CN215987131U

CN215987131U - Double-deck server mainboard and server thereof

Info

Publication number: CN215987131U
Application number: CN202120405898.6U
Authority: CN
Inventors: 聂爱君
Original assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Priority date: 2021-02-24
Filing date: 2021-02-24
Publication date: 2022-03-08
Anticipated expiration: 2031-02-24

Abstract

The utility model provides a double-layer server mainboard and a server thereof, wherein the double-layer server mainboard comprises: the interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all be provided with CPU module and memory slot module on first calculation board and the second calculation board, memory slot module set up in the unilateral of CPU module or two sides. The two computing boards and the interface bottom board form space stacking, so that a double-layer server mainboard of a multi-channel CPU is convenient to realize, the two computing boards are identical in structural design, the difficulty of production and processing can be effectively reduced, the assembly is also convenient, the material sharing rate and the production efficiency are effectively improved, and the material type and the production cost are reduced; on the basis, the connection between the CPU and the memory slot is convenient to realize, the wiring and the circuit design layout are convenient, and the structure is reasonable and efficient.

Description

Double-deck server mainboard and server thereof

Technical Field

The present invention relates to a motherboard, and more particularly, to a dual-layer server motherboard with an optimized structural design, and a server including the dual-layer server motherboard.

Background

A server motherboard is a motherboard developed specifically to meet the environment of server applications, such as high stability, high performance, and high compatibility. The server has long operation time, high operation intensity, huge data conversion amount required to be processed, and large power consumption and I/O throughput, so the requirement on the server mainboard is quite strict; with the change of the demand and the demand of the product, the multi-path CPU board has been limited by the limited area of the single board, and has met the technical bottleneck in the design of the hardware structure.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a double-layer server mainboard with optimized structural design, so that a multi-path processor is realized by a space stacking method, the production difficulty is effectively reduced, and the production efficiency is improved; on the basis, a server comprising the double-layer server mainboard is further provided.

To this end, the present invention provides a dual-layer server motherboard, comprising: the interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all be provided with CPU module and memory slot module on first calculation board and the second calculation board, memory slot module set up in the unilateral of CPU module or two sides.

The utility model is further improved in that the first computing board and the second computing board are identical in structure, and are arranged in a rotational symmetry mode.

The utility model is further improved in that the first computing board and the second computing board have 180-degree rotational symmetry therebetween.

The utility model is further improved in that the CPU module on the first computing board includes a first CPU module and a second CPU module, and the first CPU module and the second CPU module are respectively disposed at two ends of the first computing board.

A further improvement of the present invention is that it further comprises board-to-board connectors by which the interface backplane is connected to the first and second computing boards, respectively.

The utility model is further improved in that the memory slot modules are symmetrically arranged on two sides of the CPU module side by side.

The utility model has the further improvement that the interface bottom plate, the first computing plate and the second computing plate are also provided with radiators, and the direction of fins of the radiators is consistent with the direction of the memory slots of the memory slot module.

A further refinement of the present invention is that the first computing pad and the second computing pad are asymmetrically shaped convex computing pads.

The utility model has the further improvement that the utility model also comprises an interface module, and the interface module is arranged at one end of the interface bottom plate close to the rear panel of the case.

The utility model also provides a server, which comprises a case and the double-layer server mainboard, wherein the double-layer server mainboard is arranged in the case.

Compared with the prior art, the utility model has the beneficial effects that: the first computing board and the second computing board are arranged above the interface bottom board side by side, and then the two computing boards and the interface bottom board form space stacking, so that a multi-CPU double-layer server mainboard is convenient to realize, the two computing boards are identical in structural design, the difficulty of production and processing can be effectively reduced, the assembly is also convenient, the material sharing rate and the production efficiency are effectively improved, and the material type and the production cost are reduced; on this basis, the first computing board and the second computing board are both provided with a CPU module and a memory slot module, the memory slot module is arranged on one side or two sides of the CPU module, connection between the CPU and the memory slot is convenient to realize, wiring and circuit design layout is convenient, and the structure is reasonable and efficient.

