WO2017198029A1

WO2017198029A1 - Heat dissipation apparatus and projection device

Info

Publication number: WO2017198029A1
Application number: PCT/CN2017/081158
Authority: WO
Inventors: 谢涛; 林伟; 李屹
Original assignee: 深圳市光峰光电技术有限公司
Priority date: 2016-05-19
Filing date: 2017-04-19
Publication date: 2017-11-23
Also published as: CN205793888U

Abstract

Disclosed are a heat dissipation apparatus and a projection device. The heat dissipation apparatus comprises: a first substrate having a heat source heat-conducting portion and a heat dissipation heat-conducting portion, wherein the heat source heat-conducting portion is in thermal connection with a heat source; a heat tube fixed on the first substrate, wherein a part of the heat tube is located on the heat source heat-conducting portion of the first substrate, and an end part of the heat tube is located on the heat dissipation heat-conducting portion of the first substrate; and a heat dissipation fin in thermal connection with the heat dissipation heat-conducting portion of the first substrate. A projection device, comprising a light source module and the above-mentioned heat dissipation apparatus, wherein a mounting face of the light source module is in thermal connection with the heat source heat-conducting portion of the first substrate. Since the middle of the heat tube is a heat absorption end, and two ends of the heat tube are heat dissipation ends, two invalid ends at two ends are placed at the heat dissipation ends; thus, the heat tube can quickly conduct heat to the two ends thereof, which has a better heat dissipation effect. Furthermore, the distance from the heat absorption end of the heat tube to the heat dissipation ends is half the length of the heat tube, and the heat tube is inlaid in the first substrate; as a result, greater impact can be borne without deformation.

Description

Heat sink and projection device

Technical field

The present application relates to the field of optical heat dissipation technologies, and in particular, to a heat dissipation device and a projection device.

Background technique

At present, LED is a kind of heat source, and the luminous efficiency of LED is still relatively low, and a large amount of energy consumed is converted into heat energy, thereby causing an increase in junction temperature and a decrease in life. The reason why the LED heats up is because the added electric energy is not converted into light energy, but a part is converted into heat energy. The luminous efficacy of LEDs is currently only 100lm/W, and its electro-optical conversion efficiency is only about 20~30%. That is to say, about 70% of the electrical energy becomes heat. Therefore, when the light source module is in operation, the temperature rises sharply due to heat generation. Since the imaging lamp generates a large amount of heat and the heat source is concentrated, the conventional heat dissipation method for the high-power imaging lamp can not meet the heat dissipation requirement of the device, and the heat dissipation structure of the substrate + heat pipe + fin is currently used, as shown in FIG. 1 and FIG. 2 . The substrate 102c is in contact with the LED light source module (heat source) 101. One end of the heat pipe 102a is connected to the substrate 102c, and the other end is connected to the heat dissipation fin 102b. The heat conductivity of the heat pipe 102 is used (the thermal conductivity is 20 times or more of copper). It is quickly conducted to the heat sink fins 102b, and the heat is taken away by the convection of the heat sink fins and air. One end of the heat pipe is connected to the other end of the heat source and connected to the fin. Since the ends of the heat pipe are about 10 mm as the ineffective end, the heat pipe can not be used for high-efficiency heat conduction, and the heat pipe tail end of the substrate connection end can not play a soaking effect, resulting in a temperature difference between the upper and lower sides of the heat sink substrate. Large, resulting in a local temperature of the light source is too high, eventually resulting in lower efficiency of the heat pipe, and because the heat pipe is a hollow copper pipe, the wall thickness is thin, and it is easy to deform and fail when subjected to impact.

technical problem

The existing heat dissipation scheme and the end of the heat pipe at the connection end of the substrate cannot perform the soaking effect, resulting in a large temperature difference between the upper and lower sides of the heat sink substrate, thereby causing the local temperature of the light source to be too high, and the heat pipe heat pipe efficiency is low; the wall thickness of the common heat pipe is 0.3~0.5 Mm, the strength is not enough, when the imaging lamp module is subjected to impact (during transportation or use), the radiator is easily deformed, resulting in a decrease or even failure of the heat sink; the heat pipe end of the heat pipe and the heat release end are longer, and the heat source is located at a heat release. When the upper end is closed, the heat pipe is affected by gravity, and the performance is degraded, which will not meet the heat dissipation requirements of the light source, so the product cannot meet the requirements for free rotation of the product space.

