CN211481765U - Heat dissipation device and base station - Google Patents
Heat dissipation device and base station Download PDFInfo
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- CN211481765U CN211481765U CN201921323797.3U CN201921323797U CN211481765U CN 211481765 U CN211481765 U CN 211481765U CN 201921323797 U CN201921323797 U CN 201921323797U CN 211481765 U CN211481765 U CN 211481765U
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Abstract
The utility model provides a heat abstractor and basic station, this heat abstractor includes: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels; and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins. In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
Description
Technical Field
The utility model relates to heat dissipation technical field especially involves a heat abstractor and basic station.
Background
The quality of the thermal design of a communication base station product is directly related to the cost, reliability, volume and weight of the product. If the thermal design is not good, the volume and weight of the equipment can be increased to meet the environmental requirements for the operation of the equipment; otherwise, the temperature rise of the environment is high, the reliability and the service life of the electronic equipment can be reduced when the electronic equipment works under the high-temperature condition for a long time, and even devices can be burnt when the electronic equipment works seriously. How to effectively dissipate heat in a limited space becomes a key problem of the design of the current communication products. The design is applied to a natural convection heat dissipation module, and the general form of the natural convection heat dissipation module is that a certain number of heat dissipation toothed sheets are connected to a first heat conduction substrate, and the heat dissipation toothed sheets and air convection heat exchange realize heat dissipation and cooling of the whole equipment.
Fig. 1 shows a conventional heat dissipation module, wherein 1 is a substrate and 2 is a heat dissipation tooth. The traditional heat dissipation tooth structure obtains a better heat dissipation effect mainly by changing geometric parameters, but after the parameters such as the height, the length, the thickness, the tooth piece spacing and the like of the heat dissipation tooth pieces reach a certain degree of optimization, the heat dissipation capacity of the heat dissipation tooth cannot be obviously improved due to marginal effect.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat abstractor and basic station for improve the radiating effect.
In a first aspect, a heat dissipation device is provided, the heat dissipation device comprising: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels;
and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins.
In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
In a specific possible implementation manner, the length direction of the first heat dissipation fin and the length direction of the second heat dissipation fin form a set included angle. Through the radiating fins with different angles, the radiating effect is improved.
In a specific embodiment, the length direction of the first heat dissipation fin is the same as the length direction of the first heat conduction substrate;
the length direction of the second heat dissipation fins is inclined relative to the length direction of the first heat conduction substrate. The heat dissipation effect is improved.
In a specific embodiment, the perpendicular projection of the second heat-conducting substrate on the first heat-conducting substrate is located within the first heat-conducting substrate.
In a specific possible embodiment, a plurality of third heat dissipation fins are arranged on a portion of the first heat conduction substrate, which is located outside the perpendicular projection of the second heat conduction substrate.
In a specific embodiment, the third heat dissipating fin is parallel to the first heat dissipating fin.
In a specific possible embodiment, the first heat dissipation fin and the second heat dissipation fin are of a unitary structure;
the second heat conductive substrate includes a plurality of connection plates connecting adjacent ones of the first heat dissipation fins.
In a specific embodiment, the first thermally conductive substrate is the same size as the second thermally conductive substrate.
In a specific embodiment, the first heat dissipation fins and the second heat dissipation fins are arranged in a staggered manner.
In a specific embodiment, a plurality of hollow structures are disposed on the second heat conductive substrate, and each hollow structure is communicated with the ventilation channel. The ventilation effect is increased.
In a second aspect, there is provided a base station comprising an apparatus, and the heat sink of any one of the above arranged on the apparatus. In the technical scheme, the ventilation channel is defined by the first heat conduction substrate, the second heat conduction substrate and the first radiating fins, and the natural convection heat exchange capability of air in the ventilation channel increases the radiating effect.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation device in the prior art;
fig. 2 is a schematic structural diagram of a first heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic end view of a first heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second heat dissipation device according to an embodiment of the present invention;
fig. 5 is a schematic end view of a second heat dissipation device according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a third heat dissipation device according to an embodiment of the present invention;
fig. 7 is a schematic end view of a third heat dissipation device according to an embodiment of the present invention.
Detailed Description
For conveniently understand the embodiment of the utility model provides a heat abstractor, first explain below the utility model provides a heat abstractor's application scene that provides, the embodiment of the utility model provides a heat abstractor is applied to communication base station to a be used for dispel the heat for the basic station. When using, fix heat abstractor on the basic station, on heat transfer to heat abstractor that the basic station produced to distribute away the heat through heat abstractor, but heat abstractor's among the prior art radiating effect is lower, consequently the embodiment of the utility model provides a heat abstractor. In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings.
