CN215494920U

CN215494920U - Heat dissipation arrangement structure

Info

Publication number: CN215494920U
Application number: CN202122149373.3U
Authority: CN
Inventors: 王颖学; 何纯; 沈海峰
Original assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Current assignee: Wuhan Pansheng Dingcheng Technology Co ltd
Priority date: 2021-09-07
Filing date: 2021-09-07
Publication date: 2022-01-11
Anticipated expiration: 2031-09-07

Abstract

The utility model discloses a heat dissipation arrangement structure, which comprises a main board arranged in parallel with a side plate of a box body, a CPU assembly arranged on the main board, and a tower type radiator arranged on the CPU assembly; the long edges of the radiating fins of the tower type radiator are parallel to the length direction of the main board, an air guide cover is arranged below a top plate of the box body, the air guide cover is arranged in a curved structure, an air guide cover air outlet and an air guide cover air inlet are respectively arranged at the upper end and the lower end of the air guide cover, the air guide cover air outlet is abutted to the top plate of the box body, a plurality of radiating fans are arranged at the air guide cover air outlet, and the air guide cover air inlet is abutted to the side face, close to the top plate of the box body, of the tower type radiator. By the mode, the tower type radiator is arranged along the length direction parallel to the main board, the number of the heat conduction pipes is convenient to increase, the air guide cover is arranged on the upper side of the tower type radiator, air can enter the lower portion of the box body to dissipate heat of the heat dissipation fins, hot air is discharged out of the box body through the air guide cover, and the whole heat dissipation effect is better.

Description

Heat dissipation arrangement structure

Technical Field

The utility model relates to the field of computers, in particular to a heat dissipation arrangement structure.

Background

With the rapid development of the intelligent level, intelligent terminal devices such as computers become an essential part of people in daily work, study and life. The internal components of the case body of the computer case are too many, the integrated circuit is complex, and a large amount of heat can be generated when the computer works, so that the temperature in the case body is increased, and the use of the computer is seriously influenced. At present, most desktop computers are provided with tower type radiators in a case body, and the tower type radiators are simple in structure, provided with multiple layers of radiating fins and good in radiating effect.

However, in the prior art, when the tower-type heat sink is installed in the chassis of the desktop computer, the tower-type heat sink is disposed along a direction parallel to the width direction of the main board (i.e., the long sides of the heat dissipation fins are parallel to the width direction of the main board), and when the tower-type heat sink is operated, air is supplied from the front plate of the chassis and is discharged from the rear plate of the chassis.

The problem that this kind of technique faced at present is that the quantity of heat pipe can only set up five at most, and its radiating effect has the limitation. With the increasing power consumption of the CPU and the increasing heat generation amount, the current tower type heat sink cannot meet the heat dissipation requirement of the CPU. And the subsequent pins of the CPU will be increased continuously, the length of the CPU along the length direction of the main board will also be increased, and the increase of the number of the heat conducting pipes becomes a necessary problem for the tower type heat sink.

Therefore, it is necessary to design a heat dissipation arrangement structure with simple structure, increased number of heat conduction pipes and good heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems, the utility model provides a heat dissipation arrangement structure, the tower type radiator is arranged along the length direction parallel to the mainboard, the number of heat conduction pipes is convenient to increase, the lower side of the tower type radiator is provided with a heat dissipation fan, the upper side of the tower type radiator is provided with an air guide cover, air can enter from the lower side of a box body to dissipate heat of heat dissipation fins, hot air is quickly discharged out of the box body through the air guide cover, and the whole heat dissipation effect is better.

In order to achieve the purpose, the utility model adopts the technical scheme that:

a heat dissipation arrangement structure comprises a main board arranged in parallel to a side board of a box body, a CPU assembly arranged on the main board, and a tower type radiator arranged on the CPU assembly; the long edges of the radiating fins of the tower type radiator are parallel to the length direction of the mainboard, an air guide cover is arranged below a top plate of the box body, the air guide cover is arranged in a curved structure, an air guide cover air outlet and an air guide cover air inlet are respectively arranged at the upper end and the lower end of the air guide cover, the air guide cover air outlet is abutted to the top plate of the box body, a plurality of radiating fans are arranged at the air guide cover air outlet, and the air guide cover air inlet is abutted to the side face, close to the top plate of the box body, of the tower type radiator.

