CN214308303U - Extension type radiator - Google Patents
Extension type radiator Download PDFInfo
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- CN214308303U CN214308303U CN202023249910.3U CN202023249910U CN214308303U CN 214308303 U CN214308303 U CN 214308303U CN 202023249910 U CN202023249910 U CN 202023249910U CN 214308303 U CN214308303 U CN 214308303U
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Abstract
An extended heat sink is assembled on a main board and matched with a fan to dissipate heat of an element to be dissipated, at least one of two sides of the element to be dissipated is provided with a slot for inserting an electronic element, the extended heat sink comprises: a main heat radiator, which comprises a base and a main heat radiating fin group consisting of a plurality of main heat radiating fins, wherein the base consists of a bottom plate and two side plates vertically arranged at two opposite sides of the bottom plate, the bottom surface of the bottom plate is closely attached to the top surface of the element to be radiated, an opening is defined by the two side plates and the bottom plate to align to an accommodating space of the fan for accommodating the main heat radiating fin group, and the two side plates and the bottom plate vertically extend upwards from the top surface of the bottom plate; and the secondary radiator is detachably assembled on the outer side of the side plate of the main radiator and is suspended above the slot for inserting the electronic element, and at least part of the secondary radiator is closely attached to the side plate of the main radiator after being assembled on the outer side of the side plate of the main radiator.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a radiator, especially an extension formula radiator.
[ background of the invention ]
With the rapid development of computers and various electronic devices and the convenience brought by the development, modern people have developed a habit of using for a long time, but the disadvantage that the heat generated by the computers and various electronic devices cannot be dissipated in time in the process of being operated for a long time is also accompanied. Therefore, a heat sink is generally added to dissipate heat. However, as the processing speed of the cpu increases, the amount of heat dissipated increases, and the existing simple independent heat sink on the market cannot meet the heat dissipation requirement of the high-order component to be dissipated due to space limitation.
Accordingly, as shown in fig. 1, the extended heat sink 5 includes a main heat sink 50 and two auxiliary heat sinks 51, the main heat sink 50 is mounted above a component (not shown) to be cooled, the two auxiliary heat sinks 51 are disposed at intervals on one side of the electronic component 6 close to the fan and far away from the component to be cooled, the main heat sink 50 conducts heat to the two auxiliary heat sinks 51 through the heat pipe 52, thereby improving the heat dissipation capability of the component to be cooled. However, since the auxiliary heat sink 51 is disposed in the fan airflow direction, the heat of the auxiliary heat sink 51 is carried to the electronic component 6 downstream with the airflow, and the ambient temperature of the area of the electronic component 6 on both sides of the component to be radiated is increased.
[ Utility model ] content
The utility model aims to solve the technical problem that an extension formula radiator is provided, it does not increase the regional ambient temperature of both sides electronic component when treating radiating element's radiating effect in the improvement.
In order to solve the above technical problem, the utility model provides an extension type radiator, it is installed and is cooperated a fan on a mainboard and dispels the heat for a radiating element, still sets up one slot that supplies an electronic component to plant in at least one side of should treating radiating element's two sides on this mainboard, and this extension type radiator includes:
a main heat radiator, which comprises a base and a main heat radiating fin group consisting of a plurality of main heat radiating fins, wherein the base consists of a bottom plate and two side plates which are approximately vertically arranged at two opposite sides of the bottom plate, the bottom surface of the bottom plate is closely attached to the top surface of the element to be radiated, an opening is defined between the two side plates and the bottom plate and is aligned with an accommodating space of the fan, and the main heat radiating fin group is accommodated in the accommodating space and vertically extends upwards from the top surface of the bottom plate, so that the wind flow generated by the fan can pass through an airflow channel between any two adjacent main heat radiating fins which form the main heat radiating fin group; and
the secondary radiator is hung above the slot for the electronic element to be inserted, and at least part of the secondary radiator is closely attached to the side plate of the main radiator after the secondary radiator is assembled on the outer side of the side plate of the main radiator.
Preferably, the secondary heat sink is composed of a plurality of secondary heat dissipating fins, such that the wind generated by the fan can pass through the airflow channel between any two adjacent secondary heat dissipating fins in the secondary heat sink.
