CN2729902Y - Heat sink device - Google Patents
Heat sink device Download PDFInfo
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- CN2729902Y CN2729902Y CN 200420014838 CN200420014838U CN2729902Y CN 2729902 Y CN2729902 Y CN 2729902Y CN 200420014838 CN200420014838 CN 200420014838 CN 200420014838 U CN200420014838 U CN 200420014838U CN 2729902 Y CN2729902 Y CN 2729902Y
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- heat
- radiator
- heat radiating
- radiating
- heat abstractor
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Abstract
The utility model discloses a heat radiating device of an electronic chip, which comprises a heat radiating base plate, heat radiating blocks and heat radiators, wherein, the heat radiator comprises a heat radiating fan, a containing seat which contains the heat radiating fan, and a heat radiating fin; a plurality of heat radiators are arranged in the heat radiating device and respectively coupled with the heat radiating base plate, in addition, a plurality of heat inducting pipes are arranged on the heat radiating base plate; one end of each of the heat conducting pipes is coupled with the heat radiator, and the other end is coupled with the heat radiating blocks. Compared with the prior art, the heat radiating device has the advantages of small thermal resistance, strong heat radiating effect and is capable of satisfying the heat radiation requirement of an electronic chip with high power, and simultaneously, the utility model has the advantages of simple structure and small size and is suitable for the development trend of light, thin, short and small electronic devices.
Description
Technical field
The utility model relates to a kind of heat abstractor, particularly a kind of heat abstractor that is used to reduce the electronic chip surface temperature.
Background technology
Development along with electronics technology, the integrated level of some electronic chips (as the central processing unit of computer) strengthens, operating rate also constantly increases, and therefore heat abstractor must be set to reduce the surface temperature of electronic chip on the surface of electronic chip, keeps its normal work.But we still will consider several factors when solving its heat dissipation problem, and the central processing unit with computer is that example illustrates below.
The fast development of the arithmetic speed of the central processing unit of computer, the solution of the heat dissipation problem of central processing unit just becomes the problem that the emphasis consideration is wanted the time in the main frame design, especially more is rich in challenge for the little computer of volume such as the design of notebook computer.Notebook computer is compact, and is therefore very high to the requirement of the heat abstractor in the notebook host.
The heat abstractor of the central processing unit of present most of notebook computers is to connect a radiator by heat-radiating substrate, radiator comprises a radiator fan and the radiator fan air outlet radiating fin that be provided with of configuration on it, and what have also is provided with heat pipe on heat-radiating substrate.Heat conducts to radiator through heat pipe, in the heat conductive process, heat pipe and spreader surface can be to external radiation part heats, and still most of heat all is to pass through the radiating fin of radiator to external radiation, and radiator fan has increased air flows and quickened dispersing of heat.But this kind heat abstractor is because area of dissipation is certain, and the radiating effect of the single fan of employing is limited, so the heat radiation power of this device has certain limit.
Along with the quickening of central processing unit arithmetic speed, the heat of its generation is also just many more.The heat radiation power of existing heat abstractor can not satisfy the heat radiation requirement of central processing unit.Thereby just need the heat abstractor of bigger heat radiation power.In general, according to radiating principle, area of dissipation is big more, and radiating effect is good more; Thermal resistance is more little, and radiating effect is good more; Fan power is strong more, and cross-ventilation is strong more, and heat radiation is also just strong more.So can adopt bigger area of dissipation and more powerful radiator fan to strengthen radiating effect.Particularly when notebook computer adopts the central processing unit of the above power of 1.3G, the heat that central processing unit produces even can surpass 100W, if but follow the mentality of designing of heat abstractor in the past, so, the heat abstractor of the central processing unit of so big heating power, the area of dissipation of the heat abstractor that it is required is huge, and the quantity of radiating fin also will be huge; Simultaneously, the increase of radiating fin quantity and size, and the increase of the power of radiator fan all will cause the volume of the heat abstractor that makes up to increase.But for the notebook computer of element arrangements compactness, the increase of the volume of heat abstractor is not meet the short and small frivolous demand for development of notebook computer.So the quantity of the radiating fin by simple increase radiator and size or the power that increases single radiator fan all can not satisfy heat radiation far away and require.Therefore we must change mentality of designing, take all factors into consideration the caloric value of the tight space and the central processing unit of notebook computer, and it is moderate to design a kind of volume, and the heat abstractor that radiating efficiency is high satisfies the heat radiation requirement of the central processing unit of golf calorific value.
Summary of the invention
The utility model has been taken all factors into consideration the volume and the heat radiation power of heat abstractor, a kind of heat abstractor of surface temperature of the electronic chip that can reduce working at high speed has been proposed, particularly a kind of heat abstractor that can satisfy the high-power central processing unit of notebook computer.
It comprises heat-radiating substrate, radiating block and radiator to implement heat abstractor of the present utility model, wherein said radiator comprises the holding seat and the radiating fin of radiator fan, ccontaining radiator fan, wherein said radiator is a plurality of, and couples with heat-radiating substrate respectively; And described heat-radiating substrate is provided with several heat pipes, and an end and the radiator of this heat pipe couple, and the other end and radiating block couple.
