CN216412026U

CN216412026U - Server with upper layer and lower layer

Info

Publication number: CN216412026U
Application number: CN202120320339.5U
Authority: CN
Inventors: 聂爱君
Original assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Current assignee: Shenzhen Guoxin Hengyun Information Security Co ltd
Priority date: 2021-02-04
Filing date: 2021-02-04
Publication date: 2022-04-29
Anticipated expiration: 2031-02-04

Abstract

The utility model provides a server layered up and down, comprising: the device comprises a mainboard body, a CPU module, a memory bank module, a radiator, a PCIE card slot module and an air guide cover; the CPU module, the memory bank module and the radiator are all arranged on the mainboard body, and the radiator is arranged at two ends of the CPU module; the PCIE card slot module comprises a mounting plate, an elevating card and a PCIE card slot, and the PCIE card slot is arranged on the mounting plate through the elevating card; the air guiding cover is arranged between the CPU module and the PCIE card slot module. According to the utility model, the CPU module and the PCIE card in the server are layered by the optimized structural design of the air guide cover, the heightening card and the like, so that the two devices with higher heat productivity can not interfere and overlap with each other, the heat dissipation efficiency is effectively improved, and the heat dissipation requirement of the server is met.

Description

Server with upper layer and lower layer

Technical Field

The utility model relates to a heat dissipation mainboard, in particular to a server which is high in heat dissipation efficiency and layered up and down.

Background

The CPU board used by the server is produced mainly to meet the needs of professional applications such as cloud computing, servers, and graphic workstations, so that the computing processing capability and function expansion performance of the system are required to be relatively high. Accordingly, the heat dissipation requirement of the server motherboard is higher than that of a common host, and particularly, under the condition that the number of PCIE cards is large, since the CPU and the PCIE cards are both devices with high heat productivity, if the layout design is implemented, the improvement of the heat dissipation effect is also one of the problems that must be considered for the server motherboard.

Disclosure of Invention

The technical problem to be solved by the utility model is to provide a server which can promote the heat dissipation efficiency of a server mainboard and is layered up and down.

To this end, the present invention provides a server layered up and down, comprising: the device comprises a mainboard body, a CPU module, a memory bank module, a radiator, a PCIE card slot module and an air guide cover; the CPU module, the memory bank module and the radiator are all arranged on the mainboard body, and the radiator is arranged at two ends of the CPU module; the PCIE card slot module comprises a mounting plate, an elevating card and a PCIE card slot, and the PCIE card slot is arranged on the mounting plate through the elevating card; the air guiding cover is arranged between the CPU module and the PCIE card slot module.

The utility model has the further improvement that the air-suction fan module is also arranged at one end of the air guide cover far away from the CPU module.

The utility model is further improved in that the memory module is symmetrically arranged on two sides of the CPU module side by side.

The further improvement of the present invention is that the number of the heat sinks at the end of the CPU module close to the PCIE card slot module is greater than the number of the heat sinks at the end of the CPU module far from the PCIE card slot module.

A further improvement of the present invention is that the fin direction of the heat sink is parallel to the memory bank direction in the memory bank module.

A further improvement of the present invention is that the height of the PCIE card slot is higher than the height of the memory bank in the memory bank module.

The utility model is further improved in that the mounting plate is an overhead mounting plate, and the overhead height of the overhead mounting plate is greater than the height of the heat radiator between the CPU module and the PCIE card slot module.

The utility model has the further improvement that the PCIE card slot module is arranged at one side of the mainboard body close to the rear panel of the case.

The utility model is further improved by further comprising lower-layer radiating holes, wherein the lower-layer radiating holes are formed in the side edge, close to the lower-layer radiating module, of the case.

The utility model is further improved by further comprising upper-layer radiating holes, wherein the upper-layer radiating holes are formed in the side edge, close to the upper-layer radiating module, of the case.

Compared with the prior art, the utility model has the beneficial effects that: the radiators are arranged at two ends of the CPU module, and the CPU module realizes heat dissipation through the radiators; in the PCIE card slot module, the PCIE card slot is arranged on the mounting plate through the heightening card, the air guide cover is arranged between the CPU module and the PCIE card slot module, and then the CPU module and the PCIE card/GPU in the server are separated through the air guide cover, the heightening card and other optimized structural designs, so that the CPU module and the radiator form an independent lower-layer radiating channel, the PCIE card/GPU forms an upper-layer radiating channel above the mainboard body through the heightening card, and further the heat can be radiated through respective radiating channels respectively, and the heat radiation efficiency can not be improved, and the heat radiation requirement of the server can be met.

