CN2519933Y - Mainframe of computer capable of improving heat radiation property in casing - Google Patents
Mainframe of computer capable of improving heat radiation property in casing Download PDFInfo
- Publication number
- CN2519933Y CN2519933Y CN 01259470 CN01259470U CN2519933Y CN 2519933 Y CN2519933 Y CN 2519933Y CN 01259470 CN01259470 CN 01259470 CN 01259470 U CN01259470 U CN 01259470U CN 2519933 Y CN2519933 Y CN 2519933Y
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- Prior art keywords
- mainboard
- slot
- utility
- main frame
- heat
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Abstract
The utility model discloses a host computer, comprising a computer case, a power supply, a main board and a heat dissipation fan. The main board comprises a CPU chip, an extended card slot and a memory slot, wherein, the length directions of the extended card slot and the memory slot both are parallel to the direction of the wind out of the heat dissipation fan. The utility model improves the heating dissipation performance of various parts in the host computer case, thus fluent air duct is formed in the host computer case, therefore making the heat of various parts therein dissipate effectively and ensuring the working reliability of each parts.
Description
Technical field
The utility model relates to a kind of main frame, particularly a kind of main frame that improves the cabinet inside heat dispersion.
Background technology
In main frame, mainboard is one of most important parts, also is the basis of forming a personal computer.Concentrated interface on the mainboard, for example slot or the connector that is connected with central processing unit (CPU), internal memory, expansion card, disk or CD drive, input-output apparatus, power supply etc. for other circuit and parts grafting.Also concentrated simultaneously circuit such as chipset on the mainboard, be used for the each several part circuit logic control, connect data transmission between each parts etc.The electrical structure of mainboard has determined the system for computer composition to a great extent, and the layout type of mainboard has also determined the physical construction of computing machine substantially.Along with development of computer, the thermal value of the parts on the mainboard increases, and the density of arranging between the parts is also increasing, and therefore, because the inner structure of conventional main frame is undesirable, the heat dispersion of mainboard can not meet the demands, and radiating effect is relatively poor.
Motherboard layout commonly used at present has forms such as ATX, micro-ATX, Flex-ATX.Fig. 1 is a kind of schematic layout pattern of ATX mainboard.It among the figure the back I/O district that has concentrated part input-output apparatus interface; Be several memory bar slots in the frame of broken lines 3 of bottom right, can insert one or more memory bar; Be several expansion slot in the frame of broken lines 4 on the left side, can insert various expansion cards; Central processor CPU or CPU slot 2 are placed between back I/O district 1 and the memory bar slot 3, in the zone on expansion card 3 the right.The layout of micro-ATX mainboard and Flex-ATX mainboard is similar to ATX, and the key distinction is the different of the quantity of expansion slot and mainboard size.This class layout type is formed for computer system provides basic standard, and the dirigibility of system configuration also is provided.But, computing machine in the course of the work, each parts all will produce heat, particularly along with the raising of computer main frequency, the thermal value of parts such as CPU is increasing, needs enough air-flow the heat that sends is taken away, and could guarantee the operate as normal of computing machine.And above-mentioned motherboard layout mode no matter the direction of air-flow how, all can cause obstruction to air-flow, can not form smooth radiating airflow, is unfavorable for heat radiation.For example, because expansion card and memory bar are orthogonal, if the direction of arrow A among the air-flow that radiator fan blows out such as Fig. 1, the air-flow that flows through CPU and peripheral region can be expanded card and hinder, CPU and around parts can not efficiently radiates heat, expansion card also can not get enough air-flows and can not fully dispel the heat; Hinder if arrow B direction among air-flow that fan blows out such as the figure, air-flow can be subjected to memory bar, influence CPU and parts heat radiation on every side.
Summary of the invention
The purpose of this utility model is to provide a kind of main frame that improves the cabinet inside heat dispersion, and it forms smooth air channel in mainframe box, make that each parts of mainframe box inside are effectively dispelled the heat, and guarantees the reliability of each parts work.
