CN216310676U - Server double-layer mainboard with staggered design and server thereof - Google Patents
Server double-layer mainboard with staggered design and server thereof Download PDFInfo
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- CN216310676U CN216310676U CN202120405903.3U CN202120405903U CN216310676U CN 216310676 U CN216310676 U CN 216310676U CN 202120405903 U CN202120405903 U CN 202120405903U CN 216310676 U CN216310676 U CN 216310676U
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Abstract
The utility model provides a server double-layer mainboard with a staggered design and a server, wherein the server double-layer mainboard with the staggered design comprises: interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all set up two at least CPU modules on first calculation board and the second calculation board, dislocation set around between two CPU modules. The first computing board and the second computing board are arranged above the interface bottom board side by side, and then the two computing boards and the interface bottom board form space stacking, so that a multi-CPU double-layer server mainboard is convenient to realize.
Description
Technical Field
The present invention relates to a server dual-layer motherboard, and more particularly, to a server dual-layer motherboard with a staggered design that can improve heat dissipation efficiency, and a server including the server dual-layer motherboard with the staggered design.
Background
A server motherboard is a motherboard developed specifically to meet the environment of server applications, such as high stability, high performance, and high compatibility. The server has long operation time, high operation intensity, huge data conversion amount required to be processed, and large power consumption and I/O throughput, so the requirement on the server mainboard is quite strict; with the change of the requirements and the requirements of products, the multi-CPU motherboard will further provide new requirements and challenges for space design requirements and heat dissipation performance.
Disclosure of Invention
The technical problem to be solved by the utility model is to provide a server double-layer mainboard with optimized structural design, realize a multipath processor by a space stacking method, and effectively improve the heat dissipation effect; on the basis, the server comprising the server double-layer mainboard is further provided.
In view of the above, the present invention provides a server dual-layer motherboard with staggered design, comprising: interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all set up two at least CPU modules on first calculation board and the second calculation board, dislocation set around between two CPU modules.
The utility model is further improved in that the first computing board and the second computing board are identical in structure, and are arranged in a rotational symmetry mode.
The utility model is further improved in that the first computing board and the second computing board have 180-degree rotational symmetry therebetween.
A further improvement of the present invention is that it further comprises board-to-board connectors by which the interface backplane is connected to the first and second computing boards, respectively.
The utility model has the further improvement that the first computing board and the second computing board are also provided with memory slot modules, and the memory slot modules are symmetrically arranged on two sides of the CPU module side by side.
The utility model has the further improvement that the memory slot modules corresponding to the two CPU modules of the same computing board are arranged in a staggered mode, a first radiator is arranged between the two CPU modules of the same computing board, and the direction of the fins of the first radiator is consistent with the direction of the memory slots of the memory slot modules.
The utility model has the further improvement that the interface bottom plate is also provided with a second radiator, and the direction of the fins of the second radiator is consistent with the direction of the memory slots of the memory slot module.
A further refinement of the present invention is that the first computing pad and the second computing pad are asymmetrically shaped convex computing pads.
The utility model has the further improvement that the utility model also comprises an interface module, and the interface module is arranged at one end of the interface bottom plate close to the rear panel of the case.
The utility model also provides a server, which comprises a case and the server double-layer mainboard with the staggered design, wherein the server double-layer mainboard with the staggered design is arranged in the case.
Compared with the prior art, the utility model has the beneficial effects that: first calculation board and second calculation board set up side by side in the top of interface bottom plate, and then form the space through two calculation boards and interface bottom plate and pile up, be convenient for realize multichannel CPU's double-deck server mainboard, on this basis, all set up two at least CPU modules on first calculation board and the second calculation board, dislocation set around between two CPU modules, and then through dislocation set around between the different CPU modules to reduce influence each other as far as possible, improved its radiating effect effectively, can satisfy the high performance of product and heat dissipation demand well.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic top view of an embodiment of the present invention;
FIG. 3 is a schematic front view of an interface backplane according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a front side of a first computing board according to one embodiment of the utility model;
FIG. 5 is a schematic diagram of a back structure of a first computing board according to an embodiment of the utility model.
