CN113126704B - Mainboard applied to computing equipment, computing equipment and data center machine room - Google Patents
Mainboard applied to computing equipment, computing equipment and data center machine room Download PDFInfo
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- CN113126704B CN113126704B CN202010039655.5A CN202010039655A CN113126704B CN 113126704 B CN113126704 B CN 113126704B CN 202010039655 A CN202010039655 A CN 202010039655A CN 113126704 B CN113126704 B CN 113126704B
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- board body
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- server
- mounting structure
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- 230000005855 radiation Effects 0.000 claims abstract description 32
- 230000003993 interaction Effects 0.000 claims description 47
- 238000001816 cooling Methods 0.000 claims description 27
- 239000002826 coolant Substances 0.000 claims description 14
- 230000013011 mating Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 43
- 230000005540 biological transmission Effects 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000004804 winding Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000003032 molecular docking Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The application discloses be applied to mainboard, computing device and data center computer lab of computing device, wherein, the mainboard of being applied to computing device includes: the mounting structure is used for mounting the main board body into the computing equipment. Through the mounting structure symmetrically arranged on the main board body, when the heat radiation wind direction changes, the requirement of the board card on the heat radiation wind direction can be met only by rotating the main board body by 180 degrees; and because the mounting structure is symmetrically arranged, after the main board body rotates 180 degrees, the mounting structure still can be connected with a corresponding structure in the computing equipment, so that the main board body is connected to the computing equipment, and the input of new computing equipment is not needed, namely, the original computing equipment can meet the requirement of the board card on the heat radiation wind direction, thereby reducing the use of the computing equipment and further reducing the cost of using the computing equipment.
Description
Technical Field
The application relates to the technical field of computers, in particular to a mainboard applied to computing equipment, the computing equipment and a data center machine room.
Background
Different types and different forms of boards, such as a GPU (Graphics Processing Unit, graphics processor) accelerator card, a network card, an NVME (Non-Volatile Memory express, a nonvolatile memory host controller interface) memory card, and the like, are selectively configured according to different scenes in the application of the computing device.
The heat dissipation modes of different boards are different, and the heat dissipation work can be divided into active heat dissipation and passive heat dissipation according to the heat dissipation modes. The active heat dissipation is to naturally dissipate heat into the air through the heat dissipation fins, and the passive heat dissipation is to take away the heat emitted by the heat dissipation fins through heat dissipation devices such as fans. In a board card with relatively high power consumption such as a GPU, an active heat dissipation mode is adopted, and a PCIE (peripheral component interconnect express, a high-speed serial computer expansion bus standard) board card with active heat dissipation and passive heat dissipation is adopted, so that the requirements of the air cooling computing device on the heat dissipation wind direction of the system are different.
The passive heat dissipation PCIE board generally supports both wind directions, whereas the active heat dissipation PCIE board can only support one wind direction in one computing device. In active heat dissipation, in order to enable two different heat dissipation wind directions to be supported by the PCIE board, in the prior art, two types of computing devices are generally adopted to respectively and correspondingly install PCIE boards with different heat dissipation wind directions, so that requirements of different PCIE boards on the heat dissipation wind directions are met.
In other similar boards, similar problems may also exist, and two types of computing devices are correspondingly installed with different types of boards, so that the number of computing devices used is increased, and the use cost of the computing devices is increased.
Disclosure of Invention
The embodiment of the application provides a mainboard applied to computing equipment, which solves the problems that in the prior art, two types of computing equipment are adopted to correspondingly install different types of boards respectively, so that the use quantity of the computing equipment is increased, and the use cost of the computing equipment is further increased. The embodiment of the application also provides the computing equipment and the data center machine room.
The embodiment of the application provides a mainboard applied to computing equipment, which comprises the following components: the mounting structure is used for mounting the main board body into the computing equipment.
Optionally, the mounting structure is symmetrically arranged with the center of the main board body.
Optionally, the mounting structure is disposed on an end of the main board body symmetrical about a center line of the main board body.
Optionally, the mounting structure includes a connection hole; the connection hole is connected with a connection post in the computing device to mount the main board body into the computing device.
Optionally, the number of the connecting holes is one or more.
Optionally, the method further comprises: and the connecting device is matched with the connecting hole so as to install the main board body into the computing equipment.
Optionally, the connecting means comprises at least a screw or rivet that can pass through the connecting hole, the screw being connected with a screw hole on the computing device through the connecting hole; or the rivet is connected with a rivet hole on the computing device through the connecting hole.
Optionally, the method further comprises: the connection structure is connected with the data interaction interface arranged on the main board body.
Optionally, the connection structure includes a flat cable, one end of the flat cable is connected with the data interaction interface on the main board body.
Embodiments of the present application also provide a computing device, comprising: the device comprises a main board body and mounting structures symmetrically arranged on the main board body, and a computing equipment body and assembly structures symmetrically arranged on the computing equipment body; the mounting structure and the assembly structure are correspondingly arranged and are used for mounting the main board body on the computing equipment body.
Optionally, the mounting structure is symmetrically arranged with the center of the main board body.
Optionally, the mounting structure is disposed on an end of the main board body symmetrical about a center line of the main board body.
Optionally, the mounting structure includes a connection hole; the connection hole is connected with the assembly structure to mount the motherboard body to the computing device body.
Optionally, the assembly structure includes a connection post connectable with the connection hole.
Optionally, the method further comprises: and the connecting device is matched with the connecting hole, and the main board body is mounted on the computing equipment body.
Optionally, the connecting device at least comprises a screw or a rivet capable of penetrating through the connecting hole, and correspondingly, the assembling structure further comprises a screw or a rivet correspondingly matched with the screw hole or the rivet hole;
the screw is connected with a screw hole on the computing device through the connecting hole; or the rivet is connected with a rivet hole on the computing device through the connecting hole.
Optionally, the method further comprises: the locking bracket is arranged on the computing equipment and used for fixing the main board body.
Optionally, the method further comprises: the connection structure is arranged between the main board body and the computing equipment body.
