CN219302966U

CN219302966U - Mini computer host device with compact internal structure

Info

Publication number: CN219302966U
Application number: CN202320567581.1U
Authority: CN
Inventors: 王曌; 姜瑞静; 李伟基
Original assignee: Shenzhen Meigao Electronic Equipment Co ltd
Current assignee: Shenzhen Meigao Electronic Equipment Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-07-04
Anticipated expiration: 2033-03-21

Abstract

The utility model discloses a mini computer host device with compact internal structure, wherein a central processing unit is welded in the middle of the top side surface of a main board, a TF card inserting groove and a first flat cable connecting groove are welded on the edge of the top side surface of the main board, a heat radiating component is fixedly connected on the central processing unit positioned in the middle of the top surface of the main board, a memory card seat, a second flat cable connecting groove, a third flat cable connecting groove and a ssd slot seat are welded on the edge of the bottom side of the main board perpendicular to the aa direction, ssd is inserted in the ssd slot seat, DC, usb, hdmi, RJ/Dp, power, A/V interface modules are densely welded on the edges of the bottom side of the main board along the aa direction, and a storage component is fixedly connected in the middle of the bottom side surface of the main board. All circuit components and interface modules are directly welded on a pcb board with about fifteen square centimeters, the arrangement density is extremely high, the connection of the internal structure of the host is compact, the volume is greatly reduced, and the requirements in the background technology are met.

Description

Mini computer host device with compact internal structure

Technical Field

The utility model belongs to the technical field of computers, and particularly relates to a mini computer host device with a compact internal structure.

Background

The mini computer host is basically another form of the traditional desktop computer host, the electronic devices, structural members and circuit connection layout in the traditional computer host are distributed, the internal space of a case is abundant, heat dissipation is facilitated, heat dissipation performance is good, but with the continuous development of computer technology, especially the development of the physical volumes of devices such as a hard disk, a memory, a central processing unit, a transceiver module and an I/O (input/output) of a computer, the physical volumes of the devices are biased to small volumes, the heat dissipation assembly is reduced, and the operating devices of one computer host are highly concentrated on two sides of a pcb with a size of several flat to ten square centimeters.

Disclosure of Invention

In response to the above-mentioned needs in the background art, a mini-computer host device with compact internal structure is developed.

The utility model is realized in such a way, a mini computer host device with compact internal structure comprises a main board, wherein a central processing unit is welded in the middle of the top side surface of the main board, a TF card inserting groove and a first flat cable connecting groove are welded on the edge of the top side surface of the main board, a heat radiating component is fixedly connected on the central processing unit positioned in the middle of the top surface of the main board, a memory card seat, a second flat cable connecting groove, a third flat cable connecting groove and a ssd slot seat are welded on the edge of the bottom side of the main board perpendicular to the aa direction, ssd is inserted in the ssd slot seat, DC, usb, hdmi, RJ, dp, power, A/V interface modules are densely welded on the edges of the bottom side of the main board along the aa direction, and a storage component is fixedly connected in the middle of the bottom side surface of the main board.

As a preferable scheme of the utility model, the heat radiation component consists of a fixing frame, a first heat conduction plate, a first heat radiation fin, a second heat radiation fin and a fan, wherein the fixing frame is fixedly connected with a fixing lug positioned on the fan through a screw, the first heat conduction plate is fixedly connected with the fixing frame through a screw, and the first heat radiation fin and the second heat radiation fin are fixedly connected with an air outlet of the fan.

As a preferable mode of the utility model, the first heat conducting plate is a sheet-shaped plate, and horizontally covers the first heat radiating fin, the second heat radiating fin and is positioned below the fixing frame.

As a preferable mode of the present utility model, the convex portion of the first heat-conducting plate is attached to the cpu unit.

As a preferable scheme of the utility model, the storage component is formed by fixing a second heat-conducting plate, a fixing frame, a fourth flat cable spliced with a third flat cable splicing groove, a first heat-radiating block, a second heat-radiating block and a third heat-conducting plate.

As a preferable scheme of the utility model, the second heat conducting plate is composed of a plurality of heat conducting fins in equidistant arrays, the first heat radiating block and the second heat radiating block are composed of a plurality of heat conducting fins in equidistant arrays, and the fixing frame is fixed on the second heat conducting plate through bolts.

As a preferable scheme of the utility model, the number of the memory card seats is two, and the number of the second flat cable connecting grooves is three.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, interface modules such as DC, usb, hdmi, RJ, dp, power, A/V and the like are arranged on the peripheral edge of a main board, a memory card seat, a ssd slot seat, a plurality of wire connecting grooves, a TF card connecting groove and other connecting seats or grooves are arranged on the peripheral edge of the main board, all circuit components and interface modules of a computer host are directly welded on a pcb board with fifteen square centimeters or so by the design structure, the arrangement density is extremely high, and then a heat dissipation assembly and a storage assembly are directly fixed with pcb board screws through mounting holes reserved in the middle of the pcb board, so that the internal structure of the whole computer host is tightly connected, and the volume is greatly reduced; the heat dissipation assembly achieves cooling of the central processing unit, and the storage assembly achieves data interaction with the central processing unit through the fourth flat cable.

Description of the drawings:

FIG. 1 is an exploded view of the structure of the present utility model;

FIG. 2 is an exploded view of the structure of the present utility model;

FIG. 3 is a partial block diagram of a storage component of the present utility model;

FIG. 4 is an exploded view of a portion of the structure of the storage assembly of the present utility model;

in the figure:

1 motherboard, 2 CPU units, 3ssd, 4ssd slot seat, 5 second winding displacement connect slot, 6memory card seat, 7 second heat-conducting plate, 8 fixed frame, 9 first heat-radiating block, 10 second heat-radiating block, 11 fourth winding displacement, 12 third heat-conducting plate, 13 fan, 14 first heat-radiating fin, 15 second heat-radiating fin, 16 fixing frame, 17 protruding part, 18 fixed ear, 19 first winding displacement connect slot, 20, TF card connect slot, 21 third winding displacement connect slot, 22 first heat-conducting plate.