Preferably, the secondary heat sink is fastened to the second screw hole of the primary heat sink by a screw passing through the first screw hole of the secondary heat sink.
Preferably, a plurality of first heat pipes are arranged in the main heat radiator, one part of the plurality of heat pipes is embedded in the bottom plate, and the other part of the plurality of first heat pipes is embedded in the inner side of the side plate and extends upwards from the top surface of the bottom plate.
Preferably, the main heat sink is further provided with a plurality of second heat pipes, the second heat pipes are connected in series with the plurality of main heat dissipation fins, and the second heat pipes are connected with any one of the bottom plate and the two side plates.
Preferably, the secondary heat sink further includes a third heat pipe, the third heat pipe is connected in series with the plurality of secondary heat dissipation fins, and the third heat pipe is connected with at least one of the heat conductor and the corresponding side plate.
Preferably, the bottom surface of the base plate is coated with a heat conductive layer which is in close contact with the top surface of the component to be heat dissipated.
Preferably, the secondary heat sink further includes a heat conductor disposed between the plurality of secondary heat fins and the corresponding side plate of the primary heat sink, and the secondary heat sink is assembled to the primary heat sink by the combination of the heat conductor and the side edge.
Preferably, the heat conductor has a plurality of first screw holes, and the side of the primary heat sink corresponding to the secondary heat sink has a plurality of second screw holes corresponding to the plurality of first screw holes of the heat conductor, and the secondary heat sink is screwed with the first screw holes and the second screw holes corresponding to each other by screws, so that the heat conductor is tightly combined with the corresponding side plate.
Compared with the prior art, the utility model discloses an extension radiator is through the side detachably equipment inferior radiator at main radiator, and this time radiator is hung in this electronic component's of treating the radiating element both sides top, and consequently, inferior radiator is in supplementary main radiator improvement radiating effect, can not take the heat to the electronic component of treating the radiating element both sides, avoids increasing the regional ambient temperature of both sides electronic component. Furthermore, because the utility model discloses a inferior radiator is for dismantling the setting, then can assemble inferior radiator according to the heat dissipation demand selectivity, if can the independent use main radiator, install the inferior radiator of one side additional or both sides all install inferior radiator additional, use more in a flexible way.
[ description of the drawings ]
Fig. 1 is a schematic view of a conventional extended heat sink.
Fig. 2 is a schematic exploded view of the extended heat sink of the present invention.
Fig. 3 is a schematic view of the extended heat sink according to the present invention.
Fig. 4 is a schematic front view of the extended heat sink of the present invention assembled on the main board.
[ detailed description ] embodiments
Referring to fig. 2-4, the present invention provides an extended heat sink 1, which is installed on a motherboard 2 and cooperates with a fan (not shown) to dissipate heat of an element 20 to be dissipated, in this embodiment, the element 20 to be dissipated is a Processing Chip capable of Processing a large amount of data at high speed, such as a Central Processing Unit (CPU), a System on a Chip (SOC), or a Graphics Processing Unit (GPU), the motherboard 2 is further provided with a slot for inserting an electronic element 21 on at least one of two sides of the element 20 to be dissipated, and the extended heat sink 1 includes a main heat sink 10 and at least one heat sink 11.
As shown in fig. 2, the main heat sink 10 includes a base 100 and a main heat-dissipating fin set 101 composed of a plurality of main heat-dissipating fins, the base 100 is composed of a bottom plate 1001 and two side plates 1002 disposed substantially perpendicular to two opposite sides of the bottom plate 1001, a bottom surface of the bottom plate 1001 is closely attached to a top surface of the component 2 to be heat-dissipated, so that heat generated by the component 20 to be heat-dissipated is conducted to the main heat-dissipating fin set 101 through the bottom plate 1001. An opening is defined by the two side plates 1002 and the bottom plate 1001 and aligned with an accommodating space of the fan, and the main heat-dissipating fin group 101 is accommodated in the accommodating space, that is, the two side plates 1002 extend upward from the top surface of the bottom plate 1001, so that the wind flow generated by the fan can pass through an airflow channel between any two adjacent main heat-dissipating fins forming the main heat-dissipating fin group 101, and the heat conducted from the bottom plate 1001 to the main heat-dissipating fin group 101 can be taken away.
