power amplifier product three-dimensional integrated design method and a power amplifier product, belonging to the field of power amplifier product design. The invention has high synthesis efficiency, effectively improves the working efficiency of the power amplifier, has wide working bandwidth, can flexibly select the number of the power amplifier units according to the system requirement, reduces the product cost and the power consumption, has high output power, compact structure and easy maintenance.
Description
Technical Field
The invention relates to the field of power amplifier product design, in particular to a power amplifier product three-dimensional integrated design method and a power amplifier product.
Background
In a microwave system, modulated microwave small signals need to be subjected to amplitude amplification through a power amplifier and then are radiated into a free space through a transmitting antenna, so that the purpose of long-distance wireless transmission of microwave signals is achieved. The larger the power of the microwave signal after amplification is, the stronger the anti-interference capability is, and the longer the transmission distance is. Therefore, the output power of the power amplifier is increased by various means. There are two main approaches: the power output capacity of a single solid-state power amplifier chip is improved, and the output power of a plurality of power amplifier chips is subjected to power synthesis by using a power synthesizer to obtain higher power.
For the case of designing a power amplifier using a power combining circuit, the existing design method is to use a combining circuit with a binary topology. The number of the power amplifier units synthesized by the method must be 2 n And n is the number of stages of the binary synthesis circuit, and the principle of the power amplifier circuit is shown in figure 1. The synthesizer and the power divider circuit can be made of waveguides, microstrip lines, strip lines and the like, and the whole circuit is positioned on one plane. Because the synthesizer is a planar circuit and the positions of the power input ports are on a straight line, the power amplifier array must be arranged in a straight line and is a one-dimensional linear array.
The power amplifier product designed by the design method has the following defects: one is that the composite circuit losses increase exponentially as the number of stages increases. Assuming that the loss of a single-stage synthesis circuit is 0.6dB, an 8-path power synthesizer needs 3 stages of synthesis circuit cascade connection, the circuit loss reaches 1.8dB, the synthesis efficiency is only 66%, and 34% of power is consumed on the synthesis circuit; secondly, the number of the power amplifier units must be 2 n The number of the power amplification units cannot be flexibly controlled according to the power requirement of the system, so that the energy consumption of the system is increased, the cost of devices is increased, the power of the system is excessive, and the like; thirdly, the power amplifier units can only be arranged along a straight line, and when the number of the power amplifier units is large, the power amplifier array occupies a large plane space.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a three-dimensional integrated design method of a power amplifier product and the power amplifier product, and solves the problems in the background.
The purpose of the invention is realized by the following scheme:
a power amplifier product three-dimensional integrated design method comprises the steps that a power divider is in signal connection with a power amplifier unit in a three-dimensional space, and the power amplifier unit is in signal connection with a power synthesizer in the three-dimensional space.
Further, comprising the sub-steps of: dividing the excitation signal into N paths in equal amplitude and in phase by adopting an N-path power divider, outputting the N paths of signals subjected to power division to an excitation end of each power amplification unit, amplifying the signals by the power amplification units, and outputting the signals to input ports of the N-path power synthesizer; the N paths of power synthesizers superpose and synthesize the same-phase pairs of N paths of signals output by the amplified power amplification units and output the same-phase pairs of the signals; n paths of signals after power division of the N paths of power dividers are transmitted in a three-dimensional space, and input signals of the N paths of power synthesizers are received from the three-dimensional space; n is an integer of 2 or more.
Further, the N-path power combiner adopts a coaxial waveguide structure.
Further, the cross-sectional shape of the three-dimensional space includes a circle and a polygon.
A power amplifier product comprises an N-path power distributor, a power amplifier unit array consisting of N power amplifier units and an N-path power synthesizer, wherein N is an integer greater than or equal to N; the N paths of power distributors divide the excitation signals into N paths of signals in equal amplitude and in phase, the N paths of signals after power division are output to excitation ends of N power amplification units of the power amplification unit array, and the signals are amplified by the N power amplification units and then output to input ports of the N paths of power synthesizers; the N paths of power synthesizers superpose and synthesize the same phase of the N pairs of signals output by the power amplifier array after amplification and output the same; the N signal output ports after the power division of the N power dividers are in the cross-sectional shape of a three-dimensional space arrangement structure; each input port of the N-path power combiner is in a cross section shape of a three-dimensional space arrangement structure.
Further, the three-dimensional space arrangement structure comprises a regular cubic structure, and the cross section shapes of the two ends are smaller than or the same as the cross section shape of the middle part.
