CN114727548A - Air guide structure and electronic equipment with same - Google Patents

Air guide structure and electronic equipment with same Download PDF

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Publication number
CN114727548A
CN114727548A CN202210179530.1A CN202210179530A CN114727548A CN 114727548 A CN114727548 A CN 114727548A CN 202210179530 A CN202210179530 A CN 202210179530A CN 114727548 A CN114727548 A CN 114727548A
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CN
China
Prior art keywords
air
air guiding
guide structure
component
guiding component
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Pending
Application number
CN202210179530.1A
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Chinese (zh)
Inventor
方奇
赵晶南
陈静
孙可
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Pudong Technology Corp
Inventec Corp
Original Assignee
Inventec Pudong Technology Corp
Inventec Corp
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Priority to CN202210179530.1A priority Critical patent/CN114727548A/en
Publication of CN114727548A publication Critical patent/CN114727548A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a wind guide structure and an electronic device with the wind guide structure, wherein the wind guide structure is applied to the electronic device, and the electronic device comprises a plurality of heating components and a radiator for dissipating heat of the heating components; the air guide structure is covered on the top of the heating component along the air flow direction of the radiator; the wind guide structure at least comprises: the first air guiding component, the second air guiding component connected with the first air guiding component and the third air guiding component connected with the second air guiding component; the inner walls of the first air guiding part, the second air guiding part and the third air guiding part are respectively covered with different heating parts to form an air duct for guiding air flow. The invention solves the problems of single design, poor wind gathering effect, low air volume utilization rate and the like of the existing wind guide, optimizes air flow distribution, utilizes the air volume to the maximum extent and prolongs the service life of each element.