Referring first to fig. 2 and 3, fig. 2 shows a specific heat sink, and fig. 3 shows a schematic cross-sectional view of the heat sink. The heat dissipation device comprises a first heat conduction substrate 10, wherein the first heat conduction substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is firstly transferred to the first heat conduction substrate 10. With continued reference to fig. 2, in fig. 2, the embodiment of the present invention provides a first heat conducting substrate 10 which is a rectangular substrate, but it should be understood that the embodiment of the present invention provides a first heat conducting substrate 10 which is not limited to the rectangular substrate shown in fig. 2, and it can adopt substrates of other shapes, such as substrates of different shapes like ellipse, square or diamond, and only needs to match with the area of the base station where heat dissipation is needed. To the utility model discloses the material of the first heat conduction base plate 10 that the embodiment provided can select common heat conduction metals such as copper, aluminium, does not do the restriction here.
With continued reference to fig. 2, the heat dissipation device provided by the embodiment of the present invention further includes a second heat conduction substrate 30, in fig. 2, the second heat conduction substrate 30 is identical to the first heat conduction substrate 10 in shape and size, but the embodiment of the present invention does not limit the specific shape and size of the second heat conduction substrate 30. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 2, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 2, which shows a specific air flow direction, cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The embodiment of the utility model provides a second heat conduction base plate 30 can adopt a holistic platelike structure, also can adopt to set up a plurality of hollow out construction on second heat conduction base plate, and every hollow out construction and first ventilation channel intercommunication. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 2 and 3, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 2, straight fins are used for the first heat dissipation fins 20 and the second heat dissipation fins 40, and the length direction of the second heat dissipation fins 40 is inclined with respect to the length direction of the first heat conduction substrate 10, that is, the length direction of the first heat dissipation fins 20 and the length direction of the second heat dissipation fins 40 form a set included angle. In fig. 2, the angle between the first heat dissipating fins 20 and the second heat dissipating fins 40 in the longitudinal direction is 45 °, so that the flow direction of the air flowing between the first heat dissipating fins 20 is different from the flow direction of the air flowing through the second heat dissipating fins 40. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved.
It should be understood that the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 shown in fig. 2 is only a specific example, and the present invention provides that the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 is not limited to the specific mode shown in fig. 2, and other included angles may also be adopted, for example, the included angle between the first heat dissipating fin 20 and the second heat dissipating fin 40 is different angles such as 30 °, 60 °, and the like. Can achieve the effect of improving heat dissipation.
Reference is also made to fig. 4 and 5, wherein fig. 4 shows a second heat dissipation device provided by the embodiment of the present invention, and fig. 5 shows an end view of the second heat dissipation device. In the heat dissipating device shown in fig. 4, the heat dissipating device includes a first heat conductive substrate 10, the first heat conductive substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is first transferred to the first heat conductive substrate 10. With continued reference to fig. 4, in fig. 4, the embodiment of the present invention provides a first heat conducting substrate 10 which is a rectangular substrate, but it should be understood that the embodiment of the present invention provides a first heat conducting substrate 10 which is not limited to the rectangular substrate shown in fig. 4, and it can adopt substrates of other shapes, such as substrates of different shapes like ellipse, square or diamond, and only needs to match with the area of the base station where heat dissipation is needed. To the utility model discloses the material of the first heat conduction base plate 10 that the embodiment provided can select common heat conduction metals such as copper, aluminium, does not do the restriction here.
With continued reference to fig. 4, the heat dissipation device provided by the embodiment of the present invention further includes a second heat conduction substrate 30, and in fig. 4, the second heat conduction substrate 30 has the same shape as the first heat conduction substrate 10, but has a smaller size than the first heat conduction substrate 10. And when the second heat conducting substrate 30 is disposed, the second heat conducting substrate 30 is flush with one end of the first heat conducting substrate 10, as shown in fig. 5, a vertical projection of the second heat conducting substrate 30 on the first heat conducting substrate 10 is located in the first heat conducting substrate 10. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 4, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 4, which shows a specific air flow direction, cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The embodiment of the utility model provides a second heat conduction base plate 30 can adopt a holistic platelike structure, also can adopt to set up a plurality of hollow out construction on second heat conduction base plate, and every hollow out construction and first ventilation channel intercommunication. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 4 and 5, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 4, straight fins are used as the first heat dissipation fins 20 and the second heat dissipation fins 40, and the length direction of the first heat dissipation fins 20 is the same as the length direction of the first heat conductive substrate 10. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved.