Optionally, the connection structure includes a flat cable, one end of the flat cable is connected with the data interaction interface on the main board body, and the other end of the flat cable is connected with the data interaction interface on the computing device body.
The embodiment of the application also provides a data center machine room, which comprises: a first rack housing a first cluster of servers, the first cluster of servers including at least one first server;
a second rack housing a second cluster of servers, the second cluster of servers including at least one second server; the second rack and the first rack are arranged oppositely, a cooling channel is arranged between the first rack and the second rack, the cooling channel is used for transmitting cooling medium, the cooling medium passes through the first server cluster from a first direction, passes through the second server cluster from a second direction, and the first direction is opposite to the second direction;
the first server and the second server are provided with the same main board, and the main board comprises a main board body and mounting structures symmetrically arranged on the main board body.
Optionally, the mounting structure is symmetrically arranged with the center of the main board body.
Optionally, the mounting structure includes a connection hole; the connection hole may be connected with connection posts in the first server and the second server.
Optionally, the method further comprises: the connection structure is connected with the data interaction interface arranged on the main board body.
Optionally, the connection structure includes a flat cable, one end of the flat cable is connected with the data interaction interface on the main board body.
Optionally, the first frame has a first opposite end, the second frame has a second opposite end, and the first opposite end and the second opposite end are disposed close to each other; the cooling channel is disposed between the first opposite end and the second opposite end, the cooling medium passing from the first opposite end through the first server cluster in the first direction and passing from the second opposite end through the second server cluster in the second direction.
Compared with the prior art, the embodiment of the application has the following advantages:
the embodiment of the application provides a mainboard applied to computing equipment, which comprises the following components: the mounting structure is used for mounting the main board body into the computing equipment. Through the mounting structure symmetrically arranged on the main board body, when the heat radiation wind direction changes, the requirement of the board card on the heat radiation wind direction can be met only by rotating the main board body by 180 degrees; and because the mounting structure is symmetrically arranged, after the main board body rotates 180 degrees, the mounting structure still can be connected with a corresponding structure in the computing equipment, so that the main board body is connected to the computing equipment, and the input of new computing equipment is not needed, namely, the original computing equipment can meet the requirement of the board card on the heat radiation wind direction, thereby reducing the use of the computing equipment and further reducing the cost of using the computing equipment.
Drawings
Fig. 1 is a schematic structural diagram of a motherboard applied to a computing device according to a first embodiment of the present application;
fig. 2a is a schematic diagram of a heat dissipation wind direction corresponding to a board card according to a first embodiment of the present disclosure;
fig. 2b is a schematic diagram of a heat dissipation wind direction corresponding to another board card according to the first embodiment of the present application;
fig. 3 is a schematic diagram of a heat dissipation wind direction corresponding to a board mounted on a main board body in the prior art;
FIG. 4 is a schematic view of the structure of FIG. 1 rotated 180 degrees;
FIG. 5 is a cross-sectional view of a computing device provided in a second embodiment of the present application;
FIG. 6 is a cross-sectional view of yet another computing device provided by a second embodiment of the present application;
fig. 7 is a schematic structural diagram of a data center room according to a third embodiment of the present application.
Reference numerals, motherboard 100, motherboard body 1, mounting structure 2, connection hole 21, center line 3, docking structure 4, data interaction interface 5, locking structure 6, computing device 200, assembly structure 7, connection post 71, computing device body 8, locking bracket 9, fixing bracket 10, connection device 11, data center room 300, first rack 301, first server cluster 302, first server 303, second rack 304, second server cluster 305, second server 306, first opposite end 307, second opposite end 308.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present application. The embodiments of the present application may be embodied in many other forms other than those described herein and similarly generalized by those skilled in the art may be made without departing from the spirit of the embodiments of the present application and the embodiments of the present application are therefore not limited to the specific implementations disclosed below.
A first embodiment of the present application provides a motherboard applied to a computing device, and fig. 1 is a schematic structural diagram of the motherboard applied to the computing device provided in the first embodiment of the present application.
As shown in fig. 1, a motherboard 100 applied to a computing device according to a first embodiment of the present application includes a motherboard body 1 and a mounting structure 2 symmetrically disposed on the motherboard body 1, the mounting structure 2 being a structure for mounting the motherboard body 1 into the computing device 200 (shown in fig. 6).
In the first embodiment of the present application, the main board body 1 may be a PCIE (peripheral component interconnect express, a high-speed serial computer expansion bus standard) main board, and a board card slot of the same specification is provided on the main board body 1 for installing PCIE boards of the same specification. The PCIE boards are required to have the same specification, so that the PCIE boards can meet the support of the heat dissipation wind direction in the same direction. As shown in fig. 2a and 2b, the first embodiment of the present application provides two boards with different heat dissipation directions.
In the prior art, as shown in fig. 3, because the PCIE board card disposed on the motherboard body 1 can only satisfy one type of heat dissipation wind direction, and the motherboard body 1 is installed in the computing device 200, if the PCIE board card originally disposed in the computing device 200 cannot be used again when the heat dissipation wind direction changes, then the heat dissipation requirement on the PCIE board card needs to be satisfied by replacing the computing device 200, so that the number of use of the computing device 200 is increased, and the use cost of the computing device 200 is increased. In order to reduce the number of uses of the computing device 200, in the first embodiment of the present application, on the main board body 1, mounting structures 2 are symmetrically provided, the mounting structures 2 being structures for mounting the main board body 1 into the computing device 200.
Specifically, the mounting structure 2 is symmetrically arranged at the center of the main board body 1, and the mounting structure 2 may be arranged at any position on the main board body 1, so long as the mounting structure is symmetrically arranged. For example, with the center of the main board body 1 as a symmetry point, two mounting structures 2 may be provided, wherein one mounting structure 2 is disposed at the upper right corner position of the main board body 1, and the other mounting structure 2 is disposed at the lower left corner position of the main board body 1. For another example, with the center of the main board body 1 as a symmetry point, two mounting structures 2 may be provided, wherein one mounting structure 2 is disposed on the main board body 1 and near the right side position of the center thereof, and the other mounting structure 2 is disposed on the main board body 1 and near the left side position of the center thereof. There are many positions where the mounting structure 2 is symmetrically disposed about the center of the main board body 1, and the first embodiment of the present application is not particularly limited herein.
