CN215987125U

CN215987125U - Compact double-circuit CPU mainboard that dislocation set up and server thereof

Info

Publication number: CN215987125U
Application number: CN202120318570.0U
Authority: CN
Inventors: 聂爱君
Original assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Priority date: 2021-02-04
Filing date: 2021-02-04
Publication date: 2022-03-08
Anticipated expiration: 2031-02-04

Abstract

The utility model provides a staggered compact double-way CPU mainboard and a server thereof, wherein the staggered compact double-way CPU mainboard comprises: the computer case comprises a mainboard body, a first CPU module, a second CPU module, a rear panel interface module and a memory slot module, wherein the first CPU module is arranged on one side of the mainboard body, which is far away from a case rear panel, the second CPU module and the rear panel interface module are arranged on one side of the mainboard body, which is close to the case rear panel, the first CPU module and the second CPU module are arranged in a staggered manner, and the memory slot module is respectively arranged on two sides of the first CPU module and the second CPU module. The utility model realizes a compact double-path CPU mainboard with higher calculation power, has high execution efficiency, effectively improves the heat dissipation efficiency, is convenient for wiring, and is also beneficial to the function expansion and the later maintenance of products.

Description

Compact double-circuit CPU mainboard that dislocation set up and server thereof

Technical Field

The utility model relates to a dual-path CPU mainboard, in particular to a staggered compact dual-path CPU mainboard and a server comprising the staggered compact dual-path CPU mainboard.

Background

The dual-path CPU main board is produced mainly for meeting the requirements of professional applications such as cloud computing, servers and graphic workstations, so that the computing processing capacity and the function expansion performance of the system are required to be high. A traditional dual-CPU motherboard generally uses a server processor supporting two CPUs, and although an operating system can directly call resources of the two CPUs, the existing dual-CPU motherboard is generally larger in size and at least is an EATX standard board, so that with the update and upgrade of products, the layout and design of the dual-CPU motherboard also need to be further improved so as to be more compact and reasonable; secondly, in a compact server, if two CPUs are arranged side by side in tandem, the former CPU will increase the heat dissipation pressure of the latter CPU, and the arrangement and routing of other modules are not facilitated due to over concentration.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a compact two-way CPU motherboard which can meet the requirements of a compact server and can realize the functions of dual CPUs and the heat dissipation requirements thereof, and further provide a server comprising the compact two-way CPU motherboard on the basis.

In view of the above, the present invention provides a staggered compact dual-channel CPU board, comprising: the computer case comprises a mainboard body, a first CPU module, a second CPU module, a rear panel interface module and a memory slot module, wherein the first CPU module is arranged on one side of the mainboard body, which is far away from a case rear panel, the second CPU module and the rear panel interface module are arranged on one side of the mainboard body, which is close to the case rear panel, the first CPU module and the second CPU module are arranged in a staggered manner, and the memory slot module is respectively arranged on two sides of the first CPU module and the second CPU module.

A further improvement of the present invention is that the back panel interface module is disposed between the second CPU module and the rear panel of the chassis.

The utility model has the further improvement that a radiator is arranged between the second CPU module and the rear panel interface module, and a radiator is also arranged beside the first CPU module.

The utility model has the further improvement that the direction of the fins of the radiator is parallel to the air outlet direction of the memory slot in the memory slot module.

The memory slot module comprises a first memory slot module and a second memory slot module, and the first memory slot module and the second memory slot module are symmetrically arranged at two sides of the first CPU module side by side.

The memory slot module further comprises a third memory slot module and a fourth memory slot module, and the third memory slot module and the fourth memory slot module are symmetrically arranged on two sides of the second CPU module side by side.

The utility model has the further improvement that the utility model also comprises a PCI-E slot module, wherein the PCI-E slot module is arranged on one side of the mainboard body close to the rear panel of the case and is arranged on one side of the fourth memory slot module far away from the second CPU module.

A further improvement of the present invention is that the PCI-E slot module includes two X8 PCI-E slots and four X16 PCI-E slots.

