CN211061964U - High-density four-way cloud server - Google Patents
High-density four-way cloud server Download PDFInfo
- Publication number
- CN211061964U CN211061964U CN201922287249.6U CN201922287249U CN211061964U CN 211061964 U CN211061964 U CN 211061964U CN 201922287249 U CN201922287249 U CN 201922287249U CN 211061964 U CN211061964 U CN 211061964U
- Authority
- CN
- China
- Prior art keywords
- cpu
- radiating fin
- main board
- shaped
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 44
- 238000009423 ventilation Methods 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high density four ways cloud ware, include: the mainboard is provided with four CPUs; the four CPUs are uniformly distributed on the main board; a front vent is arranged on the front side surface of the main board, and a back vent is arranged on the back side surface of the main board; a plurality of NVMe hard disks are arranged on the front side close to the main board side by side; a plurality of fan modules are arranged between the NVMe hard disk and the CPU in parallel; the wind direction of the fan module is parallel to the wind channel formed by the front vent and the back vent of the main board; each CPU is provided with a T-shaped radiating fin mechanism, a radiating bar is arranged between the CPUs, and the radiating bar is provided with a ventilation channel; the ventilation channel isolates the four CPUs from each other; the T-shaped foot part of the T-shaped radiating fin mechanism is abutted against the CPU, and the T-shaped transverse surface of the T-shaped radiating fin mechanism is arranged on the ventilation channel. The heat dissipation problem among the CPU, the power supply chip and related elements is solved. Thereby realizing the purpose of deploying 4 CPUs in the case.
Description
Technical Field
The utility model relates to a server technical field especially relates to a high density four ways cloud ware.
Background
With the rapid development of cloud computing, the performance requirements of internet clients on servers are higher and higher, and the cost of IT equipment can be remarkably reduced by a server with multiple processors, large memory and small volume.
In order to reduce the size of the server, a four-way server is adopted at present, but the four-way server is often unreasonably arranged to cause the problem of poor heat dissipation.
Disclosure of Invention
In order to overcome not enough among the above-mentioned prior art, the utility model provides a high density four ways cloud server, include: the mainboard is provided with four CPUs;
the four CPUs are uniformly distributed on the main board; a front vent is arranged on the front side surface of the main board, and a back vent is arranged on the back side surface of the main board;
a plurality of NVMe hard disks are arranged on the front side close to the main board side by side;
a plurality of fan modules are arranged between the NVMe hard disk and the CPU in parallel; the wind direction of the fan module is parallel to the wind channel formed by the front vent and the back vent of the main board;
each CPU is provided with a T-shaped radiating fin mechanism, a radiating bar is arranged between the CPUs, and the radiating bar is provided with a ventilation channel; the ventilation channel isolates the four CPUs from each other;
the T-shaped foot part of the T-shaped radiating fin mechanism is abutted against the CPU, and the T-shaped transverse surface of the T-shaped radiating fin mechanism is arranged on the ventilation channel.
Preferably, the T-shaped radiating fin mechanism is provided with a lower radiating fin and an upper radiating fin connected with the lower radiating fin, the bottom of the lower radiating fin is provided with a fixing piece, and the fixing piece is connected with the main board through a bolt;
the cross section of the upper heat dissipation row is trapezoidal, and the narrow section of the upper heat dissipation row is connected with the upper end face of the lower heat dissipation row;
the width of the narrow section of the upper heat dissipation row is less than or equal to that of the lower heat dissipation row;
the width of the wide section of the upper heat dissipation row is larger than that of the lower heat dissipation row.
The width of the lower heat dissipation row is smaller than the width of the ventilation channel.
Preferably, a power supply assembly is arranged close to the back side surface of the main board;
the power supply assembly is arranged on the side edge part of the back side surface of the main board;
the ventilation channel is arranged between the power supply assembly and the CPU;
the power supply assembly and the CPU are isolated from each other by the T-shaped transverse surface of the T-shaped radiating fin mechanism.
