CN114841108A - Power amplifier product three-dimensional integrated design method and power amplifier product - Google Patents

Abstract

The invention discloses a power amplifier product three-dimensional integrated design method and a power amplifier product, belonging to the field of power amplifier product design. The invention has high synthesis efficiency, effectively improves the working efficiency of the power amplifier, has wide working bandwidth, can flexibly select the number of the power amplifier units according to the system requirement, reduces the product cost and the power consumption, has high output power, compact structure and easy maintenance.

Description

A three-dimensional integrated design method of power amplifier product and power amplifier product

technical field

The invention relates to the field of power amplifier product design, and more particularly, to a three-dimensional integrated design method of a power amplifier product and a power amplifier product.

Background technique

In the microwave system, the modulated microwave small signal needs to be amplified by the power amplifier and then radiated into the free space through the transmitting antenna to achieve the purpose of long-distance wireless propagation of the microwave signal. The greater the power of the amplified microwave signal, the stronger the anti-interference ability and the longer the transmission distance. Therefore, the industry uses various means to improve the output power of the power amplifier. There are two main ways: one is to improve the power output capability of a single solid-state power amplifier chip, and the other is to use a power combiner to combine the output power of multiple power amplifier chips to obtain higher power.

For the case of designing a power amplifier with a power combining circuit, the existing design method is a combining circuit with a binary topology structure. The number of power amplifier units synthesized by this method must be 2 ⁿ , where n is the number of binary synthesis circuit stages, and the principle of the power amplifier circuit is shown in Figure 1. Combiner and power divider circuits can be fabricated with waveguides, microstrip lines, striplines, etc., with the entire circuit on one plane. Since the synthesizer is a plane circuit, and the position of each power input port is on a straight line, the power amplifier array must also be arranged in a line, which is a one-dimensional line array.

Using the above design method to design power amplifier products has many disadvantages: First, the loss of the synthetic circuit will increase exponentially with the increase of the number of stages. Assuming that the loss of the single-stage synthesis circuit is 0.6dB, the 8-channel power combiner needs 3-stage synthesis circuits to be cascaded, the circuit loss is 1.8db, the synthesis efficiency is only 66%, and 34% of the power is consumed in the synthesis circuit; the second is the power amplifier unit The number must be 2 ⁿ , and the number of power amplifier units cannot be flexibly controlled according to the power requirements of the system, which may result in increased system energy consumption, increased device cost, and excess system power. When the number of units is large, the resulting placement array occupies a larger plane space.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies of the prior art, to provide a three-dimensional integrated design method of a power amplifier product and a power amplifier product, and to solve the problems raised in the background.

The purpose of this invention is to realize through the following scheme:

A three-dimensional integrated design method for a power amplifier product includes signal connection between a power distributor and a power amplifier unit in a three-dimensional space, and a signal connection between the power amplifier unit and a power combiner in the three-dimensional space.

Further, it includes sub-steps: using an N-way power divider to divide the excitation signal into N-way with equal amplitude and phase, the N-way signal after power division is output to the excitation end of each power amplifier unit, and after being amplified by the power amplifier unit, it is output to N Each input port of the power combiner; the N-way power combiner superimposes the N-way signals outputted by each power amplifier unit in phase, and outputs them after synthesis; the N-way signals after the power division of the N-way power divider are transmitted in three-dimensional space, Each input signal of the N-way power combiner is received from three-dimensional space; N is an integer greater than or equal to 2.

Further, the N-way power combiner adopts a coaxial waveguide structure.

Further, the cross-sectional shape of the three-dimensional space includes a circle and a polygon.

A power amplifier product, comprising N-way power dividers, a power amplifier unit array composed of N power amplifier units, and N-way power combiners, where N is an integer greater than or equal to; the N-way power divider divides excitation signals into N with equal amplitude and phase The N-way signals after power division are output to the excitation terminals of the N power amplifier units of the power amplifier unit array, and after being amplified by the N power amplifier units, they are output to each input port of the N-way power combiner; the N-way power combiner combines the power amplifier array. The N-channel signals output after amplification are superimposed in phase, combined and output; the N-channel signal output ports after power division of the N-channel power divider are the cross-sectional shape of the three-dimensional space arrangement structure; each input port of the N-channel power combiner is a three-dimensional space The cross-sectional shape of the arrangement structure.