The secondary heat sink 11 is detachably assembled outside the side plate 1002 of the primary heat sink 10, that is, a side of the side plate 1002 away from the primary heat sink fin set 101, and the secondary heat sink 11 is suspended above the slot for inserting the electronic component 21, after the secondary heat sink 11 is assembled outside the side plate 1002 of the primary heat sink 10, at least a portion of the secondary heat sink 11 is closely attached to the side plate 1002 of the primary heat sink 10, and the heat of the primary heat sink 10 is absorbed by the side plate 1002. In this embodiment, the sub-heat sink 11 is composed of a plurality of sub-heat dissipating fins, so that the wind generated by the fan can pass through the airflow channel between any two adjacent sub-heat dissipating fins in the sub-heat sink 11, to carry away the heat conducted to the sub-heat sink 11, in the present embodiment, the sub-heat sink 11 can be selectively mounted according to whether any one of two slots is inserted with the electronic component 21, for example, one of two slots is inserted with the electronic component 21, the secondary heat sink 11 is mounted correspondingly to the side plate 1002 of the main heat sink 10 corresponding to the slot into which the electronic component 21 is inserted, so as to accelerate the heat of the device 20 to be radiated and simultaneously take away the heat generated by the electronic device 21 during operation by the sub-radiator 11, for example, one of the two slots is inserted with the electronic device 21, the secondary heat sink 11 is not mounted on the side plate 1002 of the main heat sink 10 corresponding to the slot into which the electronic component 21 is inserted; in another embodiment, when the slot on one side of the to-be-radiated component 20 has the inserted electronic component 21 and the slot on the other side of the to-be-radiated component 20 has no inserted electronic component 21, the primary heat sink 11 is mounted on the side plate corresponding to the slot having the inserted electronic component 21 and the primary heat sink 11 has a first size not contacting with the electronic component inserted in the slot, and the secondary heat sink 11 having a second size is mounted on the side plate corresponding to the slot having no inserted electronic component and the second size is greater than or equal to the first size.
Referring to fig. 4, when the component 20 to be cooled operates, heat generated by the component 20 to be cooled is conducted to the main cooling fin set 101 through the bottom plate 1001 of the main cooling fin 10 in contact therewith, and an airflow generated by the fan can pass through an airflow channel between any two adjacent main cooling fins forming the main cooling fin set 101, so that part of the heat conducted from the bottom plate 1001 to the main cooling fin set 101 can be taken away, and meanwhile, two side plates 1002 of the main cooling fin 10 conduct part of the heat to the secondary cooling fins 11 at least partially in close contact therewith and suspended at two sides, so that the secondary cooling fins 11 are used for assisting cooling, thereby greatly improving the overall cooling effect.
In the present embodiment, the secondary heat sink 11 is fastened to the second screw hole of the primary heat sink 11 by screws (not shown) passing through the first screw hole of the secondary heat sink 11.
In this embodiment, the present invention provides a plurality of first heat pipes 102 in the main heat sink 10, wherein one part of the plurality of heat pipes is embedded in the bottom plate 1001, and the other part of the plurality of first heat pipes 102 is embedded in the inner side of the side plate 1002 and extends upward from the top surface of the bottom plate 1001, so that heat can be effectively and rapidly conducted from the bottom plate 1001 to the main heat dissipating fin group 101 and the side plate 1002, wherein a plurality of second heat pipes (not shown) are further disposed in the main heat sink 10, the second heat pipes are connected in series with a plurality of main heat dissipating fins, and the second heat pipes are connected to any one of the bottom plate and the two side plates, so as to accelerate the heat conducted from the component 20 to be cooled to the bottom plate 1001 to the main heat dissipating fin group 101 and take away the heat conducted to the main heat dissipating fin group 101 by the wind flow.
In another embodiment, the bottom surface of the base plate 1001 is coated with a heat conducting layer (not shown), the heat conducting layer is in close contact with the top surface of the component 20 to be heat-dissipated, the heat generated by the component to be heat-dissipated is conducted to the heat conducting layer, then conducted to the base plate 1001 through the heat conducting layer, and then conducted to each of the primary heat dissipating fins 101 through the base plate 1001.
