WO2017198029A1 - Appareil de dissipation de chaleur et dispositif de projection - Google Patents

Appareil de dissipation de chaleur et dispositif de projection Download PDF

Info

Publication number
WO2017198029A1
WO2017198029A1 PCT/CN2017/081158 CN2017081158W WO2017198029A1 WO 2017198029 A1 WO2017198029 A1 WO 2017198029A1 CN 2017081158 W CN2017081158 W CN 2017081158W WO 2017198029 A1 WO2017198029 A1 WO 2017198029A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
substrate
heat dissipation
source
conducting portion
Prior art date
Application number
PCT/CN2017/081158
Other languages
English (en)
Chinese (zh)
Inventor
谢涛
林伟
李屹
Original Assignee
深圳市光峰光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市光峰光电技术有限公司 filed Critical 深圳市光峰光电技术有限公司
Publication of WO2017198029A1 publication Critical patent/WO2017198029A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of optical heat dissipation technologies, and in particular, to a heat dissipation device and a projection device.
  • LED is a kind of heat source, and the luminous efficiency of LED is still relatively low, and a large amount of energy consumed is converted into heat energy, thereby causing an increase in junction temperature and a decrease in life.
  • the reason why the LED heats up is because the added electric energy is not converted into light energy, but a part is converted into heat energy.
  • the luminous efficacy of LEDs is currently only 100lm/W, and its electro-optical conversion efficiency is only about 20 ⁇ 30%. That is to say, about 70% of the electrical energy becomes heat. Therefore, when the light source module is in operation, the temperature rises sharply due to heat generation.
  • the conventional heat dissipation method for the high-power imaging lamp can not meet the heat dissipation requirement of the device, and the heat dissipation structure of the substrate + heat pipe + fin is currently used, as shown in FIG. 1 and FIG. 2 .
  • the substrate 102c is in contact with the LED light source module (heat source) 101.
  • One end of the heat pipe 102a is connected to the substrate 102c, and the other end is connected to the heat dissipation fin 102b.
  • the heat conductivity of the heat pipe 102 is used (the thermal conductivity is 20 times or more of copper).
  • the heat pipe It is quickly conducted to the heat sink fins 102b, and the heat is taken away by the convection of the heat sink fins and air.
  • One end of the heat pipe is connected to the other end of the heat source and connected to the fin. Since the ends of the heat pipe are about 10 mm as the ineffective end, the heat pipe can not be used for high-efficiency heat conduction, and the heat pipe tail end of the substrate connection end can not play a soaking effect, resulting in a temperature difference between the upper and lower sides of the heat sink substrate. Large, resulting in a local temperature of the light source is too high, eventually resulting in lower efficiency of the heat pipe, and because the heat pipe is a hollow copper pipe, the wall thickness is thin, and it is easy to deform and fail when subjected to impact.
  • the existing heat dissipation scheme and the end of the heat pipe at the connection end of the substrate cannot perform the soaking effect, resulting in a large temperature difference between the upper and lower sides of the heat sink substrate, thereby causing the local temperature of the light source to be too high, and the heat pipe heat pipe efficiency is low;
  • the wall thickness of the common heat pipe is 0.3 ⁇ 0.5 Mm, the strength is not enough, when the imaging lamp module is subjected to impact (during transportation or use), the radiator is easily deformed, resulting in a decrease or even failure of the heat sink;
  • the heat pipe end of the heat pipe and the heat release end are longer, and the heat source is located at a heat release.
  • the present application provides a heat dissipating device and a projection device that have good heat dissipation effect and are not easily deformed.
  • an embodiment provides a heat dissipation device, including:
  • a first substrate having a heat source heat conducting portion and a heat dissipating heat conducting portion, wherein the heat source heat conducting portion is thermally connected to the heat source;
  • a heat pipe which is fixed on the first substrate, a portion of the heat pipe is located on the heat transfer portion of the heat source of the first substrate, and an end of the heat pipe is located on the heat dissipation heat transfer portion of the first substrate;
  • a heat dissipation fin that is thermally connected to the heat dissipation heat conducting portion of the first substrate.
  • the first substrate is H-shaped, and the middle portion of the first substrate has a heat conduction portion of the heat source, and both sides are heat dissipation heat conduction portions.
  • the heat pipe has a plurality of heat-dissipating portions on the same side of the first substrate, or both ends of the heat pipe are respectively located on the heat-dissipating heat-conducting portions on both sides of the first substrate.
  • a middle portion of one side of the first substrate is in contact with a heat source, and the heat pipe is welded to the other surface of the first substrate.
  • a heat conductive medium is disposed between the first substrate and the heat source.
  • a central portion of the first substrate is provided with a circular hole for transmitting light, and an annular isolation groove is provided at a position close to the circular hole on the surface of the first substrate in contact with the heat source.