Further, the three-dimensional space arrangement structure includes a regular cube structure, and the cross-sectional shape of both ends is smaller than or the same as the cross-sectional shape of the middle portion.

Further, it includes a feeder circuit board, the N-way power divider, the feeder circuit board, the power amplifier unit array, and the N-way power combiner are arranged in sequence, and are tightened and fixed by a plurality of long screws, wherein the N-way power divider Between it and the power amplifier unit array, and between the power amplifier unit array and the N-way power combiner, bosses and grooves for limiting and supporting are provided.

Further, each port of the N-way power divider and each power amplifier unit excitation port of the power amplifier unit array are connected by a blind-plug RF coaxial connector, and each power amplifier unit output port of the power amplifier unit array is combined with the N-way power. Blind-mate RF coaxial connectors are used to connect the input ports of the device.

Further, the power amplifier unit array includes a lower base and an upper base; the connection structure of the lower base and the upper base includes any one of the following: the lower base and the upper base are fixed by screws, and after the fixing, the upper and lower bases form an internal hollow, and the hollow shape is Regular N-sided shape; or when N is an odd number, the lower base and the upper base are integrally processed and formed as a whole; the N power amplifier unit heat dissipation bottoms are installed close to the lower base and the upper base, fixed by screws, and smeared on the contact surface Thermal grease; after N power amplifier units are installed on the base, they are arranged in a circular or polygonal array.

Further, heat is extracted from the regular N-sided cube structure in the middle, and heat dissipation fins are placed around the middle of the product, or a cold plate with cooling liquid flow channels is placed around the middle of the product to dissipate heat.

The beneficial effects of the present invention include:

The design method of the embodiment of the present invention has high synthesis efficiency, effectively improves the working efficiency of the power amplifier, and can flexibly select the number of power amplifier units according to the needs of the system, so as to reduce the product cost and power consumption; the output power is high, which can reach the order of kilowatts;

The array type power amplifier product designed by the design method of the embodiment of the present invention has the following advantages: wide working bandwidth (up to 10 octaves or more), compact structure and easy maintenance and maintenance.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

Figure 1 is a schematic diagram of a power amplifier array using a binary topology synthesizer;

Figure 2 is a schematic diagram of a power amplifier array using a waveguide space power combiner;

Figure 3 is a schematic diagram of the appearance of a power amplifier array product;

Figure 4 is the heat dissipation diagram of the power amplifier array product;

Figure 5 is a schematic diagram of the composition relationship of power amplifier array products;

6 is a schematic diagram of the composition of a power amplifier unit array;

1-N-way power divider, 2-N-way power combiner, 3-power amplifier unit array, 4-long screw rod, 5-feeder circuit board, 6-lower base, 7-upper base, 8-N power amplifier units .

Detailed ways

All features disclosed in all embodiments in this specification, or steps in all methods or processes disclosed implicitly, except mutually exclusive features and/or steps, may be combined and/or expanded or replaced in any way. The technical concept, the technical problem solved, the working principle, the working process and the beneficial effect of the present invention will be further described in detail and fully below according to the accompanying drawings 2 to 6 .

The purpose of the embodiments of the present invention is to solve the problems of low synthesis efficiency, inflexible control of the number of power amplifier units, and large space occupied by the whole power amplifier in order to solve the problems of using a binary topology synthesizer circuit to design a power amplifier. A three-dimensional integration method of a power amplifier unit using a space power synthesizer circuit. The power amplifier designed by this method has the characteristics of high power synthesis efficiency, compact structure and flexible and controllable number of power amplifier units.

In a practical application process, a design and integration method of an array power amplifier based on a coaxial waveguide space power combiner is provided. The power amplifier product designed by this method has the characteristics of large output power, high synthesis efficiency, large power capacity, and compact structure. The principle is shown in Figure 2.

