CN214504354U - Notebook computer and heat dissipation module thereof - Google Patents
Notebook computer and heat dissipation module thereof Download PDFInfo
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- CN214504354U CN214504354U CN202022781685.1U CN202022781685U CN214504354U CN 214504354 U CN214504354 U CN 214504354U CN 202022781685 U CN202022781685 U CN 202022781685U CN 214504354 U CN214504354 U CN 214504354U
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Abstract
The embodiment of the utility model discloses a notebook computer and a heat dissipation module thereof, the heat dissipation module comprises a heat conducting plate fixed on a mainboard of the notebook computer, a heat dissipation plate and a heat pipe which are fixed on a keyboard bracket of the notebook computer and are positioned at one side of the mainboard, the heat pipe comprises a first contact part and a second contact part, the first contact part is fixed at one side of the heat conducting plate, which is far away from the mainboard, and is right opposite to a CPU chip, and the second contact part is fixed at one side of the heat dissipation plate, which is far away from the keyboard bracket; when the notebook computer is upright, the heat conducting plates and the heat dissipation plates are arranged at intervals along the left-right direction, and the extending direction of the heat pipes is parallel to the left-right direction; when the notebook computer is used, the heat conducting plate absorbs the heat generated by the main board and transfers the heat to the first contact part, the first contact part absorbs the heat generated by the heat conducting plate and the CPU chip and transfers the heat to the second contact part, and the heat on the second contact part is led out through the heat radiating plate, so that the problem that the existing single copper plate is too large and easy to deform is solved.
Description
Technical Field
The utility model relates to a computer heat dissipation technical field especially relates to a notebook computer and heat dissipation module thereof.
Background
At present, a notebook computer without a fan series adopts a natural convection heat dissipation mode, a heat radiator is a heat pipe and a single copper plate which are welded into a whole, the heat dissipation area is small, and the system space is occupied; the copper plate is too long, is easy to deform and tilt, is suspended, and has low availability of system space, thus being not easy to control; in addition, the heating zone is integrated with the condensing zone, no obvious cooling end is provided, and the heat pipe has limited exertion.
SUMMERY OF THE UTILITY MODEL
To the technical problem, the embodiment of the utility model provides a notebook computer and heat dissipation module thereof is provided.
The utility model discloses a first aspect of the embodiment provides a heat dissipation module of notebook computer, heat dissipation module includes:
the heat conducting plate is fixed on a mainboard of the notebook computer, and the mainboard comprises a CPU chip;
the heat dissipation plate is fixed on a keyboard bracket of the notebook computer and is positioned on one side of the mainboard;
the heat pipe comprises a first contact part and a second contact part, the first contact part is fixed on one side, away from the mainboard, of the heat conduction plate, the first contact part is opposite to the CPU chip, and the second contact part is fixed on one side, away from the keyboard support, of the heat dissipation plate;
when the notebook computer is upright, the heat conducting plates and the heat radiating plates are arranged at intervals along the left-right direction, and the extending direction of the heat pipes is parallel to the left-right direction;
when the notebook computer is used, the heat conducting plate absorbs the heat generated by the mainboard and transfers the heat to the first contact part, the first contact part absorbs the heat of the heat conducting plate and the heat generated by the CPU chip and transfers the heat to the second contact part, and the heat on the second contact part is led out through the heat radiating plate.
Optionally, the heat conducting plate and/or the heat dissipating plate is a copper plate.
Optionally, the first contact portion is embedded in the heat conducting plate; and/or the presence of a gas in the gas,
the second contact part is embedded on the heat dissipation plate; and/or the presence of a gas in the gas,
the first contact part is welded on the heat conducting plate; and/or the presence of a gas in the gas,
the second contact part is welded on the heat dissipation plate; and/or the presence of a gas in the gas,
one end of the first contact part, which is far away from the second contact part, is embedded in the heat-conducting plate; and/or the presence of a gas in the gas,
one end of the second contact part, which is far away from the first contact part, is flush with one side, which is far away from the mainboard, of the heat dissipation plate.
Optionally, the heat conducting plate is provided with a CPU heat conducting area, one end of the first contact portion, which is far away from the second contact portion, is embedded in the CPU heat conducting area, and a side of the CPU heat conducting area, which is far away from the first contact portion, is provided with a heat conducting material layer, which is in contact with the CPU chip.