The technical solution of the utility model is as follows:
According to a kind of main frame of the present utility model, comprise: cabinet, power supply, mainboard and radiator fan, comprise cpu chip, expresscard slot and memory bar slot on the mainboard, wherein, radiator fan is arranged on the cabinet inwall, the direction of the wind that the length direction of expresscard slot and memory bar slot all is parallel to radiator fan and is blown out.Because expansion card and memory bar are parallel to the air-flow wind direction on its length direction, so the resistance of their wind that radiator fan is blown out is very little, thereby can form smooth air channel in cabinet, is convenient to heat radiation, takes away the heat that each parts distributes effectively.
In the utility model, described expresscard slot and memory bar slot can be separately positioned on the wind that radiator fan blows out direction both sides and near the cabinet inwall.Expansion card and memory bar generally are erectly to be inserted on the mainboard, and institute takes up space big, and is also bigger to the influence of air-flow, they are arranged on the both sides of wind direction, make the cabinet middle part have bigger space to be convenient to flowing of air-flow, help the unobstructed of cabinet inside air-flow like this, help the heat radiation of each parts.
In the utility model, cpu chip can be arranged on the position between described expresscard slot and the memory bar slot.Cpu chip and mounted thereto 's cpu heat generally is to be flat on the mainboard, and occupation space is little, and is also little to the influence of air-flow, therefore it can be arranged between expansion card and the internal memory, i.e. the centre position of mainboard.
Be provided with heating radiator on cpu chip, preferably, the length direction of the radiating groove of the heat radiator on the heating radiator is parallel to the direction of the wind that radiator fan blows out, and makes that like this heat dispersion of CPU radiating fin is better.
In the utility model, also can comprise one on the mainboard after the I/O district, the position that this I/O district, back is provided with near with the relative cabinet inwall of cabinet inwall that radiator fan is installed, and along this inwall setting.Concentrate part input-output apparatus interface in I/O district, this back, mainly comprised mouse interface, serial communication port, parallel printout mouth, network interface and other USB interface etc.
The air-flow that main frame of the present utility model has improved in the computer system distributes, thereby has improved the heat dispersion of cabinet inside, and it forms smooth air channel in mainframe box, help the heat radiation of each parts in the system, guarantees the reliability of each parts work.In addition, motherboard design of the present utility model has sufficient configuration flexibility and extended capability; The motherboard layout of the utility model does not change the electric composition logical relation of each several part of mainboard, and is compatible mutually with the software and the hardware of existing main frame to guarantee computing machine of the present utility model; And except that the printed circuit board of mainboard, the parts on the mainboard can adopt the parts of existing mainboard, make mainboard of the present utility model be easy to produce, and also can not increase cost.
Describe embodiment of the present utility model in detail below in conjunction with accompanying drawing.
The drawing explanation
Fig. 1 is the synoptic diagram of ATX motherboard layout of the prior art;
Fig. 2 is the structural representation of one of the utility model embodiment;
Fig. 3 is the structural drawing of another embodiment of the utility model.
Embodiment of the present utility model
As shown in Figure 2, among the figure I/O district, back, be several memory banks in the frame of broken lines 3 on the left side, be several expansion slot in the frame of broken lines 4 on the right, cpu chip or CPU slot 2 are placed on the zone between internal memory and the expansion card.Memory bank 3 on the mainboard is parallel with expansion card 4, after motherboard layout will make cpu heat 5 be installed on the mainboard simultaneously, the length direction of the radiating groove of its heat radiator is also parallel with internal memory, expansion card, in the drawings, the length direction of the radiating groove of expresscard slot 4, memory bar slot 3 and heat radiator 5 (shown in the vertical line among the figure) all is in vertical direction, is parallel to the airflow direction that radiator fan as shown by arrow A blows out.
During computer working, if the air-flow that radiator fan blows out flows through along the direction that is parallel to CPU radiating fin, internal memory, expansion card, as shown by arrow A or reverse direction, the obstruction that air-flow is subjected to is little, and main heat generating components full contact such as parts, memory bar, expansion card around air-flow and cpu heat and the CPU, in system, form good air channel, help the heat radiation of each parts.
