CN1410860A - Heat dissipating module of notebook computer - Google Patents
Heat dissipating module of notebook computer Download PDFInfo
- Publication number
- CN1410860A CN1410860A CN 01140870 CN01140870A CN1410860A CN 1410860 A CN1410860 A CN 1410860A CN 01140870 CN01140870 CN 01140870 CN 01140870 A CN01140870 A CN 01140870A CN 1410860 A CN1410860 A CN 1410860A
- Authority
- CN
- China
- Prior art keywords
- heating radiator
- heat
- air outlet
- radiating module
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The heat emission module of the notebook computer is utilzied to lower the surface temperature of the chips inside the notebook computers. The heat emission module includes following parts. The fan is installed inside computer, including the first and second wind outlets. The air sucked by the fan is discharged through the first and second wind outlets. The first radiator is set at the first outlet, the bottom of the first radiator is contact with the chips for carrying out the heat exchange. The second radiator is set at the second outlet. The heat conducting structure is connected to the first radiator and the second radiator in parallel and utilized to transfer the heat from the first radiator to the second radiator.
Description
Technical field
The present invention relates to a kind of heat dissipating module of notebook computer, particularly relate to and a kind ofly utilize a plurality of air outlets to increase air quantity and blast, to improve the radiating module of heat dissipation.
Background technology
Along with the development of electronic industry technology, the transistor density of all kinds of chips (particularly central processing unit) increases day by day, though the speed of data processing is more and more faster, the power that consumes and the heat of generation also more and more increase.In order to allow central processing unit can stablize running, high efficiency heating radiator becomes present inevitable demand.In order to keep high efficiency heat sinking function, the volume of heating radiator and weight are also had to big more thereupon heavy more, yet in the design of notebook, maximum bottleneck is designed in limited space always.In the existing technologies, the most general and effective method is and utilizes fan to drive air flow, makes the fin of itself and thermal-arrest carry out heat interchange, reaches the purpose of cooling with the heat of taking away fin.This moment, air quantity of fan, the size of blast and the area of fin heat interchange promptly determined the usefulness of this heating radiator, and the heat exchange area of fin is big more, though the effect of heat radiation is good more, disagrees with the design spirit that notebook is light, thin, short, little.Therefore,, effectively improve the usefulness of heating radiator, become the direction that many slip-stick artists make great efforts how do not increase under the prerequisite of heating radiator volume as far as possible.
Please refer to Figure 1A, what it illustrated is the design of radiating module in the conventional notebook computer.As shown in the figure, dispose central processing unit 101 on the motherboard 100, traditional radiating module has comprised fan 110 and heating radiator 120.Fan 110 is disposed in the notebook, in order to cause air flow; Heating radiator 120 is disposed at the air outlet place of fan 110, is made by the material of high thermal conductivity coefficient, and its below forms surface of contact 121, in order to contact with central processing unit 101 (or chip of other kinds) and to carry out heat interchange.Wherein, during fan 110 running just air enter fan 110 along air intake direction I, and leave fan 110 along air-out direction O from air outlet again; Because heating radiator 120 is disposed at the air outlet place of fan 110, therefore when going out wind, fan 110 can make the heat dissipation on the heating radiator 120, with the temperature of reduction heating radiator 120.
Next please refer to Figure 1B, what it illustrated is the vertical view of Figure 1A.When notebook operates, central processing unit 101 produces high hot because of computing, the contact jaw 121 that the heat that produces is made by the material of high thermal conductivity coefficient brings to heating radiator 120 places, dispose many fins that are arranged in parallel 130 on the heating radiator 120, can allow and pass through along air-out direction O flow air by the air outlet place, and carry out heat interchange by fin 130 and air, the heat on the fin 130 is left.The usefulness of radiating module depends mainly on fin 130 and the contact area of air and air quantity, the blast of fan 110, therefore, can be improved the function of radiating module by the heat exchange area that increases air quantity, blast and fin 130.
Can utilize the number that increases fin 130 traditionally, or increase the heat exchange area that two kinds of methods of fin length increase fin 130.But the number that increases fin 130 may cause having some setbacks of air-out, thereby generation noise or wind are cut sound; Increase fin 130 length and then can increase the volume of radiating module, and strengthen the impedance of air and fin 130 frictions, make fan 110 rotating speeds increase or cause the boundary effect of heat radiation, reduced the efficient of dispelling the heat on the contrary.If want to increase the air quantity or the blast of fan 110, then must add the power and the size of big fan 110, but this is inconsistent with light, thin, short, the little characteristic of notebook, so more than way all to have many shortcomings to have to be overcome.
