CN101807100A - High-density rack server radiating system - Google Patents
High-density rack server radiating system Download PDFInfo
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- CN101807100A CN101807100A CN 201010128631 CN201010128631A CN101807100A CN 101807100 A CN101807100 A CN 101807100A CN 201010128631 CN201010128631 CN 201010128631 CN 201010128631 A CN201010128631 A CN 201010128631A CN 101807100 A CN101807100 A CN 101807100A
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Abstract
The invention relates to a high-density rack server radiating system, which comprises an axial fan group, a radiator and a case body, wherein the axial fan group and the radiator are installed in the case body; the axial fan group comprises a plurality of fans; the radiator is made of fin-shaped aluminum profiles, wherein the number of CPU chip radiators can be 4-16, and the number of Chipset and communication chip radiators can be 2-6 respectively; the CPU chip radiators are axially arranged in two rows along the fans in front and at the back of the case and are covered on the surface of a CPU chip; and the case body is a box type galvanized steel sheet, comprises a front panel, a back panel, an upper panel, a lower panel, a left panel and a right panel, and is fixed by adopting L-shaped side lugs. The invention overcomes the defects of the traditional radiating system, enables radiating elements to have lower temperature and be more balanced, provides secure thermal environment guarantee for stable operation and longer service life of the whole server system, and has good practical value and popularization prospect in the technical field of computer servers.
Description
(1) technical field
The present invention relates to a kind of high-density rack server radiating system.Belong to field of computer technology.
(2) background technology
Studies show that thermal failure is one of the main failure forms that comprises the electronic equipment of computing machine.Along with the increase of temperature, the crash rate of electronic equipment is exponential increase trend, even the device that has raises 10 ℃ in environment temperature, and crash rate increases and is twice above (being referred to as 10 ℃ of rules).The chip operation increase in temperature can be brought the electron transfer in the semiconductor, thereby causes chip failure even burn.
Because the thermal environment stress that heat produces is a kind of important working stress, statistics shows that 70% electronic equipment lost efficacy relevant with too high thermal environment stress.Therefore for electronic equipment,, also will make the crash rate of equipment reduce a considerable value even reduce by 1 ℃.
Frame (RACK) server is the server of a kind of outward appearance according to the unified standard design, cooperates the unified use of rack.The width of rack server is 19 inches, and height is unit (1U=1.75 inch=44.5 millimeter) with U, can divide into specifications such as 1U, 2U, 3U, 4U, 5U.How efficiently to utilize the computer cabinet inner space, be the problem of academia and industrial community exploratory development always.
The design aim of rack server mainly is in order to reduce taking of server space as far as possible, particularly in the Network of Workstation of space sensitive and need under the situation of trust server.The design of dwindling on the space to cooling system has brought limitation.
Because inside dimension is fixed, the space is narrow and small, density of components is big, therefore the heat dissipation problem of numerous heat generating components such as the building block of 1U RACK server such as central processing unit, internal memory, Chipset, external bus controller becomes a key issue such as this class server design of 1U RACK server.
Loongson3A (a kind of homemade processor brand) is the bigger a polycaryon processor of relative single core processor power consumption.Machine box for server is intensive being positioned in the standard cabinet often, and cabinet environment ventilation effect is relatively poor.Simultaneously, the processor quantity of server system is generally many, and power consumption is bigger, and the cabinet inside space is less, makes heat flow density (unit area internal heat generation performance number) bigger, and the heat dissipation that can take also is subjected to space constraint.These bring challenges all for the heat dissipation design of server system.
Traditional a kind of solution is to increase number of fans, rotating speed merely.Its shortcoming is: the first, and the 1U lateral length is fixed, and installable industrial products standard specification number of fans is limited; The second, more fan, bigger rotating speed cause the noise of server bigger.
