CN211352607U

CN211352607U - Computer motherboard structure of BGA encapsulation CPU

Info

Publication number: CN211352607U
Application number: CN202020207047.6U
Authority: CN
Inventors: 曾见; 向会耀; 李林; 张小伟
Original assignee: Chengdu Apuqi Technology Co ltd
Current assignee: Chengdu Apuqi Technology Co ltd
Priority date: 2020-02-25
Filing date: 2020-02-25
Publication date: 2020-08-25
Anticipated expiration: 2030-02-25

Abstract

The utility model discloses a computer motherboard structure of BGA encapsulation CPU, which comprises a support plate and a core plate, wherein the core plate is integrated with the CPU and/or the singlechip, and the support plate is integrated with a plurality of interfaces; the carrier plate is provided with a pair of row nuts used for connecting the core plate, and the core plate is provided with row needles connected with the row nuts; the carrier plate is provided with a heat dissipation channel in the pair of row nuts, and a heat dissipation support piece is arranged in the heat dissipation channel and is in contact with the lower end of the core plate in an abutting mode. According to the computer mainboard structure for BGA packaging of the CPU, only the interface function signal needs to be led out from the core board to the carrier board on the carrier board, the replacement of the mainboard CPU can be conveniently and rapidly realized, the CPU of the mainboard is replaced under the condition that the BGA replacement of the mainboard CPU is not needed, and the product development period and the development cost are reduced; meanwhile, the high performance of the mounting support is ensured, the mounting and using strength is improved, and the heat dissipation effect is ensured.

Description

Computer motherboard structure of BGA encapsulation CPU

Technical Field

The utility model particularly relates to a BGA encapsulates CPU's computer motherboard structure.

Background

With the progress of integration technology, the improvement of devices and the use of deep submicron technology in the 90 s, LSI, VLSI and ULSI have appeared in succession, the integration level of a silicon single chip has been increasing, the requirements for packaging integrated circuits have become stricter, the number of I/O pins has sharply increased, and power consumption has also increased. In order to meet the development requirement, a new type, ball grid array packaging, BGA for short, is added on the basis of the original packaging type.

The memory packaged by the BGA technology can improve the memory capacity by two to three times under the condition that the memory volume is not changed, and compared with the TSOP, the BGA has smaller volume. However, if the CPU of the computer motherboard with the CPU packaged by the BGA package needs to be replaced, the CPU of the motherboard needs to be replaced by the BGA package again, which has the disadvantages of long period and high cost.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a be convenient for realize having reduced product development cycle and development cost to mainboard CPU's change under the condition that need not carry out BGA to the mainboard and change CPU again, and install, the BGA that heat dispersion is good encapsulates CPU's computer motherboard structure.

In order to solve the above technical problem, the utility model provides a computer motherboard structure of BGA encapsulation CPU, which comprises a support plate and a core plate, wherein the core plate is integrated with the CPU and/or the singlechip, and the support plate is integrated with a plurality of interfaces; the carrier plate is provided with a pair of row nuts used for connecting the core plate, and the core plate is provided with row needles connected with the row nuts; the carrier plate is provided with a heat dissipation channel in the pair of row nuts, and a heat dissipation support piece is arranged in the heat dissipation channel and is in contact with the lower end of the core plate in an abutting mode.

Furthermore, the heat dissipation support comprises a plurality of ribs arranged in parallel at intervals, and a plurality of heat dissipation holes are formed in the ribs.

Furthermore, the number of the row nuts is even; the row nuts are uniformly distributed on two sides of the center of the carrier plate, and the row nuts positioned on two sides of the center of the carrier plate are asymmetrical.

Furthermore, the arrangement directions of the row nuts positioned at the two sides of the center of the carrier plate are parallel.

Furthermore, the part where the bead contacts with core plate is provided with the outer edge of being connected, through connecting outer edge and core plate contact, increase area of contact.

The utility model has the advantages that: this BGA encapsulates CPU's computer motherboard structure only needs to draw interface function signal from the mode of nuclear core plate to the support plate through integrated CPU of nuclear core plate and main interface function on the support plate, and the change of realization mainboard CPU that can be convenient quick is not carrying out BGA to the mainboard and is changing the CPU of mainboard under the circumstances that CPU was changed, has reduced product development cycle and development cost again. A heat dissipation channel is arranged in the pair of row nuts on the carrier plate, and a heat dissipation support piece is arranged in the heat dissipation channel; through the conflict contact of heat dissipation support piece and nuclear core plate, both ensured the high performance of erection bracing, improved installation use intensity, ensured radiating effect again. Specifically, heat dissipation support piece can include a plurality of interval parallel arrangement's bead, still is provided with a plurality of louvres simultaneously on the bead, and the even distribution of a plurality of louvres makes the passageway intercommunication between each bead through setting up of louvre on the bead, ensures the radiating efficiency.

Drawings

FIG. 1 is a schematic structural diagram of a computer motherboard structure of a BGA package CPU.

FIG. 2 is a schematic view of a heat dissipation support member of a computer motherboard structure of a BGA package CPU.

FIG. 3 is a top view of a heat dissipating support of a computer motherboard structure of a BGA package CPU.

FIG. 4 is a schematic diagram of a plurality of row mothers of a computer motherboard structure of a BGA package CPU.

Wherein: 1. a carrier plate; 2. a core board; 3. a CPU; 4. a single chip microcomputer; 5. an interface; 6. mother arrangement; 7. a rib; 71. heat dissipation holes; 72. and connecting the outer edges.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiment is only one embodiment of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings and specific embodiments.