Summary of the invention
The object of the present invention is to provide a kind of heat dissipating module of notebook computer, it utilizes air outlet that increases fan and the heating radiator that is disposed at the air outlet place, increases the heat exchange area of heating radiator and air quantity, the blast of fan, thereby improves radiating effect.
The object of the present invention is achieved like this, a kind of heat dissipating module of notebook computer promptly is provided, in order to reduce the surface temperature of a chip in this notebook, this radiating module comprises: a fan, be disposed in this notebook and include one first air outlet and one second air outlet, this first air outlet and this second air outlet are in order to discharge this fan inhaled air; One first heating radiator is disposed at this first air outlet place, and the bottom of this first heating radiator is in order to contact with this chip and to carry out heat interchange; One second heating radiator is disposed at this second air outlet place, and a conductive structure, with this first heating radiator and this second heating radiator coupled in parallel, in order to heat is passed to this second heating radiator place by this first heating radiator place.
The present invention also provides a kind of radiating module, in order to reduce the surface temperature of a chip in the computing machine, this radiating module comprises: a fan, be disposed in this computing machine and include one first air outlet and one second air outlet, this first air outlet and this second air outlet are in order to discharge this fan inhaled air; One first heating radiator is disposed at this first air outlet place, and the bottom of this first heating radiator is in order to contact with this chip and to carry out heat interchange; One second heating radiator is disposed at this second air outlet place; And a conductive structure, with this first heating radiator and this second heating radiator coupled in parallel, in order to heat is passed to this second heating radiator place by this first heating radiator place.
The advantage of apparatus of the present invention is, the design that it increases air outlet can increase air quantity, blast and the area of dissipation of fan thus; Can reduce the thermal resistance value of radiating module; By heat interchange repeatedly, can improve radiating efficiency significantly; Can more effectively utilize space limited in the notebook, under the prerequisite that does not as far as possible increase too many volume, improve radiating efficiency; Increase the design of fin length or fin density, make it be difficult for producing the boundary effect of noise and heat radiation.
Illustrated simple declaration
Figure 1A is the synoptic diagram of radiating module in the existing notebook;
Figure 1B is the vertical view of Figure 1A;
Fig. 2 is the heat conducting synoptic diagram of point-to-point transmission;
The radiating module vertical view that Fig. 3 is provided for the embodiment of the invention one;
The radiating module vertical view that Fig. 4 is provided for the embodiment of the invention two.
Embodiment
The radiating efficiency of radiating module depends on the thermal resistance value of its material greatly, and thermal resistance value is the notion of similar resistance value, and the resistance value of material is more little, and its efficient of transmitting electric energy is just high more; Same, the thermal resistance value of material is more little, and the efficient of its transferring heat energy is also just high more.Please refer to Fig. 2, what it illustrated is the heat conducting synoptic diagram of point-to-point transmission.By among the figure as can be known, some X and point have two kinds of parallel connections between the Y and different heat passes material 201,202, its thermal resistance value is respectively θ 1 and θ 2.According to the mode of calculating the parallel circuit resistance value, the thermal resistance value θ between some X and the some Y also can be via similarly calculating:
θ＝θ1θ2/(θ1+θ2)
Thermal resistance value θ between some X and some Y must be less than thermal resistance value θ 1, and θ 2, by above explanation as can be known, can pass material by the extra heat of parallel connection and reduce thermal resistance value.
Embodiment one
Then please refer to Fig. 3, it illustrated is vertical view according to the radiating module of the embodiment of the invention one arch of carrying.As shown in the figure, radiating module has comprised interior wing 310 and two heating radiators 321,322, and with heat pipe 340 heating radiator 321,322 is coupled together, with the conductive structure of heat pipe 340 as radiating module.The bottom surface of heating radiator 321 forms surface of contact (not illustrating), in order to contact with central processing unit 101 (or chip of other kinds) and to carry out heat interchange; Fan 310 is disposed in the notebook, is to have two air outlets with the conventional fan difference, and 321,322 in heating radiator is disposed at two air outlet places of fan 310 respectively, and couples with heat pipe 340.Dispose many fins 330 on the heating radiator 321,322, air is passed through, and by fin 330 with carry out heat interchange by air, heat is left.