Traditional a kind of solution is to dispel the heat by adding the heating radiator that has fan for the big chip of thermal value.Its shortcoming is: at cabinet hour, the vertical blast that fan on the heating radiator produces can have a negative impact to the transverse convection inside and outside the cabinet, when convection current inside and outside the cabinet is not enough, the accumulation of heat that heating radiator produces is in cabinet, temperature in the cabinet is raise, and the high temperature in the cabinet influences the radiating effect of heating radiator conversely again.
Traditional a kind of solution is to increase the wind scooper of artificial design to form a plurality of air channels.Its shortcoming is: itself occupies certain space wind scooper, and the cycle of Custom Design is longer.
Therefore, how to take all factors into consideration type servers such as 1U RACK space constraint, reduce factors such as noise, cross-ventilation effect, in certain design cycle, provide a kind of practicality, the solution of dispelling the heat has become problem demanding prompt solution in the server design efficiently.
(3) summary of the invention
1. purpose:
The purpose of this invention is to provide a kind of high-density rack server radiating system, and be example, provide its concrete device and be provided with 1U ten six road rack servers.This cooling system is based on space constraint, overcome the defective of traditional heat-dissipating system, can make main radiating element temperature such as CPU lower and balanced more each other, avoid the various system failures that cause by system radiating, and prolong the mean time between failures and the serviceable life of total system.
2. technical scheme:
A kind of high-density rack server radiating system of the present invention designs as follows.This cooling system is made up of aerofoil fan group, heating radiator, cabinet casing, and aerofoil fan group and heating radiator all are installed in the cabinet casing.
Described aerofoil fan group is made up of the N+M desk fan, and wherein the N desk fan is positioned at cabinet casing front end, exhausting in the cabinet casing, and the M desk fan is positioned at the cabinet box back, air draft outside the cabinet casing.The odd test air discharging and radiating is blown in the two groups of fans collocation in front and back.Wherein, N, M are at least 2 respectively.The fan group can partly or entirely select for use the fan with double pressure air draft performance to form where necessary.
Described heating radiator is a parallel fins formula shape, aluminium section bar matter, settle direction along fan shaft to.4～16 of the quantity of cpu chip (as Loongson3A) heating radiator; The quantity of Chipset (as MCP68) and communication chip (as IB) heating radiator can be 2～6 respectively.Heating radiator is covered in the said chip surface, chip heat is absorbed and is dispersed in the surrounding air.On all cpu chip heating radiators fan is not installed, fan is not installed on all Chipset and the communication chip heating radiator yet.
The boxlike casing that described cabinet casing is the galvanized steel plain sheet material, it is made up of front and back panels, upper and lower panel and left and right side panel, adopts the L shaped fixed form of picking up the ears.Wherein the front and back panels of cabinet casing, left and right side panel all have through the suitable air vent of emulation experiment proof quantity.
The length and width of upper and lower panel, gauge are respectively L1mm*W1mm*T1mm (1000＞=L1＞=900, W1=440,1.3＞=T1＞=1.1), for example 950mm*440mm*1.2mm; The length and width of front and back panels, gauge are respectively L2mm*W2mm*T2mm (L2=440, W2=44.5,1.3＞=T2＞=1.1), for example 440mm*44.5mm*1.2mm; The percentage of open area of cabinet casing front panel 19 is 40%～80%, for example 60%; Perforate is positioned at the front portion of front end fan 7; The length and width of left and right side plate, gauge are respectively L3mm*W3mm*T3mm (L3=L1, W3=44.5,1.3＞=T3＞=1.1), for example 950mm*44.5mm*1.2mm.
In order to leave air vent in the position that front and back panel is positioned on the wind path, the power switch of cabinet casing front end adopts the card extender design that is independent of mainboard, places the preceding left end of cabinet casing, comprises 4 groups of reset button, 4 groups of power knobs, 4 groups of LED light; Medial axis is avoided in the exit position of cabinet cabinet rear panel, and the rear panel interface comprises 4 USB, 4 RJ45,2 IB chip interfaces.