Optionally, the second contact portion includes a first connection portion, a second connection portion and a protruding portion, the protruding portion is located between the first connection portion and the second connection portion, the second contact portion is fixedly connected to the protruding portion, the protruding portion is formed by the heat dissipation plate being recessed towards a direction away from the keyboard support, and the first connection portion and the second connection portion are respectively fixedly connected to the keyboard support.
Optionally, the first connecting portion and/or the second connecting portion are attached to the keyboard support.
Optionally, a heat-conducting back adhesive layer is arranged between the first connecting portion and the keyboard support and/or between the second connecting portion and the keyboard support.
Optionally, an end of the second contact portion away from the first contact portion forms a sharp corner.
A second aspect of the embodiments of the present invention provides a notebook computer, the notebook computer includes:
a motherboard including a CPU chip;
a keyboard support; and
the heat dissipation module of the notebook computer in the first aspect.
Optionally, the keyboard support is made of aluminum; and/or the presence of a gas in the gas,
the notebook computer further comprises an SSD solid state disk and/or a wifi card, and the heat dissipation plate is far away from one side of the heat conduction plate and is close to the SSD solid state disk and/or the wifi card.
In the technical scheme provided by the embodiment of the utility model, the heat dissipation module of the notebook computer adopts a double-plate structure of the heat conduction plate and the heat dissipation plate, the first contact part of the heat pipe is fixed on the heat conduction plate, and the second contact part of the heat pipe is fixed on the heat dissipation plate, so that the problem that the existing single copper plate is too large and easy to deform is solved; meanwhile, the double-plate structure distinguishes heating and condensing areas, and better exerts the excellent heat conduction performance of the heat pipe; in addition, the heat dissipation plate is in contact with the keyboard support, the heat dissipation area is increased by means of the keyboard support, and the heat dissipation effect is enhanced.
Drawings
Fig. 1 is a schematic structural diagram of a notebook computer according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present invention;
fig. 3 is a schematic structural view of the heat dissipation module in another direction according to an embodiment of the present invention.
Reference numerals:
100: a main board; 200: a keyboard support; 300: a heat dissipation module; 1: a heat conducting plate; 11: a CPU heat conducting area; 2: a heat dissipation plate; 21: a first connection portion; 22: a second connecting portion; 23: a protrusion; 3: a heat pipe; 31: a first contact portion; 32: a second contact portion; 4: a layer of thermally conductive material.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that the following embodiments may be combined without conflict.
Referring to fig. 1, a notebook computer according to an embodiment of the present invention may include a motherboard 100, a keyboard support 200, and a heat dissipation module 300, wherein the motherboard 100 includes a Central Processing Unit (CPU) chip.
The embodiment of the utility model provides a heat dissipation module 300 is applicable to no fan series's notebook computer.
Next, the structure of the heat sink module 300 of the present embodiment will be described in detail.
Referring to fig. 1 to 3, a heat dissipation module 300 according to an embodiment of the present invention may include a heat conduction plate 1, a heat dissipation plate 2 and a heat pipe 3, wherein the heat conduction plate 1 is fixed on a motherboard 100 of a notebook computer, the heat dissipation plate 2 is fixed on a keyboard support 200 of the notebook computer, and the heat dissipation plate 2 of this embodiment is located on one side of the motherboard 100. The heat pipe 3 includes a first contact portion 31 and a second contact portion 32, the first contact portion 31 is fixed on one side of the heat conducting plate 1 away from the motherboard 100, the first contact portion 31 faces the CPU chip, and the second contact portion 32 is fixed on one side of the heat radiating plate 2 away from the keyboard support 200.
In this embodiment, when the notebook computer is upright, the heat conducting plate 1 and the heat dissipating plate 2 are arranged at intervals in the left-right direction, and the extending direction of the heat pipe 3 is parallel to the left-right direction.
When the notebook computer of the embodiment is used, the heat conducting plate 1 absorbs the heat generated by the main board 100 and transfers the heat to the first contact portion 31, the first contact portion 31 absorbs the heat of the heat conducting plate 1 and the heat generated by the CPU chip and transfers the heat to the second contact portion 32, and the heat on the second contact portion 32 is conducted out through the heat dissipating plate 2.