The present invention has a further improvement in that the present invention further includes a south bridge module, and the south bridge module is disposed on a side of the motherboard body away from the rear panel of the chassis and is disposed beside the second memory slot module.

The utility model also provides a server which comprises a case and the compact double-path CPU mainboard arranged in a staggered manner, wherein the compact double-path CPU mainboard arranged in the staggered manner is arranged in the case.

Compared with the prior art, the utility model has the beneficial effects that: the first CPU module and the second CPU module are arranged in a staggered mode, and the second CPU module and the rear panel interface module are arranged on one side, close to the rear panel of the case, of the mainboard body, so that a compact double-path CPU mainboard with higher calculation capacity is realized, the execution efficiency is higher, and through the design that the front and back layout is staggered with each other, the heat dissipation pressure of the first CPU module on the second CPU module can be effectively reduced, the heat dissipation efficiency is improved, and wiring is facilitated; on the basis, the rear panel interface module is arranged between the second CPU module and the rear panel of the case, so that the space between the second CPU module and the rear panel of the case is reasonably arranged, the rear panel interface module is convenient to fix, and meanwhile, the mainboard body can be enabled to reserve a space to realize other functions, such as setting up PCI-E card slots as many as possible, and the function expansion and later maintenance of products are facilitated.

Drawings

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic top view of an embodiment of the present invention;

fig. 3 is a schematic diagram of a backside structure according to an embodiment of the utility model.

Detailed Description

Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 3, this embodiment provides a compact dual-CPU board arranged in a staggered manner, including: the computer case comprises a main board body 1, a first CPU module 2, a second CPU module 3, a rear panel interface module 4 and a memory slot module, wherein the first CPU module 2 is arranged on one side of the main board body 1, which is far away from a case rear panel, the second CPU module 3 and the rear panel interface module 4 are arranged on one side of the main board body 1, which is close to the case rear panel, the first CPU module 2 and the second CPU module 3 are arranged in a staggered mode, and the memory slot module is respectively arranged on two sides of the first CPU module 2 and the second CPU module 3.

The compact two-way CPU board described in this example refers to a two-way CPU board with a more compact and reasonable layout design, the main board body 1 is a main circuit board, the first CPU module 2 is preferably an integrated module where a main CPU is located, and the second CPU module 3 is preferably an integrated module where a sub-CPU is located, and may be implemented by intel or other processors; the memory slot modules are respectively arranged on two sides of the first CPU module 2 and the second CPU module 3, so as to conveniently configure memory strips for the first CPU module 2 and the second CPU module 3 and facilitate wiring.

In this embodiment, the rear panel interface module 4 is preferably disposed between the second CPU module 3 and the rear panel of the chassis, the rear panel interface module 4 includes a serial communication interface, a BMC management port, a USB interface, an RJ45 network, a VGA interface, and the like, the second CPU module 3 is disposed beside the rear panel interface module 4, and memory slot modules are disposed on two sides of the second CPU module 3, so that a memory, a serial communication interface, a BMC management port, a USB interface, an RJ45 network, a VGA interface, and a memory stick can be placed on one side of the motherboard body 1 close to the rear panel of the chassis through a reasonable layout, and a sufficient space can be reserved on the other side of the motherboard body 1 close to the rear panel of the chassis to set up as many PCI-E card slots as possible.

In this embodiment, the first CPU module 2 and the second CPU module 3 are arranged in a staggered manner, and the second CPU module 3 and the rear panel interface module 4 are arranged on one side of the main board body 1 close to the rear panel of the chassis, so that a compact two-way CPU board with higher calculation power is realized, the execution efficiency is higher, and by the design that the front and rear layouts of the double CPUs are arranged in a staggered manner, the heat dissipation pressure of the first CPU module 2 on the second CPU module 3 can be effectively reduced, the heat dissipation efficiency is improved, and the wiring is facilitated; on this basis, rear panel interface module 4 set up in between second CPU module 3 and the quick-witted case rear panel, and then utilized the space reasonable setting between second CPU module 3 and the quick-witted case rear panel interface module 4, can also make mainboard body 1 reserve the space when being convenient for fixed and realize other functions, for example set up PCI-E card slot as much as possible, be favorable to the function extension and the later maintenance of product.