Description

Air guide structure and electronic equipment with same
Technical Field
The invention belongs to the field of server hardware, relates to a structure, and particularly relates to an air guide structure and electronic equipment with the same.
Background
With the increase of the working and operating strength of the server, the power consumption of each processor on the mainboard is continuously increased, the heat flux density of the surface of each chip is increased, and the generated heat is continuously increased, so that a radiator is arranged on the upper surface of each processor to enhance the heat dissipation. The heat radiator exchanges heat with the chip through the bottom of the heat radiator so as to transfer heat to the fins above the heat radiator, and then the heat on the fins is taken away through air flow provided by the fan. The wind flow generated by the fan is directly blown to each processor inside the server, and the following defects are often caused:
firstly, the air flow generates a bypass flow in the gaps or the side edges among the processors, and the part of the air flow cannot play a role in heat dissipation, so that resource waste is caused;
secondly, the unreasonable air flow distribution can prevent each radiator from achieving the optimal radiating effect, and the processor is damaged in the past, so that the service life of the radiator is shortened;
thirdly, the wind scooper has simple structure, single design and low utilization rate of wind quantity.
Therefore, how to provide an air guiding structure and an electronic device having the same to solve the defects of resource waste, poor heat dissipation effect, low air volume utilization rate and the like in the prior art during heat dissipation processing has become a technical problem to be solved by those skilled in the art.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide an air guiding structure and an electronic device having the same, which are used to solve the problems of resource waste, poor heat dissipation effect, and low air volume utilization rate during heat dissipation in the prior art.
In order to achieve the above and other related objects, an aspect of the present invention provides an air guiding structure for an electronic device, where the electronic device includes a plurality of heat generating components and a heat sink for dissipating heat from the heat generating components; the air guide structure is covered on the top of the heating component along the air flow direction of the radiator; the wind guide structure at least comprises: the first air guiding component, the second air guiding component connected with the first air guiding component and the third air guiding component connected with the second air guiding component; the inner walls of the first air guiding part, the second air guiding part and the third air guiding part are respectively covered with different heating parts to form an air duct for guiding air flow.
In an embodiment of the invention, the heat generating component includes a motherboard, and a central processing unit, a dual in-line memory module, a south bridge chip, and/or a solid state disk module disposed on the motherboard.
In an embodiment of the invention, the first air guiding component is covered on the top of the central processing unit and the dual in-line memory module; the inner wall of the first air guide component forms a first air channel for guiding air flow by the central processing unit and the dual in-line storage module.
In an embodiment of the present invention, the first air guiding component is T-shaped; the middle of the first air channel is used for guiding air flow for the central processing unit, and two sides of the first air channel are used for guiding air flow for the dual in-line storage modules positioned on two sides of the central processing unit.
In an embodiment of the invention, a groove-shaped buckle is disposed at the air outlet of the first air guiding component, and the groove-shaped buckle is used for being clamped with a fixing piece disposed on the central processing unit; and a cylindrical buckle is arranged at the joint of the first air guiding part and the second air guiding part.
In an embodiment of the invention, the second air guiding component is disposed on the top of the south bridge chip and a part of the solid state disk module; and the inner wall of the second air guide component forms a second air duct for guiding air flow by the south bridge chip and part of the solid state disk module.
In an embodiment of the invention, the second air guiding component is provided with an extension arm near the dual in-line storage module, and the extension arm is provided with a cover body covering the south bridge chip and a part of the solid state disk module; the extension arm is provided with a mounting hole; fixing the second air guiding component to the main board through a fixing piece arranged in the mounting hole; a clamping groove used for clamping the cylindrical buckle is formed in the joint of the second air guiding component and the first air guiding component; and a clamping groove is also arranged at the joint of the second air guiding part and the third air guiding part.
In an embodiment of the invention, the third air guiding component cover is disposed on the top of another part of the solid state disk module; and the inner wall of the third air guiding part forms a third air channel for guiding air flow of the other part of the solid state disk module.
In an embodiment of the present invention, a connection portion between the third air guiding component and the second air guiding component is provided with a cylindrical buckle for being matched with the slot; the middle of the inner wall of the third air guiding component is obliquely arranged along the wind flow direction.
Another aspect of the present invention provides an electronic device, including a plurality of heat generating components, a heat sink for dissipating heat from the heat generating components, and an air guiding structure; the air guide structure is arranged on the top of the heating component along the air flow direction of the radiator in a covering mode.
As described above, the air guide structure and the electronic device having the same according to the present invention have the following advantageous effects:
firstly, the invention can utilize the air quantity provided by the fan in the machine station to the maximum extent, reduce the bypass flow, increase the air quantity flowing through the radiator and realize reasonable utilization and air quantity distribution;
secondly, the air flow is gathered in the air guide cover and then distributed to the direction of each radiator, so that the heat dissipation effect of the radiators is improved, the working efficiency of the server is improved, and the optimized air flow distribution is realized;
thirdly, the invention reduces the risk of irreversible damage to each working element due to the fact that heat in the server chassis cannot be dissipated in time, and realizes the purpose of prolonging the service life of the product;