Detailed Description
Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
As shown in fig. 1 to 5, this embodiment provides a server dual-layer motherboard with staggered design, which includes: interface bottom plate 1, first calculation board 2 and second calculation board 3 set up side by side in interface bottom plate 1's top, all set up two at least CPU modules 4 on first calculation board 2 and the second calculation board 3, dislocation set around between two CPU modules 4.
The interface bottom plate 1 in this example is a first layer of main plate, and is mainly used for realizing the arrangement of an interface module 7, a power supply, a heat sink 602 and the like; the first computing board 2 and the second computing board 3 are both second-layer mainboards used for setting the CPU module 4 and the memory slot module 5 and used for realizing data processing, the first computing board 2 and the second computing board 3 are arranged side by side, so that four-path CPU setting is convenient to realize, and certainly, in practical application, the multi-path double-layer mainboards with other quantities can be designed according to different circuit boards, and are not limited to four paths.
As shown in fig. 1, 2, 4 and 5, in this example, the first computing board 2 and the second computing board 3 have the same structure, and the first computing board 2 and the second computing board 3 are arranged in a rotational symmetry manner. Preferably, the first calculating board 2 and the second calculating board 3 have 180 ° rotational symmetry therebetween. In this embodiment, the first computing board 2 and the second computing board 3 have the same structure, that is, during production, the same computing main board is actually used, and only during assembly, one of the computing main boards is rotationally and symmetrically arranged on the interface bottom board 1.
On the basis, the first computing board 2 and the second computing board 3 are preferably in 180 ° rotational symmetry, and such a design can further realize regular staggering of the CPU modules 4 on the first computing board 2 and the second computing board 3, and further improve the heat dissipation efficiency, which is very important for a server dual-layer motherboard including a plurality of CPU modules 4.
Preferably, as shown in fig. 3 and 5, this example further includes a board-to-board connector 8, and the interface backplane 1 is connected to the first computing board 2 and the second computing board 3 through the board-to-board connector 8, respectively. The interface backplane 1 is preferably provided with four inter-board connectors 8, and the back of the first computing board 2 and the back of the second computing board 3 are respectively provided with two inter-board connectors 8, so that the interface backplane 1 is connected with the first computing board 2 and the second computing board 3.
As shown in fig. 1 and fig. 2, in this embodiment, memory slot modules 5 are further disposed on the first computing board 2 and the second computing board 3, and the memory slot modules 5 are symmetrically disposed side by side on two sides of the CPU module 4. Due to the design, the CPU module 4 and the memory slot module 5 can be connected and wired more conveniently, and function expansion is facilitated.
As shown in fig. 1, fig. 2 and fig. 4, in this embodiment, the memory slot modules 5 corresponding to the two CPU modules 4 of the same computing board are also arranged in a staggered manner, so that the design can realize wiring at a shorter distance on the basis of facilitating heat dissipation, facilitating wiring and arranging regularly; and a first radiator 601 is arranged between two CPU modules 4 of the same computing board, the fin direction of the first radiator 601 is the same as the memory slot direction of the memory slot module 5, and further, the air is guided and discharged through the same heat dissipation wind direction, thereby further improving the heat dissipation efficiency and reducing the mutual influence between the two CPU modules 4.
As shown in fig. 1, 2 and 5, the first computing board 2 and the second computing board 3 in this example are asymmetric convex computing boards in shape. That is to say, the first computing board 2 and the second computing board 3 are not regular rectangles in shape, so that after the first computing board 2 and the second computing board 3 are assembled, a gap is formed between the first computing board 2 and the second computing board 3 so as to arrange the second heat sink 602 on the interface bottom board 1, the space between the first computing board 2 and the second computing board 3 is reasonably used for arranging the second heat sink 602, the server double-layer mainboard is prevented from being too thick, and the overall heat dissipation effect of the server double-layer mainboard can be improved. Similarly, in this embodiment, the direction of the fins of the second heat sink 602 is the same as the direction of the memory slot module 5, so that the air is guided and discharged through the same heat dissipation wind direction, and the heat dissipation efficiency is further improved.