Fig. 3 is a kind of computer organization that adopts the motherboard layout of the utility model.Wherein, back I/O district 1, expansion card 3, memory bar 7, cpu chip 4 and cpu heat 5 are by design proposal layout of the present utility model, hard disk 2 places the top in I/O district, back 1, fan 6 before the mainboard is dried in system, air-flow flows through and blows out outside the system along the direction of memory bar 7, cpu heat 5 and expansion card 3, the gas channel of the smoothness that the utility model forms in cabinet, reaching on every side to CPU, parts, memory bar, hard disk, expansion card all have good thermolysis.
Claims (5)
1, a kind of main frame, comprise: cabinet, power supply, mainboard and radiator fan, comprise cpu chip, expresscard slot and memory bar slot on the mainboard, it is characterized in that, the direction of the wind that the length direction of expresscard slot and memory bar slot all is parallel to radiator fan and is blown out.
2, main frame according to claim 1 is characterized in that, described expresscard slot and memory bar slot be separately positioned on the wind that radiator fan blows out direction both sides and near the cabinet inwall.
3, main frame according to claim 1 and 2 is characterized in that, cpu chip is arranged on the position between described expresscard slot and the memory bar slot.
4, main frame according to claim 1 and 2 is characterized in that, cpu chip is provided with heating radiator, and the length direction of the radiating groove of the heat radiator on the heating radiator is parallel to the direction of the wind that radiator fan blows out.
5, main frame according to claim 1 is characterized in that, also comprises I/O district, back on the mainboard, the position that this I/O district, back is provided with near with the relative cabinet inwall of cabinet inwall of installation radiator fan, and along this inwall setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01259470 CN2519933Y (en) | 2001-08-27 | 2001-08-27 | Mainframe of computer capable of improving heat radiation property in casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01259470 CN2519933Y (en) | 2001-08-27 | 2001-08-27 | Mainframe of computer capable of improving heat radiation property in casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2519933Y true CN2519933Y (en) | 2002-11-06 |
Family
ID=33667839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01259470 Expired - Lifetime CN2519933Y (en) | 2001-08-27 | 2001-08-27 | Mainframe of computer capable of improving heat radiation property in casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2519933Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100349093C (en) * | 2004-12-13 | 2007-11-14 | 三星电子株式会社 | Portable computer with docking station |
| CN1799297B (en) * | 2003-05-09 | 2012-01-11 | 英特尔公司 | An actuation membrane for application to a card slot of a system |
| CN102346508A (en) * | 2011-09-23 | 2012-02-08 | 浪潮电子信息产业股份有限公司 | Design method for improving expansion capability of heterogeneous system mainboard |
| CN102609042A (en) * | 2012-01-19 | 2012-07-25 | 百度在线网络技术（北京）有限公司 | Whole cabinet and node server thereof |
| CN105278640A (en) * | 2014-06-10 | 2016-01-27 | 纬创资通股份有限公司 | Replaceable flow guide mechanism and electronic device |
| CN113126704A (en) * | 2020-01-15 | 2021-07-16 | 阿里巴巴集团控股有限公司 | Mainboard applied to computing equipment, computing equipment and data center machine room |
-
2001
- 2001-08-27 CN CN 01259470 patent/CN2519933Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1799297B (en) * | 2003-05-09 | 2012-01-11 | 英特尔公司 | An actuation membrane for application to a card slot of a system |
| CN100349093C (en) * | 2004-12-13 | 2007-11-14 | 三星电子株式会社 | Portable computer with docking station |
| CN102346508A (en) * | 2011-09-23 | 2012-02-08 | 浪潮电子信息产业股份有限公司 | Design method for improving expansion capability of heterogeneous system mainboard |
| CN102609042A (en) * | 2012-01-19 | 2012-07-25 | 百度在线网络技术（北京）有限公司 | Whole cabinet and node server thereof |
| CN105278640A (en) * | 2014-06-10 | 2016-01-27 | 纬创资通股份有限公司 | Replaceable flow guide mechanism and electronic device |
| CN113126704A (en) * | 2020-01-15 | 2021-07-16 | 阿里巴巴集团控股有限公司 | Mainboard applied to computing equipment, computing equipment and data center machine room |
| CN113126704B (en) * | 2020-01-15 | 2024-04-02 | 阿里巴巴集团控股有限公司 | Mainboard applied to computing equipment, computing equipment and data center machine room |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20110827 Granted publication date: 20021106 |