Further, tower radiator includes a plurality of heat pipes that set up side by side and with a plurality of heat radiation fins of heat pipe grafting, a plurality of heat pipes are the setting of U type structure to locate including flexion and part the first end and the second end at flexion both ends.

Further, the bending angles of the bending portions of two adjacent heat conduction pipes are different.

Further, keeping away from of flexion one side of CPU subassembly is provided with the mounting panel, be provided with a plurality of mounting grooves on the mounting panel, a plurality of mounting grooves with the length direction of mainboard is parallel, the flexion hold in the mounting groove.

Further, the mounting plate is fixed with the main board through a fixing member.

Furthermore, a plurality of separating cylinders are symmetrically arranged on one side, far away from the bending part, of the radiating fin, and the first end and the second end respectively penetrate through the plurality of separating cylinders correspondingly.

Furthermore, the caliber of the air outlet of the air guide cover is larger than that of the air inlet of the air guide cover.

Furthermore, the number of the plurality of the heat radiation fans is two, and the two heat radiation fans are arranged in the air outlet of the air guide cover and are matched with the opening size of the air outlet of the air guide cover.

Furthermore, an air inlet is formed in a bottom plate of the box body.

Furthermore, an air outlet is arranged on a top plate of the box body.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the tower type radiator is arranged along the length direction parallel to the mainboard (namely, the long edges of the radiating fins are parallel to the length direction of the mainboard), so that when the length of the CPU is increased along the length direction of the mainboard, the number of the heat conduction pipes of the tower type radiator can be increased, and the radiating effect is enhanced; and the lower side of the tower type radiator is provided with a heat radiation fan, the upper side of the tower type radiator is provided with an air guide cover, air can be fed from the lower part of the box body to radiate heat of the heat radiation fins, hot air is quickly discharged out of the box body through the air guide cover, and the whole heat radiation effect is better by adopting the design of a heat radiation air channel from bottom to top.

2. The air guide cover with the curved structure ensures that the boundary layer separation phenomenon does not occur in the air flowing process, reduces the on-way resistance loss of air flowing, and improves the performance of the cooling fan.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view from another perspective of the present invention;

FIG. 3 is a schematic layout of a tower heat sink according to the present invention;

FIG. 4 is a schematic view of another arrangement of the tower heat sink of the present invention;

FIG. 5 is a schematic view of the tower heat sink of the present invention;

FIG. 6 is a schematic view of the structure of the heat conducting pipe of the present invention;

the parts in the drawings are numbered as follows: 100. a box body; 110. an air outlet; 120. an air inlet; 130. a main board; 140. a CPU component; 150. a tower radiator; 151. heat dissipation fins; 1511. a separating cylinder; 152. a heat conducting pipe; 1521. a first end; 1522. a second end; 1523. a bending section; 153. mounting a plate; 160. a heat radiation fan; 170. an air guide cover.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the aspects of the present invention are shown in the drawings, and other details not closely related to the present invention are omitted.

In addition, it is also to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Example 1

As shown in fig. 1 to 5, a heat dissipation arrangement structure for a tower-type heat sink chassis, a compact chassis, a server, and the like, which can dissipate heat of components inside a box 100, includes a main board 130 disposed parallel to side panels of the box 100, a CPU component 140 disposed on the main board 130, and a tower-type heat sink 150 disposed on the CPU component 140. The long sides of the heat dissipation fins 151 of the tower heat sink 150 are parallel to the longitudinal direction of the main board 130. Compared with the traditional installation mode of the tower type heat sink 150 (the long sides of the heat radiating fins 151 are parallel to the width direction of the main board 130), the structure of the utility model can ensure that when the number of pins of the CPU is increased and the length of the CPU is increased along the length direction of the main board 130, the tower type heat sink 150 can increase the number of the heat conducting pipes 152 along the length direction of the heat radiating fins 151 so as to adapt to the increase of the heat productivity caused by the change of the CPU.