Technical solution

The present application provides a heat dissipating device and a projection device that have good heat dissipation effect and are not easily deformed.

According to a first aspect, an embodiment provides a heat dissipation device, including:

a first substrate having a heat source heat conducting portion and a heat dissipating heat conducting portion, wherein the heat source heat conducting portion is thermally connected to the heat source;

a heat pipe, which is fixed on the first substrate, a portion of the heat pipe is located on the heat transfer portion of the heat source of the first substrate, and an end of the heat pipe is located on the heat dissipation heat transfer portion of the first substrate;

And a heat dissipation fin that is thermally connected to the heat dissipation heat conducting portion of the first substrate.

Further, the first substrate is H-shaped, and the middle portion of the first substrate has a heat conduction portion of the heat source, and both sides are heat dissipation heat conduction portions.

Further, the heat pipe has a plurality of heat-dissipating portions on the same side of the first substrate, or both ends of the heat pipe are respectively located on the heat-dissipating heat-conducting portions on both sides of the first substrate.

Further, a middle portion of one side of the first substrate is in contact with a heat source, and the heat pipe is welded to the other surface of the first substrate.

Further, a heat conductive medium is disposed between the first substrate and the heat source.

Further, a central portion of the first substrate is provided with a circular hole for transmitting light, and an annular isolation groove is provided at a position close to the circular hole on the surface of the first substrate in contact with the heat source.

Further, the second substrate further includes a shape of the second substrate in a middle portion of the first substrate, and the second substrate is mounted in a middle portion of the first substrate and covers the heat pipe.

Further, the heat dissipation fins comprise four groups, each of which is mounted on two sides of one side of the first substrate, and four sets of heat dissipation fins sandwich the two sides of the first substrate.

Further, the heat dissipation fins are formed by laminating a plurality of heat dissipation fins, and the heat dissipation fins have a predetermined gap therebetween.

According to a second aspect, an embodiment provides a projection apparatus including a light source module and the heat dissipation device, wherein a mounting surface of the light source module is thermally coupled to a heat conducting portion of the heat source of the first substrate.

Beneficial effect

According to the heat dissipating device and the projection device of the above embodiment, the heat dissipating device is located on the heat conducting portion of the heat source of the first substrate, and the end portion of the heat pipe is located on the heat dissipating heat conducting portion of the first substrate, and the heat conducting portion and the heat source of the heat source of the first substrate are The heat-dissipating heat-dissipating portion of the first substrate is thermally connected to the heat-dissipating fins, so that the middle portion of the heat pipe is a heat-absorbing end, and the heat-pipe ends are heat-dissipating ends, and the ineffective ends of the two ends are placed at the heat-dissipating end, so that the heat pipe can quickly transfer heat. Conducted to both ends, has a better heat dissipation effect, and the distance from the heat absorption end of the heat pipe to the heat dissipation end is half of the length of the heat pipe, and the heat pipe is mounted on the first substrate, so that it can withstand greater impact and is not easily deformed. Therefore, the projection device equipped with the heat sink has better heat dissipation effect.

DRAWINGS

1 is a schematic structural view of a heat sink device in the prior art;

2 is a structural exploded view of a heat dissipating device in the prior art;

3 is a schematic structural view of a heat sink device in an embodiment;

4 is an exploded view showing the structure of a heat dissipating device in an embodiment;

FIG. 5 is a schematic structural view of a first substrate in an embodiment; FIG.

Figure 6 is a cross-sectional view taken along line A-A of Figure 5;

Fig. 7 is a partial enlarged view C of Fig. 6.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1:

As shown in FIG. 3 and FIG. 4, the embodiment provides a heat dissipation device, which mainly includes a heat pipe 202a, a heat dissipation fin 202b, and a first substrate 202c. The heat dissipating device of this embodiment can be installed in an optical device or other setting with a heat source, for example, installed in a projection device to cool and cool the projection device.