fourthly, structural adjustment is carried out according to differences of element layouts in different servers or ribs are additionally arranged according to different wind direction requirements, the wind direction is adjusted while a reinforcing effect is achieved, and convenience in later optimization is achieved;
fifth, the invention has simple structure, easy manufacture and low economic cost, and is made of common materials.
Drawings
Fig. 1 is a schematic structural diagram of an air guiding structure according to the present invention.
Fig. 2A is a schematic perspective view illustrating a first wind guide part according to the present invention.
Fig. 2B is a schematic top view of the first wind guiding component according to the present invention.
Fig. 2C is a schematic bottom view of the first wind guiding component of the present invention.
Fig. 2D is a front view of the first wind-guiding component of the present invention.
Fig. 3A is a schematic perspective view illustrating a second wind guide part according to the present invention.
Fig. 3B is a schematic top view of a second wind-guiding component according to the present invention.
Fig. 3C is a schematic bottom view of the second wind guiding component of the present invention.
Fig. 4A is a schematic perspective view illustrating a third wind guide part according to the present invention.
Fig. 4B is a schematic top view of a third wind guiding component according to the present invention.
Description of the element reference numerals
10 electronic device
1 Heat sink
2 air guide structure
21 first air guiding component
22 second air guiding component
23 third air guiding component
211 groove type fastener
212 cylindrical buckle
221 extension arm
222 cover body
223 card slot
231 cylindrical buckle
232 middle part
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 4B. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
Example one
The present embodiment provides an air guiding structure, which is applied to an electronic device, where the electronic device includes a plurality of heating components and a heat sink for dissipating heat from the heating components; the air guide structure is covered on the top of the heating component along the air flow direction of the radiator; the wind guide structure at least comprises:
the first air guiding component, the second air guiding component connected with the first air guiding component and the third air guiding component connected with the second air guiding component;
the inner walls of the first air guiding part, the second air guiding part and the third air guiding part are respectively covered with different heating parts to form an air duct for guiding air flow.
The following describes the wind guide structure provided in this embodiment in detail with reference to the drawings. The air guiding structure of the present embodiment is suitable for electronic devices, such as servers and other electronic devices that include various heat generating components and a heat sink (e.g., a fan) for dissipating heat from the heat generating components. Please refer to fig. 1, which is a schematic diagram of a wind guiding structure. As shown in fig. 1, the wind guiding structure 2 is disposed in an electronic device 10 (e.g., a server 10, specifically, a DL320 type), and is covered on top of the heat generating component along the wind flow direction (the direction shown by arrow a in fig. 1) of the heat sink 1 (e.g., fans No. 1-7). In this embodiment, the heat generating component includes a motherboard, and a Central Processing Unit (CPU), a dual in-line memory module (DIMM), a south bridge chip (PCH) and/or a solid state disk module (m.2) disposed on the motherboard.
With reference to fig. 1, the wind guiding structure 2 includes a first wind guiding component 21, a second wind guiding component 22 connected to the first wind guiding component 21, and a third wind guiding component 23 connected to the second wind guiding component 22.
The first air guiding component 21 is covered on the top of the central processing unit and the top of the dual in-line storage module; the inner wall of the first air guiding component 21 is formed into a first air duct for guiding the air flow by the central processing unit and the dual in-line storage module.
Please refer to fig. 2A, 2B, 2C and 2D, which are schematic diagrams illustrating a three-dimensional structure, a top view structure, a bottom view structure and a front view structure of the first wind guiding component, respectively. As shown in fig. 2A, 2B and 2C, the first wind-guiding member 21 has a T-shape. The first air guiding component 21 is provided with a groove-shaped buckle 211 at the air outlet, and the groove-shaped buckle 211 is used for being clamped with a fixing member (in this embodiment, a screw/bolt arranged on the cpu) arranged on the cpu. Referring to fig. 2D, a cylindrical buckle 212 is disposed at a joint of the first wind-guiding component 21 and the second wind-guiding component 22.
The second air guiding component 22 is covered on the top of the south bridge chip and a part of the solid state disk module. The inner wall of the second air guiding component 22 forms a second air duct for guiding the air flow by the south bridge chip and part of the solid state disk modules.
Please refer to fig. 3A, 3B, and 3C, which respectively show a three-dimensional structure, a top view structure, and a bottom view structure of the second air guiding component. As shown in fig. 3A, 3B and 3C, the second wind guiding member is provided with an extension arm 221 near the dual inline memory module. In this embodiment, the extension arm 221 reasonably divides the wind flow discharged from the fan into the cover 222 disposed thereon. The cover body covers the south bridge chip and the top of a part of the solid state disk module.
In this embodiment, in order to fix the second air guiding component 22, a mounting hole is opened on the extension arm 221, and the second air guiding component 22 is fixed to the main board by a fixing member installed in the mounting hole.
In order to connect the second air guiding component 22 to the first air guiding component 21, a clamping groove for clamping the cylindrical buckle 212 is arranged at a joint of the second air guiding component 22 and the first air guiding component 21. In order to connect with the third air guiding component 23, a clamping groove 223 is also disposed at a joint of the second air guiding component 22 and the third air guiding component 23.
The third air guiding part 23 is covered on the top of the other part of the solid state disk module. The inner wall of the third air guiding component 23 forms a third air duct for guiding the air flow of another part of the solid state disk module.