It should be noted that, in the first embodiment of the present application, the mounting structure 2 is symmetrically disposed, so that when the direction of the heat radiation wind changes, the heat radiation direction of the PCIE board card on the motherboard body 1 is correspondingly changed (for example, as shown in fig. 1 and fig. 4, the motherboard body 1 in fig. 1 forms a form shown in fig. 4 after performing 180-degree horizontal rotation) after performing 180-degree horizontal rotation of the motherboard body 1, so as to meet the requirement of the PCIE board card on the heat radiation direction, and since the mounting structure 2 is symmetrically disposed, the mounting structure 2 can also be connected with a corresponding structure in the computing device 200 through the connection device 11 after rotating the motherboard body 1, thereby disposing the motherboard body 1 in the computing device 200. Therefore, when the heat radiation wind direction changes, the requirement of the current heat radiation wind direction is met by replacing the computing device 200, namely, the mounting structure 2 is symmetrically arranged and can be connected with the corresponding structure in the computing device 200 after the horizontal rotation of the main board body by 180 degrees, so that the heat radiation direction of the PCIE board card on the main board body 1 is correspondingly changed after the horizontal rotation of the main board body 1 by 180 degrees, and the requirement of the current heat radiation wind direction can be met.
Further, in the first embodiment of the present application, as shown in fig. 1, the mounting structure 2 is provided on the end of the main board body 1 symmetrical about the center line 3 of the main board body 1. Wherein the center line 3 is the center line 3 of the main plate body 1 in the width direction. The mounting structure 2 includes a connection hole 21; the connection hole 21 is connected with a connection post 71 (shown in fig. 5, the main board body 1 is installed downward in the arrow direction) in the computing device to install the main board body 1 into the computing device 200. Wherein, one or more connecting holes 21 are provided, and as shown in fig. 1, four connecting holes 21 are provided on the upper end of the main board body 1, and correspondingly, four connecting holes 21 are provided on the lower end of the main board body 1, wherein the four connecting holes 21 on the upper end are in a one-to-one symmetrical relationship with the four connecting holes 21 on the lower end. It will be appreciated that the connection posts 71 provided in the computing device are also symmetrically disposed and correspond to the connection holes 21.
Of course, the mounting structures 2 may also be symmetrically disposed with respect to a center line (not shown) of the main board body 1 in the longitudinal direction thereof as a symmetry line, and the mounting structures 2 may be disposed in two groups, one group being disposed at a left side position on the main board body 1 near the center line and the other group being disposed at a right side position on the main board body 1 near the center line. There are many positions where the mounting structure 2 is disposed on the main board body 1, and the first embodiment of the present application is not specifically limited thereto, and is not limited thereto, as long as the mounting structure 2 is symmetrically disposed on the main board body 1.
In other aspects of the first embodiment of the present application, the mounting structure 2 may also be a slot (not shown) that is directly connectable with a corresponding plug-in provided on the computing device 200. Of course, mounting structure 2 may also be a plug-in (not shown) that is connectable with a corresponding socket provided on the computing device 200. That is, the specific structure of the mounting structure 2 of the first embodiment of the present application may be other, as long as the mounting structure is symmetrically disposed on the main board body 1 and can be connected with a structure correspondingly disposed on the computing device 200, so as to mount the main board body 1 on the computing device 200, which is the scope of the first embodiment of the present application.
In the first embodiment of the present application, as shown in fig. 6, the main board body 1 may also be disposed on the computing device 200 by the connection device 11 cooperating with the connection hole 21. Wherein the connecting device 11 at least comprises a screw or a rivet. It will be appreciated that in the computing device 200, screw holes are provided that mate with screws, or rivet holes are provided that mate with rivets. For example, if the connection device 11 is a screw, the corresponding structure in the computing apparatus 200 is a screw hole, into which the screw is connected through the connection hole 21. Of course, it will be further understood that since the connection holes 21 on the main board body 1 are symmetrically disposed about the center line 3 of the main board body 1, the screw holes disposed on the computing device 200 are also symmetrically disposed, so that after the main board body 1 rotates 180 degrees, the connection holes 21 can still be disposed corresponding to the screw holes, thereby fixing the main board body 1 in the computing device 200 through the connection device 11, and further, the computing device 200 does not need to be replaced, thereby reducing the number of applications and cost of the computing device 200.
In the first embodiment of the present application, in order to make the main board body 1 more stable when being mounted on the computing device 200, a locking structure 6 is further provided, the locking structure 6 is symmetrically disposed on the main board body 1, the locking structure 6 is a structure matched with a locking bracket 9 on the computing device 200, and the locking bracket 9 (shown in fig. 6) is used for fixing the main board body 1. Wherein the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about a center line 3 in a width direction of the main plate body 1, or the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about a center line in a length direction of the main plate body 1.
In the first embodiment of the present application, considering that after the main board body 1 rotates, the data interaction interface 5 disposed on the main board body 1 will change along with the rotation, for example, as shown in fig. 1, the data interaction interface 5 is located above the center line 3 with respect to the current main board body 1 at the beginning, when the main board body 1 rotates 180 degrees, the main board body 1 after the data interaction interface 5 rotates relatively is located below the center line 3, as shown in fig. 4, so that the data interaction interface 5 cannot be connected with the data interaction interface 5 (shown in fig. 6) disposed on the computing device 200, and information such as data cannot be transmitted. In order to avoid this, a connection structure 4 is further provided, and the connection structure 4 is connected to a data interaction interface 5 provided on the main board body 1. Specifically, the connection structure 4 may be a flat cable, where one end of the flat cable is connected to the data interaction interface 5 on the main board body 1. Because the winding displacement has fine ductility and pliability, so when mainboard body 1 carries out 180 degrees rotations, the winding displacement can not influence the transmission of data because of the change of current data interaction interface 5 position on the mainboard body 1, and rotatory process winding displacement can not damage, and then can not influence the normal transmission of data.