The specific embodiment is as follows:

the following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, a mini computer host device with a compact internal structure includes a motherboard 1, a central processing unit 2 is welded in the middle of the top side of the motherboard 1, a TF card socket 20 and a first flat cable connector 19 are welded on the edge of the top side of the motherboard 1, a heat dissipation component is fixedly connected to the central processing unit 2 located in the middle of the top side of the motherboard 1, a memory card seat 6, a second flat cable connector 5, a third flat cable connector 21, a ssd slot seat 4 are welded on the bottom edge of the motherboard 1 perpendicular to the aa direction, ssd 3 are inserted in the ssd slot seat 4, DC, usb, hdmi, RJ, dp, power, A/V interface modules are densely welded on the two edges of the bottom side of the motherboard 1 along the aa direction, and a storage component is fixedly connected to the middle of the bottom side of the motherboard 1.

Further, the heat dissipation assembly is composed of a fixing frame 16, a first heat conducting plate 22, a first heat dissipation fin 14, a second heat dissipation fin 15 and a fan 13, the fixing frame 16 is fixedly connected with a fixing lug 18 positioned on the fan 13 through a screw, the first heat conducting plate 22 is fixedly connected with the fixing frame 16 through a screw, and the first heat dissipation fin 14 and the second heat dissipation fin 15 are fixedly connected with an air outlet of the fan 13.

Further, the first heat conducting plate 22 is a sheet-shaped plate, and horizontally covers the first heat dissipating fins 14 and the second heat dissipating fins 15 and is located below the fixing frame 16, and the first heat conducting plate is used for directly absorbing heat generated by the cpu unit, and absorbs heat and conducts heat through the first heat conducting plate, and dissipates heat through the first heat dissipating fins, the second heat dissipating fins and the fan.

Further, the protruding portion 17 of the first heat conducting plate 22 is attached to the cpu unit 2, and the protruding portion is designed to absorb heat generated by the cpu unit.

Further, the storage component is formed by fixing a second heat-conducting plate 7, a fixing frame 8, a fourth flat cable 11 spliced with a third flat cable connecting groove 21, a first heat-dissipating block 9, a second heat-dissipating block 10 and a third heat-conducting plate 12.

Further, the second heat conducting plate 7 is composed of a plurality of heat conducting fins in an equidistant array, the first heat radiating block 9 and the second heat radiating block 10 are composed of a plurality of heat conducting fins in an equidistant array, the fixing frame 8 is fixed on the second heat conducting plate 7 through bolts 19, the second heat conducting plate is used for absorbing heat generated by ssd and three second bus slots, heat is radiated and cooled through the second heat conducting plate, the first heat radiating block is used for conducting heat and dissipating heat of DC, hdmi, RJ and the power interface module, and the second heat radiating block is used for conducting heat and dissipating heat of two memory strips on two memory card seats.

Further, the number of memory cards 6 is two, and the number of second flat cable connection slots 5 is three.

Although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a mini computer host device of compact internal structure, includes mainboard (1), its characterized in that: central processing unit (2) has been welded in the middle part of mainboard (1) top side, and its top side border welding has TF card jack-in groove (20) and first winding displacement connect groove (19), is located fixedly connected with radiator unit on central processing unit (2) in mainboard (1) top surface middle part, with aa direction vertically mainboard (1) bottom side border welding has memory cassette (6), second winding displacement connect groove (5), third winding displacement connect groove (21) and ssd slot seat (4), ssd slot seat (4) peg graft have ssd (3), along aa direction mainboard (1) bottom side both sides border intensive welding has DC, usb, hdmi, RJ, dp, power, A/V interface module, mainboard (1) bottom side middle part fixedly connected with storage module.

2. The compact internal mini-host device of claim 1, wherein: the heat radiation assembly consists of a fixing frame (16), a first heat conduction plate (22), a first heat radiation fin (14), a second heat radiation fin (15) and a fan (13), wherein the fixing frame (16) is fixedly connected with a fixing lug (18) positioned on the fan (13) through a screw, the first heat conduction plate (22) is fixedly connected with the fixing frame (16) through a screw, and the first heat radiation fin (14) and the second heat radiation fin (15) are fixedly connected with an air outlet of the fan (13).

3. The compact internal mini-host device of claim 2, wherein: the first heat conducting plate (22) is a sheet-shaped plate and horizontally covers the upper parts of the first radiating fins (14) and the second radiating fins (15) and is positioned below the fixing frame (16).

4. A compact internal mini-host device as in claim 3, wherein: the protruding part (17) of the first heat-conducting plate (22) is attached to the central processing unit (2).

5. The compact internal mini-host device of claim 1, wherein: the storage component is formed by fixing a second heat-conducting plate (7), a fixing frame (8), a fourth flat cable (11) which is spliced with a third flat cable connecting groove (21), a first heat-radiating block (9), a second heat-radiating block (10) and a third heat-conducting plate (12).

6. The compact internal mini-host device of claim 5, wherein: the second heat conducting plate (7) is composed of a plurality of heat conducting fin equidistant arrays, the first heat radiating block (9) and the second heat radiating block (10) are composed of a plurality of heat radiating fin equidistant arrays, and the fixed frame (8) is fixed on the second heat conducting plate (7) through bolts.

7. The compact internal mini-host device of claim 1, wherein: the number of the memory card seats (6) is two, and the number of the second flat cable connecting grooves (5) is three.