Please refer to fig. 4A and 4B, which are schematic perspective and top view diagrams of the third wind guiding component, respectively. As shown in fig. 4A and 4B, a cylindrical buckle 231 for matching with the slot is disposed at a joint of the third air guiding component 23 and the second air guiding component 22, and the third air guiding component 23 is matched with the slot 223 disposed on the second air guiding component 22 through the cylindrical buckle 231, so as to connect the third air guiding component 23 and the second air guiding component 22.
Because the solid state disk module is installed at a lower position, in order to prevent the air flow released by the radiator from flowing away from the top and being incapable of taking away the heat dissipated by the solid state disk module, in this embodiment, the middle 232 of the inner wall of the third air guiding component 22 is obliquely arranged along the air flow direction, the slope-shaped inner wall presses down the air flow entering the third air duct, the air flow is guided to the upper side of the solid state disk module to the maximum extent, and the air guiding effect is enhanced.
In the embodiment, the air guide structure is designed with three air guide covers with different structures aiming at the heat dissipation requirements of different heating elements in the electronic equipment, and respectively guides the air flow to the CPU chip, the DIMM card, the M.2 chip and the PCH chip, so that the air quantity of each heat dissipation fin is increased, and the heat exchange effect is optimized to enhance the heat dissipation. The method has the following beneficial effects:
firstly, the air guide structure of the embodiment can utilize the air quantity provided by the fan in the machine station to the maximum extent, reduce the bypass flow, increase the air quantity flowing through the radiator, and realize reasonable utilization and air quantity distribution;
secondly, the wind guide structure of the embodiment collects the wind flow into the wind guide cover and then distributes the wind flow to the direction of each radiator, so that the heat dissipation effect of the radiators is improved, the working efficiency of the server is improved, and the optimized wind flow distribution is realized;
thirdly, the wind guide structure of the embodiment reduces the risk of irreversible damage to each working element due to the fact that heat in the server chassis cannot be dissipated in time, and prolongs the service life of a product;
fourthly, the air guide structure of the embodiment is structurally adjusted according to differences of element layouts in different servers or ribs are additionally arranged according to different wind direction requirements, so that the wind direction is adjusted while a reinforcing effect is achieved, and convenience is brought to later-stage optimization;
fifth, this embodiment wind-guiding structure simple structure, easily preparation and adopt common material to make, realize that economic cost is low.
Example two
The present embodiment provides an electronic device, which includes a plurality of heat generating components, a heat sink for dissipating heat from the heat generating components, and an air guiding structure; the wind guide structure is arranged on the top of the heating component along the wind flow direction of the radiator.
In this embodiment, the heat generating component includes a motherboard, and a Central Processing Unit (CPU), a dual in-line memory module (DIMM), a south bridge chip (PCH) and/or a solid state disk module (m.2) disposed on the motherboard.
The air guide structure comprises a first air guide part, a second air guide part connected with the first air guide part and a third air guide part connected with the second air guide part.
The first air guide part is covered on the top of the central processing unit and the top of the dual in-line storage module; the inner wall of the first air guiding component forms a first air channel for guiding air flow by the central processing unit and the dual in-line storage module.
The first air guiding component is T-shaped. The first air guiding component 21 is provided with a groove-shaped buckle at the air outlet, and the groove-shaped buckle is used for being fastened with a fixing piece (in this embodiment, a screw/bolt arranged on the central processing unit) arranged on the central processing unit. And a cylindrical buckle is arranged at the joint of the first air guiding part and the second air guiding part.
The second air guiding component cover is arranged on the top of the south bridge chip and a part of the solid state disk module. And the inner wall of the second air guide component forms a second air duct for guiding air flow by the south bridge chip and part of the solid state disk module.
And an extension arm is arranged at the position, close to the dual in-line storage module, of the second air guide component. In this embodiment, the extension arm reasonably diverts the airflow released by the fan into the shroud disposed thereon. The cover body covers the south bridge chip and the top of a part of the solid state disk module.
In this embodiment, in order to fix the second air guiding component, a mounting hole is formed in the extension arm, and the second air guiding component is fixed to the main board through a fixing member installed in the mounting hole.
In order to connect the second air guiding component to the first air guiding component, a clamping groove for clamping the cylindrical buckle is arranged at the joint of the second air guiding component and the first air guiding component. And in order to be connected with the third air guiding component, a clamping groove is also arranged at the joint of the second air guiding component and the third air guiding component.
The third air guiding component cover is arranged at the top of the other part of the solid state disk module. And the inner wall of the third air guiding part forms a third air channel for guiding air flow of the other part of the solid state disk module.
And a cylindrical buckle used for being matched with the clamping groove is arranged at the joint of the third air guiding component and the second air guiding component, and the third air guiding component is matched with the clamping groove arranged on the second air guiding component through the cylindrical buckle so as to realize the connection of the third air guiding component and the second air guiding component.
Because the solid state disk module is installed at a lower position, in order to prevent the air flow released by the radiator from flowing away from the top and being incapable of taking away the heat emitted by the solid state disk module, the middle of the inner wall of the third air guiding component is obliquely arranged along the air flow direction, the slope-shaped inner wall presses the air flow entering the third air duct downwards, the air flow is guided to the upper side of the solid state disk module to the greatest extent, and the air guiding effect is enhanced.