Preferably, the power supply assembly is provided with at least two power supply chips;
and a radiating fin is arranged between the power supply chips.
Preferably, an IO interface and an M.2 hard disk are further arranged close to the back side face of the main board;
the ventilation channel is arranged between the M.2 hard disk and the CPU;
the T-shaped transverse surface of the T-shaped radiating fin mechanism isolates the M.2 hard disk from the CPU.
Preferably, a Riser card is further arranged close to the back side face of the main board;
the Riser card is connected with a PCIe slot position;
the ventilation channel is arranged between the Riser card and the CPU;
the T-shaped transverse surface of the T-shaped radiating fin mechanism isolates the Riser card from the CPU.
Preferably, a memory bank is respectively arranged at a position close to each CPU;
the memory bank is arranged close to the ventilation channel.
According to the technical scheme, the utility model has the advantages of it is following:
the utility model discloses set up the heat dissipation wind channel in the middle of each components and parts of mainboard, helped improving the radiating effect of each component, mutual isolation avoids the interact moreover. The heat dissipation problem of the CPU is solved by arranging the heat dissipation row, the T-shaped heat dissipation plate mechanism and the ventilation channel. By designing the T-shaped radiating fin mechanism, the problem of interference between the CPU and a power chip radiator and the problem of heat dissipation between the CPU and other elements are solved.
The heat dissipation problem among the CPU, the power supply chip and related elements is solved. Thereby realizing the purpose of deploying 4 CPUs in the case.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a high density four-way cloud server;
FIG. 2 is a schematic diagram of a high density four-way cloud server;
FIG. 3 is a schematic diagram of a high density four-way cloud server;
fig. 4 is a schematic view of a T-shaped heat sink mechanism.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the following embodiments and drawings are applied to clearly and completely describe the technical solution protected by the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.
It will be understood that when an element or layer is referred to as being "on," connected to, "or" coupled to "another element or layer, it can be directly on, connected or coupled to the other element or layer, and intervening elements or layers may also be present. In contrast, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The utility model provides a high density four ways cloud server, as shown in fig. 1 to 4, include: the mainboard 1, the mainboard 1 is provided with four CPUs 2; the four CPUs 2 are uniformly distributed on the mainboard 1; a front ventilation opening is formed in the front side face 3 of the main board 1, and a back ventilation opening is formed in the back side face 4 of the main board 1; a plurality of NVMe hard disks 5 are arranged side by side close to the front side 3 of the main board 1; a plurality of fan modules 6 are arranged between the NVMe hard disk 5 and the CPU2 in parallel; the wind direction of the fan module 6 is parallel to the wind channel formed by the front vent and the back vent of the main board 1; thus, the heat dissipation air can enter from one side of the ventilation opening of the main board 1 and exit from the other ventilation opening. Each CPU2 is provided with a T-shaped radiating fin mechanism 9, a radiating row 7 is arranged between the CPUs 2, and the radiating row 7 is provided with a ventilation channel 8; the heat radiation air can flow in the ventilation channel 8. The ventilation channel 8 isolates the four CPUs 2 from each other to help the flow of the cooling air, the T-shaped cooling fin mechanism 9 is provided with a lower cooling fin 21 and an upper cooling fin 24 connected with the lower cooling fin 21, the bottom of the lower cooling fin 21 is provided with a fixing piece 22, and the fixing piece 22 is connected with the main board 1 through a bolt 23; the cross section of the upper heat dissipation row 24 is trapezoidal, and the narrow section of the upper heat dissipation row 24 is connected with the upper end face of the lower heat dissipation row 21; the width of the narrow section of the upper heat dissipation row 24 is less than or equal to the width of the lower heat dissipation row 21; the width of the wide cross-section of the upper heat dissipation row 24 is greater than the width of the lower heat dissipation row 21. The width of the lower heat dissipation row 21 is smaller than the width of the ventilation channel. The T-leg 91 of the T-shaped fin mechanism 9 is in contact with the CPU2, and the T-shaped lateral surface 92 of the T-shaped fin mechanism 9 is provided on the air duct 8. The heat dissipation air can avoid the obstruction of the lower heat dissipation row 21 and can smoothly circulate in the ventilation channel 8, and the area of the upper heat dissipation row 24 is increased to increase the heat dissipation effect.