In another embodiment, the sub-radiator 11 of the present invention further includes a heat conductor 110 disposed between the plurality of sub-fins and the corresponding side plate 1002 of the main radiator 10, and efficiently conducts heat from the main radiator 10 to the sub-radiator 11 through the corresponding side plate 1002 and the heat conductor 110, wherein the sub-radiator 11 is assembled to the main radiator 10 by combining the heat conductor with the side edge, and in detail, the heat conductor has a plurality of first screw holes, and the side edge of the main radiator 10 corresponding to the sub-radiator 11 has a plurality of second screw holes corresponding to the first screw holes of the heat conductor, and the sub-radiator 11 is screwed to the corresponding first screw holes and second screw holes of the heat conductor by screws, so that the heat conductor is tightly combined to the corresponding side plate 1002; in another embodiment, the heat spreader 11 further comprises a third heat pipe (not shown) connected to a plurality of secondary fins in series, and the third heat pipe is connected to at least one of the heat conductor and the corresponding side plate 1002, for example, the third heat pipe is connected to the corresponding side plate 1002, so that the heat of the component 20 to be heat-dissipated is conducted to the bottom plate 1001 and conducted to at least one of the heat conductor and the third heat pipe through the side plate, so that the heat is conducted to the plurality of fins by at least one of the heat conductor 110 and the third heat pipe, and the wind flowing through the airflow channel between any two adjacent fins takes away the heat, in another embodiment, the third heat pipe is connected to only a plurality of secondary fins and the heat conductor in series, so that the heat of the component 20 to be heat-dissipated is conducted to the bottom plate 1001 and conducted to the third heat pipe through the side plate and the heat conductor, the heat is conducted to the plurality of radiating fins by at least one of the heat conductor and the third heat pipe, so that the wind current flowing through the airflow channel between any two adjacent radiating fins takes away the heat.
When the sub-radiator 11 and the main radiator 10 of the present invention are to be assembled, the basic assembly of the sub-radiator 11 and the main radiator 10 is completed by first passing screws through the first screw holes corresponding to the sub-radiator 11 and the second screw holes corresponding to the side plate 1002 to screw-lock the sub-radiator 11 to the main radiator 10, in another embodiment, the sub-radiator 11 further comprises the third heat pipe, so that, after the basic assembly of the sub-radiator 11 to the main radiator 10 is completed, one end of the third heat pipe is passed through the corresponding heat pipe holes on the plurality of sub-radiator fins, and the other end of the third heat pipe is embedded into one of the corresponding side plate and the corresponding heat conductor, thereby completing the installation of the sub-radiator 11 to the main radiator, wherein, the third heat pipe is slightly U-shaped or J-shaped, the longer end of the third heat pipe, which is slightly J-shaped, penetrates through the heat pipe holes of the heat dissipation fins for several times, and the shorter end is embedded into the corresponding side plate 1002.
On the contrary, when the sub-radiator 11 of the present invention is to be detached from the main radiator 10, if the sub-radiator 11 has the third heat pipe, the third heat pipe is firstly detached from one of the side plate 1002 and the heat conductor, and the associated third heat pipe is gradually detached from the heat pipe holes of the plurality of sub-heat dissipation fins until the third heat pipe is completely detached from the plurality of sub-heat dissipation fins, and then the screws for locking and locking the sub-radiator 11 and the main radiator 10 are unlocked, thereby completing detaching the sub-radiator 11 from the main radiator 10.