Of course, in other technical solutions of the first embodiment of the present application, the data interaction interface 5 disposed on the main board body 1 may be symmetrically disposed about the center of the main board body 1, so that even after the main board body 1 rotates 180 degrees, the data interaction interface 5 may still be connected with the data interaction interface 5 disposed on the computing device 200, so as to support normal transmission of data.
A first embodiment of the present application provides a motherboard applied to a computing device, including: a main board body 1 and a mounting structure 2 symmetrically provided on the main board body 1, the mounting structure 2 being a structure for mounting the main board body 1 into the computing device. Through the mounting structure 2 symmetrically arranged on the main board body 1 in the first embodiment of the application, when the heat radiation wind direction changes, the requirement of the board card on the heat radiation wind direction can be met only by rotating the main board body 1 by 180 degrees; and because mounting structure 2 is symmetrical setting, after mainboard body 1 carries out 180 degrees rotations, mounting structure 2 still can be connected with the structure that corresponds in the computing equipment 200 to connect mainboard body 1 on the computing equipment, just so need not the input of new computing equipment 200, original computing equipment 200 can satisfy the demand of integrated circuit board to the heat dissipation wind direction promptly, thereby reduces computing equipment 200's use, and then has reduced the cost of using computing equipment 200.
The second embodiment of the present application further provides a computing device 200, based on which the motherboard 100 of the first embodiment is adopted by the computing device 200, so the components in the computing device 200 of the second embodiment may refer to the labels of the components of the first embodiment.
As shown in fig. 5 and 6, a second embodiment of the present application provides a computing device 200, comprising: a main board body 1, a mounting structure 2 symmetrically arranged on the main board body 1, a computing device body 8 and an assembling structure 7 symmetrically arranged on the computing device body 8; the mounting structure 2 and the assembling structure 7 are correspondingly arranged for mounting the main board body 1 on the computing device body 8.
In the second embodiment of the present application, the mounting structure 2 is symmetrically disposed with respect to the center of the main board body 1, and the mounting structure 2 may be disposed at any position on the main board body 1, so long as it is symmetrically disposed. For example, with the center of the main board body 1 as a symmetry point, two mounting structures 2 may be provided, wherein one mounting structure 2 is disposed at the upper right corner position of the main board body 1, and the other mounting structure 2 is disposed at the lower left corner position of the main board body 1. For another example, with the center of the main board body 1 as a symmetry point, two mounting structures 2 may be provided, wherein one mounting structure 2 is disposed on the main board body 1 and near the right side position of the center thereof, and the other mounting structure 2 is disposed on the main board body 1 and near the left side position of the center thereof. There are many positions where the mounting structure 2 is symmetrically disposed about the center of the main board body 1, and the second embodiment of the present application is not particularly limited herein.
It should be noted that, in the second embodiment of the present application, the mounting structure 2 is symmetrically disposed, so that when the direction of the heat radiation wind changes, the heat radiation direction of the PCIE board card on the motherboard body 1 is correspondingly changed (for example, as shown in fig. 1 and fig. 4, the motherboard body 1 in fig. 1 forms a form shown in fig. 4 after performing 180-degree horizontal rotation) after performing 180-degree horizontal rotation on the motherboard body 1, so as to meet the requirement of the PCIE board card on the heat radiation direction, and since the mounting structure 2 is symmetrically disposed, the mounting structure 2 can be connected with the mounting structure 7 on the computing device body 8 through the connecting device 11 after rotating the motherboard body 1, as shown in fig. 6, so that the motherboard body 1 is disposed on the computing device body 8. Therefore, when the heat radiation wind direction is changed, the requirement of the current heat radiation wind direction is met by replacing the computing equipment 200, namely, the mounting structure 2 is symmetrically arranged, and the mounting structure 2 can still be connected with the corresponding assembly structure 7 on the computing equipment body 8 after the horizontal rotation of the main board body by 180 degrees, so that the PCIE board card heat radiation direction on the main board body 1 is correspondingly changed after the horizontal rotation of the main board body 1 by 180 degrees, and the requirement of the current heat radiation wind direction can be met.
Further, in the second embodiment of the present application, as shown in fig. 1, the mounting structure 2 is provided on the end of the main board body 1 symmetrical about the center line 3 of the main board body 1. Wherein the center line 3 is the center line 3 of the main plate body 1 in the width direction. The mounting structure 2 includes a connection hole 21; the connection hole 21 is connected with a connection post 71 (shown in fig. 5, the main board body 1 is mounted downward in the arrow direction) in the computing device to mount the main board body 1 to the computing device body 8. Wherein, one or a plurality of connecting holes 21 are provided, and as shown in fig. 1, four connecting holes 21 which are arranged side by side along the width direction are arranged on the upper end part of the main board body 1; correspondingly, four connecting holes 21 are arranged on the lower end part of the main board body 1 side by side along the width direction, and the four connecting holes 21 on the upper end part are respectively in one-to-one symmetrical relation with the four connecting holes 21 on the lower end part. It will be appreciated that the connection posts 71 provided in the computing device are also symmetrically disposed and correspond to the connection holes 21.
Of course, the mounting structures 2 may also be symmetrically disposed with respect to a center line (not shown) of the main board body 1 in the longitudinal direction thereof as a symmetry line, and the mounting structures 2 may be disposed in two groups, one group being disposed at a left side position on the main board body 1 near the center line and the other group being disposed at a right side position on the main board body 1 near the center line. The positions where the mounting structures 2 are disposed on the main board body 1 are many, and the second embodiment of the present application is not particularly limited, and is not limited to the second embodiment of the present application as long as the mounting structures 2 are symmetrically disposed on the main board body 1.
In other versions of the second embodiment of the present application, the mounting structure 2 may also be a socket (not shown) that may be directly connected to a corresponding plug-in provided on the computing device body 8, i.e. the mounting structure 7 is a plug-in. Of course, the mounting structure 2 may also be a plug-in (not shown) which is connectable with a socket correspondingly provided on the computing device body 8, i.e. the mounting structure 7 is a socket. That is, the specific structure of the mounting structure 2 of the second embodiment of the present application may be other, as long as the specific structure is symmetrically disposed on the main board body 1 and can be connected to the mounting structure 7 correspondingly disposed on the computing device body 8, which is the scope to be protected by the second embodiment of the present application, and the specific structure of the mounting structure 7 will be disposed correspondingly to the mounting structure 2.