The cabinet casing adopts the L shaped mode of picking up the ears to fix, and does not use guide rail, and its objective is increases cabinet box house space, to increase the mainboard width, reduces heat flow density.
In order to make wind path unobstructed, cpu chip is arranged in mainboard central authorities in two separate ranks.The same column cpu chip vertically is positioned on the straight line.Internal memory branch multiple row places the mainboard both sides, and same column vertically linearly.Chipset (as MCP68) and communication chip (as IB) are on the gap path between cpu chip and the memory bar.Cabinet casing upper and lower panel, in save as the wind-guiding pipeline that the cpu chip heating radiator has formed a relative closure, the high blast that the aerofoil fan group produces can better be kept in the wind-guiding pipeline, the heat of heater members such as processor is discharged the cabinet casing, overcome length effect to a certain extent.
Processor is the more serious parts that generate heat, and it can be operated under the higher temperature simultaneously, and a lot of miscellaneous part belongs to temperature sensitive parts, and as clock circuit, temperature variation causes frequency drift easily.If there is not the air channel of isolation relatively, whole cabinet casing is in a warm area, the heat that processor produces can cause that temperature is whole in the cabinet casing raises, though processor can be under this temperature operate as normal, some other equipment such as clock also may not operate as normal.The air channel has produced two different warm areas after separating, and has reduced the influence of the contour heat resource equipment of processor to other equipment.
Processor is as one of high heat resource equipment, and its heat radiation is the emphasis of considering in this cooling system design.Because the restriction of the crosswise fixed in 1U rack server space laterally can only be put 2 processors at most side by side.When putting, the temperature that is placed on the inlet air of accepting near the processor of air inlet fan one end is lower, blast is bigger, and the processor of back, because the temperature of the inlet air of accepting is higher, blast is less, radiating effect is subjected to obvious influence.This is the altitude temperature difference effect that the length factor in air channel causes.The result of this altitude temperature difference effect is exactly that different processor parts are because the difference of present position has different crash rates and life cycle.The present invention uses two methods to weaken this influence:
(1) except the perforate of cabinet casing front and back panel, also increases the left and right side perforate of cabinet casing.For the parts such as processor away from air inlet fan one end, but the outside cold wind slave box body side with ambient temperature blows to these parts.Should consider fan type selecting, longitudinal air flow and factors such as crossflow, interface exit position by the simulation means compromise, determine percentage of open area, the position of opening of front and back panel and left side plate perforate.Left side plate is being of a size of perforate on the zone of 120*30mm respectively, percentage of open area is 50%～70%, near being centered close to some main source of heat release of mainboard and being positioned at 2/3～3/4 place of whole wind path length of opening area is for example near the motherboard power supply module and be in the zone of transition of 1-12 cpu chip and 13-16 cpu chip.
(2) parts such as processor away from air inlet fan one end use larger-size heating radiator, compensate the negative effect that altitude temperature difference effect brings by bigger area of dissipation, thereby make the radiating effect basically identical of parts such as the processor acquisition that is in diverse location.To the chip of same kind, be designed to X1mm*Y1mm*Z1mm (the wide * height of long *) near the heating radiator physical dimension of air inlet, be designed to X2mm*Y2mm*Z2mm (the wide * height of long *) away from the heating radiator physical dimension of air inlet.1.33X1＞=X2＞=1.25X1 wherein, Y2=X2,1.33Z1＞=Z2＞=1.25Z1
In order to shorten cabinet length as far as possible, reduce length effect among the present invention, the mainboard profile is designed to be " recessed " font, fan is placed at mainboard depression position, and external interfaces such as USB are placed at outstanding position.
In order to reduce cabinet casing inside conductor saving cabinet box house space, and make wind path unimpeded among the present invention, two identical mainboards in the cabinet casing adopt the mother daughter board connector modes interconnected.