When notebook operates, central processing unit 101 produces high hot because of computing, the heat that produces reaches the heat pipe 340 that the material of heating radiator 321 and high thermal conductivity coefficient is made by surface of contact, and heat pipe 340 simultaneously with heat transferred to heating radiator 322 places.Air along air-out direction A discharges will carry out heat interchange by heating radiator 321 and by fin 330 and air, and the heat of fin 330 is left; Same, the air along air-out direction B discharges will carry out heat interchange by heating radiator 322 and by fin 330 and air, and heat is left.
By above explanation as can be known, airflow can carry out a heat interchange with fin 330 when heating radiator 321, and airflow can carry out another time heat interchange with fin 330 when heating radiator 322, can increase radiating efficiency by the number of times that increases heat interchange; Because the air outlet of fan 310 increases, air quantity, blast and the heat exchange area of its radiating module are also increased thereupon, therefore, the thermal resistance value of radiating module also thereby reduce, improved the heat dissipation of radiating module widely, also can more effectively utilize the space, to avoid noise and heat radiation boundary effect than traditional method.
Embodiment two
Then please refer to Fig. 4, it illustrated is the vertical view of the radiating module that provided according to the embodiment of the invention two.As shown in the figure, radiating module has comprised fan 410 and three heating radiators 421,422,423, and with heat pipe 440 with heating radiator 421,422,423 couple together, with the conductive structure of heat pipe 440 as radiating module.The bottom surface of heating radiator 421 forms surface of contact (not illustrating), in order to contact with central processing unit 101 (or chip of other kinds) and to carry out heat interchange; Fan 410 is disposed in the notebook, is to have three air outlets with the conventional fan difference, heating radiator 421,422, and 423 three air outlet places that are disposed at fan 410 respectively, and couple with heat pipe 440.Heating radiator 421,422 disposes many fins 430 on 423, and air is passed through, and carries out heat interchange by fin 430 and the air that passes through, and unnecessary heat is left.
When notebook operates, central processing unit 101 produces high hot because of computing, the heat that produces brings to the heat pipe 440 that the material of heating radiator 421 and high thermal conductivity coefficient is made by surface of contact, and heat pipe 440 simultaneously with heat transferred to heating radiator 422,423 places.Air along air outlet direction A discharges will carry out heat interchange by heating radiator 421 and by fin 430 and air, and the heat of fin 430 is left; Same, along air outlet direction B, the air that C discharges will carry out heat interchange by heating radiator 422,423 and by fin 430 and air, and heat is left.
By above explanation as can be known, airflow can carry out a heat interchange with fin 430 when advancing heating radiator 421, and airflow can carry out twice heat interchange in addition with fin 430 at 422,423 o'clock through heating radiator, can increase radiating efficiency by the number of times that increases heat interchange; Because the air outlet of fan 410 increases, the airflow pressure and the area of dissipation of its radiating module are also increased thereupon, therefore, the thermal resistance value of radiating module also thereby reduce, improved the heat sinking function of radiating module widely, also can more effectively utilize the space and avoid noise and the heat radiation boundary effect than traditional method.
In sum; though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can do various changes and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (11)
1. heat dissipating module of notebook computer, in order to reduce the surface temperature of a chip in this notebook, this radiating module comprises:
One fan is disposed in this notebook and includes one first air outlet and one second air outlet, and this first air outlet and this second air outlet are in order to discharge this fan inhaled air;
One first heating radiator is disposed at this first air outlet place, and the bottom of this first heating radiator is in order to contact with this chip and to carry out heat interchange;
One second heating radiator is disposed at this second air outlet place, and
One conductive structure is with this first heating radiator and this second heating radiator coupled in parallel, in order to heat is passed to this second heating radiator place by this first heating radiator place.
2. radiating module as claimed in claim 1, wherein this conductive structure is made with the high material of coefficient of heat conductivity.
3. radiating module as claimed in claim 1, wherein this conductive structure is a heat pipe (heatpipe).
4. radiating module as claimed in claim 1, wherein this each heat sink arrangements has a plurality of fins (fin).
5. radiating module as claimed in claim 1, wherein this chip is central processing unit (CPU).
6. radiating module, in order to reduce the surface temperature of a chip in the computing machine, this radiating module comprises:
One fan is disposed in this computing machine and includes one first air outlet and one second air outlet, and this first air outlet and this second air outlet are in order to discharge this fan inhaled air;
One first heating radiator is disposed at this first air outlet place, and the bottom of this first heating radiator is in order to contact with this chip and to carry out heat interchange;
One second heating radiator is disposed at this second air outlet place; And
One conductive structure is with this first heating radiator and this second heating radiator coupled in parallel, in order to heat is passed to this second heating radiator place by this first heating radiator place.