The heat dissipation module 300 of the notebook computer in the embodiment of the present invention adopts a double-plate structure of the heat conduction plate 1 and the heat dissipation plate 2, the first contact portion 31 of the heat pipe 3 is fixed on the heat conduction plate 1, and the second contact portion 32 of the heat pipe 3 is fixed on the heat dissipation plate 2, so as to improve the problem that the existing single copper plate is too large and easy to deform; meanwhile, the double-plate structure distinguishes heating and condensing areas (the heat conducting plate 1 is used as a heating area, and the heat radiating plate 2 is used as a condensing area), so that the excellent heat conduction performance of the heat pipe 3 is better exerted; in addition, the heat dissipation plate 2 contacts the keyboard support 200, and the heat dissipation area is increased by means of the keyboard support 200, so that the heat dissipation effect is enhanced.
The heat derivation path on the heat dissipation plate 2 of the embodiment of the present invention includes two types:
1. led out through the keyboard stand 200;
2. and the heat is led out through an electrical interface at the side part of the notebook computer and/or a separately designed heat dissipation port.
Optionally, the heat conducting plate 1 and the heat dissipating plate 2 have substantially the same height, so as to reduce the space occupied by the heat dissipating module 300 in the height direction. The substantially same height means that the heights of the heat transfer plate 1 and the heat dissipation plate 2 are considered to be the same within an allowable error range.
The heat conducting plate 1 and the heat radiating plate 2 are connected through the heat pipe 3 to form an integral structure, so that the heat conducting plate is convenient to mount. The dimensions of the heat conduction plate 1 and the heat dissipation plate 2 may be designed as needed, and in the present embodiment, both the heat conduction plate 1 and the heat dissipation plate 2 are substantially square.
Further, a fixing member such as a screw may be used to fix the heat conducting plate 1 to the main board and/or fix the heat radiating plate 2 to the keyboard support 200, thereby preventing the heat conducting plate 1 and/or the heat radiating plate 2 from shaking.
The heat conducting plate 1 of the present embodiment may be a copper plate, or may be a heat conducting plate made of other materials. The heat sink 2 may be a copper plate, but the heat sink 2 may be made of other materials. Specifically, the materials of the heat conducting plate 1 and the heat dissipating plate 2 may be selected as necessary.
In the embodiment in which the heat conducting plate 1 and the heat radiating plate 2 are copper plates, it can be understood that the heat conducting plate 1 and the heat radiating plate 2 can be regarded as being formed by segmenting the existing single copper plate, thereby improving the problem that the existing single copper plate is too large and easy to deform, and distinguishing the heating area from the condensation area.
The fixing manner of the first contact portion 31 and the heat conducting plate 1 can be designed as required, for example, in some embodiments, the first contact portion 31 is embedded on the heat conducting plate 1; in some embodiments, the first contact portion 31 is welded to the plate 1; in some embodiments, the first contact portion 31 is embedded on the plate 1 and the first contact portion 31 is welded on the plate 1.
Further, in some embodiments, an end of the first contact portion 31 away from the second contact portion 32 is embedded in the heat conducting plate 1, that is, the first contact portion 31 does not extend out of the heat conducting plate 1, so as to reduce the occupied space of the heat dissipation module 300.
The fixing manner of the second contact portion 32 and the heat dissipation plate 2 can also be designed as required, for example, in some embodiments, the second contact portion 32 is embedded on the heat dissipation plate 2; in some embodiments, the second contact portion 32 is welded to the heat dissipation plate 2; in some embodiments, the second contact portion 32 is embedded on the heat dissipation plate 2, and the second contact portion 32 is welded on the heat dissipation plate 2.
Further, in some embodiments, an end of the second contact portion 32 away from the first contact portion 31 is flush with a side of the heat dissipation plate 2 away from the motherboard 100, that is, the second contact portion 32 does not extend out of the heat dissipation plate 2, so that the occupied space of the heat dissipation module 300 is reduced.
In this embodiment, the heat pipe 3 is in a strip shape, the first contact portion 31 is disposed at one end of the heat pipe 3, the second contact portion 32 is disposed at the other end of the heat pipe 3, it can be considered that the first contact portion 31 is disposed at the head end of the heat pipe 3, the second contact portion 32 is disposed at the tail end of the heat pipe 3, and the heat generated by the CPU chip is transferred to the heat dissipation plate 2 at the tail end of the heat pipe 3 through the excellent heat conductivity of the heat pipe 3.