Owing to adopted technique scheme, the utility model compared with prior art has the following advantages: the one, and heat abstractor volume of the present utility model is little and thin, and the distribution of a plurality of radiators and radiating block can be according to the distribution of the element around the electronic chip of required heat radiation and difference, therefore heat-dissipating space can be made full use of, of the space requirement of the internal body of space compactness can be further satisfied the heat abstractor proposition; In addition, because heat abstractor of the present utility model has adopted a plurality of radiators, this has just increased area of dissipation greatly, simultaneously, many heat pipes that are provided with on the heat-radiating substrate can conduct to radiator with heat from radiating block rapidly, thermal resistance is little, and heat-sinking capability is stronger, can satisfy the heat radiation requirement of powerful electronic chip.
Description of drawings
Fig. 1 is the isometric front view of first embodiment of the utility model heat abstractor.
Fig. 2 is the reverse side stereogram of first embodiment of the utility model heat abstractor.
Fig. 3 is the isometric front view of second embodiment of the utility model heat abstractor.
Fig. 4 is the reverse side stereogram of second embodiment of the utility model heat abstractor.
Embodiment
Shown in Figure 2 as Fig. 1 is respectively the obverse and reverse stereogram of first embodiment of the present utility model.Its heat abstractor comprises heat-radiating substrate 121, first radiator 101 and second radiator 102, radiating block 301 and heat pipe 111, wherein first radiator 101 is provided with first holding seat 201 to hold radiator fan, and radiator fan is the fan of air intake, side air-out up and down in the present embodiment; Air outlet 401 at radiator fan communicates with first wind guide tank 501 simultaneously; And in wind guide tank 501, be provided with radiating fin 601.Equally, second radiator 102 is provided with second holding seat 202 to hold radiator fan, and the air outlet 402 at radiator fan communicates with second wind guide tank 502 simultaneously; And in wind guide tank 502, be provided with radiating fin 601.Specifically, because first radiator 101 and second radiator 102 of present embodiment link together, so first wind guide tank 501 also is set to an integral channel that is communicated with second wind guide tank 502.In addition, heat-radiating substrate 121 and radiating block 301 and first radiator 101 and second radiator 102 couple, and this heat abstractor is provided with several heat pipes 111, one end and the radiating block 301 of this heat pipe 11 1 couple, the other end and two radiators 101 and 102 couple, and several heat pipes are 111 one-tenth as a whole " Y " shape is coupled on the heat abstractor.
When the heat that electronic chip produces is held attaching radiating block 301 conduction thereon through tight button after, the heat pipe 111 that couples on it is given in the most of conduction rapidly of heat, and the sub-fraction heat also conducts to heat-radiating substrate 121 by radiating block 301 and couples radiator 101 and 102 on it.Because the thermal resistance of heat pipe is little, most of heat conducts to two radiators rapidly through behind the heat pipe 111, and an end of the heat pipe in the present embodiment 111 is coupled to the side of wind guide tank 501 and 502, so through the heat of heat pipe 111 can be very fast conduct to radiating fin 601 in wind guide tank 501 and 502, the air outlet 401 and 402 of two radiator fans all is connected with wind guide tank, therefore can further accelerate the circulation of air at radiating fin 601 places, strengthen radiating effect; Certainly the equal continuous air radiation heat towards periphery of the outer surface of entire heat dissipation device when work.
Shown in Figure 4 as Fig. 3 is respectively the obverse and reverse stereogram of second embodiment of the present utility model.Wherein, first radiator 101 ' and second radiator 102 ' are separated, and are coupled to one by heat-radiating substrate 121 '.Wherein, first radiator 101 ' is provided with first holding seat 201 ' to hold radiator fan, and the air outlet 401 ' of this radiator fan communicates with first wind guide tank 501 ', and is provided with radiating fin 601 ' in this wind guide tank; Second radiator 102 ' is provided with second holding seat 202 ' to hold radiator fan, and the air outlet 402 ' of this radiator fan communicates with second wind guide tank 502 ', and is provided with radiating fin 602 ' in this wind guide tank.Because two radiators of the present utility model separate, thus the wind guide tank 501 ' on two radiators and 502 ' also be separated, radiating fin be provided with respectively and wind guide tank separately in.
Really, the concrete enforcement of the heat abstractor that the utility model proposes, can be set to surpass two radiator according to concrete heat radiation requirement and heat-dissipating space heat abstractor, and several radiators can be arbitrarily made with coupling and heat-radiating substrate of connecting in twos or be separated from each other; The air outlet of each radiator fan is provided with wind guide tank, and radiating fin is arranged in the wind guide tank, also can be arranged on the side of the air outlet of radiator fan, or the like.