7. radiating module as claimed in claim 6, wherein this conductive structure is to make with the high material of coefficient of heat conductivity.
8. radiating module as claimed in claim 6, wherein this conductive structure is a heat pipe.
9. radiating module as claimed in claim 6, wherein this each heat sink arrangements has a plurality of fins.
10. radiating module as claimed in claim 6, wherein this chip is a central processing unit.
11. radiating module as claimed in claim 6, wherein this computing machine is a notebook.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011408707A CN100535829C (en) | 2001-09-25 | 2001-09-25 | Heat dissipating module of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011408707A CN100535829C (en) | 2001-09-25 | 2001-09-25 | Heat dissipating module of notebook computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1410860A true CN1410860A (en) | 2003-04-16 |
| CN100535829C CN100535829C (en) | 2009-09-02 |
Family
ID=4676014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011408707A Expired - Lifetime CN100535829C (en) | 2001-09-25 | 2001-09-25 | Heat dissipating module of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100535829C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103134832A (en) * | 2011-11-28 | 2013-06-05 | 古河奇宏电子（苏州）有限公司 | Detecting method for shortening thermal property detecting time of heat sink assembly |
| CN104597992A (en) * | 2014-12-22 | 2015-05-06 | 合肥联宝信息技术有限公司 | Method and device for dissipating heat of notebook computer |
| CN107193350A (en) * | 2017-05-08 | 2017-09-22 | 云雀科技成都有限责任公司 | A kind of intelligent cloud dispatches the improved structure of system |
| CN108803838A (en) * | 2018-05-09 | 2018-11-13 | 江西中船航海仪器有限公司 | A kind of heat sink arrangement of reinforced notebook computer |
| CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
| CN114895508A (en) * | 2022-03-28 | 2022-08-12 | 桂林智神信息技术股份有限公司 | Photographic lamp |
-
2001
- 2001-09-25 CN CNB011408707A patent/CN100535829C/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103134832A (en) * | 2011-11-28 | 2013-06-05 | 古河奇宏电子（苏州）有限公司 | Detecting method for shortening thermal property detecting time of heat sink assembly |
| CN104597992A (en) * | 2014-12-22 | 2015-05-06 | 合肥联宝信息技术有限公司 | Method and device for dissipating heat of notebook computer |
| CN107193350A (en) * | 2017-05-08 | 2017-09-22 | 云雀科技成都有限责任公司 | A kind of intelligent cloud dispatches the improved structure of system |
| CN108803838A (en) * | 2018-05-09 | 2018-11-13 | 江西中船航海仪器有限公司 | A kind of heat sink arrangement of reinforced notebook computer |
| CN110597356A (en) * | 2019-09-12 | 2019-12-20 | 华为技术有限公司 | Notebook computer |
| CN114895508A (en) * | 2022-03-28 | 2022-08-12 | 桂林智神信息技术股份有限公司 | Photographic lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100535829C (en) | 2009-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201465020U (en) | Conduction and heat dissipation device of CPCI module | |
| US20040120115A1 (en) | Heat-dissipating assembly | |
| CN100535829C (en) | Heat dissipating module of notebook computer | |
| CN111240445A (en) | Server heat radiation structure | |
| CN2606455Y (en) | Radiating module | |
| CN2757508Y (en) | Heat radiator | |
| CN2729902Y (en) | Heat sink device | |
| CN1209693C (en) | Heat radiation module assembly used in notebook computers | |
| CN1234057C (en) | Heat sink | |
| CN1309065C (en) | Radiation device for electronic element | |
| CN100345289C (en) | Hot-piping radiator | |
| CN2519933Y (en) | Mainframe of computer capable of improving heat radiation property in casing | |
| CN1204479C (en) | Heat sinking unit | |
| CN2755781Y (en) | Integrated radiator | |
| CN2875002Y (en) | Assembling type heat radiator structure | |
| CN209928357U (en) | Device for computer heat dissipation and heat dissipation mechanism | |
| CN1681113A (en) | Hot-piping radiator | |
| CN1480818A (en) | Radiator | |
| CN211207266U (en) | Virtual digital currency processing apparatus | |
| CN215494920U (en) | Heat dissipation arrangement structure | |
| CN2781448Y (en) | Folding cooling device | |
| CN2618206Y (en) | Radiating mould set of computer | |
| CN2674518Y (en) | Portable computer with inserted radiator | |
| CN2665425Y (en) | Heat abstractor with air ducts | |
| CN220554255U (en) | Enhanced heat dissipation router |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090902 |
|
| CX01 | Expiry of patent term |