In summary, the invention designs three wind scoops with different structures aiming at the heat dissipation requirements of different heating elements in the electronic equipment, and respectively guides the wind flow to the CPU chip, the DIMM card, the M.2 chip and the PCH chip, so that the wind quantity at each heat sink is increased, and the heat exchange effect is optimized to enhance the heat dissipation. The method has the following beneficial effects:
firstly, the invention can utilize the air quantity provided by the fan in the machine station to the maximum extent, reduce the bypass flow, increase the air quantity flowing through the radiator and realize reasonable utilization and air quantity distribution;
secondly, the wind flow is gathered in the wind scooper and then distributed to the direction of each radiator, so that the heat dissipation effect of the radiators is improved, the working efficiency of the server is improved, and the optimized wind flow distribution is realized;
thirdly, the invention reduces the risk of irreversible damage to each working element due to the fact that heat in the server chassis cannot be dissipated in time, and realizes the purpose of prolonging the service life of the product;
fourthly, structural adjustment is carried out according to differences of element layouts in different servers or ribs are additionally arranged according to different wind direction requirements, the wind direction is adjusted while a reinforcing effect is achieved, and convenience in later optimization is achieved;
fifth, the invention has simple structure, easy manufacture and low economic cost, and is made of common materials. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. An air guide structure is applied to electronic equipment, and the electronic equipment comprises a plurality of heating components and a radiator for dissipating heat of the heating components; the air guide structure is covered on the top of the heating component along the air flow direction of the radiator; the wind guide structure at least comprises:
the first air guiding component, the second air guiding component connected with the first air guiding component and the third air guiding component connected with the second air guiding component;
the inner walls of the first air guiding part, the second air guiding part and the third air guiding part are respectively covered with different heating parts to form an air duct for guiding air flow.
2. The air guide structure according to claim 1, wherein: the heating component comprises a mainboard, and a central processing unit, a dual in-line storage module, a south bridge chip and/or a solid state disk module which are arranged on the mainboard.
3. The air guide structure according to claim 2, wherein: the first air guiding component is covered on the top of the central processing unit and the top of the dual in-line storage module; the inner wall of the first air guide component forms a first air channel for guiding air flow by the central processing unit and the dual in-line storage module.
4. The air guide structure according to claim 3, wherein: the first air guiding component is T-shaped; the middle of the first air channel is used for guiding air flow for the central processing unit, and two sides of the first air channel are used for guiding air flow for the dual in-line storage modules positioned on two sides of the central processing unit.
5. The air guide structure according to claim 4, wherein:
the first air guiding component is provided with a groove-shaped buckle at an air outlet, and the groove-shaped buckle is used for being clamped with a fixing piece arranged on the central processing unit;
and a cylindrical buckle is arranged at the joint of the first air guiding part and the second air guiding part.
6. The air guide structure according to claim 5, wherein: the second air guiding component cover is arranged at the tops of the south bridge chip and a part of the solid state disk module; and the inner wall of the second air guide component forms a second air duct for guiding air flow by the south bridge chip and part of the solid state disk module.
7. The air guide structure according to claim 6, wherein: the second air guide component is provided with an extension arm at a position close to the dual in-line storage module, and the extension arm is provided with a cover body which covers the south bridge chip and a part of the solid state disk module; the extension arm is provided with a mounting hole; fixing the second air guiding component to the main board through a fixing piece arranged in the mounting hole;
a clamping groove for clamping the cylindrical buckle is formed in the joint of the second air guiding component and the first air guiding component;
and a clamping groove is also arranged at the joint of the second air guiding part and the third air guiding part.
8. The air guide structure according to claim 7, wherein: the third air guiding component cover is arranged at the top of the other part of the solid state disk module; and the inner wall of the third air guiding part forms a third air channel for guiding air flow of the other part of the solid state disk module.
9. The air guide structure according to claim 8, wherein:
a cylindrical buckle used for being matched with the clamping groove is arranged at the joint of the third air guiding component and the second air guiding component;
the middle part of the inner wall of the third air guiding component is obliquely arranged along the wind flow direction.
10. An electronic device, characterized in that: the air guide structure comprises a plurality of heat generating components, a radiator for dissipating heat of the heat generating components and the air guide structure of any one of claims 1 to 9; the wind guide structure is arranged on the top of the heating component along the wind flow direction of the radiator.
CN202210179530.1A 2022-02-25 2022-02-25 Air guide structure and electronic equipment with same Pending CN114727548A (en)

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Application Number Priority Date Filing Date Title
CN202210179530.1A CN114727548A (en) 2022-02-25 2022-02-25 Air guide structure and electronic equipment with same

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Application Number Priority Date Filing Date Title
CN202210179530.1A CN114727548A (en) 2022-02-25 2022-02-25 Air guide structure and electronic equipment with same

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Publication Number Publication Date
CN114727548A true CN114727548A (en) 2022-07-08

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Application Number Title Priority Date Filing Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117806430A (en) * 2024-02-28 2024-04-02 苏州元脑智能科技有限公司 Memory test server system and double-air-duct memory test device thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117806430A (en) * 2024-02-28 2024-04-02 苏州元脑智能科技有限公司 Memory test server system and double-air-duct memory test device thereof
CN117806430B (en) * 2024-02-28 2024-04-26 苏州元脑智能科技有限公司 Memory test server system and double-air-duct memory test device thereof

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