Referring to fig. 1 to 3 again, the heat conducting plate 1 may have a CPU heat conducting area 11, one end of the first contact portion 31 away from the second contact portion 32 is embedded in the CPU heat conducting area 11, and a heat conducting material layer 4 is disposed on one side of the CPU heat conducting area 11 away from the first contact portion 31, where the heat conducting material layer 4 contacts with the CPU chip. Optionally, the size of the CPU heat conduction area 11 is the same as that of the CPU chip, and the CPU heat conduction area 11 is larger than one end of the first contact portion 31 away from the second contact portion 32, so that one end of the first contact portion 31 away from the second contact portion 32 can be completely embedded in the CPU heat conduction area 11, and the first contact portion 31 can fully absorb heat generated by the CPU chip, thereby improving heat dissipation efficiency.
The material of the heat conducting material layer 4 can be heat conducting paste, and can also be other heat conducting materials.
Referring to fig. 3, the second contact portion 32 may include a first connection portion 21, a second connection portion 22 and a protrusion portion 23, the protrusion portion 23 is located between the first connection portion 21 and the second connection portion 22, the second contact portion 32 is fixedly connected to the protrusion portion 23, the protrusion portion 23 is formed by the heat dissipation plate 2 being recessed towards a direction away from the keyboard support 200, and the first connection portion 21 and the second connection portion 22 are respectively fixedly connected to the keyboard support 200. The first connecting portion 21 and the second connecting portion 22 are fixed to the keyboard holder 200, so that the heat of the heat sink 2 can be transferred to the keyboard holder 200, thereby dissipating heat by the keyboard holder 200 and increasing the heat dissipating area of natural convection. The keyboard support 200 of this embodiment can be aluminum material, also can be for other materials that do benefit to the heat dissipation to improve the radiating efficiency.
Alternatively, the shape of the recess is square, but not limited to square. In this embodiment, the recess extends from one end of the heat dissipation plate 2 facing the motherboard 100 to one end of the heat dissipation plate 2 away from the motherboard 100, that is, the recess penetrates through both ends of the heat dissipation plate 2.
Optionally, the first connecting portion 21 and/or the second connecting portion 22 are attached to the keyboard holder 200. The notebook computer of the present embodiment may further include a SSD (Solid State Disk or Solid State Drive) Solid State hard Disk and/or a wifi card, and a side of the heat dissipation plate 2 away from the heat conduction plate 1 is disposed next to the SSD Solid State hard Disk and/or the wifi card. The heat dissipation plate 2 of the embodiment is shaped like a Chinese character ji, and the first connection portion 21 and the second connection portion 22 are attached to the keyboard support 200, so that the space is saved, and the space of the SSD solid state disk and/or the wifi card of the notebook computer is not affected.
Optionally, a heat conducting back adhesive layer is arranged between the first connecting portion 21 and the keyboard support 200 and/or between the second connecting portion 22 and the keyboard support 200, and the bottom of the heat dissipation plate 2 is provided with the heat conducting back adhesive layer to be attached to the keyboard support 200, so that heat of the heat dissipation plate 2 can be transferred to the keyboard support 200, heat dissipation is achieved through the keyboard support 200, and the heat dissipation area of natural convection is increased. Illustratively, a heat-conducting back adhesive layer is arranged between the first connecting portion 21 and the keyboard support 200 and between the second connecting portion 22 and the keyboard support 200.
Alternatively, the end of the second contact portion 32 away from the first contact portion 31 is formed with a sharp corner, so that the design can avoid heat from accumulating at the end of the heat dissipation plate 2, which is beneficial for heat dissipation.
The heat conductive plate 1 and the heat radiating plate 2 have substantially the same height, which means that the first connecting portion 21 has substantially the same height as the heat conductive plate 1 and the second connecting portion 22 has substantially the same height as the heat conductive plate 1. The height of the projection 23 may be slightly higher than the height of the heat-conducting plate 1.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (12)
1. A heat dissipation module of a notebook computer, the heat dissipation module (300) comprising:
the heat conducting plate (1) is fixed on a mainboard (100) of the notebook computer, and the mainboard (100) comprises a CPU chip;
the heat dissipation plate (2) is fixed on a keyboard bracket (200) of the notebook computer, and the heat dissipation plate (2) is positioned on one side of the mainboard (100);
the heat pipe (3) comprises a first contact part (31) and a second contact part (32), the first contact part (31) is fixed on one side, away from the mainboard (100), of the heat conduction plate (1), the first contact part (31) is opposite to the CPU chip, and the second contact part (32) is fixed on one side, away from the keyboard support (200), of the heat dissipation plate (2);
when the notebook computer is upright, the heat conducting plates (1) and the heat radiating plates (2) are arranged at intervals along the left-right direction, and the extending direction of the heat pipes (3) is parallel to the left-right direction;
when the notebook computer is used, the heat conducting plate (1) absorbs heat generated by the mainboard (100) and transfers the heat to the first contact part (31), the first contact part (31) absorbs heat generated by the heat conducting plate (1) and heat generated by the CPU chip and transfers the heat to the second contact part (32), and the heat on the second contact part (32) is led out through the heat radiating plate (2).