As shown in FIG. 5, the first substrate 202c is H-shaped, has a middle portion and two sides having a certain area, a heat conduction portion 202f in the middle portion, a heat dissipation portion 202g on both sides, and a heat conduction portion 202f on one side of the first substrate 202c. The heat pipe 202a has a plurality of heat pipes 202a fixed to the other surface of the first substrate 202c, and the heat pipe 202a is partially located on the heat source heat conducting portion 202f of the middle portion of the first substrate 202c, and the two ends of the heat pipe 202a are respectively On the heat dissipating heat transfer portion 202g on both sides of the first substrate 202c, in other embodiments, both ends of the heat pipe 202a may be located on the heat dissipating heat transfer portion 202g on the same side of the first substrate 202c as long as the heat pipe 202a is partially located in the middle of the first substrate 202c. The heat source heat conducting portion 202f may be disposed on the same side of the first substrate 202c, and the two ends of the other heat pipes 202a are respectively located at two sides of the first substrate 202c.

In this embodiment, the heat pipe 202a is mounted on the surface of the first substrate 202c by a soldering process. In order to protect the heat pipe 202a in the middle of the first substrate 202c and improve the heat conduction effect, the heat sink further includes a second substrate 202d and a second substrate 202d. Consistent with the structure of the middle portion of the first substrate 202c, the second substrate 202d can cover the heat source heat conducting portion in the middle of the first substrate 202c without occupying other space, and the second substrate 202d covers the heat pipe 202a located in the middle of the first substrate 202c. The impact resistance of the heat pipe 202a is improved, and the heat pipe 202a is capable of dissipating part of the heat through the second substrate 202d, thereby improving heat dissipation efficiency.

In other embodiments, the heat pipe 202a is directly embedded inside the first substrate 202c. The heat pipe 202a also has good impact resistance and heat dissipation.

In order to avoid the projection light, the same circular hole is provided at the intermediate position between the first substrate 202c and the second substrate 202d.

In order to increase the thermal conductivity of the first substrate 202c and the heat source, a heat conductive medium is filled between the first substrate 202c and the heat source, and the heat conductive medium is filled in a liquid form between the first substrate 202c and the heat source to form a heat conductive solid after filling. The heat conductive medium fills a gap between the first substrate 202c and the heat source, the heat conductive medium increases the contact surface of the first substrate 202c and the heat source, and the heat conductive medium has a good heat conduction effect, and reduces the space between the first substrate 202c and the heat source. Thermal resistance. Therefore, the heat transfer medium greatly enhances heat conduction between the first substrate 202c and the heat source.

As shown in FIG. 5, FIG. 6, and FIG. 7, since the heat conductive medium is in a liquid state during the filling process, in order to prevent the heat conductive medium from penetrating into the circular hole of the first substrate 202c, thereby contaminating the light source, the first substrate 202c is in contact with the heat source. An annular isolation groove 202e is disposed at a position close to the circular hole, and the leaked heat conductive medium is collected by the isolation groove 202e, so that the heat conductive medium is blocked by the isolation groove 202e, and does not leak into the circular hole to affect the light source.

As shown in FIG. 3 and FIG. 4, the heat dissipation fins 202b have four groups, and each set of heat dissipation fins 202b is formed by stacking a plurality of heat dissipation fins, and the heat dissipation fins have a certain spacing between them, thereby increasing the heat dissipation area and improving the heat dissipation effect. . The two sets of heat dissipation fins 202b sandwich one side of the first substrate 202c, and the four sets of heat dissipation fins 202b sandwich both sides of the first substrate 202c.