In particular, the bottom plate of the box 100 is provided with an air inlet 120; an air outlet 110 is formed in a ceiling of the cabinet 100. It is noted that the number, shape and position of the air inlets 120 and the air outlets 110 can be set according to the specific implementation. The tower-type heat sink 150 sucks cold air from the air inlet 120, the cold air takes away heat on the heat dissipation fins 151 after passing through the tower-type heat sink 150 and forms hot air flow, and then the hot air flow is discharged from the air outlet 110, thereby realizing heat dissipation of the CPU component 140.

As shown in fig. 3 to 4, in some embodiments, a wind scooper 170 is provided under the ceiling of the cabinet 100. The wind scooper 170 is disposed in a curved structure, and an air scoop outlet and an air scoop inlet are respectively disposed at the upper and lower ends thereof. The air outlet of the wind scooper abuts against the top plate of the box body 100, and a plurality of heat dissipation fans 160 are arranged at the air outlet of the wind scooper. The number of the plurality of heat dissipation fans 160 is preferably two, and the two heat dissipation fans 160 are arranged in the air outlet of the air guide cover, and the size of the two heat dissipation fans 160 is the same as that of the air outlet of the air guide cover, so that hot air in the air guide cover can be better pumped out. The air inlet of the wind scooper is abutted against the side surface of the tower-type radiator 150 close to the top plate of the box body 100. Specifically, the wind scooper 170 is arranged in a curved structure, so that the boundary layer separation phenomenon is avoided in the air flowing process, the on-way resistance loss of the air flowing is reduced, and the performance of the cooling fan 160 is improved. The aperture of the air outlet of the air guide cover is larger than that of the air inlet of the air guide cover, so that the heat dissipation air duct above the main board 130 is in an air suction state, and hot air is sucked into the air guide cover 170 in a centralized manner. With such an arrangement, when the heat dissipation fan 160 works, a heat dissipation air duct from bottom to top is formed above the main board 130, and the air duct is in an air suction state, so that air flow in the box body 100 is intensively sucked into the air guide cover 170, heat generated by the heat dissipation fins 151 can be taken away, the heat is rapidly discharged from the air outlet 110 to the box body 100 through the heat dissipation fan 160, and the heat dissipation fins 151 can be rapidly dissipated. And adopt the design from bottom to top of radiating air duct, whole radiating effect is better.

Particularly, the air inlet of the wind scooper abuts against the side surface of the tower-type radiator 150 close to the top of the box 100, and the size of the air inlet is the same as that of the side surface of the tower-type radiator 150, so that hot air flowing through the tower-type radiator 150 is better discharged out of the box through the wind scooper 170, and the heat dissipation effect is better.

As shown in fig. 5 to 6, in some embodiments, the tower heat sink 150 includes a plurality of heat pipes 152 arranged side by side and a plurality of heat dissipation fins 151 inserted into the heat pipes 152. The heat pipe 152 contacts with the CPU chip, the CPU chip transfers the generated heat to the heat pipe 152, and the heat pipe 152 transfers the heat to the plurality of heat dissipation fins 151 connected thereto, and the heat is discharged by the heat dissipation fins 151. Specifically, the heat pipes 152 are disposed in a U-shaped structure, and include a bending portion 1523, and a first end 1521 and a second end 1522 respectively disposed at two ends of the bending portion 1523. The first end 1521 and the second end 1522 are sequentially arranged along a length direction parallel to the main board 130.

The bending angles of the bending portions 1523 of two adjacent heat pipes 152 are different, so that the positions of the two ends of the heat pipes 152, which penetrate through the heat dissipation fins 151, are different in the long side direction of the heat dissipation fins 151, and the two ends of the heat pipes 152 are conveniently arranged on the heat dissipation fins 151 in a staggered manner, so that more heat pipes 152 can be additionally arranged in the limited width range of the heat dissipation fins 151.