In this second embodiment, in order to install the main board body 1 on the computing device body 8 more firmly, a locking structure 6 is further provided, the locking structure 6 is symmetrically disposed on the main board body 1, the locking structure 6 is a structure matched with a locking bracket 9 on the computing device body 8, and the locking bracket 9 is used for fixing the main board body 1. Wherein the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about a center line 3 in a width direction of the main plate body 1, or the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about a center line in a length direction of the main plate body 1.
In the second embodiment of the present application, as shown in fig. 6, the main board body 1 may also be disposed on the computing device body 8 by the connection device 11 cooperating with the connection hole 21, wherein the connection device 11 includes at least a screw or a rivet. It will be appreciated that on the computing device body 8, screw holes are provided that match screws, or rivet holes are provided that match rivets. For example, if the connection device 11 is a screw, the corresponding structure on the computing device body 8 is a screw hole, and the screw is connected to the screw hole through the connection hole 21. Of course, it can be understood that, since the connecting holes 21 on the main board body 1 are symmetrically arranged about the center line 3 of the main board body 1, the screw holes provided on the computing device body 8 are also symmetrically arranged, so that after the main board body 1 rotates 180 degrees, the connecting holes 21 can still be correspondingly arranged with the screw holes, thereby fixing the main board body 1 on the computing device body 8 through the connecting device 11, and further, the computing device 200 does not need to be replaced, thereby reducing the number of use and cost of the computing device 200.
In the second embodiment of the present application, considering that after the main board body 1 rotates, the data interaction interface 5 disposed on the main board body 1 will change along with the rotation, for example, as shown in fig. 1, the data interaction interface 5 is located above the center line 3 with respect to the current main board body 1 at the beginning, when the main board body 1 rotates 180 degrees, the main board body 1 after the data interaction interface 5 rotates relatively is located below the center line 3, as shown in fig. 4, so that the data interaction interface 5 cannot be connected with the data interaction interface 5 disposed on the computing device body 8, and information such as data cannot be transmitted. In order to avoid this, a docking structure 4 is also provided, said docking structure 4 being arranged between said motherboard body 1 and said computing device body 8. Specifically, the connection structure 4 may be a flat cable, where one end of the flat cable is connected to the data interaction interface 5 on the main board body 1, and the other end of the flat cable is connected to the data interaction interface 5 disposed on the computing device body 8. Because the winding displacement has fine ductility and pliability, so when mainboard body 1 carries out 180 degrees rotations, the winding displacement can not influence the transmission of data because of the change of current data interaction interface 5 position on the mainboard body 1, and rotatory process winding displacement can not damage, and then can not influence the normal transmission of data.
Of course, in other technical solutions of the second embodiment of the present application, the data interaction interface 5 disposed on the main board body 1 may be symmetrically disposed about the center of the main board body 1, so that even after the main board body 1 rotates 180 degrees, the data interaction interface 5 may still be connected with the data interaction interface 5 disposed on the computing device body 8, so as to support normal transmission of data.
A second embodiment of the present application provides a computing device comprising: a main board body 1, a mounting structure 2 symmetrically arranged on the main board body 1, a computing device body 8 and an assembling structure 7 symmetrically arranged on the computing device body 8; the mounting structure 2 and the assembling structure 7 are correspondingly arranged for mounting the main board body 1 on the computing device body 8. Through the mounting structure 2 symmetrically arranged on the main board body 1 in the second embodiment of the application, when the heat radiation wind direction changes, the requirement of the board card on the heat radiation wind direction can be met only by rotating the main board body 1 by 180 degrees; and because mounting structure 2 is symmetrical setting, mounting structure 2 with assembly structure 7 corresponds the setting, and after mainboard body 1 carries out 180 degrees rotations, mounting structure 2 still can be connected with assembly structure 7 on the computing equipment body 8 to connect mainboard body 1 on computing equipment body 8, just so do not need the input of new computing equipment 200, original computing equipment 200 can satisfy the demand of different heat dissipation wind directions promptly, thereby reduces computing equipment 200's use, and then has reduced the cost of using computing equipment 200.
The third embodiment of the present application further provides a data center room 300, based on which the motherboard 100 of the first embodiment and the second embodiment is adopted by the data center room 300, so the components in the data center room 300 of the third embodiment may refer to the labels of the components of the first embodiment and the second embodiment.
As shown in fig. 7, a data center room 300 provided in the third embodiment of the present application includes: the first chassis 301 and the second chassis 304, the first chassis 301 and the second chassis 304 being disposed opposite each other. Wherein the first rack 301 houses a first server cluster 302, the first server cluster 302 including at least one first server 303; the second rack 304 houses a second cluster of servers 305, the second cluster of servers 305 including at least one second server 306. It is understood that the first server 303 and the second server 306 according to the third embodiment of the present application are the computing devices according to the second embodiment of the present application.
In the third embodiment of the present application, in order to remove the heat dissipated by the first server cluster 302 and the second server cluster 305, a cooling channel is further provided, as shown in fig. 7, between the first rack 301 and the second rack 304, the cooling channel is used for transferring a cooling medium, and the cooling medium passes through the first server cluster 302 from a first direction and passes through the second server cluster 305 from a second direction. The first direction and the second direction are opposite, and the first direction and the second direction may be understood as a direction of the heat radiation wind corresponding to the first server cluster 302 and the second server cluster 305. Further, the first rack 301 has a first opposite end 307 and the second rack 304 has a second opposite end 308, the first opposite end 307 and the second opposite end 308 being disposed proximate to each other, a cooling channel being disposed between the first opposite end 307 and the second opposite end 308, the cooling medium passing from the first opposite end 307 through the first server cluster 302 in a first direction and passing from the second opposite end 308 through the second server cluster 305 in a second direction.