The heat abstractor that the utility model provides can be widely used in electronic applications, for the solution of the heat sink conception of heat-dissipating space compactness, running electronic chip at a high speed provides heat abstractor, especially for the heat radiation of the central processing unit of notebook computer.Compared with prior art, the utlity model has following advantage:
1. the heat abstractor that provides of the utility model is simple in structure, and volume is little and thin, and the distribution of a plurality of radiators and radiating block can be according to the distribution of the element around the electronic chip of required heat radiation and difference, therefore heat-dissipating space can be made full use of, of the space requirement of the internal body of space compactness can be further satisfied the heat abstractor proposition;
2. heat abstractor of the present utility model has adopted two or more radiators, this has just increased area of dissipation greatly, simultaneously, many heat pipes that are provided with on the heat-radiating substrate can conduct to radiator with heat from radiating block rapidly, thermal resistance is little, heat-sinking capability is stronger, can satisfy the heat radiation requirement of powerful electronic chip.
Claims (7)
1. heat abstractor, comprise heat-radiating substrate, be connected in radiating block and radiator on the heat-radiating substrate, wherein said radiator comprises the holding seat and the radiating fin of radiator fan, ccontaining radiator fan, it is characterized in that: described radiator is a plurality of, and couples with heat-radiating substrate respectively; And described heat-radiating substrate is provided with several heat pipes, and an end and the radiator of this heat pipe couple, and the other end and radiating block couple.
2. heat abstractor as claimed in claim 1 is characterized in that; Described a plurality of radiator connects as one.
3. heat abstractor as claimed in claim 1 is characterized in that; Described a plurality of radiator is to be separated from each other.
4. heat abstractor as claimed in claim 1 or 2 is characterized in that; Described radiator is provided with wind guide tank at the air outlet of each fan, and this wind guide tank communicates with the air outlet adjacent and radiator fan that air-out direction is identical, and radiating fin is arranged in the wind guide tank.
5. as claim 1 or 3 described heat abstractors, it is characterized in that; Described radiator is provided with wind guide tank at the air outlet of each fan, is provided with radiating fin in this wind guide tank.
6. heat abstractor as claimed in claim 4 is characterized in that; Described heat pipe with " Y " shape is coupled on this heat abstractor.
7. heat abstractor as claimed in claim 5 is characterized in that; Described heat pipe with " Y " shape is coupled on this heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420014838 CN2729902Y (en) | 2004-01-16 | 2004-01-16 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420014838 CN2729902Y (en) | 2004-01-16 | 2004-01-16 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2729902Y true CN2729902Y (en) | 2005-09-28 |
Family
ID=35048675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420014838 Expired - Fee Related CN2729902Y (en) | 2004-01-16 | 2004-01-16 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2729902Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271479A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN102449759A (en) * | 2011-09-30 | 2012-05-09 | 华为技术有限公司 | Radiator |
| CN103025123A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Separated type portable terminal and electronic device thereof |
| CN103140118A (en) * | 2011-12-05 | 2013-06-05 | 英业达股份有限公司 | Heat dissipation assembly |
| CN105466965A (en) * | 2014-09-10 | 2016-04-06 | 神讯电脑(昆山)有限公司 | Heat dissipating effect testing apparatus of heat dissipating module |
| WO2017198029A1 (en) * | 2016-05-19 | 2017-11-23 | 深圳市光峰光电技术有限公司 | Heat dissipation apparatus and projection device |
| CN115933845A (en) * | 2023-01-09 | 2023-04-07 | 融科联创(天津)信息技术有限公司 | Computer radiator |
-
2004
- 2004-01-16 CN CN 200420014838 patent/CN2729902Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102271479A (en) * | 2010-06-01 | 2011-12-07 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN103025123A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Separated type portable terminal and electronic device thereof |
| CN103025123B (en) * | 2011-09-23 | 2015-07-29 | 联想(北京)有限公司 | Divergence type portable terminal and electronic equipment thereof |
| CN102449759A (en) * | 2011-09-30 | 2012-05-09 | 华为技术有限公司 | Radiator |
| WO2012149786A1 (en) * | 2011-09-30 | 2012-11-08 | 华为技术有限公司 | Heat sink |
| CN102449759B (en) * | 2011-09-30 | 2013-08-28 | 华为技术有限公司 | Radiator |
| US9917029B2 (en) | 2011-09-30 | 2018-03-13 | Huawei Technologies Co., Ltd. | Heat dissipater for main heat generating device with peripheral heat generating devices |
| CN103140118A (en) * | 2011-12-05 | 2013-06-05 | 英业达股份有限公司 | Heat dissipation assembly |
| CN105466965A (en) * | 2014-09-10 | 2016-04-06 | 神讯电脑(昆山)有限公司 | Heat dissipating effect testing apparatus of heat dissipating module |
| WO2017198029A1 (en) * | 2016-05-19 | 2017-11-23 | 深圳市光峰光电技术有限公司 | Heat dissipation apparatus and projection device |
| CN115933845A (en) * | 2023-01-09 | 2023-04-07 | 融科联创(天津)信息技术有限公司 | Computer radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050928 Termination date: 20120116 |