The power amplifier involved in the method includes an N-way power divider, a power amplifier array composed of N power amplifier units, and an N-way power combiner, where N is an integer greater than or equal to 2.

The working principle of the power amplifier involved in this method is described with reference to Figure 2: the N-channel power divider is used to divide the excitation signal into N-channels with equal amplitude and in-phase, and the N-channel signals after power division are output to the excitation end of each power amplifier unit. After the unit is amplified, it is output to each input port of the N-way power combiner. The N-way power combiner superimposes and combines the N-way signals outputted by the power amplifier array in the same phase, and outputs them after synthesis.

The N-way power divider used in the method divides the signals into N-way through a first-stage power division circuit, and the N output ports are arranged in a circle; For one road, N input ports are arranged in a circle. The N-way combiner adopts a coaxial waveguide structure to reduce transmission loss, improve combined power capacity, and expand working bandwidth.

The typical shape of the power amplifier product designed by this method is shown in Figure 3. The middle part of the product has a regular cubic structure (it can also be a regular polygonal columnar structure or a cylindrical structure), and the cross-sectional shape of both ends of the product is smaller than or the same as that of the middle part.

The heat dissipation diagram of the array power amplifier product is shown in Figure 4. When working, the heat must be radiated from the cube structure in the middle of the product. Cooling fins can be placed around the middle of the product, and a certain wind speed can be applied to dissipate heat; a cold plate with coolant flow channels can also be placed around the middle of the product to dissipate heat.

The composition and assembly relationship of each part of the array power amplifier product are described in conjunction with Figure 4: N-way power divider 1, feeding circuit board 5, power amplifier unit array 3, N-way power combiner 2 are arranged in sequence, and finally a plurality of long screws 4 Tighten and fasten, wherein between the N-way power divider 1 and the power amplifier unit array 3, and between the power amplifier unit array 3 and the N-way power combiner 2, there are bosses and grooves for limiting and supporting, including but not Limited to round and square.

Between the ports of the N-way power divider 1 and the excitation ports of the power amplifier units of the power amplifier unit array 3, and between the output ports of the power amplifier units of the power amplifier unit array 3 and the input ports of the N-way power combiner 2, blind insertion such as SMP is used. RF coaxial connectors are used for connection to achieve the purpose of reducing product size.

The composition of the power amplifier unit array 3 is described in conjunction with FIG. 5: it includes a lower base 6, an upper base 7, and N power amplifier units 8, wherein the lower base 6 and the upper base 7 are fixed by screws, and the upper and lower bases form an internal hollow after being fixed. is a regular N-gon. Structurally, the lower base 6 and the upper base 7 can also be integrally processed and formed as a whole, and N is suitable for odd numbers. The heat dissipation bottoms of the N power amplifier units 8 are installed in close contact with the lower base 6 and the upper base 7, and are fixed by screws. An appropriate amount of thermal grease can be applied to the contact surface to reduce the thermal resistance of the contact surface. After the N power amplifier units 8 are installed on the base, they are arranged in a circular array.

In order to verify the correctness of the embodiments of the present invention, a 14-channel array power amplifier product in the frequency band of 2 GHz to 18 GHz is designed, as shown in FIG. 3 . After testing, the power synthesis efficiency of the power amplifier product is higher than 93%, the efficiency of the whole machine is equivalent to the efficiency of the power amplifier unit, the output power of the full working frequency band is greater than 100W, and the product size is 150mm×60mm×60mm.

Embodiment 1: A three-dimensional integrated design method for a power amplifier product, including signal connection between a power distributor and a power amplifier unit in a three-dimensional space, and a signal connection between the power amplifier unit and a power combiner in the three-dimensional space.