To sum up, the utility model discloses an extension radiator 1 assembles inferior radiator 11 through the side detachably at main radiator 10, and this time radiator 11 hangs in this top of treating electronic component 21 of radiating element 20 both sides, consequently, this time radiator 11 when supplementary this main radiator 10 improves the radiating effect, can not take the heat to the electronic component 21 of treating radiating element 20 both sides, avoids increasing the regional ambient temperature of both sides electronic component 21. Furthermore, because the utility model discloses a inferior radiator 11 is for dismantling the setting, then can be according to heat dissipation demand selectivity equipment inferior radiator 11, if can independent use main radiator 10, install the inferior radiator 11 or both sides of one side additional and all install inferior radiator 11, use more in a flexible way.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. An extended heat sink is provided, which is installed on a motherboard to cooperate with a fan to dissipate heat of an element to be dissipated, and the motherboard is further provided with a slot for inserting an electronic element at least one of two sides of the element to be dissipated, the extended heat sink is characterized in that the extended heat sink comprises:
a main heat radiator, which comprises a base and a main heat radiating fin group consisting of a plurality of main heat radiating fins, wherein the base consists of a bottom plate and two side plates vertically arranged at two opposite sides of the bottom plate, the bottom surface of the bottom plate is closely attached to the top surface of the element to be radiated, an opening is defined between the two side plates and the bottom plate and is aligned with an accommodating space of the fan, and the main heat radiating fin group is accommodated in the accommodating space and vertically extends upwards from the top surface of the bottom plate, so that the wind flow generated by the fan can pass through an air flow channel between any two adjacent main heat radiating fins forming the main heat radiating fin group; and
the secondary radiator is hung above the slot for the electronic element to be inserted, and at least part of the secondary radiator is closely attached to the side plate of the main radiator after the secondary radiator is assembled on the outer side of the side plate of the main radiator.
2. The extended heat sink of claim 1, wherein the secondary heat sink is formed of a plurality of secondary heat dissipating fins such that the airflow generated by the fan can pass through the airflow channel between any two adjacent secondary heat dissipating fins in the secondary heat sink.
3. The extension heat sink of claim 1, wherein the secondary heat sink is secured to the secondary heat sink by screws passing through first screw holes of the secondary heat sink and second screw holes of the primary heat sink.
4. The extended heat sink of claim 1, wherein a plurality of first heat pipes are disposed in the main heat sink, one part of the plurality of first heat pipes is embedded in the bottom plate, and the other part of the plurality of first heat pipes is embedded in the inner side of the side plate and extends upward from the top surface of the bottom plate.
5. The extended heat sink of claim 4, wherein a plurality of second heat pipes are further disposed in the main heat sink, the second heat pipes are connected in series with the plurality of main heat dissipating fins, and the second heat pipes are connected to either the bottom plate or the two side plates.
6. The extended heat sink of claim 5, wherein the sub-heat sink further comprises a third heat pipe, the third heat pipe is connected to the plurality of sub-fins in series, and the third heat pipe is connected to at least one of the heat conductor and the corresponding side plate.
7. An extended heat sink as claimed in claim 1, wherein the bottom surface of the base plate is coated with a heat conductive layer, the heat conductive layer being in intimate contact with the top surface of the component to be cooled.
8. The extended heat sink of claim 1, wherein the secondary heat sink further comprises a heat conductor disposed between the plurality of secondary fins and the corresponding side plate of the primary heat sink, the secondary heat sink being assembled to the primary heat sink by the heat conductor engaging the side.
9. The extension heat sink as claimed in claim 8, wherein the heat conductor has a plurality of first screw holes, and the sides of the primary heat sink and the secondary heat sink corresponding to the plurality of first screw holes of the heat conductor have a plurality of second screw holes corresponding to the plurality of first screw holes of the heat conductor, respectively, and the secondary heat sink is screwed to the first screw holes and the second screw holes corresponding to each other by screws, respectively, so that the heat conductor is tightly combined to the corresponding side plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023249910.3U CN214308303U (en) | 2020-12-29 | 2020-12-29 | Extension type radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023249910.3U CN214308303U (en) | 2020-12-29 | 2020-12-29 | Extension type radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214308303U true CN214308303U (en) | 2021-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023249910.3U Active CN214308303U (en) | 2020-12-29 | 2020-12-29 | Extension type radiator |
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| CN (1) | CN214308303U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI827477B (en) * | 2022-03-24 | 2023-12-21 | 雙鴻科技股份有限公司 | Heat dissipation device |
-
2020
- 2020-12-29 CN CN202023249910.3U patent/CN214308303U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI827477B (en) * | 2022-03-24 | 2023-12-21 | 雙鴻科技股份有限公司 | Heat dissipation device |
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