Drawings

FIG. 1 is a schematic perspective view of an embodiment of the present invention;

FIG. 2 is a schematic top view of an embodiment of the present invention;

FIG. 3 is a schematic front view of an interface backplane according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a front side of a first computing board according to one embodiment of the utility model;

FIG. 5 is a schematic diagram of a back structure of a first computing board according to an embodiment of the utility model.

Detailed Description

Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 5, this embodiment provides a dual-layer server motherboard, including: interface bottom plate 1, first calculation board 2 and second calculation board 3 set up side by side in the top of interface bottom plate 1, all be provided with CPU module 4 and memory slot module 5 on first calculation board 2 and the second calculation board 3, memory slot module 5 set up in CPU module 4's unilateral or both sides.

The interface bottom plate 1 in this example is a first layer of main plate, and is mainly used for realizing the arrangement of an interface module 7, a power supply, a radiator 6 and the like; the first computing board 2 and the second computing board 3 are both second-layer mainboards used for setting the CPU module 4 and the memory slot module 5 and used for realizing data processing, the first computing board 2 and the second computing board 3 are arranged side by side, so that four-path CPU setting is convenient to realize, and certainly, in practical application, the multi-path double-layer mainboards with other quantities can be designed according to different circuit boards, and are not limited to four paths.

As shown in fig. 1, 2, 4 and 5, in this example, the first computing board 2 and the second computing board 3 have the same structure, and the first computing board 2 and the second computing board 3 are arranged in a rotational symmetry manner. Preferably, the first calculating board 2 and the second calculating board 3 have 180 ° rotational symmetry therebetween. In this embodiment, the first computing board 2 and the second computing board 3 have the same structure, that is, during production, the same computing board is actually used, and only during assembly, one of the computing boards is rotationally and symmetrically disposed on the interface bottom board 1.

On the basis, the first computing board 2 and the second computing board 3 are preferably in 180 ° rotational symmetry, and such a design can regularly shift the CPU modules 4 on the first computing board 2 and the second computing board 3, thereby improving the heat dissipation efficiency, which is very important for a dual-layer server motherboard including a plurality of CPU modules 4.

As shown in fig. 4 and 5, the CPU module 4 on the first computing board 2 in this embodiment includes a first CPU module 401 and a second CPU module 402, and the first CPU module 401 and the second CPU module 402 are respectively disposed at two ends of the first computing board 2; likewise, the structure and layout of the second computing board 3 is preferably identical to the first computing board 2 and is not otherwise described herein; by adopting the design, two CPU modules can be distributed in a limited space on each computing board, and after the first computing board 2 and the second computing board 3 are assembled, a double-layer server mainboard comprising four paths of CPUs can be realized.

Preferably, as shown in fig. 3 and 5, the interface backplane 1 further includes board-to-board connectors 8, the interface backplane 1 is connected to the first computing board 2 and the second computing board 3 through the board-to-board connectors 8, four board-to-board connectors 8 are preferably disposed on the interface backplane 1, and two board-to-board connectors 8 are disposed on the back surface of the first computing board 2 and the back surface of the second computing board 3, respectively, so as to facilitate connection between the interface backplane 1 and the first computing board 2 and the second computing board 3.

In this embodiment, the memory slot modules 5 are respectively disposed on two sides of the first CPU module 401 and the second CPU module 402. Preferably, the memory slot modules 5 are symmetrically arranged on two sides of the CPU module 4 side by side. Due to the design, the CPU module 4 and the memory slot module 5 can be connected and wired more conveniently, and function expansion is facilitated.

As shown in fig. 1 and fig. 2, in this embodiment, the interface board 1, the first computing board 2, and the second computing board 3 are further provided with a heat sink 6, and preferably, the CPU heat sinks are also provided on the first CPU module 401 and the second CPU module 402, so as to facilitate heat dissipation; the fin direction of the radiator 6 is consistent with the direction of the memory slot module 5, and then the air is guided and exhausted through the consistent radiating wind direction, so that the radiating efficiency is further improved.