In the third embodiment of the present application, since one cooling channel is shared between the first rack 301 and the second rack 304, the first server cluster 302 and the second server cluster 305 need to accept two different wind directions to achieve heat dissipation. In order to meet the requirements of different heat dissipation wind directions, in the third embodiment of the present application, the first server 303 has a motherboard, the second server 306 has a motherboard, the motherboard of the first server 303 and the motherboard of the second server 306 have the same specification, and the motherboard 100 of the two includes a motherboard body 1 and a mounting structure 2 symmetrically disposed on the motherboard body 1. The first server 303 and the second server 306 are respectively provided with symmetrically arranged assembling structures 7; the mounting structure 2 and the mounting structure 7 are correspondingly arranged for mounting the main board body 1 into the first server 303 and the second server 306.
The mounting structure 2 is symmetrically arranged at the center of the main board body 1, and the mounting structure 2 may be arranged at any position on the main board body 1, so long as the mounting structure is symmetrically arranged. For example, with the center of the main board body 1 as a symmetry point, the mounting structures 2 may be provided in two, wherein one mounting structure 2 is provided at the upper right corner position of the main board body 1, and the other mounting structure 2 is provided at the lower left corner position of the main board body 1. For another example, with the center of the main board body 1 as a symmetry point, the mounting structures 2 may be provided in two, wherein one mounting structure 2 is provided on the main board body 1 near the right side position of the center thereof, and the other mounting structure 2 is provided on the main board body 1 near the left side position of the center thereof. There are many positions where the mounting structure 2 is arranged symmetrically with respect to the center of the main board body 1, and the third embodiment of the present application is not particularly limited herein.
It can be understood that in the third embodiment of the present application, the mounting structure 2 is symmetrically disposed, so that when the cooling channels have different cooling wind directions, the cooling direction of the PCIE board card on the motherboard body 1 is correspondingly changed after the motherboard body 1 in the first server 303 or the second server 306 is horizontally rotated 180 degrees (for example, as shown in fig. 1 and fig. 4, the motherboard body 1 in fig. 1 is horizontally rotated 180 degrees to form the configuration shown in fig. 4), so as to meet the requirement of the PCIE board card on the cooling direction. And since the mounting structure 2 is symmetrically arranged, after the main board body 1 rotates, the mounting structure 2 can be connected with the assembly structure 7 on the first server 303 and the second server 306 through the connecting device 11 as shown in fig. 6, so that the main board body 1 is arranged on the first server 303 and the second server 306 for continuous use. In this way, when the heat dissipation wind directions are different, the requirement of different current heat dissipation wind directions does not need to be met by replacing the first server 303 or the second server 306.
Further, in the third embodiment of the present application, as shown in fig. 1, the mounting structure 2 is provided on the end of the main board body 1 symmetrical about the center line 3 of the main board body 1. Wherein the center line 3 is the center line 3 of the main plate body 1 in the width direction. The mounting structure 2 includes a connection hole 21, that is, the first server 303 and the second server 306 have connection holes 21, respectively, and the connection holes 21 are connected with connection posts 71 (shown in fig. 5, the main board body 1 is mounted downward in the arrow direction) in the first server 303 and the second server 306 to mount the main board body 1 to the first server 303 or the second server 306. Wherein the number of the connecting holes 21 is one or more. As shown in fig. 1, four connecting holes 21 are provided on the upper end of the main board body 1, and correspondingly, four connecting holes 21 are provided on the lower end of the main board body 1, wherein the four connecting holes 21 on the upper end are in a one-to-one symmetrical relationship with the four connecting holes 21 on the lower end. It will be appreciated that the connection posts 71 provided in the first server 303 and the second server 306 are also symmetrically provided and correspond to the connection holes 21.
In other aspects of the third embodiment of the present application, the mounting structure 2 may also be a slot (not shown) that may be directly connected to the corresponding plug-ins provided on the first server 303 and the second server 306, i.e. the mounting structure 7 is a plug-in. Of course, the mounting structure 2 may also be a plug-in (not shown) which is connectable with the corresponding slots provided on the first server 303 and the second server 306, i.e. the mounting structure 7 is a slot. That is, the specific structure of the mounting structure 2 of the third embodiment of the present application may be other, as long as the mounting structure is symmetrically disposed on the main board body 1 and can be connected to the mounting structure 7 correspondingly disposed on the first server 303 and the second server 306, which is the scope to be protected by the third embodiment of the present application, and the specific structure of the mounting structure 7 may be disposed corresponding to the mounting structure 2.
In the third embodiment of the present application, in order to make the main board body 1 more stable when being mounted on the first server 303 and the second server 306, a locking structure 6 is further provided, the locking structure 6 is symmetrically disposed on the main board body 1, the locking structure 6 is a structure matched with the locking brackets 9 on the first server 303 and the second server 306, and the locking brackets 9 are used for fixing the main board body 1. Wherein the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about the center line 3 of the main plate body 1 in the width direction, or the locking structure 6 is provided at an end edge of the main plate body 1 symmetrical about the center line of the main plate body 1 in the length direction.
In the third embodiment of the present application, as shown in fig. 6, the main board body 1 may also be disposed on the first server 303 and the second server 306 by the connection device 11 cooperating with the connection hole 21, wherein the connection device 11 includes at least a screw or a rivet. It will be appreciated that screw holes matching the screws or rivet holes matching the rivets are provided on the first server 303 and the second server 306, respectively. For example, if the connection device 11 is a screw, the corresponding structures on the first server 303 and the second server 306 are screw holes, and the screw is connected to the screw holes through the connection hole 21. Of course, it can be understood that, since the connecting hole 21 on the main board body 1 is symmetrically arranged about the center line 3 of the main board body 1, the screw holes provided on the first server 303 and the second server 306 are symmetrically arranged, so that after the main board body 1 rotates 180 degrees, the connecting hole 21 can still be correspondingly arranged with the screw hole, thereby fixing the main board body 1 on the first server 303 or the second server 306 through the connecting device 11, and further, the first server 303 or the second server 306 does not need to be replaced, and the number and cost of the first server 303 and the second server 306 are reduced.