With continued reference to fig. 4 and 5, in the heat dissipation device provided in the embodiment of the present invention, a plurality of third heat dissipation fins 70 are disposed on the portion of the first heat conduction substrate 10 that is located outside the vertical projection of the second heat conduction substrate 30. As shown in fig. 5, the first heat conductive substrate 10 is provided with first and third heat dissipation fins 20 and 70, and the first and third heat dissipation fins 20 and 70 are disposed in parallel. In a specific arrangement, the first heat dissipating fins 20 and the second heat dissipating fins 40 are integrated, and the second heat conducting substrate 30 can be regarded as a plurality of connecting plates connecting the adjacent first heat dissipating fins 20. When the heat dissipation fin is connected specifically, the connecting plate and the heat dissipation fin can be fixedly connected in a welding mode.
As shown in fig. 6 and 7, fig. 6 shows a third heat dissipation device provided by the embodiment of the present invention, and fig. 7 shows a schematic end view of the third heat dissipation device.
The heat dissipation device comprises a first heat conduction substrate 10, wherein the first heat conduction substrate 10 is used for being fixedly connected with a base station, and heat generated by the base station is firstly transferred to the first heat conduction substrate 10. With continued reference to fig. 6, in fig. 6, the embodiment of the present invention provides a first heat conducting substrate 10 which is a rectangular substrate, but it should be understood that the embodiment of the present invention provides a first heat conducting substrate 10 which is not limited to the rectangular substrate shown in fig. 6, and it can adopt substrates of other shapes, such as substrates of different shapes like ellipse, square or diamond, and only needs to match with the area of the base station where heat dissipation is needed. To the utility model discloses the material of the first heat conduction base plate 10 that the embodiment provided can select common heat conduction metals such as copper, aluminium, does not do the restriction here.
With continued reference to fig. 6, the heat dissipation device provided by the embodiment of the present invention further includes a second heat conduction substrate 30, in fig. 6, the second heat conduction substrate 30 is identical to the first heat conduction substrate 10 in shape and size, but the embodiment of the present invention does not limit the specific shape and size of the second heat conduction substrate 30. When the second heat conducting substrate 30 is specifically arranged, a gap with a certain distance is formed between the second heat conducting substrate 30 and the first heat conducting substrate 10 at intervals, and the first heat conducting substrate 10 and the second heat conducting substrate 30 are fixedly connected through the plurality of first heat radiating fins 20. One side of each first heat dissipation fin 20 is fixedly connected with the first heat conduction substrate 10, and the other side is fixedly connected with the second heat conduction substrate 30, and the specific fixing mode can be a welding mode or a connection mode through a threaded connection piece (a bolt or a screw); when connected, the first heat dissipation fins 20 are thermally connected to both the first heat conduction substrate 10 and the second heat conduction substrate 30. With continued reference to fig. 6, the plurality of first heat dissipation fins 20 are arranged at intervals, and the plurality of first heat dissipation fins 20 divide the gap between the first heat conductive substrate 10 and the second heat conductive substrate 30 into a plurality of ventilation channels. The two ends of the ventilation channel are open, one of the openings is an air inlet, and the other opening is an air outlet, as shown by the arrow in fig. 6, which shows a specific air flow direction, and cold air enters the ventilation channel from below and then flows out from the air outlet above. It is of course also possible for cold air to enter the ventilation channel from above and then to exit from the air outlet below. The first heat conductive substrate 10, the second heat conductive substrate 30, and the first heat dissipation fins 20 are used to form a ventilation channel, which is named as a first ventilation channel 50 for convenience of description. The cold air has increased the radiating effect in first ventilation passageway 50 air natural convection heat transfer ability, and because first ventilation passageway 50 is tubular structure, the cold air can become the low pressure gas of high temperature mutually after the heat absorption to form the siphon effect in first ventilation passageway 50, improve the mobility of air, and then improve the radiating effect.
The embodiment of the utility model provides a second heat conduction base plate 30 can adopt a holistic platelike structure, also can adopt to set up a plurality of hollow out construction on second heat conduction base plate, and every hollow out construction and first ventilation channel intercommunication. If each first ventilation channel corresponds to a plurality of hollow structures, and the hollow structures are arranged along the length direction of the first ventilation channel. Due to the siphon effect of the first ventilation channel, outside cold air can be supplemented into the first ventilation channel through the hollow structure, and the heat dissipation effect is improved.