Drawings

FIG. 1 is a simplified structural schematic of one embodiment of the present invention;

FIG. 2 is a simplified block diagram of an embodiment of the present invention from another perspective;

fig. 3 is a schematic perspective view of an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present embodiment provides a server layered up and down, including: the main board comprises a main board body 1, a CPU module 2, a memory bank module 3, a radiator 4, a PCIE card slot module and an air guide cover 8; the CPU module 2, the memory bank module 3 and the radiator 4 are all arranged on the mainboard body 1, and the radiator 4 is arranged at two ends of the CPU module 2; the PCIE card slot module comprises a mounting plate 5, an elevating card 6 and a PCIE card slot 7, wherein the PCIE card slot 7 is arranged on the mounting plate 5 through the elevating card 6; the air guiding cover 8 is arranged between the CPU module 2 and the PCIE card slot module.

The main board body 1 in this embodiment is preferably a main circuit board of a server, and the CPU module 2 may include a single CPU or a plurality of CPUs, such as dual CPUs; the memory bank module 3 preferably includes a plurality of memory bank units, each of which may include one or more memory banks arranged side by side, and preferably, the memory bank modules 3 are symmetrically arranged side by side on both sides of the CPU module 2, so that on one hand, the occupied space is smaller, and on the other hand, the CPU module 2 can be connected to the memory banks left and right, respectively, thereby facilitating wiring and reducing the wiring distance; the PCIE card slot module comprises a plurality of PCIE card slots 7 arranged side by side, the mounting plate 5 is a mounting fixing plate of the PCIE card slots 7, and the padding card 6 is a clamping component used for achieving padding effect of the PCIE card slots 7.

The air guiding cover 8 is a structural member for realizing an air guiding function, is arranged between the CPU module 1 and the PCIE card slot module, and is used for realizing heat dissipation and air guiding of the components such as the CPU module 2, the memory bank module 3, and the heat sink 4. In the embodiment, the CPU module 2 and the PCIE card/GPU in the server are separated by the optimized structural design of the air guide cover 8, the padding card 6 and the like, the PCIE card/GPU is arranged in the PCIE card slot module, so that the CPU module 2, the radiator 4 and the like form an independent lower-layer radiating channel, the PCIE card/GPU forms an upper-layer radiating channel above the mainboard body 1 through the padding card 6, heat can be radiated through respective radiating channels respectively, mutual interference and heat superposition cannot be generated, the radiating efficiency is improved, and the radiating requirement of the server is met.

As shown in fig. 3, the present embodiment further includes an air suction fan module 9, where the air suction fan module 9 is disposed at an end of the air guiding cover 8 away from the CPU module 2, so that air suction is realized by the cooperation of the air suction fan module 9 and the air guiding cover 8, and the heat dissipation effect is further promoted.

As shown in fig. 1 and fig. 2, in this embodiment, the number of the heat sinks 4 at the end of the CPU module 2 close to the PCIE card slot module is greater than the number of the heat sinks 4 at the end of the CPU module 2 away from the PCIE card slot module, so that the CPU module 2 and the PCIE card slot module are isolated by the heat sinks 4 as much as possible, and the possibility of mutual interference or influence of heat is reduced as much as possible. Preferably, the direction of the fins of the heat sink 4 in this embodiment is parallel to the direction of the memory bank in the memory bank module 3, so that the heat dissipation efficiency is improved by the consistent heat dissipation wind direction to achieve the diversion and air outlet.

The height of the PCIE card slot 7 in this embodiment is higher than the height of the memory bank in the memory bank module 3. That is to say, after assembly, the PCIE card slot 7 is higher than the memory bank after assembly, and then there is an idle channel between the distance and the CPU module 2, where the idle channel is actually the position of the air guiding cover 8, so that the upper heat dissipation channel and the lower heat dissipation channel are conveniently separated, and the heat dissipation efficiency is further facilitated; more preferably, in practical application, a cooling plate is preferably further disposed in a channel between the CPU module 2 and the PCIE card slot module, for example, a cooling plate made of a semiconductor cooling plate is disposed in the air guiding cover 8, so that a better cooling and heat dissipation effect can be achieved for a high-performance server motherboard, and heat between an upper layer and a lower layer can also be avoided from affecting each other.