In the third embodiment of the present application, considering that after the main board body 1 of the first server 303 or the second server 306 rotates, the data interaction interface 5 disposed on the main board body 1 may change along with the rotation, for example, as shown in fig. 1, the data interaction interface 5 is initially located above the center line 3 relative to the current main board body 1, and after the main board body 1 rotates 180 degrees, the data interaction interface 5 is located below the center line 3 relative to the rotated main board body 1, as shown in fig. 4; this causes a situation that the data interaction interface 5 cannot be connected to the data interaction interface 5 provided on the first server 303 or the second server 306, and thus information such as data cannot be transmitted. In order to avoid this, a docking structure 4 is also provided, the docking structure 4 being arranged between the motherboard body 1 and the computing device body 8. Specifically, the connection structure 4 may be a flat cable, where one end of the flat cable is connected to the data interaction interface 5 on the main board body 1, and the other end of the flat cable is connected to the data interaction interface 5 disposed on the first server 303 or the second server 306. Because the winding displacement has fine ductility and pliability, so when mainboard body 1 carries out 180 degrees rotations, the winding displacement can not influence the transmission of data because of the change of current data interaction interface 5 position on the mainboard body 1, and rotatory process winding displacement can not damage, and then can not influence the normal transmission of data.
Of course, in other technical solutions of the third embodiment of the present application, the data interaction interface 5 disposed on the main board body 1 may be disposed symmetrically with respect to the center of the main board body 1, so that even after the main board body 1 rotates 180 degrees, the data interaction interface 5 may still be connected with the data interaction interface 5 disposed on the computing device body 8, so as to support normal transmission of data.
It should be noted that, the direction of the heat dissipation wind of the cooling channel may be changed, and may specifically be another data center room (not shown), where the data center room includes: the first rack and the second rack are arranged oppositely. The first rack accommodates a first server cluster, wherein the first server cluster comprises at least one first server; the second rack houses a second cluster of servers, the second cluster of servers including at least one second server. The cooling channel is arranged between the first rack and the second rack, and specifically, the first rack is further provided with a first opposite end, the second rack is further provided with a second opposite end, the first opposite end is far away from the first opposite end, the second opposite end is far away from the second opposite end, the cooling channel is arranged between the first opposite end and the second opposite end, and a cooling medium passes through the first server cluster from the first opposite end along a first direction and passes through the second server cluster from the second opposite end along a second direction. The first direction and the second direction are opposite directions in the connection direction of the first rack and the second rack, and a heat dissipation channel needs to be arranged between the first opposite end and the second opposite end at this time, so that heat in the first server cluster and the second server cluster is dissipated through the channel.
A third embodiment of the present application provides a data center room, including: a first rack 301, the first rack 301 housing a first server cluster 302, the first server cluster 302 comprising at least one first server 303; a second rack 304, the second rack 304 housing a second cluster of servers 305, the second cluster of servers 305 including at least one second server 306; the second rack 304 is disposed opposite to the first rack 301, a cooling channel is disposed between the first rack 301 and the second rack 304, the cooling channel is used for transferring a cooling medium, the cooling medium passes through the first server cluster 302 from a first direction, and passes through the second server cluster 305 from a second direction, and the first direction is opposite to the second direction; the first server 303 and the second server 306 have the same motherboard, and the motherboard includes a motherboard body and a mounting structure symmetrically disposed on the motherboard body. In the third embodiment of the present application, a cooling channel is shared between the first rack 301 and the second rack 304, so that the first server cluster 302 and the second server cluster 305 need to receive two different wind directions to realize heat dissipation, but the mounting structure 2 is symmetrically arranged on the main board body 1, so that only the main board body 1 in the first server 303 or the second server 306 needs to be rotated 180 degrees, so that the requirements of the first server cluster 302 and the second server cluster 305 for different heat dissipation wind directions can be met; and because mounting structure 2 is symmetrical setting, mounting structure 2 and assembly structure 7 correspond the setting, after mainboard body 1 carries out 180 degrees rotations, mounting structure 2 still can be connected with assembly structure 7 in first server 303 or the second server 306 to connect mainboard body 1 on first server 303 or second server 306, just so do not need new first server 303 or second server 306's input, original first server 303 or second server 306 can satisfy the demand of heat dissipation wind direction promptly, thereby reduce first server 303 or second server 306's use, and then reduced use cost.
Application scenario 1
The computing device 200 is installed in the computing device air cooling system, and at this time, the main board body 1 in the computing device 200 dissipates heat according to the heat dissipation wind direction provided by the computing device air cooling system. When the heat radiation wind direction of the air cooling system of the computing equipment is changed, at this time, the computing equipment 200 is opened, the main board body 1 in the computing equipment 200 is rotated 180 degrees, and the board card on the main board body 1 can meet the requirement of the changed heat radiation wind direction. Then, through the connection of the mounting structure 2 symmetrically arranged on the main board body 1 and the assembly structure 7 correspondingly arranged on the computing device body 8 by the mounting structure 2, the main board body 1 is fixedly arranged in the current computing device 200 again, so that the investment of the new computing device 200 is not needed, namely, the original computing device 200 can meet the requirement of the heat radiation wind direction, thereby reducing the use of the computing device 200 and further reducing the cost of using the computing device 200.