2. The heat dissipating module for a notebook computer according to claim 1, wherein the heat conducting plate (1) and/or the heat dissipating plate (2) is a copper plate.
3. The heat dissipation module of notebook computer as claimed in claim 1, wherein the first contact portion (31) is embedded on the heat conductive plate (1); and/or the presence of a gas in the gas,
the second contact portion (32) is embedded in the heat dissipation plate (2).
4. The heat dissipation module for notebook computers according to claim 1, characterized in that the first contact portion (31) is welded on the heat conductive plate (1); and/or the presence of a gas in the gas,
the second contact portion (32) is welded to the heat dissipation plate (2).
5. The heat dissipation module of notebook computer as claimed in claim 1, wherein an end of the first contact portion (31) away from the second contact portion (32) is embedded in the heat conductive plate (1); and/or the presence of a gas in the gas,
one end of the second contact part (32) far away from the first contact part (31) is flush with one side of the heat dissipation plate (2) far away from the main plate (100).
6. The heat dissipation module of notebook computer according to claim 1 or 5, wherein the heat conduction plate (1) is provided with a CPU heat conduction area (11), one end of the first contact portion (31) away from the second contact portion (32) is embedded in the CPU heat conduction area (11), and one side of the CPU heat conduction area (11) away from the first contact portion (31) is provided with a heat conduction material layer (4), and the heat conduction material layer (4) is in contact with the CPU chip.
7. The heat dissipation module of the notebook computer according to claim 1, wherein the second contact portion (32) includes a first connection portion (21), a second connection portion (22), and a protrusion portion (23), the protrusion portion (23) is located between the first connection portion (21) and the second connection portion (22), the second contact portion (32) is fixedly connected to the protrusion portion (23), the protrusion portion (23) is formed by the heat dissipation plate (2) being recessed towards a direction away from the keyboard holder (200), and the first connection portion (21) and the second connection portion (22) are respectively and fixedly connected to the keyboard holder (200).
8. The heat dissipation module of the notebook computer according to claim 7, wherein the first connection portion (21) and/or the second connection portion (22) is attached to the keyboard support (200).
9. The heat dissipation module of the notebook computer according to claim 8, wherein a heat conductive adhesive backing layer is disposed between the first connection portion (21) and the keyboard support (200) and/or between the second connection portion (22) and the keyboard support (200).
10. The heat dissipation module of notebook computer as claimed in any one of claims 1 and 3 to 5, wherein an end of the second contact portion (32) away from the first contact portion (31) forms a sharp corner.
11. A notebook computer, comprising:
a motherboard (100), the motherboard (100) comprising a CPU chip;
a keyboard support (200); and
the heat sink module (300) of a notebook computer according to any of claims 1 to 10.
12. The notebook computer of claim 11, wherein the keyboard support (200) is made of aluminum; and/or the presence of a gas in the gas,
the notebook computer further comprises an SSD solid state disk and/or a wifi card, and the heat dissipation plate (2) is far away from one side of the heat conduction plate (1) and is close to the SSD solid state disk and/or the wifi card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022781685.1U CN214504354U (en) | 2020-11-26 | 2020-11-26 | Notebook computer and heat dissipation module thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022781685.1U CN214504354U (en) | 2020-11-26 | 2020-11-26 | Notebook computer and heat dissipation module thereof |
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| CN214504354U true CN214504354U (en) | 2021-10-26 |
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| CN202022781685.1U Active CN214504354U (en) | 2020-11-26 | 2020-11-26 | Notebook computer and heat dissipation module thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112286329A (en) * | 2020-11-26 | 2021-01-29 | 南京微智新科技有限公司 | Notebook computer and its cooling module |
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- 2020-11-26 CN CN202022781685.1U patent/CN214504354U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112286329A (en) * | 2020-11-26 | 2021-01-29 | 南京微智新科技有限公司 | Notebook computer and its cooling module |
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