Adopt CF (Compact Flash) card to replace hard disk among the present invention, saved cabinet box house space, and helped wind path unimpeded.
Cooling system of the present invention can be used for ten six road servers of 1U.The 1U server is as the strongest a kind of standard rack server of space constraint, and its cooling system can be used for 2U and the above server of 2U.To more than 1U and be less than ten six tunnel server, way of realization of the present invention is consistent, realizes that effect is better than at present specifically 1U ten six road servers of enforcement theoretically.
3. advantage and effect:
A kind of high-density rack server radiating system of the present invention, compared with the prior art, its advantage is: (with 1U ten six road rack servers is example to have successfully managed the heat density problem of high density server, in the space of 1U, held the AC-DC power supply of 16 cpu chips, 32 DDR2 memory bars, 4 IB chips, 4 MCP68 chips and 1 1200W); The radiating equipment that adopts need not special, do not need complicated heat dissipation technologys such as water-cooled, hot pipe technique, the mainboard symmetric design requirement of cooling system design compliance with system greatly reduces overall system design complexity and fabrication cycle and cost, has good promotion prospect.
(4) description of drawings
Fig. 1 is a perspective view of the present invention;
Fig. 2 is a cabinet box house vertical view;
Fig. 3 is the front panel synoptic diagram of cabinet casing;
Fig. 4 is the rear panel synoptic diagram of cabinet casing;
Fig. 5 is a cabinet casing Left-Hand Panel synoptic diagram;
Fig. 6 is a cabinet casing right panel synoptic diagram.
Symbol description is as follows among the figure:
1 serial control interface; The 2RJ45 interface; The 3USB interface; The 4IB interface; The 5CF card; 6 fan draw-in grooves; 7 fans; 8 (8.1-8.2) IB chip radiator (greatly); 9 (9.1-9.2) Chipset chip radiator (greatly); 10 mainboards; 11 cabinet casing right panel air vents (backward) from front end; 12 cabinet casing Left-Hand Panel air vents (backward) from front end; 13 memory bars; 14 (14.1-14.2) Chipset chip radiator (little); 15 (15.1-15.4) cpu chip heating radiator (greatly); 16 (16.1-16.12) cpu chip heating radiator (little); 17 (17.1-17.2) IB chip radiator (little); 18 cabinet casing front panel air vents; 19 cabinet casing front panels; 20 the cabinet casing is L shaped picks up the ears; 21 (21.1-21.4) mother daughter board connector male; 22 (22.1-22.4) mother daughter board connector female; 23 cabinet box back fan outlets; 24 power supply AC/DC air outlets; 25 cabinet casing front-panel led pilot lamp; 26 electric source line interfaces.
(5) embodiment
Be example now, embodiment is described with 1U ten six road rack servers.
A kind of high-density rack server radiating system of the present invention is made up of aerofoil fan group, heating radiator, cabinet casing.Fan group and heating radiator all are installed in the cabinet casing.
Described aerofoil fan group is that 4056 fans 7 are formed by 8 models, and wind axially passes through from fan 7.4 desk fans 7 are positioned at cabinet casing front end in the tool, exhausting in the cabinet casing, and other 4 desk fans 7 are positioned at the cabinet box back, air draft outside the cabinet casing.The 2 groups of corresponding fans 7 in front and back all on a line, blow-the odd test air discharging and radiating by collocation.All fans 7 have double pressure air draft performance, therefore, fan are not installed on the heating radiator of all cpu chips, and fan is not installed on the heating radiator of all IB chips, and fan is not installed on the heating radiator of all MCP68 chips yet.
Described heating radiator comprises 8,17,4 MCP68 chip radiators 9,14 of 15,16,4 IB chip radiators of 16 cpu chip heating radiators.This heating radiator is the fin type shape, aluminium section bar matter, be provided with direction along fan shaft to.Heating radiator is covered in the said chip surface, chip heat is absorbed and is dispersed in the surrounding air.