And furthermore, the power amplifier further comprises a feed circuit board, wherein the N paths of power distributors, the feed circuit board, the power amplifier unit array and the N paths of power combiners are sequentially arranged and are tensioned and fixed by a plurality of long screw rods, and bosses and grooves for limiting and supporting are arranged between the N paths of power distributors and the power amplifier unit array and between the power amplifier unit array and the N paths of power combiners.
Furthermore, each port of the N-path power distributor is connected with each power amplifier unit excitation port of the power amplifier unit array by a blind-mate radio frequency coaxial connector, and each power amplifier unit output port of the power amplifier unit array is connected with each input port of the N-path power synthesizer by a blind-mate radio frequency coaxial connector.
Furthermore, the power amplifier unit array comprises a lower base and an upper base; the connecting structure of the lower base and the upper base comprises any one of the following structures: the lower base and the upper base are fixed through screws, and after the upper base and the lower base are fixed, an inner hollow part is formed by the upper base and the lower base, and the hollow part is a regular N-edge shape; or when N is an odd number, the lower base and the upper base are integrally machined and formed; the heat dissipation bottoms of the N power amplifier units are tightly attached to the lower base and the upper base, the power amplifier units are fixed through screws, and heat-conducting silicone grease is coated on the contact surfaces; the N power amplifier units are arranged on the base in a circular ring or polygonal array.
Furthermore, heat is led out from the periphery of the regular N-edge cubic structure in the middle, radiating fins are arranged on the periphery of the middle of the product, or cold plates with cooling liquid flow channels are arranged on the periphery of the middle of the product for radiating.
The beneficial effects of the invention include:
the design method of the embodiment of the invention has high synthesis efficiency, effectively improves the working efficiency of the power amplifier, and can flexibly select the number of the power amplifier units according to the system requirement so as to reduce the product cost and the power consumption; the output power is high and can reach kilowatt level;
the array type power amplifier product designed by the design method of the embodiment of the invention has the following advantages: wide working bandwidth (up to more than 10 octaves), compact structure, easy maintenance and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a power amplifier array using a binary topology synthesizer;
FIG. 2 is a schematic diagram of a power amplifier array employing a waveguide spatial power combiner;
FIG. 3 is a schematic diagram of the power amplifier array product;
fig. 4 is a heat dissipation intention of the power amplifier array product;
FIG. 5 is a schematic diagram of the composition relationship of a power amplifier array product;
FIG. 6 is a schematic diagram of the power amplifier cell array;
the power amplifier comprises 1-N power distributors, 2-N power combiners, 3-power amplifier unit arrays, 4-long screws, 5-feed circuit boards, 6-lower bases, 7-upper bases and 8-N power amplifier units.
Detailed Description
All features disclosed in all embodiments in this specification, or all methods or process steps implicitly disclosed, may be combined and/or expanded, or substituted, in any way, except for mutually exclusive features and/or steps. The technical concept, the technical problems to be solved, the working principle, the working process and the advantages of the present invention will be fully described in detail with reference to the accompanying fig. 2 to 6.
The embodiment of the invention aims to solve the problems of low synthesis efficiency, inflexible control of the number of power amplifier units and large occupied space of the whole power amplifier existing in the conventional power amplifier designed by adopting a binary topological structure synthesizer circuit, and provides a three-dimensional integration method of the power amplifier units by adopting a spatial power synthesizer circuit in practical application. The power amplifier designed by the method has the characteristics of high power synthesis efficiency, compact structure and flexible and controllable number of power amplifier units.
In the practical application process, a design and integration method of an array type power amplifier based on a coaxial waveguide space power combiner is provided. The power amplifier product designed by the method has the characteristics of large output power, high synthesis efficiency, large power capacity, compact structure and the like, and the principle is shown in figure 2.
The power amplifier related by the method comprises an N-path power distributor, a power amplifier array consisting of N power amplifier units and an N-path power synthesizer, wherein N is an integer more than or equal to 2.
The working principle of the power amplifier related to the method is described with reference to fig. 2: the N paths of power dividers are adopted to divide the excitation signal into N paths of signals with equal amplitude and in phase, the N paths of signals after power division are output to the excitation end of each power amplification unit, and the signals are amplified by the power amplification units and then output to each input port of the N paths of power synthesizers. And the N paths of power synthesizers output N paths of signals and other pairs of signals which are amplified by the power amplifier array and are in-phase superposed and synthesized are output.