Application scenario 2
In a data center room, comprising: a first rack 301, the first rack 301 housing a first server cluster 302, the first server cluster 302 comprising at least one first server 303; a second rack 304, the second rack 304 housing a second cluster of servers 305, the second cluster of servers 305 including at least one second server 306; the second rack 304 is disposed opposite to the first rack 301, and a cooling channel is disposed between the first rack 301 and the second rack 304, where the cooling channel is used for transferring a cooling medium, and since one cooling channel is shared between the first rack 301 and the second rack 304, the first server cluster 302 and the second server cluster 305 need to receive two different wind directions to achieve heat dissipation, that is, the cooling medium passes through the first server cluster 302 from a first direction and passes through the second server cluster 305 from a second direction, where the first direction and the second direction are opposite. However, the first server 303 and the second server 306 have the same motherboard, and the motherboard includes a motherboard body and a mounting structure symmetrically disposed on the motherboard body. Therefore, in this scenario, only the main board body 1 in the first server 303 or the second server 306 needs to be rotated 180 degrees, so that the board card on the main board body 1 can meet the requirement of the changed heat dissipation wind direction, even if the first server cluster 302 and the second server cluster 305 simultaneously meet two different heat dissipation wind directions. Then, the main board body 1 of the first server 303 or the second server 306 is fixedly installed in the current first server 303 or the second server 306 again through the connection of the installation structure 2 symmetrically arranged on the main board body 1 and the assembly structure 7 correspondingly arranged on the first server 303 or the second server 306 by the installation structure 2, so that the investment of a new first server 303 or second server 306 is not needed, namely, the original first server 303 or second server 306 can meet the requirement of heat radiation wind direction, thereby reducing the use of the first server 303 or the second server 306 and further reducing the use cost.
Although the embodiments of the present application have been described in terms of preferred embodiments, it should be understood that the embodiments of the present application are not limited to the embodiments of the present application, and that various changes and modifications can be made herein by one skilled in the art without departing from the spirit and scope of the embodiments of the present application.
Claims (15)
1. A motherboard for a computing device, comprising: a main board body and a mounting structure symmetrically disposed on the main board body, the mounting structure being a structure for mounting the main board body into the computing device, the mounting structure being disposed on an end of the main board body symmetrical about a center line of the main board body; when the heat radiation wind direction changes, after the main board body rotates 180 degrees, the mounting structure can still be connected with a corresponding structure in the computing equipment so as to connect the main board body to the computing equipment;
the connection structure is connected with the data interaction interface arranged on the main board body and comprises a flat cable, and one end of the flat cable is connected with the data interaction interface on the main board body.
2. The motherboard of claim 1, wherein the mounting structure comprises a connection hole; the connection hole is connected with a connection post in the computing device to mount the main board body into the computing device.
3. The motherboard of claim 2, wherein the connection holes are one or more.
4. The motherboard for a computing device of claim 2, further comprising: and the connecting device is matched with the connecting hole so as to install the main board body into the computing equipment.
5. The motherboard of claim 4, wherein the connection means comprises at least a screw or rivet that can pass through the connection hole, the screw being connected to a screw hole on the computing device through the connection hole; or the rivet is connected with a rivet hole on the computing device through the connecting hole.
6. A computing device, comprising: the device comprises a main board body and mounting structures symmetrically arranged on the main board body, and a computing equipment body and assembly structures symmetrically arranged on the computing equipment body; the mounting structure and the assembling structure are correspondingly arranged and are used for mounting the main board body on the computing equipment body, and the mounting structure is arranged on the end part of the main board body symmetrical with the central line of the main board body; when the heat radiation wind direction changes, after the main board body rotates 180 degrees, the mounting structure can still be connected with a corresponding structure in the computing equipment so as to connect the main board body to the computing equipment;
The connection structure is connected with the data interaction interface arranged on the main board body and comprises a flat cable, and one end of the flat cable is connected with the data interaction interface on the main board body.
7. The computing device of claim 6, wherein the mounting structure comprises a connection hole; the connection hole is connected with the assembly structure to mount the motherboard body to the computing device body.
8. The computing device of claim 7, wherein the mounting structure comprises a connection post connectable with the connection hole.
9. The computing device of claim 7, further comprising: and the connecting device is matched with the connecting hole, and the main board body is mounted on the computing equipment body.
10. The computing device of claim 9, wherein the connection means comprises at least a screw or rivet that is passable through the connection hole, the mounting structure further comprising a corresponding mating screw or rivet with the screw hole or rivet hole, respectively;
the screw is connected with a screw hole on the computing device through the connecting hole; or the rivet is connected with a rivet hole on the computing device through the connecting hole.
11. The computing device of claim 6, further comprising: the locking bracket is arranged on the computing equipment and used for fixing the main board body.
12. The computing device of claim 6, wherein the other end of the flat cable is connected with a data interaction interface disposed on the computing device body.
13. A data center room, comprising:
a first rack housing a first cluster of servers, the first cluster of servers including at least one first server;
a second rack housing a second cluster of servers, the second cluster of servers including at least one second server; the second rack and the first rack are arranged oppositely, a cooling channel is arranged between the first rack and the second rack, the cooling channel is used for transmitting cooling medium, the cooling medium passes through the first server cluster from a first direction, passes through the second server cluster from a second direction, and the first direction is opposite to the second direction;
the first server and the second server are provided with the same main board, the main board comprises a main board body and mounting structures symmetrically arranged on the main board body, and the mounting structures are arranged on the end parts of the main board body which are symmetrical with the central line of the main board body; when the heat radiation wind direction changes, after the main board body rotates 180 degrees, the mounting structure can still be connected with a corresponding structure in the computing equipment so as to connect the main board body to the computing equipment; the mainboard further comprises a connection structure, the connection structure is connected with a data interaction interface arranged on the main board body, the connection structure comprises a flat cable, and one end of the flat cable is connected with the data interaction interface on the main board body.
14. The data center room of claim 13, wherein the mounting structure comprises a connection hole; the connection hole may be connected with connection posts in the first server and the second server.
15. The data center room of claim 13, wherein the first rack has a first opposite end and the second rack has a second opposite end, the first opposite end and the second opposite end being disposed proximate; the cooling channel is disposed between the first opposite end and the second opposite end, the cooling medium passing from the first opposite end through the first server cluster in the first direction and passing from the second opposite end through the second server cluster in the second direction.
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| CN202010039655.5A CN113126704B (en) | 2020-01-15 | 2020-01-15 | Mainboard applied to computing equipment, computing equipment and data center machine room |
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| CN202010039655.5A CN113126704B (en) | 2020-01-15 | 2020-01-15 | Mainboard applied to computing equipment, computing equipment and data center machine room |
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| CN113126704B true CN113126704B (en) | 2024-04-02 |
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| CN113126704A (en) | 2021-07-16 |
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