Harmony for the cpu chip temperature, reduce length effect, to be designed to 60mm*60mm*30mm (the wide * height of long *) near heating radiator 16 physical dimension of 12 cpu chips of air inlet, be designed to 70mm*60mm*30mm (the wide * height of long *) away from heating radiator 15 physical dimension of 4 cpu chips of air inlet.All 16 cpu chip heating radiators, 15,16 directions are lined up 2 row along cabinet casing fore-and-aft direction.
Harmony for the IB chip temperature, reduce length effect, to be designed to 30mm*30mm*24mm (the wide * height of long *) near heating radiator 17 physical dimension of 2 IB chips of air inlet, be designed to 45mm*30mm*30mm (the wide * height of long *) away from heating radiator 8 physical dimension of 2 IB chips of air inlet.
Harmony for the MCP68 chip temperature, reduce length effect, to be designed to 40mm*40mm*24mm (the wide * height of long *) near heating radiator 14 physical dimension of 2 MCP68 chips of air inlet, be designed to 50*40*30mm (the wide * height of long *) away from heating radiator 9 physical dimension of 2 MCP68 chips of air inlet.
The boxlike casing that described cabinet casing is the galvanized steel plain sheet material, it is made up of front and back panels, upper and lower panel and left and right side panel, adopts the L shaped fixed form of picking up the ears.Wherein the front and back panels of cabinet casing, left and right side panel all have through the suitable air vent of emulation experiment proof quantity.
The length and width of upper and lower panel, gauge are 950mm*440mm*1.2mm; The length and width of front and back panels, gauge are 440mm*44.5mm*1.2mm; The percentage of open area of cabinet casing front panel 19 is 60%; Perforate is positioned at the front portion of front end fan 7; The length and width of left and right side plate, gauge are 950mm*44.5mm*1.2mm; Left and right side plate the zone that is of a size of 120*30mm (this zone be positioned at the motherboard power supply module near, and be in the zone of transition of 1-12 cpu chip and No. 1316 cpu chips) go up perforate, percentage of open area is 60%.
In order to leave air vent in the position that panel is positioned on the wind path, medial axis is avoided in the exit position of cabinet box back, the power switch of cabinet casing front end adopts the card extender design, places the preceding left end of cabinet casing, and adopts 4 groups of reset button, power knob, LED light 25 to show.The rear panel interface comprises 2,2 IB interfaces 4 of 3,4 RJ45 interfaces of 4 USB interface.
Adopt L shaped 20 modes of picking up the ears of cabinet casing to fix, and do not use guide rail, its objective is increases cabinet box house space, to increase mainboard 10 width, reduces heat flow density.
Fig. 1 is a perspective view of the present invention, and Fig. 2 is a cabinet box house vertical view.
The 10th, mainboard.The length and width of mainboard is designed and sized to 345mm*465mm.7 system fan that are to use are double fan.The blast of this fan, wind speed are all higher.The front and back end of cabinet casing is placed 4 desk fans 7 respectively, and front end is inside exhausting, the outside air draft in rear end.Double fan forces the mode of air draft, has improved the wind flow of system.The 6th, the fan draw-in groove.
9 and 14 is the Chipset chip radiator.Among Fig. 2 9.1,9.2nd, the heating radiator near 2 Chipset chips of cabinet box back is positioned at the wind path downstream, its size is than 14.1,14.2 the size of these 2 heating radiators that are positioned at the wind path upstream is big, by increasing area of dissipation, makes the more approaching equilibrium of radiating effect of 4 Chipset chips.
8 and 17 is the IB chip radiator.Among Fig. 2 8.1,8.2nd, the heating radiator near 2 IB chips of cabinet box back is positioned at the wind path downstream, its size is than 17.1,17.2 the size of these 2 heating radiators that are positioned at the wind path upstream is big, by increasing area of dissipation, makes the more approaching equilibrium of radiating effect of 4 IB chips.
More than these heating radiators all be directly installed on chip surface, these chips are main heater members, are positioned at the centre of cabinet box house wind path.
21 and 22 is mother daughter board connector male, mother daughter board connector female, 4 pairs altogether of mother daughter board connectors.2nd, 4 pairs are positioned between cpu chip and memory bar 13 spaces, and the 1st, 3 pair is positioned in the middle of the 2 row cpu chips.Because the volume of mother daughter board connector is bigger, they can stop air to pass through to a certain extent, and air-flow is mainly passed through between the cpu chip heat radiator fin.
Fig. 2 is a cabinet box house vertical view, and this figure center section has been represented main design wind path of the present invention.In order to save the inner space, adopt CF (Compact Flash) card 5 among the present invention, to replace hard disk.Mainboard 10 is shaped as " recessed " font, is convenient at cabinet tank ends installation system fan, and guarantees that IB interface 4, USB interface 3 receive cabinet casing outside smoothly.Simultaneously, " recessed " font helps to save cabinet casing length, thereby shortens wind path, improves radiating effect.
Fig. 3 is cabinet casing front panel 13 synoptic diagram.The 18th, cabinet casing front panel air vent; The 4th, the IB interface; The 25th, the front-panel led pilot lamp, one has 8.Front panel is except that interface, and residual area is designed primarily to air vent, to increase air-admitting surface.
Fig. 4 is the rear panel synoptic diagram of cabinet casing, the 23rd, and cabinet box back fan outlet; The 24th, 1200W AC-DC power supply air outlet; The 4th, IB interface, 2 altogether; The 3rd, USB interface, 4 altogether; 2 is the RJ45 interface, 4 altogether; The 26th, electric source line interface; The 1st, serial control interface.The rear panel interface position is avoided cabinet casing middle part wind path, is beneficial to the installation system fan.
Fig. 5 is a cabinet casing Left-Hand Panel synoptic diagram, the 12nd, and cabinet casing Left-Hand Panel air vent, this ventilating opening provides the air intake path for the AC-DC power supply.Fig. 6 is a cabinet casing right panel synoptic diagram, the 11st, and cabinet casing right panel air vent.
Claims (8)
1. high-density rack server radiating system, it is characterized in that: this cooling system is made up of aerofoil fan group, heating radiator, cabinet casing, and aerofoil fan group and heating radiator all are installed in the cabinet casing;
Described aerofoil fan group is to be combined by the N+M platform, and wherein the N desk fan is positioned at cabinet casing front end, exhausting in the cabinet casing; The M desk fan is positioned at the cabinet box back, air draft outside the cabinet casing;
Described heating radiator is a parallel fins formula shape, settle direction along fan shaft to; It comprises cpu chip heating radiator, Chipset and communication chip heating radiator; Heating radiator is covered in the said chip surface, chip heat is absorbed and is dispersed in the surrounding air;
The boxlike casing that described cabinet casing is the galvanized steel plain sheet material, it is made up of front and back panels, upper and lower panel and left and right side panel, adopts the L shaped fixed form of picking up the ears; Wherein the front and back panels of cabinet casing, left and right side panel all are provided with air vent; The cabinet casing adopts the L shaped mode of picking up the ears to fix; The power switch of cabinet casing front end adopts the card extender design and places the front panel left end; The mainboard profile is designed to be " recessed " font, and the fan group is placed at mainboard depression position, and external interface is placed at outstanding position; Two identical mainboards in the cabinet casing adopt the mother daughter board connector mode interconnected, and adopting CF is that Compact Flash card is to replace hard disk.
2. a kind of high-density rack server radiating system according to claim 1 is characterized in that: this cpu chip is arranged in mainboard central authorities in two separate ranks, and the same column cpu chip vertically is positioned on the straight line; Internal memory branch multiple row places the mainboard both sides, and same column vertically linearly; Chipset and communication chip are on the gap path between cpu chip and the memory bar.
3. a kind of high-density rack server radiating system according to claim 1 is characterized in that: the quantity of this cpu chip heating radiator is 4～16; The quantity of Chipset and communication chip heating radiator is respectively 2～6.
4. a kind of high-density rack server radiating system according to claim 1, it is characterized in that: to the same kind chip, its physical dimension near the heating radiator of air inlet is the wide * height of the promptly long * of X1 mm*Y1 mm*Z1 mm, is the wide * height of the promptly long * of X2 mm*Y2 mm*Z2 mm away from the physical dimension of the heating radiator of air inlet; Wherein, 1.33X1＞=X2＞=1.25X1, Y2=X2,1.33Z1＞=Z2＞=1.25Z1.
5. a kind of high-density rack server radiating system according to claim 1, it is characterized in that: the length and width of this upper and lower panel, gauge are respectively i.e. 1000＞=L1＞=900 of L1 mm*W1 mm*T1 mm, W1=440,1.3＞=T1＞=1.1; It is L2=440 that the length and width of this front and back panels, gauge are respectively L2 mm*W2 mm*T2 mm, W2=44.5,1.3＞=T2＞=1.1; The percentage of open area of front panel can be 40%～80%, and perforate is positioned at the front portion of front end fan; It is L3=950 that the length and width of this left and right side plate, gauge are respectively L3 mm*W3 mm*T3 mm, W3=44.5,1.3＞=T3＞=1.1.
6. a kind of high-density rack server radiating system according to claim 1, it is characterized in that: this left and right side plate is being of a size of perforate on the zone of 120*30mm respectively, percentage of open area is 50%～70%, near the source of heat release that is centered close to mainboard of opening area and be positioned at 2/3～3/4 place of whole wind path length.
7. a kind of high-density rack server radiating system according to claim 1, it is characterized in that: this aerofoil fan group is to be combined by the N+M platform, N, M are at least 2 respectively, the aerofoil fan group can partly or entirely select for use the fan with double pressure air draft performance to form, and fan is not installed on all heating radiators.
8. a kind of high-density rack server radiating system according to claim 1 is characterized in that: this heating radiator is an aluminium section bar matter.
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| CN2010101286313A CN101807100B (en) | 2010-03-18 | 2010-03-18 | High-density rack server radiating system |
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| CN102480389A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Frame server system |
| CN103713714A (en) * | 2013-12-17 | 2014-04-09 | 华为技术有限公司 | Three-dimensional air channel blade framework and chassis comprising the same |
| CN109062374A (en) * | 2018-08-16 | 2018-12-21 | 郑州云海信息技术有限公司 | Server |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI511656B (en) * | 2013-12-17 | 2015-12-01 | Inventec Corp | Server module |
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| US20070201205A1 (en) * | 2004-01-08 | 2007-08-30 | Apple Inc. | Apparatus for air cooling of an electronic device |
| CN201364544Y (en) * | 2009-03-26 | 2009-12-16 | 浪潮电子信息产业股份有限公司 | High-end cabinet server radiating structure device |
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| US20020054479A1 (en) * | 2000-11-06 | 2002-05-09 | Jeff Wu | Server having an air flow guide device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102480389A (en) * | 2010-11-30 | 2012-05-30 | 英业达股份有限公司 | Frame server system |
| CN103713714A (en) * | 2013-12-17 | 2014-04-09 | 华为技术有限公司 | Three-dimensional air channel blade framework and chassis comprising the same |
| CN103713714B (en) * | 2013-12-17 | 2017-03-15 | 华为技术有限公司 | Three-dimensional air channel blade frame and its cabinet |
| CN109062374A (en) * | 2018-08-16 | 2018-12-21 | 郑州云海信息技术有限公司 | Server |
| CN109062374B (en) * | 2018-08-16 | 2021-11-09 | 郑州云海信息技术有限公司 | Server |
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| CN101807100B (en) | 2012-01-11 |
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