In the following description, references to "one embodiment," "an embodiment," "one example," "an example," etc., indicate that the embodiment or example so described may include a particular feature, structure, characteristic, property, element, or limitation, but every embodiment or example does not necessarily include the particular feature, structure, characteristic, property, element, or limitation. Moreover, repeated use of the phrase "in accordance with an embodiment of the present application" although it may possibly refer to the same embodiment, does not necessarily refer to the same embodiment.

Referring to fig. 1 to 3, in the present application, the computer motherboard structure of the BGA package CPU includes a carrier board 1 and a core board 2, a CPU3 and/or a single chip 4 are integrated on the core board 2, and a multi-interface 5 is integrated on the carrier board 1; the interface 5 is mainly integrated at the peripheral position of the carrier plate 1, and the core board 2 is integrated at the central position of the carrier plate 1, so that the layout is reasonable and compact, the wiring design is more convenient, and other components can be conveniently integrated on the carrier plate 1 subsequently.

According to the invention, the CPU3 and the main interface 5 are integrated by the core board 2, and only the mode that the interface 5 function signal is led out from the core board 2 to the carrier board 1 on the carrier board 1 is needed, so that the replacement of the CPU3 of the mainboard can be conveniently and rapidly realized, the CPU3 of the mainboard is replaced under the condition that the BGA of the mainboard is not required to be replaced by the CPU3 again, and the product development period and the development cost are reduced. And the carrier board 1 is integrated with a plurality of interfaces 5, the types of the interfaces 5 are not limited, and the interfaces can be as many as possible to be connected and communicated with the outside.

A pair of row nuts 6 used for connecting the core board 2 is arranged on the carrier board 1, and row needles connected with the row nuts 6 are arranged on the core board 2; the core board 2 and the carrier board 1 are spliced in a mode of arranging the nuts 6 and arranging the pins, so that the connection is stable and reliable; meanwhile, a heat dissipation channel is arranged in the pair of row nuts 6 on the carrier plate 1 for heat dissipation between the core board 2 and the carrier plate 1, and the core board 2 is not in contact with the middle of the carrier plate 1 to form a heat dissipation channel.

A heat dissipation support member is arranged in a heat dissipation channel of a computer mainboard structure of the BGA package CPU, and the heat dissipation support member is in contact with the lower end of the core board 2 in a butting way; it is contradicted the contact through heat dissipation support piece and nuclear core plate 2, has both ensured the high performance of erection bracing, has improved installation use intensity, has ensured radiating effect again. In particular, the heat dissipating support may include a plurality of spaced parallel ribs 7.

In specific implementation, the arrangement direction of the plurality of ribs 7 is preferably parallel to the row bus bar 6, and meanwhile, the plurality of heat dissipation holes 71 are arranged on the ribs 7, the plurality of heat dissipation holes 71 are uniformly distributed on the ribs 7, and the channels between the ribs 7 are communicated through the arrangement of the heat dissipation holes 71, so that the heat dissipation efficiency is increased. The part of the rib 7, which is contacted with the core plate 2, is provided with a connecting outer edge 72, and the connecting outer edge 72 is contacted with the core plate 2, so that the contact area is increased, and the support installation performance is improved; and the connecting outer edge 72 may also be provided in the form of a heat-conducting block, which will increase the heat dissipation of the core board 2 into which the CPU3, which is liable to generate heat, is integrated.

Referring to fig. 4, the row bus 6 of the computer motherboard structure of the BGA package CPU may be provided in plurality and in even number; meanwhile, the row mothers 6 are all arranged on two sides of the center of the carrier plate 1, the row mothers 6 on two sides of the center of the carrier plate 1 are asymmetric, and the arrangement directions of the row mothers 6 on two sides of the center of the carrier plate 1 are parallel.

The row of bus bars 6 located at the left side of the center of the carrier plate 1 and the row of bus bars 6 located at the right side of the center of the carrier plate 1 are not located on the same horizontal line, and/or the distance between the row of bus bars 6 located at the left side of the center of the carrier plate 1 is different from the distance between the row of bus bars 6 located at the right side of the center of the carrier plate 1. The core board 2 and the carrier board 1 have a unique correct connection mode, so that the core board 2 and the carrier board 1 cannot be mistakenly buckled when being connected, and the use is convenient.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a computer motherboard structure of BGA encapsulation CPU which characterized in that: the device comprises a carrier plate (1) and a core plate (2), wherein a CPU (3) and/or a singlechip (4) are integrated on the core plate (2), and a plurality of interfaces (5) are integrated on the carrier plate (1); the carrier plate (1) is provided with a pair of row nuts (6) used for connecting the core plate (2), and the core plate (2) is provided with row pins connected with the row nuts (6); the heat dissipation device is characterized in that a heat dissipation channel is arranged in the row nuts (6) on the carrier plate (1), a heat dissipation support piece is arranged in the heat dissipation channel, and the heat dissipation support piece is in contact with the lower end of the core plate (2) in an abutting mode.

2. The computer motherboard structure of BGA package CPU of claim 1, wherein: the heat dissipation support comprises a plurality of ribs (7) which are arranged at intervals in parallel, and a plurality of heat dissipation holes (71) are formed in the ribs (7).

3. The computer motherboard structure of BGA package CPU of claim 1, wherein: the number of the row nuts (6) is even; the row nuts (6) are uniformly distributed on two sides of the center of the carrier plate (1), and the row nuts (6) located on two sides of the center of the carrier plate (1) are asymmetric.

4. The computer motherboard structure of BGA package CPU of claim 3, wherein: the arrangement directions of the row nuts (6) positioned at the two sides of the center of the carrier plate (1) are parallel.

5. The computer motherboard structure of BGA package CPU of claim 2, wherein: the position department that bead (7) and core plate (2) contacted is provided with and connects outer edge (72), contacts with core plate (2) through connecting outer edge (72), increases area of contact.