The N paths of power distributors used in the method divide signals into N paths through a primary power dividing circuit, and N output ports are circularly arranged; the N paths of signals are combined into one path by the N paths of synthesizers after passing through the primary synthesizing circuit, and N input ports are circularly arranged. The N-path synthesizer adopts a coaxial waveguide structure to reduce transmission loss, improve synthesized power capacity and expand working bandwidth.
The typical shape of the power amplifier product designed by the method is shown in fig. 3, the middle part of the product is in a regular cube structure (also can be in a regular polygonal column structure or a cylindrical structure), and the cross sections of the two ends of the product are smaller than or equal to the cross section of the middle part.
The heat dissipation of the array type power amplifier product is schematic, as shown in fig. 4. When the heat dissipation device works, heat is required to be led out from the periphery of the cubic structure in the middle of the product, and heat dissipation fins can be arranged on the periphery of the middle of the product to apply certain wind speed for heat dissipation; and cold plates with cooling liquid flow channels can be arranged around the middle part of the product to dissipate heat.
The composition and assembly relationship of each part of the array type power amplifier product are described with reference to fig. 4: the N power distributors 1, the feed circuit board 5, the power amplifier unit array 3 and the N power combiners 2 are sequentially arranged and are finally tightened and fixed by a plurality of long screws 4, wherein bosses and grooves for limiting and supporting are arranged between the N power distributors 1 and the power amplifier unit array 3 and between the power amplifier unit array 3 and the N power combiners 2, and the shapes of the bosses and the grooves include, but are not limited to, circular and square.
The ports of the N-path power distributor 1 and the exciting ports of the power amplifier units of the power amplifier unit array 3, and the output ports of the power amplifier units of the power amplifier unit array 3 and the input ports of the N-path power synthesizer 2 are connected by blind insertion type radio frequency coaxial connectors such as SMP (symmetrical multi processing) so as to achieve the purpose of reducing the size of products.
The composition of the power amplifier cell array 3 is described with reference to fig. 5: contain lower base 6, go up base 7, a N power amplifier unit 8, wherein lower base 6 and last base 7 pass through the fix with screw, and the upper and lower base forms an inside cavity after the fixed, and the cavity shape is regular N polygon. Structurally, the lower base 6 and the upper base 7 can be integrally formed into an odd number N. N power amplifier unit 8 heat dissipation bottoms hug closely lower base 6 and upper base 7 installation, through the fix with screw, can scribble the right amount heat conduction silicone grease on the contact surface to reduce contact surface thermal resistance. N power amplifier units 8 are arranged on the base in a circular array.
In order to verify the correctness of the embodiment of the invention, a 14-channel array type power amplifier product with a frequency range of 2 GHz-18 GHz is designed, as shown in figure 3. Through tests, the power synthesis efficiency of the power amplifier product is higher than 93%, the efficiency of the whole power amplifier is equivalent to that of a power amplifier unit, the output power of the full working frequency band of the output power is larger than 100W, and the size of the product is 150mm multiplied by 60 mm.
Example 1: a power amplifier product three-dimensional integrated design method comprises the steps that a power divider is in signal connection with a power amplifier unit in a three-dimensional space, and the power amplifier unit is in signal connection with a power synthesizer in the three-dimensional space.
Example 2: on the basis of the embodiment 1, the method comprises the following substeps:
dividing the excitation signal into N paths in equal amplitude and in phase by adopting an N-path power divider, outputting the N paths of signals subjected to power division to an excitation end of each power amplification unit, amplifying the signals by the power amplification units, and outputting the signals to input ports of the N-path power synthesizer; the N paths of power synthesizers superpose and synthesize the same-phase pairs of N paths of signals output by the amplified power amplification units and output the same-phase pairs of the signals; n paths of signals after power division of the N paths of power dividers are transmitted in a three-dimensional space, and input signals of the N paths of power synthesizers are received from the three-dimensional space; n is an integer of 2 or more.
Example 3: in addition to embodiment 2, the N-path power combiner adopts a coaxial waveguide structure.
Example 4: in any one of embodiments 1 to 3, the cross-sectional shape of the three-dimensional space includes a circle and a polygon.