In other embodiments, a mounting plate 153 is disposed on a side of the bending portion 1523 away from the CPU component 140, and a plurality of mounting grooves are disposed on a side of the mounting plate 153 close to the main board 130, and the mounting grooves are disposed in a semi-cylindrical structure. The plurality of mounting grooves are parallel to the length direction of the main plate 130, and the bending portion 1523 is accommodated in the mounting grooves. The four corners of the mounting plate 153 are fixed to the main plate 130 by fixing members. The fixing piece is a screw or a rivet and the like.

As shown in fig. 4, in other embodiments, a plurality of spacers 1511 are symmetrically disposed on a side of the heat sink 151 away from the bending portion 1523, and the first end 1521 and the second end 1522 respectively pass through the plurality of spacers 1511. With the arrangement, gaps exist among the radiating fins 151 through the separating cylinder 1511, so that air circulation is facilitated, and the radiating effect of each radiating fin 151 is enhanced.

The above description is only for the purpose of illustrating the technical solutions of the present invention and is not intended to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent processes performed by using the contents of the specification and the drawings of the utility model, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A heat dissipation arrangement structure comprises a main board (130) arranged in parallel to a side board of a box body, a CPU assembly (140) arranged on the main board (130), and a tower type heat sink (150) arranged on the CPU assembly (140); the heat dissipation device is characterized in that the long edges of the heat dissipation fins (151) of the tower-type radiator (150) are parallel to the length direction of the main board (130), an air guide cover (170) is arranged below the top plate of the box body (100), the air guide cover (170) is arranged in a curved structure, an air guide cover air outlet and an air guide cover air inlet are respectively arranged at the upper end and the lower end of the air guide cover (170), the air guide cover air outlet is abutted to the top plate of the box body (100), a plurality of heat dissipation fans (160) are arranged at the air guide cover air outlet, and the air guide cover air inlet is abutted to the side face, close to the top plate of the box body (100), of the tower-type radiator (150).

2. A heat dissipation arrangement according to claim 1, wherein the tower heat sink (150) comprises a plurality of heat pipes (152) arranged side by side and a plurality of heat dissipation fins (151) inserted into the heat pipes (152), wherein the plurality of heat pipes (152) are arranged in a U-shaped configuration and comprise a curved portion (1523) and a first end (1521) and a second end (1522) respectively arranged at two ends of the curved portion (1523).

3. A heat dissipation arrangement according to claim 2, wherein the bend (1523) of two adjacent heat pipes (152) have different bend angles.

4. The heat dissipation arrangement according to claim 3, wherein a mounting plate (153) is arranged on a side of the curved portion (1523) remote from the CPU component (140), wherein a plurality of mounting slots are arranged on the mounting plate (153), the mounting slots are parallel to a length direction of the main board (130), and the curved portion (1523) is accommodated in the mounting slots.

5. The heat dissipation arrangement according to claim 4, wherein the mounting plate (153) is fixed to the main plate (130) by a fixing member.

6. The heat dissipation arrangement according to claim 5, wherein a plurality of spacers (1511) are symmetrically disposed on a side of the heat dissipation fins (151) away from the curved portion (1523), and the first end (1521) and the second end (1522) respectively pass through the plurality of spacers (1511) correspondingly.

7. The heat dissipation arrangement of claim 6, wherein a diameter of the air outlet of the air scooper is greater than a diameter of the air inlet of the air scooper.

8. The heat dissipation arrangement of claim 7, wherein the number of the plurality of heat dissipation fans (160) is two, and the two heat dissipation fans (160) are disposed in the air outlet of the air guide cover and are adapted to the size of the opening of the air outlet of the air guide cover.

9. A heat dissipation arrangement according to claim 1, characterized in that the bottom plate of the box (100) is provided with air inlets (120).

10. A heat dissipation arrangement according to claim 1, characterized in that an air outlet (110) is provided in the ceiling of the box (100).