Preferably, a radiator 5 is arranged between the second CPU module 3 and the rear panel interface module 4 in this embodiment, so as to facilitate the realization of the heat dissipation requirement of the second CPU module 3 and avoid over-high temperature rise; a radiator 5 is also arranged beside the first CPU module 2; more preferably, the direction of the fins of the heat sink 5 in this embodiment is parallel to the air outlet direction of the memory slot in the memory slot module, so that air can be guided and exhausted through a consistent heat dissipating wind direction, and the heat dissipating efficiency is improved.

As shown in fig. 1 and fig. 2, the memory slot module in this embodiment includes a first memory slot module 6 and a second memory slot module 7, and the first memory slot module 6 and the second memory slot module 7 are symmetrically disposed on two sides of the first CPU module 2 side by side. Preferably, the first memory slot module 6 and the second memory slot module 7 are both preferably provided with 4 memory slots side by side, so that wiring is facilitated, and 8 memory slots are provided for the first CPU module 2, so as to meet the high-performance requirement of the server; of course, in practical applications, the number of the memory slots may be adjusted and modified according to practical situations and requirements.

Similarly, the memory slot module in this embodiment further includes a third memory slot module 8 and a fourth memory slot module 9, where the third memory slot module 8 and the fourth memory slot module 9 are symmetrically disposed on two sides of the second CPU module 3 side by side. Preferably, the third memory slot module 8 and the fourth memory slot module 9 are both preferably provided with 4 memory slots side by side, so that wiring is facilitated, and the second CPU module 3 is provided with 8 memory slots, so that the high-performance requirement of the server is met; of course, in practical applications, the number of the memory slots may be adjusted and modified according to practical situations and requirements.

It is worth mentioning that, as shown in fig. 1 and fig. 2, in this example, the first CPU module 2 and the second CPU module 3 are arranged in a staggered manner, the memory slot modules on both sides of the first CPU module 2 and the second CPU module 3 are also arranged in a staggered manner and cannot intersect with each other, that is, in the depth direction, a vacancy is left between the first CPU module 2 and the second CPU module 3, a vacancy is left between the first memory slot module 6 and the third memory slot module 8, and a vacancy is also left between the second memory slot module 7 and the fourth memory slot module 9, so that a channel is formed between one side of the motherboard body 1 close to the chassis rear panel and the middle of one side of the motherboard body 1 close to the chassis rear panel, thereby facilitating heat dissipation and wiring; and realize the dislocation at width direction then, and then can further improve the radiating efficiency again to promote the layout rationality of mainboard.

As shown in fig. 1, the present embodiment further includes a PCI-E slot module 10, where the PCI-E slot module 10 is disposed on one side of the motherboard body 1 close to the rear panel of the chassis, and is disposed on one side of the fourth memory slot module 9 away from the second CPU module 3, so as to reasonably utilize the spaces on the right of the second CPU module 3, the rear panel interface module 4, the third memory slot module 8, and the fourth memory slot module 9, thereby implementing the fixation and setting of the PCI-E card slot, optimizing the space design, and improving the stability of the product.

As shown in fig. 1, the PCI-E slot module 10 in this embodiment includes a plurality of PCI-E card slots arranged side by side, and preferably, two X8 PCI-E slots and four X16 PCI-E slots are arranged side by side on the PCI-E slot module 10; the X8 PCI-E slot is an 8-channel PCI-E slot, and the X16 PCI-E slot is a 16-channel PCI-E slot. An X8 PCI-E slot is arranged at the position with insufficient position; where the location is sufficient, then set up the X16 PCI-E slot; the PCI-E card of the 4 th X8 PCI-E slot from the left is preferentially connected to the second CPU module 3, and the PCI-E cards of the other five PCI-E slots are preferentially connected to the first CPU module 2, so that the requirement of the main CPU of the first CPU module 2 is preferentially met, and the expansion of functions is realized.