As shown in fig. 1, 2 and 5, the first computing board 2 and the second computing board 3 in this example are asymmetric convex computing boards in shape. That is to say, the first computing board 2 and the second computing board 3 are not regular rectangles in shape, such a design is convenient for a gap to be formed between the first computing board 2 and the second computing board 3 after the first computing board 2 and the second computing board 3 are assembled, so as to set the heat sink 6 on the interface bottom board 1, as shown in fig. 3, the heat sink 6 at this position is larger than the heat sink 6 on the first computing board 2 and the second computing board 3 for implementing MOS tube heat dissipation, so as to reasonably utilize the space between the first computing board 2 and the second computing board 3 to set heat sinks of different sizes/models, so as to improve the overall heat dissipation effect of the dual-layer server motherboard, ensure that the dual-layer server motherboard is not too thick, and simultaneously can also meet the requirements of heat dissipation and other performances.

As shown in fig. 1, the present embodiment further includes an interface module 7, where the interface module 7 is disposed at an end of the interface bottom plate 1 close to the rear panel of the chassis, so as to facilitate connection and fixation of various interfaces and facilitate expansion of functions.

The present invention also provides a server, including a chassis and the dual-layer server motherboard as described above, where the dual-layer server motherboard is disposed in the chassis.

In summary, in the present embodiment, the first computing board 2 and the second computing board 3 are arranged side by side above the interface bottom board 1, and then the two computing boards and the interface bottom board 1 form a spatial stack, so as to facilitate the realization of a multi-CPU dual-layer server motherboard, and the two computing boards have the same structural design, which can effectively reduce the difficulty of production and processing, facilitate assembly, effectively improve the material sharing rate and production efficiency, and reduce the material type and production cost; on this basis, the first computing board 2 and the second computing board 3 are both provided with a CPU module 4 and a memory slot module 5, and the memory slot module 5 is arranged on one side or both sides of the CPU module 4, so that the connection between the CPU and the memory slot is facilitated, the layout of wiring and circuit design is facilitated, and the structure is reasonable and efficient.

The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.

Claims

1. A dual-layer server motherboard, comprising: the interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all be provided with CPU module and memory slot module on first calculation board and the second calculation board, memory slot module set up in the unilateral of CPU module or two sides.

2. The dual-layer server motherboard of claim 1, wherein the first computing board and the second computing board are identical in structure, and the first computing board and the second computing board are arranged in a rotational symmetry manner.

3. The dual-tier server motherboard of claim 2, wherein the first computing board and the second computing board have 180 ° rotational symmetry therebetween.

4. The dual-layer server motherboard of any one of claims 1 to 3, wherein the CPU modules on the first computing board comprise a first CPU module and a second CPU module, and the first CPU module and the second CPU module are respectively disposed at two ends of the first computing board.

5. The bi-level server motherboard of any of claims 1 to 3, further comprising an inter-board connector, wherein the interface backplane is connected to the first computing board and the second computing board via the inter-board connector, respectively.

6. The dual-layer server motherboard of any one of claims 1 to 3, wherein the memory slot modules are symmetrically arranged side by side on both sides of the CPU module.

7. The dual-layer server motherboard of any one of claims 1 to 3, wherein the interface backplane, the first computing board and the second computing board are further provided with heat sinks, and the fin direction of the heat sinks is consistent with the memory slot direction of the memory slot module.

8. The dual-tier server motherboard of any of claims 1 to 3, wherein the first computing board and the second computing board are asymmetrically shaped convex computing boards.

9. The dual-layer server motherboard of any one of claims 1 to 3, further comprising an interface module, wherein the interface module is disposed at an end of the interface backplane adjacent to the rear panel of the chassis.

10. A server comprising a chassis and the dual-tier server motherboard of any of claims 1 to 9 disposed within the chassis.