As shown in fig. 1, the present embodiment further includes an interface module 7, where the interface module 7 is disposed at an end of the interface bottom plate 1 close to the rear panel of the chassis, so as to facilitate connection and fixation of various interfaces and facilitate expansion of functions. Preferably, a third heat sink 603 is further disposed beside the interface module 7, so as to ensure stable operation of the interface module 7.
The embodiment also provides a server, which comprises a case and the staggered server double-layer mainboard, wherein the staggered server double-layer mainboard is arranged in the case.
In summary, in the present embodiment, the first computing board 2 and the second computing board 3 are disposed side by side above the interface bottom board 1, and then the two computing boards and the interface bottom board 1 form a spatial stack, so as to facilitate the realization of a multi-CPU dual-layer server motherboard, on this basis, at least two CPU modules 4 are disposed on the first computing board 2 and the second computing board 3, and the two CPU modules 4 are disposed in a front-back staggered manner, and further, by disposing different CPU modules 4 in a front-back staggered manner, so as to reduce the mutual influence, effectively improve the heat dissipation effect, and well meet the high performance of the product and the heat dissipation requirement thereof.
The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides a double-deck mainboard of dislocation design's server which characterized in that includes: interface bottom plate, first calculation board and second calculation board set up side by side in the top of interface bottom plate, all set up two at least CPU modules on first calculation board and the second calculation board, dislocation set around between two CPU modules.
2. The server double-layer main board with staggered design according to claim 1, wherein the first computing board and the second computing board are identical in structure and are arranged in a rotational symmetry manner.
3. The server double-deck mainboard with staggered design according to claim 2, wherein the first computing board and the second computing board have 180 ° rotational symmetry therebetween.
4. The server dual-layer motherboard with staggered design according to any one of claims 1 to 3, further comprising an inter-board connector, wherein the interface backplane is respectively connected to the first computing board and the second computing board through the inter-board connector.
5. The server double-layer mainboard with the staggered design according to any one of claims 1 to 3, wherein memory slot modules are further arranged on the first computing board and the second computing board, and the memory slot modules are symmetrically arranged on two sides of the CPU module side by side.
6. The server double-layer mainboard with staggered design according to claim 5, wherein the memory slot modules corresponding to the two CPU modules of the same computing board are arranged in a staggered manner, and a first heat sink is arranged between the two CPU modules of the same computing board, and the fin direction of the first heat sink is consistent with the memory slot direction of the memory slot modules.
7. The server double-layer mainboard with staggered design according to claim 5, wherein the interface bottom plate is further provided with a second heat sink, and the direction of fins of the second heat sink is consistent with the direction of memory slots of the memory slot module.
8. The server double-deck main board of staggered design according to any one of claims 1 to 3, wherein the first and second computing boards are asymmetrically shaped convex computing boards.
9. The server double-layer mainboard with the staggered design according to any one of claims 1 to 3, further comprising an interface module, wherein the interface module is arranged at one end of the interface bottom plate close to the rear panel of the chassis.
10. A server, comprising a chassis and the staggered server dual-layer motherboard according to any one of claims 1 to 9, wherein the staggered server dual-layer motherboard is disposed in the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120405903.3U CN216310676U (en) | 2021-02-24 | 2021-02-24 | Server double-layer mainboard with staggered design and server thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120405903.3U CN216310676U (en) | 2021-02-24 | 2021-02-24 | Server double-layer mainboard with staggered design and server thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216310676U true CN216310676U (en) | 2022-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120405903.3U Active CN216310676U (en) | 2021-02-24 | 2021-02-24 | Server double-layer mainboard with staggered design and server thereof |
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|---|---|
| CN (1) | CN216310676U (en) |
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2021
- 2021-02-24 CN CN202120405903.3U patent/CN216310676U/en active Active
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