Example 5: a power amplifier product comprises an N-path power distributor 1, a power amplifier unit array 3 consisting of N power amplifier units 8 and an N-path power synthesizer 2, wherein N is an integer more than or equal to 2; the N paths of power distributors 1 divide the excitation signals into N paths of signals in equal amplitude and in phase, the N paths of signals after power division are output to excitation ends of N power amplification units of the power amplification unit array 3, and the signals are amplified by the N power amplification units and then output to input ports of an N path of power synthesizer 2; the N paths of power synthesizers 2 output N paths of signals which are amplified by the power amplifier array and the like in the same phase are superposed and synthesized and then output; the N signal output ports of the N power dividers 1 after power division are in the cross-sectional shape of a three-dimensional space arrangement structure; each input port of the N-path power combiner 2 is in a cross-sectional shape of a three-dimensional space arrangement structure.
Example 6: on the basis of embodiment 5, the three-dimensional space arrangement structure comprises a regular cubic structure, and the cross-sectional shapes of both ends are smaller than or the same as the cross-sectional shape of the middle part.
Example 7: on the basis of the embodiment 5, the power amplifier comprises a feed circuit board 5, wherein the N-path power distributor 1, the feed circuit board 5, the power amplifier unit array 3 and the N-path power combiner 2 are sequentially arranged and are tightened and fixed by a plurality of long screws 4, and bosses and grooves for limiting and supporting are arranged between the N-path power distributor 1 and the power amplifier unit array 3 and between the power amplifier unit array 3 and the N-path power combiner 2.
Example 8: on the basis of embodiment 5, the ports of the N-path power divider 1 are connected to the excitation ports of the power amplification units of the power amplification unit array 3 by blind-mate rf coaxial connectors, and the output ports of the power amplification units of the power amplification unit array 3 are connected to the input ports of the N-path power combiner 2 by blind-mate rf coaxial connectors.
Example 9: on the basis of the embodiment 5, the power amplifier unit array 3 comprises a lower base 6 and an upper base 7; the connecting structure of the lower base 6 and the upper base 7 includes any one of the following: the lower base 6 and the upper base 7 are fixed through screws, and after the upper base and the lower base are fixed, an inner hollow is formed and the hollow shape is a regular N-shaped polygon; or when N is an odd number, the lower base 6 and the upper base 7 are integrally processed and formed;
the heat dissipation bottoms of the N power amplifier units 8 are tightly attached to the lower base 6 and the upper base 7, and are fixed through screws, and heat-conducting silicone grease is coated on the contact surface; the N power amplifier units 8 are arranged on the base in a circular ring or polygonal array.
Example 10: on the basis of embodiment 5, heat is led out from the periphery of an N-edge cubic structure with a regular middle part, and radiating fins are arranged on the periphery of the middle part of a product, or cold plates with cooling liquid flow channels are arranged on the periphery of the middle part of the product for radiating.
The parts not involved in the present invention are the same as or can be implemented using the prior art.
The above-described embodiment is only one embodiment of the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be easily made based on the application and principle of the present invention disclosed in the present application, and the present invention is not limited to the method described in the above-described embodiment of the present invention, so that the above-described embodiment is only preferred, and not restrictive.
Other embodiments than the above examples may be devised by those skilled in the art based on the foregoing disclosure, or by adapting and using knowledge or techniques of the relevant art, and features of various embodiments may be interchanged or substituted and such modifications and variations that may be made by those skilled in the art without departing from the spirit and scope of the present invention are intended to be within the scope of the following claims.
Claims (10)
1. A power amplifier product three-dimensional integrated design method is characterized by comprising a power divider and a power amplifier unit which are in signal connection in a three-dimensional space, and the power amplifier unit is in signal connection with a power synthesizer in the three-dimensional space.
2. The power amplifier product three-dimensional integrated design method according to claim 1, comprising the substeps of:
dividing the excitation signal into N paths in equal amplitude and in phase by adopting an N-path power divider, outputting the N paths of signals subjected to power division to an excitation end of each power amplification unit, amplifying the signals by the power amplification units, and outputting the signals to input ports of the N-path power synthesizer; the N paths of power synthesizers superpose and synthesize the same-phase pairs of N paths of signals output by the amplified power amplification units and output the same-phase pairs of the signals; n paths of signals after power division of the N paths of power dividers are transmitted in a three-dimensional space, and input signals of the N paths of power synthesizers are received from the three-dimensional space; n is an integer of 2 or more.
3. The power amplifier product three-dimensional integration design method of claim 2, wherein the N-path power combiner adopts a coaxial waveguide structure.
4. The power amplifier product three-dimensional integration design method according to any one of claims 1 to 3, wherein the cross-sectional shape of the three-dimensional space includes a circle and a polygon.