Embodiment 2: on the basis of embodiment 1, including sub-steps:

The N-way power divider is used to divide the excitation signal into N-way with equal amplitude and phase. The N-way signal after power division is output to the excitation end of each power amplifier unit. After being amplified by the power amplifier unit, it is output to each input port of the N-way power combiner. ; The N-way power combiner superimposes the N-way signals outputted by each power amplifier unit in the same phase, and outputs after synthesis; the N-way power divider's power-divided N-way signals are transmitted in three-dimensional space, and each input of the N-way power combiner Signals are received from three-dimensional space; N is an integer greater than or equal to 2.

Embodiment 3: On the basis of Embodiment 2, the N-way power combiner adopts a coaxial waveguide structure.

Embodiment 4: On the basis of any of Embodiments 1 to 3, the cross-sectional shape of the three-dimensional space includes a circle and a polygon.

Embodiment 5: A power amplifier product, including N-way power divider 1, a power amplifier unit array 3 composed of N power amplifier units 8, and N-way power combiner 2, where N is an integer greater than or equal to 2; N-way power divider 1. Divide the excitation signal into N channels with equal amplitude and phase, and output the N-channel signals after power division to the excitation terminals of the N power amplifier units in the power amplifier unit array 3. After being amplified by the N power amplifier units, it is output to the N-channel power combiner 2 Each input port; N-way power combiner 2 superimposes the N-way signals outputted by the power amplifier array in the same phase, and outputs after synthesis; Cross-sectional shape; each input port of the N-way power combiner 2 is the cross-sectional shape of a three-dimensional space arrangement structure.

Embodiment 6: On the basis of Embodiment 5, the three-dimensional space arrangement structure includes a regular cube structure, and the cross-sectional shape of both ends is smaller than or the same as the cross-sectional shape of the middle portion.

Embodiment 7: On the basis of Embodiment 5, it includes a feeder circuit board 5, the N-way power divider 1, the feeder circuit board 5, the power amplifier unit array 3, and the N-way power combiner 2 are arranged in sequence, and are composed of A plurality of long screws 4 are tightened and fixed, wherein between the N-way power divider 1 and the power amplifier unit array 3, and between the power amplifier unit array 3 and the N-way power combiner 2 are provided with bosses and recesses for limiting and supporting. groove.

Embodiment 8: On the basis of Embodiment 5, the ports of the N-way power divider 1 and the excitation ports of the power amplifier units of the power amplifier unit array 3 are connected by blind-plug RF coaxial connectors, and the power amplifier unit The output ports of the power amplifier units of the array 3 and the input ports of the N-way power combiner 2 are connected by blind-plug RF coaxial connectors.

Embodiment 9: On the basis of Embodiment 5, the power amplifier unit array 3 includes a lower base 6 and an upper base 7; the connection structure of the lower base 6 and the upper base 7 includes any of the following: the lower base 6 and the upper base 7 By screw fixing, the upper and lower bases form an internal hollow after fixing, and the hollow shape is a regular N-gon; or when N is an odd number, the lower base 6 and the upper base 7 are integrally processed and formed as a whole;

The heat dissipation bottom of the N power amplifier units 8 is installed in close contact with the lower base 6 and the upper base 7, fixed by screws, and thermally conductive silicone grease is applied to the contact surface; after the N power amplifier units 8 are installed on the base, they are circular or polygonal Array arrangement.

Example 10: On the basis of Example 5, heat is exported from around the regular N-sided cube structure in the middle, and heat dissipation fins are placed around the middle of the product, or a cold plate with cooling liquid flow channels is placed around the middle of the product. heat dissipation.

The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

The above technical solution is only an embodiment of the present invention. For those skilled in the art, on the basis of the application methods and principles disclosed in the present invention, it is easy to make various types of improvements or deformations, not limited to The methods described in the above-mentioned specific embodiments of the present invention, therefore, the methods described above are only preferred, and have no restrictive meaning.

In addition to the above examples, those skilled in the art can obtain enlightenment from the above disclosure or use knowledge or technology in related fields to make changes to obtain other embodiments, the features of each embodiment can be interchanged or replaced, and the changes and changes made by those skilled in the art Without departing from the spirit and scope of the present invention, all should fall within the protection scope of the appended claims of the present invention.