In the heat dissipating device provided in this embodiment, the heat pipe portion is located on the heat conducting portion 202f of the first substrate, and the end portion of the heat pipe is located on the heat dissipating heat conducting portion 202g of the first substrate, and the heat conducting portion 202f is thermally connected to the heat source to avoid The heat pipe has an ineffective end, and the plurality of heat pipes substantially cover the entire heat source heat conducting portion 202f. The mounting surface has good heat and no hot spots, so that the heat on the heat source mounting surface can be uniformly absorbed; the heat pipe 202a is an endothermic end, and both ends are exothermic. The end is equivalent to two heat pipes connected in series, and the heat dissipation capability is greatly improved compared with the existing heat dissipation scheme, which is 1.5 to 2 times of the existing heat dissipation scheme; at the same time, the heat pipe end of the heat pipe and the heat release end path are short, and the influence by gravity is small. The heat dissipation of the product during the rotation process is hardly affected, and the requirement for free rotation of the product can be satisfied; the heat pipe 202a is welded on the first substrate 202c, and the heat pipe is not deformed by the external impact, and is not affected by the impact and is not easily deformed.

Embodiment 2:

The present embodiment provides a projection device, including a light source module and a heat sink 202 in the first embodiment. The mounting surface of the light source module is in contact with the heat source heat conducting portion 202f of the first substrate 202c of the heat sink to form a thermal connection.

The heat dissipating device dissipates heat from the heat source light source module. Since the first substrate 202c and the light source module are filled with the heat conductive medium, the thermal resistance between the first substrate 202c and the light source module is reduced, and the first substrate 202c and the light source module are improved. The thermal conductivity between the groups enables the heat sink 202 to quickly cool the heat of the light source module.

It should be noted that the thermal connection described in the above embodiments may mean that the two components are in direct contact and connected, or may be connected to each other through a heat conductive medium or/and a heat conductive component, as long as the heat conduction effect is achieved.

The invention has been described above with reference to specific examples, which are merely intended to aid the understanding of the invention and are not intended to limit the invention. For the person skilled in the art to which the invention pertains, several simple derivations, variations or substitutions can be made in accordance with the inventive concept.

Claims

A heat dissipation device, comprising:

a heat pipe fixed on the first substrate, a portion of the heat pipe is located on a heat conducting portion of the heat source of the first substrate, and an end of the heat pipe is located on a heat dissipating heat conducting portion of the first substrate;

And a heat dissipation fin that is thermally connected to the heat dissipation heat conduction portion of the first substrate.

2. The heat dissipating device according to claim 1, wherein the first substrate is in an H-shape, and the first substrate has a heat-dissipating portion at a central portion thereof and a heat-dissipating portion on both sides.

3. The heat dissipating device according to claim 2, wherein the heat pipe has a plurality of heat pipes having two ends on the same side of the first substrate, or two ends of the heat pipe are respectively located The heat dissipation heat conducting portions on both sides of the first substrate.

4. The heat dissipation device according to claim 3, wherein a middle portion of one side of the first substrate is in contact with a heat source, and the heat pipe is fixed to the other surface of the first substrate.

5. The heat sink according to claim 4, wherein a heat conducting medium is disposed between the first substrate and the heat source.

6. The heat dissipating device according to claim 5, wherein a central portion of the first substrate is provided with a circular hole for transmitting light, and a position close to the circular hole on a surface of the first substrate in contact with the heat source There is a ring-shaped isolation groove.

7. The heat dissipation device according to claim 4 or 6, further comprising a second substrate, wherein the second substrate has a shape conforming to a central portion of the first substrate, and the second substrate is mounted at a middle portion of the first substrate And covering the heat pipe.

8. The heat dissipation device according to claim 7, wherein the heat dissipation fins comprise four groups, each of which is mounted on two sides of one side of the first substrate, and four sets of the heat dissipation fins Clamped on both sides of a substrate.

9. The heat dissipation device according to claim 8, wherein each of the heat dissipation fins is formed by laminating a plurality of heat dissipation fins, and the heat dissipation fins have a predetermined gap therebetween.

10. A projection apparatus comprising: a light source module and the heat dissipation device according to any one of claims 1 to 9, wherein a mounting surface of the light source module is thermally connected to a heat source heat conducting portion of the first substrate.