  • the second substrate further includes a shape of the second substrate in a middle portion of the first substrate, and the second substrate is mounted in a middle portion of the first substrate and covers the heat pipe.
  • the heat dissipation fins comprise four groups, each of which is mounted on two sides of one side of the first substrate, and four sets of heat dissipation fins sandwich the two sides of the first substrate.
  • the heat dissipation fins are formed by laminating a plurality of heat dissipation fins, and the heat dissipation fins have a predetermined gap therebetween.
  • an embodiment provides a projection apparatus including a light source module and the heat dissipation device, wherein a mounting surface of the light source module is thermally coupled to a heat conducting portion of the heat source of the first substrate.
  • the heat dissipating device is located on the heat conducting portion of the heat source of the first substrate, and the end portion of the heat pipe is located on the heat dissipating heat conducting portion of the first substrate, and the heat conducting portion and the heat source of the heat source of the first substrate are
  • the heat-dissipating heat-dissipating portion of the first substrate is thermally connected to the heat-dissipating fins, so that the middle portion of the heat pipe is a heat-absorbing end, and the heat-pipe ends are heat-dissipating ends, and the ineffective ends of the two ends are placed at the heat-dissipating end, so that the heat pipe can quickly transfer heat.
  • the projection device equipped with the heat sink has better heat dissipation effect.
  • FIG. 1 is a schematic structural view of a heat sink device in the prior art
  • FIG. 2 is a structural exploded view of a heat dissipating device in the prior art
  • FIG. 3 is a schematic structural view of a heat sink device in an embodiment
  • FIG. 4 is an exploded view showing the structure of a heat dissipating device in an embodiment
  • FIG. 5 is a schematic structural view of a first substrate in an embodiment
  • Figure 6 is a cross-sectional view taken along line A-A of Figure 5;
  • Fig. 7 is a partial enlarged view C of Fig. 6.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the embodiment provides a heat dissipation device, which mainly includes a heat pipe 202a, a heat dissipation fin 202b, and a first substrate 202c.
  • the heat dissipating device of this embodiment can be installed in an optical device or other setting with a heat source, for example, installed in a projection device to cool and cool the projection device.
  • the first substrate 202c is H-shaped, has a middle portion and two sides having a certain area, a heat conduction portion 202f in the middle portion, a heat dissipation portion 202g on both sides, and a heat conduction portion 202f on one side of the first substrate 202c.
  • the heat pipe 202a has a plurality of heat pipes 202a fixed to the other surface of the first substrate 202c, and the heat pipe 202a is partially located on the heat source heat conducting portion 202f of the middle portion of the first substrate 202c, and the two ends of the heat pipe 202a are respectively On the heat dissipating heat transfer portion 202g on both sides of the first substrate 202c, in other embodiments, both ends of the heat pipe 202a may be located on the heat dissipating heat transfer portion 202g on the same side of the first substrate 202c as long as the heat pipe 202a is partially located in the middle of the first substrate 202c.
  • the heat source heat conducting portion 202f may be disposed on the same side of the first substrate 202c, and the two ends of the other heat pipes 202a are respectively located at two sides of the first substrate 202c.
  • the heat pipe 202a is mounted on the surface of the first substrate 202c by a soldering process.
  • the heat sink further includes a second substrate 202d and a second substrate 202d. Consistent with the structure of the middle portion of the first substrate 202c, the second substrate 202d can cover the heat source heat conducting portion in the middle of the first substrate 202c without occupying other space, and the second substrate 202d covers the heat pipe 202a located in the middle of the first substrate 202c.
  • the impact resistance of the heat pipe 202a is improved, and the heat pipe 202a is capable of dissipating part of the heat through the second substrate 202d, thereby improving heat dissipation efficiency.
  • the heat pipe 202a is directly embedded inside the first substrate 202c.
  • the heat pipe 202a also has good impact resistance and heat dissipation.
  • the same circular hole is provided at the intermediate position between the first substrate 202c and the second substrate 202d.
  • a heat conductive medium is filled between the first substrate 202c and the heat source, and the heat conductive medium is filled in a liquid form between the first substrate 202c and the heat source to form a heat conductive solid after filling.
  • the heat conductive medium fills a gap between the first substrate 202c and the heat source, the heat conductive medium increases the contact surface of the first substrate 202c and the heat source, and the heat conductive medium has a good heat conduction effect, and reduces the space between the first substrate 202c and the heat source. Thermal resistance. Therefore, the heat transfer medium greatly enhances heat conduction between the first substrate 202c and the heat source.