Claims (10)

1. A power amplifier product three-dimensional integrated design method is characterized by comprising a power divider and a power amplifier unit which are in signal connection in a three-dimensional space, and the power amplifier unit is in signal connection with a power synthesizer in the three-dimensional space.

2. The power amplifier product three-dimensional integrated design method according to claim 1, comprising the substeps of:

dividing the excitation signal into N paths in equal amplitude and in phase by adopting an N-path power divider, outputting the N paths of signals subjected to power division to an excitation end of each power amplification unit, amplifying the signals by the power amplification units, and outputting the signals to input ports of the N-path power synthesizer; the N paths of power synthesizers superpose and synthesize the same-phase pairs of N paths of signals output by the amplified power amplification units and output the same-phase pairs of the signals; n paths of signals after power division of the N paths of power dividers are transmitted in a three-dimensional space, and input signals of the N paths of power synthesizers are received from the three-dimensional space; n is an integer of 2 or more.

3. The power amplifier product three-dimensional integration design method of claim 2, wherein the N-path power combiner adopts a coaxial waveguide structure.

4. The power amplifier product three-dimensional integration design method according to any one of claims 1 to 3, wherein the cross-sectional shape of the three-dimensional space includes a circle and a polygon.

5. A power amplifier product is characterized by comprising N paths of power distributors (1), a power amplifier unit array (3) consisting of N power amplifier units (8) and N paths of power synthesizers (2), wherein N is an integer more than or equal to 2; the N paths of power distributors (1) divide the excitation signals into N paths of signals in equal amplitude and in phase, the N paths of signals after power division are output to excitation ends of N power amplification units of a power amplification unit array (3), and the signals are amplified by the N power amplification units and then output to input ports of N paths of power synthesizers (2); the N paths of power synthesizers (2) superpose and synthesize in-phase pairs of N paths of signals and the like output after the amplification of the power amplifier array and output; n signal output ports of the N power distributors (1) after power division are in the cross section shape of a three-dimensional space arrangement structure; each input port of the N-path power combiner (2) is in a cross section shape of a three-dimensional spatial arrangement structure.

6. The power amplifier product according to claim 5, wherein the three-dimensional arrangement structure comprises a regular cubic structure, and the cross-sectional shapes of the two ends are smaller than or equal to the cross-sectional shape of the middle part.

7. The power amplifier product according to claim 5, comprising a feed circuit board (5), wherein the N power dividers (1), the feed circuit board (5), the power amplifier unit array (3) and the N power combiner (2) are sequentially arranged and tightened and fixed by a plurality of long screws (4), wherein bosses and grooves for limiting and supporting are respectively arranged between the N power dividers (1) and the power amplifier unit array (3) and between the power amplifier unit array (3) and the N power combiner (2).

8. The power amplifier product according to claim 5, characterized in that each port of the N-way power divider (1) is connected with each exciting port of the power amplifier unit array (3) by a blind-mate RF coaxial connector, and each output port of the power amplifier unit array (3) is connected with each input port of the N-way power combiner (2) by a blind-mate RF coaxial connector.

9. The power amplifier product according to claim 5, characterized in that the power amplifier cell array (3) comprises a lower base (6) and an upper base (7); the connecting structure of the lower base (6) and the upper base (7) comprises any one of the following structures: the lower base (6) and the upper base (7) are fixed through screws, and after the upper base and the lower base are fixed, an inner hollow is formed and the hollow shape is a regular N-shaped polygon; or when N is an odd number, the lower base (6) and the upper base (7) are integrally processed and formed;

the heat dissipation bottoms of the N power amplifier units (8) are tightly attached to the lower base (6) and the upper base (7) and fixed through screws, and heat-conducting silicone grease is coated on the contact surface; the N power amplifier units (8) are arranged on the base in a circular ring shape or polygonal array.

10. The power amplifier product of claim 5, wherein heat is derived from the periphery of the regular N-sided polygonal cubic structure in the middle, and heat dissipation fins are disposed around the middle of the product, or a cold plate with a coolant channel is disposed around the middle of the product for heat dissipation.

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