Preferably, the mounting plate 5 in this embodiment is an overhead mounting plate, that is, an overhead layer is disposed below the mounting plate 5, and the overhead height of the overhead mounting plate is greater than the height of the heat sink 4 between the CPU module 2 and the PCIE card slot module, so that more space is provided for the heat sink 4 between the CPU module 2 and the PCIE card slot module to realize air circulation, and the heat dissipation effect is better.

The PCIE card slot module is arranged on one side, close to the rear panel of the chassis, of the mainboard body 1, so that fixation and arrangement of the PCIE card slot module are facilitated, the PCIE card slot module and the rear panel interface module are arranged together, layout design is facilitated to be optimized, and occupied space is reduced.

The heat dissipation module also preferably comprises lower-layer heat dissipation holes (not shown in the figure, the lower-layer heat dissipation holes are only needed to be arranged at the lower layer, and the positions of the lower-layer heat dissipation holes are not limited), and the lower-layer heat dissipation holes are arranged on the side edge, close to the lower-layer heat dissipation module, of the case, so that the lower-layer heat dissipation is conveniently realized. For the same reason, the present embodiment preferably further includes upper heat dissipation holes (not shown in the present embodiment, the upper heat dissipation holes are only needed to be disposed on the upper layer, and the positions of the upper heat dissipation holes are not limited), and the upper heat dissipation holes are disposed on the side of the chassis close to the upper heat dissipation module.

In summary, in this embodiment, the heat sinks 4 are disposed at two ends of the CPU module 2, and the CPU module 2 dissipates heat through the heat sinks 4; in the PCIE card slot module, the PCIE card slot 7 is disposed on the mounting board 5 through the heightening card 6, the air guiding cover 8 is disposed between the CPU module 2 and the PCIE card slot module, and then the CPU module 2 and the PCIE card/GPU in the server are separated by the optimized structural design such as the air guiding cover 8 and the heightening card 6, so that the CPU module 2 and the heat sink 4 form an independent lower heat dissipation channel, and the PCIE card/GPU forms an upper heat dissipation channel above the motherboard body 1 through the heightening card 6, so that heat can be dissipated through respective heat dissipation channels, and mutual interference and heat superposition are avoided, so that the heat dissipation efficiency is improved, and the heat dissipation requirement of the server is met.

The above-mentioned embodiments are preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the equivalent changes in shape and structure according to the present invention are within the protection scope of the present invention.

Claims

1. A vertically tiered server, comprising: the device comprises a mainboard body, a CPU module, a memory bank module, a radiator, a PCIE card slot module and an air guide cover; the CPU module, the memory bank module and the radiator are all arranged on the mainboard body, and the radiator is arranged at two ends of the CPU module; the PCIE card slot module comprises a mounting plate, an elevating card and a PCIE card slot, and the PCIE card slot is arranged on the mounting plate through the elevating card; the air guiding cover is arranged between the CPU module and the PCIE card slot module.

2. The vertically-layered server according to claim 1, further comprising an air suction fan module, wherein the air suction fan module is disposed at an end of the air guide cover away from the CPU module.

3. The top-bottom hierarchical server according to claim 1, wherein the memory bank modules are symmetrically arranged side by side on both sides of the CPU module.

4. The vertically layered server of claim 1, wherein the number of heat sinks at the end of the CPU module close to the PCIE card slot module is greater than the number of heat sinks at the end of the CPU module away from the PCIE card slot module.

5. The vertically layered server as recited in claim 4, wherein the fin direction of said heat sink is parallel to the memory bank direction in said memory bank module.

6. The vertically layered server according to any one of claims 1 to 5, wherein the height of the PCIE card slot is higher than the height of the memory bank in the memory bank module.

7. The vertically tiered server of any one of claims 1 to 5 wherein the mounting board is an overhead mounting board having an overhead height greater than a heat sink height between the CPU module and the PCIE card slot module.

8. The vertically-layered server according to any one of claims 1 to 5, wherein the PCIE card slot module is disposed on a side of the motherboard body close to a rear panel of the chassis.

9. The server according to any one of claims 1 to 5, further comprising lower heat dissipation holes, wherein the lower heat dissipation holes are disposed on a side of the chassis near the lower heat dissipation module.

10. The server according to any one of claims 1 to 5, further comprising upper heat dissipation holes, wherein the upper heat dissipation holes are disposed on a side of the chassis near the upper heat dissipation module.