The ventilation passage 8 is provided between the power supply module 11 and the CPU 2; the T-shaped cross-section 92 of the T-shaped heat sink mechanism 9 isolates the power module 11 from the CPU 2.
The power supply assembly 11 is provided with at least two power supply chips 12; a heat sink is provided between the power chips 12.
An IO interface 13 and an M.2 hard disk 14 are also arranged near the back side 4 of the mainboard 1; the ventilation channel 8 is provided between the m.2 hard disk 14 and the CPU 2; the T-shaped cross-section 92 of the T-shaped heat sink mechanism 9 isolates the m.2 hard disk 14 from the CPU 2.
The Riser card 15 is connected with a PCIe slot 16; the ventilation channel 8 is provided between the Riser card 15 and the CPU 2; the T-shaped cross-section 92 of the T-shaped heat sink mechanism 9 isolates the Riser card 15 from the CPU 2.
A memory bank 17 is respectively arranged at the position close to each CPU 2; the memory bank 17 is arranged close to the ventilation channel 8.
The heat dissipation air duct is arranged in the middle of each component of the main board, so that the heat dissipation effect of each component is improved, the components are isolated from each other, and mutual influence is avoided.
The utility model provides a memory bank quantity, NVMe hard disk quantity, the quantity of Riser card and PCIe trench, the quantity of M.2 hard disk do not all do the injecing.
The utility model discloses, through setting up the heat dissipation row, T type fin mechanism, CPU's heat dissipation problem is solved to the ventilation passageway. By designing the T-shaped radiating fin mechanism, the problem of interference between the CPU and a power chip radiator and the problem of heat dissipation between the CPU and other elements are solved. The utility model discloses can also solve fan below power chip heat dissipation problem through form backward flow wind at fan module below trompil.
The utility model provides a CPU, the heat dissipation problem between power chip and the relevant component. Thereby realizing the purpose of deploying 4 CPUs in the case.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A high-density four-way cloud server, comprising: the mainboard is provided with four CPUs;
the four CPUs are uniformly distributed on the main board; a front vent is arranged on the front side surface of the main board, and a back vent is arranged on the back side surface of the main board;
a plurality of NVMe hard disks are arranged on the front side close to the main board side by side;
a plurality of fan modules are arranged between the NVMe hard disk and the CPU in parallel; the wind direction of the fan module is parallel to the wind channel formed by the front vent and the back vent of the main board;
each CPU is provided with a T-shaped radiating fin mechanism, a radiating bar is arranged between the CPUs, and the radiating bar is provided with a ventilation channel; the ventilation channel isolates the four CPUs from each other;
the T-shaped foot part of the T-shaped radiating fin mechanism is abutted against the CPU, and the T-shaped transverse surface of the T-shaped radiating fin mechanism is arranged on the ventilation channel.
2. The high-density four-way cloud server of claim 1,
the T-shaped radiating fin mechanism is provided with a lower radiating fin and an upper radiating fin connected with the lower radiating fin, and the bottom of the lower radiating fin is provided with a fixing piece which is connected with the main board through a bolt;
the cross section of the upper heat dissipation row is trapezoidal, and the narrow section of the upper heat dissipation row is connected with the upper end face of the lower heat dissipation row;
the width of the narrow section of the upper heat dissipation row is less than or equal to that of the lower heat dissipation row;
the width of the wide section of the upper heat dissipation row is larger than that of the lower heat dissipation row.
3. The high-density four-way cloud server of claim 2,
the width of the lower heat dissipation row is smaller than the width of the ventilation channel.
4. The high-density four-way cloud server of claim 1,
a power supply assembly is arranged close to the back side surface of the main board;
the ventilation channel is arranged between the power supply assembly and the CPU;
the power supply assembly and the CPU are isolated from each other by the T-shaped transverse surface of the T-shaped radiating fin mechanism.