With continued reference to fig. 6 and 7, a plurality of second heat dissipation fins 40 are disposed on a surface of the second heat conduction substrate 30 facing away from the first heat conduction substrate 10. And a plurality of second heat dissipating fins 40 are arranged at intervals, and gaps at intervals between the second heat dissipating fins 40 form another ventilation channel. In fig. 6, straight fins are used for the first heat dissipation fins 20 and the second heat dissipation fins 40, the length direction of the second heat dissipation fins 40 is the same with respect to the length direction of the first heat conduction substrate 10, and when the first heat dissipation fins 20 and the second heat dissipation fins 40 are specifically arranged, as shown in fig. 7, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged in a staggered manner. During specific heat dissipation, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively, heat transferred from the base station is transferred to the first heat-conducting substrate 10 and is transferred to the second heat-conducting substrate 30 through the first heat-radiating fins 20, the second heat-conducting substrate 30 transfers heat to the second heat-radiating fins 40, and when air flows, air flows through the first ventilation channel 50 and the second ventilation channel 60 respectively and is in contact with the first heat-conducting substrate 10, the second heat-conducting substrate 30, the first heat-radiating fins 20 and the second heat-radiating fins 40 respectively, so that the contact area between the air and the heat dissipation device is increased, and the heat dissipation effect is improved. And through the second heat conduction base plate 30 and the second radiating fins 40, an upper layer and a lower layer of ventilation effect are formed, the convection heat exchange capability of the radiating device is enhanced, and the radiating efficiency of the radiating device is improved. In addition, the first heat dissipation fins 20 and the second heat dissipation fins 40 are arranged in a staggered manner, so that the heat transfer effect can be increased.
The embodiment of the utility model provides a still provide a basic station, this basic station includes equipment to and set up the heat abstractor of above-mentioned arbitrary on equipment. In the above technical scheme, a ventilation channel is defined by the first heat conduction substrate 10, the second heat conduction substrate 30 and the first heat dissipation fins 20, and the natural convection heat exchange capability of air in the ventilation channel increases the heat dissipation effect. When specifically arranged, the first heat conductive substrate 10 may be a casing of the apparatus.
The above embodiments are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (11)
1. A heat dissipating device, comprising: the heat-conducting substrate comprises a first heat-conducting substrate and a second heat-conducting substrate arranged at intervals with the first heat-conducting substrate; a plurality of first heat dissipation fins are arranged between the first heat conduction substrate and the second heat conduction substrate, and each first heat dissipation fin is in heat conduction connection with the first heat conduction substrate and the second heat conduction substrate respectively; the plurality of first heat dissipation fins divide a gap between the first heat conduction substrate and the second heat conduction substrate into a plurality of ventilation channels;
and one surface of the second heat conduction substrate, which is deviated from the first heat conduction substrate, is provided with a plurality of second heat dissipation fins.
2. The heat dissipating device of claim 1, wherein the length direction of the first heat dissipating fins and the length direction of the second heat dissipating fins form a predetermined angle.
3. The heat dissipating device of claim 2, wherein the first heat dissipating fin has a longitudinal direction that is the same as a longitudinal direction of the first heat conductive substrate;
the length direction of the second heat dissipation fins is inclined relative to the length direction of the first heat conduction substrate.
4. The heat dissipation device of claim 1, wherein a perpendicular projection of the second thermally conductive substrate onto the first thermally conductive substrate is located within the first thermally conductive substrate.
5. The heat dissipating device as claimed in claim 4, wherein a portion of the first heat conducting substrate located outside a vertical projection of the second heat conducting substrate is provided with a plurality of third heat dissipating fins.
6. The heat dissipating device of claim 5, wherein the third heat dissipating fin is parallel to the first heat dissipating fin.
7. The heat dissipating device of claim 4, wherein the first heat dissipating fin and the second heat dissipating fin are of a unitary structure;
the second heat conductive substrate includes a plurality of connection plates connecting adjacent ones of the first heat dissipation fins.
8. The heat dissipating device of claim 1, wherein the first thermally conductive substrate is the same size as the second thermally conductive substrate.
9. The heat dissipating device of claim 8, wherein the first heat dissipating fins are staggered from the second heat dissipating fins.
10. The heat dissipation device as claimed in any one of claims 1 to 9, wherein a plurality of hollow structures are disposed on the second heat conductive substrate, and each hollow structure is communicated with the ventilation channel.
11. A base station, comprising equipment, and the heat sink device according to any one of claims 1 to 10 provided on the equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201921323797.3U CN211481765U (en) | 2019-08-15 | 2019-08-15 | Heat dissipation device and base station |
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| CN201921323797.3U CN211481765U (en) | 2019-08-15 | 2019-08-15 | Heat dissipation device and base station |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908953A (en) * | 2021-02-03 | 2021-06-04 | 百色市彩虹铝业有限公司 | 5G base station chip heat dissipation plate and manufacturing method |
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2019
- 2019-08-15 CN CN201921323797.3U patent/CN211481765U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908953A (en) * | 2021-02-03 | 2021-06-04 | 百色市彩虹铝业有限公司 | 5G base station chip heat dissipation plate and manufacturing method |
| CN112908953B (en) * | 2021-02-03 | 2022-11-01 | 百色市彩虹铝业有限公司 | 5G base station chip heat dissipation plate and manufacturing method |
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