The further improvement of this example is that the motherboard further comprises a south bridge module 11, where the south bridge module 11 is disposed on a side of the motherboard body 1 away from the rear panel of the chassis and is disposed beside the second memory slot module 7, so as to effectively utilize the remaining space to realize the fixing and installation of a south bridge chip and other interfaces; the South Bridge module 9 is preferably implemented by a South Bridge chip (South Bridge), belongs to an important component of a motherboard chipset, and is mainly responsible for controlling input and output parts of a motherboard, such as a hard disk and an I/O interface, so as to facilitate input and output control and function expansion.

The present embodiment further includes a high-speed connector and a low-speed connector, the high-speed connector is preferably disposed beside the first CPU module 2 or the second CPU module 3, that is, the remaining space of the motherboard body 1 is utilized to implement the arrangement of various interfaces/connectors, which facilitates the expansion of various interfaces and functions; the high-speed connector comprises any one or more of a USB connector, a PCI-E slot connector, a DIMM connector, a VGA interface, an M.2 connector and an SPI interface, the low-speed connector comprises any one or more of a power switch interface, a TPM connector and an LED signal lamp interface, the high-speed connector is connected to the first CPU module 2 and the second CPU module 3 through any one or more of a UPI signal line, a PCI-E signal line, a BMI signal line and a CH signal line, and the low-speed connector is connected to the first CPU module 2 and the second CPU module 3 through a low-speed signal line.

The embodiment also provides a server, which comprises a case and the compact dual-path CPU board arranged in the staggered manner, wherein the compact dual-path CPU board arranged in the staggered manner is arranged in the case.

The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.

Claims

1. The utility model provides a dislocation set's compact double-circuit CPU mainboard which characterized in that includes: the computer case comprises a mainboard body, a first CPU module, a second CPU module, a rear panel interface module and a memory slot module, wherein the first CPU module is arranged on one side of the mainboard body, which is far away from a case rear panel, the second CPU module and the rear panel interface module are arranged on one side of the mainboard body, which is close to the case rear panel, the first CPU module and the second CPU module are arranged in a staggered manner, and the memory slot module is respectively arranged on two sides of the first CPU module and the second CPU module.

2. The misplaced compact two-way CPU board of claim 1, wherein the rear panel interface module is disposed between the second CPU module and the chassis rear panel.

3. The misplaced compact two-way CPU board according to claim 1, wherein a heat sink is disposed between the second CPU module and the rear panel interface module, and a heat sink is also disposed adjacent to the first CPU module.

4. The misplaced compact dual-channel CPU board according to claim 3, wherein the fin direction of the heat sink is parallel to the air outlet direction of the memory slot in the memory slot module.

5. The staggered compact dual-channel CPU motherboard according to any one of claims 1 to 4, wherein the memory slot modules comprise a first memory slot module and a second memory slot module, and the first memory slot module and the second memory slot module are symmetrically arranged side by side on two sides of the first CPU module.

6. The staggered compact two-way CPU motherboard according to claim 5, wherein said memory slot modules further comprise a third memory slot module and a fourth memory slot module, and said third memory slot module and said fourth memory slot module are symmetrically disposed side by side on both sides of said second CPU module.

7. The misplaced compact two-way CPU board of claim 6, further comprising a PCI-E slot module disposed on a side of the board body near the rear panel of the chassis and on a side of the fourth memory slot module away from the second CPU module.

8. The misplaced compact two-way CPU board of claim 7, wherein the PCI-E slot module includes two X8 PCI-E slots and four X16 PCI-E slots.

9. The staggered compact dual-channel CPU motherboard as recited in claim 5, further comprising a south bridge module, wherein said south bridge module is disposed on a side of said motherboard body away from said chassis rear panel and beside said second memory slot module.

10. A server, comprising a chassis and the staggered compact dual-channel CPU board of any one of claims 1 to 9, wherein the staggered compact dual-channel CPU board is disposed in the chassis.