5. The high-density four-way cloud server of claim 1,
the power supply assembly is provided with at least two power supply chips;
and a radiating fin is arranged between the power supply chips.
6. The high-density four-way cloud server of claim 1,
an IO interface and an M.2 hard disk are also arranged on the back side surface close to the mainboard;
the ventilation channel is arranged between the M.2 hard disk and the CPU;
the T-shaped transverse surface of the T-shaped radiating fin mechanism isolates the M.2 hard disk from the CPU.
7. The high-density four-way cloud server of claim 1,
a Riser card is arranged close to the back side of the main board;
the Riser card is connected with a PCIe slot position;
the ventilation channel is arranged between the Riser card and the CPU;
the T-shaped transverse surface of the T-shaped radiating fin mechanism isolates the Riser card from the CPU.
8. The high-density four-way cloud server of claim 1,
memory banks are respectively arranged at the positions close to each CPU;
the memory bank is arranged close to the ventilation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287249.6U CN211061964U (en) | 2019-12-18 | 2019-12-18 | High-density four-way cloud server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922287249.6U CN211061964U (en) | 2019-12-18 | 2019-12-18 | High-density four-way cloud server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211061964U true CN211061964U (en) | 2020-07-21 |
Family
ID=71595570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922287249.6U Active CN211061964U (en) | 2019-12-18 | 2019-12-18 | High-density four-way cloud server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211061964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805686A (en) * | 2021-09-27 | 2021-12-17 | 深圳市国鑫恒运信息安全有限公司 | Server with GPU module and CPU module capable of independently radiating heat separately |
-
2019
- 2019-12-18 CN CN201922287249.6U patent/CN211061964U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805686A (en) * | 2021-09-27 | 2021-12-17 | 深圳市国鑫恒运信息安全有限公司 | Server with GPU module and CPU module capable of independently radiating heat separately |
| CN113805686B (en) * | 2021-09-27 | 2023-12-26 | 深圳市国鑫恒运信息安全有限公司 | Separate independent heat dissipation server for GPU module and CPU module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100543639C (en) | Cooling system | |
| US7309911B2 (en) | Method and stacked memory structure for implementing enhanced cooling of memory devices | |
| US20140016268A1 (en) | Electronic device and airflow adjustment member | |
| CN109727937B (en) | Assemblies including heat dissipating elements and related systems and methods | |
| US8787021B2 (en) | Memory cooler | |
| TWI236336B (en) | Electronic product having airflow-guiding device | |
| CN100541390C (en) | Multidirectional configurable architecture for multi-processor system | |
| CN211061964U (en) | High-density four-way cloud server | |
| CN101106887B (en) | Radiator | |
| CN104684356A (en) | Heat radiation structure and LED (light emitting diode) splicing display screen | |
| TW202038045A (en) | Liquid cooling sink | |
| CN204119708U (en) | Radiator | |
| WO2021036249A1 (en) | Heat dissipation device, electronic apparatus, and automobile | |
| CN109189193B (en) | Air guide device and air guide method for realizing uniform distribution of airflow in chassis | |
| US20080123294A1 (en) | Cooling apparatus for memory modules | |
| TWI662401B (en) | Electronic device with arc shape front panel and chassis | |
| CN109460137B (en) | Server case and linear double-heat-source balanced heat dissipation mechanism thereof | |
| CN101807100A (en) | High-density rack server radiating system | |
| CN204695202U (en) | Wind-cooling heat dissipating unit and there is the notebook computer of this wind-cooling heat dissipating unit | |
| CN106125870A (en) | Server | |
| CN204904192U (en) | Mainboard subassembly | |
| CN216647299U (en) | Novel radiator | |
| CN115113703B (en) | Six-node OTII server for edge calculation | |
| US20130014921A1 (en) | Air flow guiding structure | |
| CN217588004U (en) | Server with prevent scattered hot-blast backward flow |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |