CN109062374B

CN109062374B - Server

Info

Publication number: CN109062374B
Application number: CN201810934994.2A
Authority: CN
Inventors: 宗斌
Original assignee: Zhengzhou Yunhai Information Technology Co Ltd
Current assignee: Zhengzhou Yunhai Information Technology Co Ltd
Priority date: 2018-08-16
Filing date: 2018-08-16
Publication date: 2021-11-09
Anticipated expiration: 2038-08-16
Also published as: CN109062374A

Abstract

The invention discloses a server, which comprises a case, a fan and a CPU radiator, wherein the CPU radiator comprises a first radiator and a second radiator, the first radiator is attached to the CPU, the second radiator is connected to the first radiator through a heat conduction pipe, and the second radiator is arranged close to the fan. In this server, first radiator can directly dispel the heat to CPU, and simultaneously, first radiator can be through the solid heat conduction of heat pipe with heat conduction to the second radiator that is close to the fan, and the second radiator will pass the heat consumption that comes and fall in order to reduce CPU's temperature, can effectively improve the radiating efficiency to CPU to guarantee CPU's reliable work, be particularly useful for the big model of CPU power.

Description

Server

Technical Field

The invention relates to the technical field of computer equipment, in particular to a server.

Background

With the development of novel technologies such as cloud computing and big data, the requirements on data computing speed and demand are higher and higher, the computing speed and the computation load of a processor are also higher and higher, the temperature of each component such as a memory and a hard disk is also increased dramatically, especially, the power consumption of a CPU is greatly increased by 80% every year, and the heat dissipation requirement of the CPU is also increased correspondingly.

However, in the existing chassis, the heat dissipation efficiency of the CPU is low, and it is difficult to meet the heat dissipation requirement of the CPU, which may affect the normal use of the CPU.

Therefore, how to improve the heat dissipation efficiency of the CPU is a technical problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of the above, an object of the present invention is to provide a server capable of improving heat dissipation efficiency of a CPU.

In order to achieve the purpose, the invention provides the following technical scheme:

a server comprises a case, a fan and a CPU radiator, wherein the CPU radiator comprises a first radiator and a second radiator, the first radiator is used for being attached to the CPU, the second radiator is connected to the first radiator through a heat conduction pipe, and the second radiator is close to the fan.

Preferably, the first heat sink comprises a U-shaped base and a first heat sink shell provided with first fins, the U-shaped base is arranged in the first heat sink shell, and an opening of the U-shaped base faces the second heat sink; one end of the heat conducting pipe is fixedly arranged in the groove of the U-shaped base, and the other end of the heat conducting pipe extends out of the first heat dissipation shell and extends into the second heat dissipation shell.

Preferably, the first heat sink further includes a first heat transfer pipe disposed in the first heat dissipation case, and the first heat transfer pipe is connected between the top wall of the first heat dissipation case and the heat transfer pipe.

Preferably, first heat transfer pipe includes two orientations the first U-shaped pipe of first side wall open-ended and two orientations of first heat dissipation shell the second U-shaped pipe of second side wall open-ended of first radiator, two the top separation and the bottom of first U-shaped pipe are laminated mutually and are set up, two the top separation and the bottom of second U-shaped pipe are laminated mutually and are set up, first side wall with the second side wall sets up relatively, the bottom landing leg of first U-shaped pipe the bottom landing leg of second U-shaped pipe all is fixed in two landing legs of U-shaped base.

Preferably, the connecting portion of the first U-shaped tube is attached to the second side wall, and the connecting portion of the second U-shaped tube is attached to the first side wall.

Preferably, the opening of the first U-shaped tube faces perpendicular to the opening of the U-shaped base, and the opening of the second U-shaped tube faces perpendicular to the opening of the U-shaped base.

Preferably, the number of the second heat sink is one, and the heat conducting pipe extends into a second heat dissipation shell of the second heat sink and then bends towards one side, so that the heat conducting pipe forms an L-shaped pipe.

Preferably, a second heat transfer pipe is provided in the second heat dissipation case, and the second heat transfer pipe is connected between the top wall of the second heat dissipation case and the heat conductive pipe.

Preferably, the second heat transfer pipe includes a plurality of U-shaped pipes arranged in parallel.

Preferably, the second heat dissipation shell is provided with second fins.

The server provided by the invention comprises a chassis, a fan and a CPU radiator. The CPU radiator comprises a first radiator and a second radiator, wherein the first radiator is used for being attached to the CPU, the second radiator is connected to the first radiator through a heat conduction pipe, and the second radiator is arranged close to the fan.

In this server, first radiator can directly dispel the heat to CPU, and simultaneously, first radiator can be through the solid heat conduction of heat pipe with heat conduction to the second radiator that is close to the fan, and the second radiator will pass the heat consumption that comes and fall in order to reduce CPU's temperature, can effectively improve the radiating efficiency to CPU to guarantee CPU's reliable work, be particularly useful for the big model of CPU power.

In addition, through the matching arrangement of the first radiator and the second radiator, the heat dissipation capacity can be improved without increasing a fan in the case, so that the temperature of the system is minimized, and the increase of noise caused by the increase of the fan is avoided. When processing, the second radiator can directly add the vacant position department that is close to the fan in the quick-witted case, for example mainboard rear portion space, can keep original fan performance in original mainboard layout, and processing is convenient, and can make full use of current node space, increases the heat dissipation capacity through the area of contact who increases radiator and distinguished and admirable, realizes rational distribution and the maximize utilization to the amount of wind.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a block diagram of a server provided by the present invention;

FIG. 2 is a diagram of a CPU heat sink in the server according to the present invention;

fig. 3 is an internal structure diagram of a CPU heat sink in the server according to the present invention.

In fig. 1 to 3, 1-a first heat sink, 11-a first heat dissipation shell, 12-a first fin, 13-a first U-shaped tube, 14-a second U-shaped tube, 15-a U-shaped base, 2-a second heat sink, 21-a second heat dissipation shell, 22-a second fin, 3-a chassis, 4-a fan, 5-a heat conduction pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The core of the invention is to provide a server which can improve the heat dissipation efficiency of a CPU.

In an embodiment of the server provided by the present invention, please refer to fig. 1 to 3, which include a chassis 3, a fan 4 and a CPU heat sink. The CPU heat sink includes a first heat sink 1 for attaching to the CPU and a second heat sink 2 connected to the first heat sink 1 through a heat pipe 5. Wherein the second heat sink 2 is arranged close to the fan 4. Among them, the heat transfer pipe 5 is preferably made of a metal having a high heat transfer ability.

The first heat sink 1 directly dissipates heat from the CPU. The first heat sinks 1 and the CPUs may be arranged in a one-to-one correspondence manner, and accordingly, the number of the first heat sinks 1 may be set according to the number of the CPUs, for example, two CPUs are provided, and two first heat sinks 1 are also provided. The first heat sink 1 can also conduct heat to the second heat sink 2 in a solid heat conduction manner through the heat conduction pipe 5 while dissipating heat by itself, and the second heat sink 2 is disposed close to the fan 4, so that the second heat sink 2 can dissipate heat quickly by the fan 4.

For the existing chassis 3 in the prior art, during processing, the second heat sink 2 may be directly disposed in the available empty space such as the rear portion of the main board in the chassis 3, so as to improve the heat dissipation capability and the space utilization rate of the chassis 3.

In this embodiment, first radiator 1 can directly dispel the heat to CPU, and simultaneously, first radiator 1 can conduct the heat to second radiator 2 that is close to fan 4, dispels the heat by second radiator 2, and the second radiator consumes the heat that arrives in order to reduce CPU's temperature, can effectively improve the radiating efficiency to CPU to guarantee CPU's reliable work, be particularly useful for the model that CPU power is big. In addition, through the matching arrangement of the first radiator 1 and the second radiator 2, the heat dissipation capacity can be improved without increasing the fan 4 in the case 3, so that the temperature of the system can be minimized.

On the basis of the above-mentioned embodiment, referring to fig. 3, the first heat sink 1 may specifically include a U-shaped base 15 and a first heat dissipation shell 11 provided with first fins 12(fin sheets). Wherein the U-shaped base 15 is disposed inside the first heat sink 11, and an opening of the U-shaped base 15 faces the second heat sink 2. One end of the heat pipe 5 is fixed in the groove of the U-shaped base 15, and the other end extends out of the first heat dissipation case 11 and into the second heat dissipation case 21.

The bending condition of the portion of the heat pipe 5 extending out of the first heat dissipation case 11 and located outside the second heat dissipation case 2 should be set according to the specific layout condition inside the chassis 3, and specifically should not interfere with the setting of other components.

The U-shaped base 15 may be fixedly connected to an inner surface of the first heat dissipation case 11, so as to improve strength of the first heat dissipation case 11. More specifically, the U-shaped base 15 may be fixedly coupled to the bottom of the inner surface of the first heat dissipation case 11. In addition, the U-shaped base 15 may be made of metal such as aluminum, and may be used with other components of the first heat sink 1 to conduct heat while ensuring strength.

In this embodiment, the U-shaped base facing the opening of the second heat sink 2 is used to stably support the heat pipe 5, so as to prevent the heat pipe 5 from separating from the first heat sink 1 during the process of carrying the chassis. In addition, the first ribs 12 are provided to ensure a large heat dissipation area of the first heat dissipation case 11. Of course, in other embodiments, the heat conducting pipe 5 may be fixed by other methods, for example, the heat conducting pipe 5 is directly fixed to the first heat dissipation case 11.

On the basis of any of the above embodiments, the first heat sink 1 may further include a first heat transfer pipe disposed inside the first heat dissipation case 11, the first heat transfer pipe being connected between the top wall of the first heat dissipation case 11 and the heat conductive pipe 5. The heat conduction pipe 5 and the first heat conduction pipe constitute a double-layer heat conduction system. Since the heat pipe 5 is disposed in the U-shaped base 15, the first heat pipe can conduct heat between the top and the bottom of the first heat dissipation case 11, so that the heat dissipation efficiency can be further improved, and when the first heat sink 1 is disposed on the top surface of the CPU, the first heat pipe can conduct heat from bottom to top.

On the basis of the above embodiment, the first heat transfer pipe may specifically include two first U-shaped pipes 13 opening toward the first side wall of the first heat dissipation case 11 and two second U-shaped pipes 14 opening toward the second side wall of the first heat dissipation case 11, and top ends of the two first U-shaped pipes are separated and bottom ends of the two first U-shaped pipes are attached to each other, and meanwhile top ends of the two second U-shaped pipes are separated and bottom ends of the two second U-shaped pipes are attached to each other. The first side wall and the second side wall are opposite to each other, and the first side wall and the second side wall are wall surfaces disposed between the top wall and the bottom wall of the first heat dissipation case 11. The bottom leg of the first U-shaped tube 13 and the bottom leg of the second U-shaped tube 14 are fixed to two legs of the U-shaped base 15.

In this embodiment, the first U-shaped pipe 13 and the second U-shaped pipe 14 are arranged, so that the vertical heat transfer effect in the first heat dissipation casing 11 can be effectively ensured. Meanwhile, the U-shaped base 15 is connected with both the first U-shaped pipe 13 and the second U-shaped pipe 14, and can play a supporting role.

Wherein, the top ends of the two first U-shaped pipes 13 are separated and the bottom ends are jointed in various ways. As shown in fig. 3, the top leg, the bottom leg and the connecting portion connecting between the top leg and the bottom leg of one of the first U-shaped tubes 13 may all be straight tubes; while for the other first U-shaped tube 13 the top leg, the connection between the top leg and the bottom leg may be straight and the bottom leg may in particular be arranged as an L-shaped tube, for which the part between the turn and one of the ends extends from the connection on this first U-shaped tube 13 towards the connection on the other first U-shaped tube 13, while the part between the turn and the other end is arranged in abutment with the bottom leg of the other first U-shaped tube 13. Obviously, the arrangement of the two second U-shaped tubes 14 may be the same as that of the first U-shaped tube 13 described above. By adopting the first U-shaped pipe 13 and the second U-shaped pipe 14 with the structure, the arrangement of inclined pipes in the first U-shaped pipe 13 and the second U-shaped pipe 14 can be reduced, and the placing stability of the first U-shaped pipe 13 and the second U-shaped pipe 14 is improved.

On the basis of any of the above embodiments, the connecting portion of the first U-shaped tube 13 and the second side wall may be attached to each other, and the connecting portion of the second U-shaped tube 14 and the first side wall may be attached to each other, so that the contact area between the first heat transfer tube and the first heat dissipation case 11 is increased, and the heat transfer effect of the first heat transfer tube can be further improved.

On the basis of any of the above embodiments, the opening orientation of the first U-shaped pipe 13 can be perpendicular to the opening orientation of the U-shaped base 15, and the opening orientation of the second U-shaped pipe 14 can be perpendicular to the opening orientation of the U-shaped base 15, so as to facilitate the processing. Of course, the opening orientation relationship of the first U-shaped tube 13, the second U-shaped tube 14, and the U-shaped seat 15 is not limited to the arrangement provided in the present embodiment.

In addition to any of the above embodiments, the second heat sink 2 may be provided as one, and the heat conductive pipe 5 may be inserted into the second heat dissipation case 21 of the second heat sink 2. Preferably, the second heat sink case 21 may be provided with second ribs 22(fin fins) to secure a large heat dissipation area of the second heat sink 2. The heat conductive pipes 5 are bent toward one side after being inserted into the second heat dissipation case 21 of the second heat sink 2, so that the heat conductive pipes 5 form an L-shaped pipe, that is, the extension directions of the heat conductive pipes 5 are different between the inside and the outside of the second heat dissipation case 21.

In this embodiment, the heat pipe 5 is set to be an L-shaped pipe, so that the heat pipe 5 can have a certain limiting effect, and the heat pipe 5 is prevented from being separated from the second heat dissipation case 21.

On the basis of any of the above embodiments, the second heat transfer pipe may be disposed in the second heat dissipation shell 21, and the second heat transfer pipe is connected between the top wall of the second heat dissipation shell 21 and the heat conduction pipe 5, and the second heat transfer pipe may transfer heat in the up-down direction in the second heat dissipation shell 21, which is favorable for the heat dissipation capability of the second heat sink 2. Here, the structure of the second heat transfer pipe may refer to the structure of the first heat transfer pipe in the above embodiments, and specifically may be the same as the structure of the first heat transfer pipe. Specifically, the second heat transfer pipe may include a plurality of U-shaped pipes arranged in parallel, which is convenient for processing, and in addition, the number of the U-shaped pipes may be 4 or other numbers.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The server provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. A server comprises a case (3) and a fan (4), and is characterized by further comprising a CPU radiator, wherein the CPU radiator comprises a first radiator (1) and a second radiator (2), the first radiator (1) is attached to the CPU, the second radiator (2) is connected to the first radiator (1) through a heat conducting pipe (5), the second radiator (2) is arranged close to the fan (4), the first radiator (1) comprises a U-shaped base (15) and a first radiating shell (11) provided with first fins (12), the U-shaped base (15) is arranged in the first radiating shell (11), and an opening of the U-shaped base (15) faces the second radiator (2); one end of the heat conducting pipe (5) is fixedly arranged in a groove of the U-shaped base (15), and the other end of the heat conducting pipe extends out of the first heat radiating shell (11) and extends into the second heat radiator (2); the first radiator (1) further comprises a first heat transfer pipe arranged in the first radiating shell (11), and the first heat transfer pipe is connected between the top wall of the first radiating shell (11) and the heat transfer pipe (5); the first heat transfer pipe comprises two orientations, namely a first U-shaped pipe (13) with a first side wall opening of the first heat dissipation shell (11) and two orientations, a second U-shaped pipe (14) with a second side wall opening of the first heat dissipation shell (1), two, the top end separation and the bottom end of the first U-shaped pipe (13) are jointed and arranged, two, the top end separation and the bottom end of the second U-shaped pipe (14) are jointed and arranged, the first side wall and the second side wall are arranged oppositely, and the bottom supporting leg of the first U-shaped pipe (13) and the bottom supporting leg of the second U-shaped pipe (14) are fixed on two supporting legs of the U-shaped base (15).

2. The server according to claim 1, wherein the connection portions of the first U-shaped tubes (13) are arranged in abutment with the second side wall and the connection portions of the second U-shaped tubes (14) are arranged in abutment with the first side wall.

3. The server according to claim 2, characterized in that the openings of the first U-shaped tubes (13) are oriented perpendicularly to the openings of the U-shaped seats (15) and the openings of the second U-shaped tubes (14) are oriented perpendicularly to the openings of the U-shaped seats (15).

4. The server according to claim 2, wherein the second heat sink (2) is one, and the heat pipe (5) is bent toward one side after protruding into the second heat dissipation case (21) of the second heat sink (2) so that the heat pipe (5) forms an L-shaped pipe.

5. The server according to claim 4, wherein a second heat transfer pipe is provided in the second heat dissipation shell (21), the second heat transfer pipe being connected between the top wall of the second heat dissipation shell (21) and the heat conductive pipe (5).

6. The server according to claim 5, wherein said second heat transfer pipe comprises a plurality of U-shaped pipes arranged in parallel.

7. The server according to claim 6, wherein the second heat dissipation case (21) is provided with second ribs (22).