  • the first substrate 202c is in contact with the heat source.
  • An annular isolation groove 202e is disposed at a position close to the circular hole, and the leaked heat conductive medium is collected by the isolation groove 202e, so that the heat conductive medium is blocked by the isolation groove 202e, and does not leak into the circular hole to affect the light source.
  • the heat dissipation fins 202b have four groups, and each set of heat dissipation fins 202b is formed by stacking a plurality of heat dissipation fins, and the heat dissipation fins have a certain spacing between them, thereby increasing the heat dissipation area and improving the heat dissipation effect. .
  • the two sets of heat dissipation fins 202b sandwich one side of the first substrate 202c, and the four sets of heat dissipation fins 202b sandwich both sides of the first substrate 202c.
  • the heat pipe portion is located on the heat conducting portion 202f of the first substrate, and the end portion of the heat pipe is located on the heat dissipating heat conducting portion 202g of the first substrate, and the heat conducting portion 202f is thermally connected to the heat source to avoid
  • the heat pipe has an ineffective end, and the plurality of heat pipes substantially cover the entire heat source heat conducting portion 202f.
  • the mounting surface has good heat and no hot spots, so that the heat on the heat source mounting surface can be uniformly absorbed; the heat pipe 202a is an endothermic end, and both ends are exothermic.
  • the end is equivalent to two heat pipes connected in series, and the heat dissipation capability is greatly improved compared with the existing heat dissipation scheme, which is 1.5 to 2 times of the existing heat dissipation scheme; at the same time, the heat pipe end of the heat pipe and the heat release end path are short, and the influence by gravity is small.
  • the heat dissipation of the product during the rotation process is hardly affected, and the requirement for free rotation of the product can be satisfied; the heat pipe 202a is welded on the first substrate 202c, and the heat pipe is not deformed by the external impact, and is not affected by the impact and is not easily deformed.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the present embodiment provides a projection device, including a light source module and a heat sink 202 in the first embodiment.
  • the mounting surface of the light source module is in contact with the heat source heat conducting portion 202f of the first substrate 202c of the heat sink to form a thermal connection.
  • the heat dissipating device dissipates heat from the heat source light source module. Since the first substrate 202c and the light source module are filled with the heat conductive medium, the thermal resistance between the first substrate 202c and the light source module is reduced, and the first substrate 202c and the light source module are improved. The thermal conductivity between the groups enables the heat sink 202 to quickly cool the heat of the light source module.
  • thermal connection described in the above embodiments may mean that the two components are in direct contact and connected, or may be connected to each other through a heat conductive medium or/and a heat conductive component, as long as the heat conduction effect is achieved.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Projection Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un appareil de dissipation de chaleur et un dispositif de projection. L'appareil de dissipation de chaleur comprend : un premier substrat comportant une partie thermoconductrice de source de chaleur et une partie thermoconductrice de dissipation de chaleur, la partie thermoconductrice de source de chaleur étant en liaison thermique avec une source de chaleur; un tube thermique fixé sur le premier substrat, une partie du tube thermique étant placée sur la partie thermoconductrice de source de chaleur du premier substrat, et une partie d'extrémité du tube thermique étant placée sur la partie thermoconductrice de dissipation de chaleur du premier substrat; et une ailette de dissipation de chaleur en liaison thermique avec la partie thermoconductrice de dissipation de chaleur du premier substrat. Le dispositif de projection comprend un module source de lumière et l'appareil de dissipation de chaleur susmentionné, une face de montage du module source de lumière étant en liaison thermique avec la partie thermoconductrice de source de chaleur du premier substrat. Étant donné que le milieu du tube thermique est une extrémité d'absorption de chaleur, et que deux extrémités du tube thermique sont des extrémités de dissipation de chaleur, deux extrémités invalides à deux extrémités sont placées au niveau des extrémités de dissipation de chaleur; ainsi, le tube thermique peut rapidement conduire la chaleur jusqu'à ses deux extrémités, ce qui offre un meilleur effet de dissipation de chaleur. En outre, la distance entre l'extrémité d'absorption de chaleur du tube thermique et les extrémités de dissipation de chaleur est égale à la moitié de la longueur du tube thermique, et le tube thermique est incrusté dans le premier substrat; en conséquence, un impact plus fort peut être supporté sans déformation.
PCT/CN2017/081158 2016-05-19 2017-04-19 Appareil de dissipation de chaleur et dispositif de projection WO2017198029A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201620460603.4U CN205793888U (zh) 2016-05-19 2016-05-19 一种散热装置及投影设备
CN201620460603.4 2016-05-19