5. A power amplifier product is characterized by comprising N paths of power distributors (1), a power amplifier unit array (3) consisting of N power amplifier units (8) and N paths of power synthesizers (2), wherein N is an integer more than or equal to 2; the N paths of power distributors (1) divide the excitation signals into N paths of signals in equal amplitude and in phase, the N paths of signals after power division are output to excitation ends of N power amplification units of a power amplification unit array (3), and the signals are amplified by the N power amplification units and then output to input ports of N paths of power synthesizers (2); the N paths of power synthesizers (2) superpose and synthesize in-phase pairs of N paths of signals and the like output after the amplification of the power amplifier array and output; n signal output ports of the N power distributors (1) after power division are in the cross section shape of a three-dimensional space arrangement structure; each input port of the N-path power combiner (2) is in a cross section shape of a three-dimensional spatial arrangement structure.
6. The power amplifier product according to claim 5, wherein the three-dimensional arrangement structure comprises a regular cubic structure, and the cross-sectional shapes of the two ends are smaller than or equal to the cross-sectional shape of the middle part.
7. The power amplifier product according to claim 5, comprising a feed circuit board (5), wherein the N power dividers (1), the feed circuit board (5), the power amplifier unit array (3) and the N power combiner (2) are sequentially arranged and tightened and fixed by a plurality of long screws (4), wherein bosses and grooves for limiting and supporting are respectively arranged between the N power dividers (1) and the power amplifier unit array (3) and between the power amplifier unit array (3) and the N power combiner (2).
8. The power amplifier product according to claim 5, characterized in that each port of the N-way power divider (1) is connected with each exciting port of the power amplifier unit array (3) by a blind-mate RF coaxial connector, and each output port of the power amplifier unit array (3) is connected with each input port of the N-way power combiner (2) by a blind-mate RF coaxial connector.
9. The power amplifier product according to claim 5, characterized in that the power amplifier cell array (3) comprises a lower base (6) and an upper base (7); the connecting structure of the lower base (6) and the upper base (7) comprises any one of the following structures: the lower base (6) and the upper base (7) are fixed through screws, and after the upper base and the lower base are fixed, an inner hollow is formed and the hollow shape is a regular N-shaped polygon; or when N is an odd number, the lower base (6) and the upper base (7) are integrally processed and formed;
the heat dissipation bottoms of the N power amplifier units (8) are tightly attached to the lower base (6) and the upper base (7) and fixed through screws, and heat-conducting silicone grease is coated on the contact surface; the N power amplifier units (8) are arranged on the base in a circular ring shape or polygonal array.
10. The power amplifier product of claim 5, wherein heat is derived from the periphery of the regular N-sided polygonal cubic structure in the middle, and heat dissipation fins are disposed around the middle of the product, or a cold plate with a coolant channel is disposed around the middle of the product for heat dissipation.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117134729A (en) * | 2023-10-25 | 2023-11-28 | 南京纳特通信电子有限公司 | High-power synthesizer, synthesizing method and design method |
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| CN102280681A (en) * | 2011-05-13 | 2011-12-14 | 电子科技大学 | Power divider of coaxial-ridge waveguide-microstrip transformation structure |
| CN103354301A (en) * | 2013-07-12 | 2013-10-16 | 中国电子科技集团公司第四十一研究所 | Expansion coaxial power distribution synthesizer, power distribution method, power synthesis method |
| CN106879230A (en) * | 2017-03-02 | 2017-06-20 | 广州程星通信科技有限公司 | A kind of cooling system of three-dimensional power amplifier |
| CN107222175A (en) * | 2017-05-27 | 2017-09-29 | 中国电子科技集团公司第四十研究所 | A kind of Broadband Solid-state power amplifier of new cross-linking design |
| CN107749509A (en) * | 2017-11-24 | 2018-03-02 | 中国电子科技集团公司第二十七研究所 | A kind of microwave multi-path radial waveguide power distribution synthesizes passive network |
| CN109585996A (en) * | 2018-11-27 | 2019-04-05 | 中国电子科技集团公司第四十研究所 | Convertible broadband power synthesizer based on compound function curve ridge |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117134729A (en) * | 2023-10-25 | 2023-11-28 | 南京纳特通信电子有限公司 | High-power synthesizer, synthesizing method and design method |
| CN117134729B (en) * | 2023-10-25 | 2024-01-30 | 南京纳特通信电子有限公司 | High-power synthesizer, synthesizing method and design method |
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