Publications (1)

Publication Number Publication Date
WO2017198029A1 true WO2017198029A1 (fr) 2017-11-23

Family

ID=58117407

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/081158 WO2017198029A1 (fr) 2016-05-19 2017-04-19 Appareil de dissipation de chaleur et dispositif de projection

Country Status (2)

Country Link
CN (1) CN205793888U (fr)
WO (1) WO2017198029A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205793888U (zh) * 2016-05-19 2016-12-07 深圳市光峰光电技术有限公司 一种散热装置及投影设备
CN112672598A (zh) * 2019-11-20 2021-04-16 华为技术有限公司 热管、散热模组及终端设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217366A (ja) * 2000-02-02 2001-08-10 Ricoh Co Ltd 回路部品の冷却装置
CN2729902Y (zh) * 2004-01-16 2005-09-28 佛山市顺德区汉达精密电子科技有限公司 散热装置
CN201039636Y (zh) * 2006-08-02 2008-03-19 深圳市七彩虹科技发展有限公司 散热器
JP2011003604A (ja) * 2009-06-16 2011-01-06 Kiko Kagi Kofun Yugenkoshi 放熱板およびその放熱板の製造方法
US7907407B2 (en) * 2008-04-14 2011-03-15 Chidae Electronics Co., Ltd. Heat dissipating device
CN204180450U (zh) * 2014-10-10 2015-02-25 成都萨伯电子应用科技有限公司 超薄基板超薄热管阵列散热器
CN205793888U (zh) * 2016-05-19 2016-12-07 深圳市光峰光电技术有限公司 一种散热装置及投影设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217366A (ja) * 2000-02-02 2001-08-10 Ricoh Co Ltd 回路部品の冷却装置
CN2729902Y (zh) * 2004-01-16 2005-09-28 佛山市顺德区汉达精密电子科技有限公司 散热装置
CN201039636Y (zh) * 2006-08-02 2008-03-19 深圳市七彩虹科技发展有限公司 散热器
US7907407B2 (en) * 2008-04-14 2011-03-15 Chidae Electronics Co., Ltd. Heat dissipating device
JP2011003604A (ja) * 2009-06-16 2011-01-06 Kiko Kagi Kofun Yugenkoshi 放熱板およびその放熱板の製造方法
CN204180450U (zh) * 2014-10-10 2015-02-25 成都萨伯电子应用科技有限公司 超薄基板超薄热管阵列散热器
CN205793888U (zh) * 2016-05-19 2016-12-07 深圳市光峰光电技术有限公司 一种散热装置及投影设备

Also Published As

Publication number Publication date
CN205793888U (zh) 2016-12-07

Similar Documents

Publication Publication Date Title
CN105378954B (zh) 热电装置
WO2011002213A2 (fr) Appareil de production d'énergie photovoltaïque
WO2010126255A2 (fr) Dissipateur thermique pour un boîtier de ci de type à parties saillantes
WO2011130944A1 (fr) Dispositif de dissipation thermique et régulateur de vitesse en étant équipé
WO2011030976A1 (fr) Refroidissement thermoélectrique et appareil de génération de puissance
CN211530140U (zh) 电池模组及电池包
WO2017008559A1 (fr) Structure de dissipation thermique de carte mère et terminal mobile
US20210218216A1 (en) Laser gain optical fiber heat-dissipating device
WO2017198029A1 (fr) Appareil de dissipation de chaleur et dispositif de projection
TW201425854A (zh) 散熱模組
TW201124684A (en) Solar panel heat-dissipating device and related solar panel module
CN210610161U (zh) 逆变器设备及其散热装置
TWI328736B (en) Radiation structure for processors
WO2022145969A1 (fr) Module de gestion de chaleur pour batterie
JP4082090B2 (ja) 排熱発電装置
WO2017080069A1 (fr) Dissipateur de chaleur d'un dispositif de chauffage, d'un terminal mobile et d'un ensemble de rayonnement thermique d'un<b> </b>amplificateur de puissance
WO2023070905A1 (fr) Module de batterie de puissance, bloc-batterie de puissance associé et son procédé de gestion thermique
CN210319943U (zh) 一种水下led灯散热装置
CN211481765U (zh) 一种散热装置及基站
CN113675494A (zh) 一种应用于动力电池模组的热管翅片式冷却结构
KR101205093B1 (ko) 태양 광 발전 마이크로 인버터 소자 방열장치
JP2003137199A (ja) 太陽電池パネル及び太陽電池パネルを有する宇宙機
CN105698768A (zh) 空间用离轴相机大视场高集成度焦面结构
CN210381769U (zh) 一种石墨烯散热铝板结构
CN106641787B (zh) 一种led灯管

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17798593

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17798593

Country of ref document: EP

Kind code of ref document: A1