CN218068719U - Staggered double-path CPU mainboard and server thereof - Google Patents

Abstract

The utility model provides a dislocation set's double-circuit CPU mainboard and server thereof, dislocation set's double-circuit CPU mainboard includes: the main board comprises a main board body, a first CPU module, a second CPU module and a PCI-E slot module, wherein the first CPU module and the PCI-E slot module are respectively arranged on one side of the main board body close to a rear panel of the case; the second CPU module is arranged on one side of the mainboard body, which is far away from the rear panel of the case, and is arranged in a staggered manner with the first CPU module. The utility model discloses a calculate the double-circuit CPU mainboard of higher dislocation set of power, the execution efficiency is high, and can effectively reduce the second CPU module has optimized the overall arrangement design of mainboard to the radiating pressure of first CPU module, when improving the radiating efficiency, is convenient for walk the extension of line and function, still is favorable to the later maintenance of product.

Description

Staggered double-circuit CPU mainboard and server thereof

Technical Field

The utility model relates to a CPU mainboard especially relates to a dislocation set's double-circuit CPU mainboard to the server of double-circuit CPU mainboard including this dislocation set has been related to.

Background

The dual-path CPU main board is produced mainly for meeting the requirements of professional applications such as cloud computing, servers and graphic workstations, so that the computing processing capacity and the function expansion performance of the system are required to be high. The traditional double-CPU mainboard usually uses a server processor supporting two CPUs, although the resources of the two CPUs can be directly called by an operating system can also be realized, due to the layout and size limitation, if the two CPUs are arranged side by side in tandem, the former CPU will increase the heat dissipation pressure of the latter CPU, and the arrangement and routing of other modules are not facilitated due to the over concentration.

Disclosure of Invention

The utility model aims to solve the technical problem that a need provide one kind and optimized the layout design of mainboard, improve the radiating efficiency, be convenient for walk the double-circuit CPU mainboard of the dislocation set of line and extension, on this basis, still further provide the server including the double-circuit CPU mainboard of this dislocation set.

To this end, the utility model provides a dislocation set's double-circuit CPU mainboard, include: the main board comprises a main board body, a first CPU module, a second CPU module and a PCI-E slot module, wherein the first CPU module and the PCI-E slot module are respectively arranged on one side of the main board body close to a rear panel of the case; the second CPU module is arranged on one side of the mainboard body, which is far away from the rear panel of the case, and is arranged in a staggered manner with the first CPU module.

The utility model discloses a further improvement lies in, the both sides of first CPU module and second CPU module all are provided with memory slot.

The utility model discloses a further improvement lies in, the memory slot symmetry on first CPU module both sides sets up side by side, the memory slot symmetry on second CPU module both sides also sets up side by side.

The utility model discloses a further improvement lies in, every side of first CPU module all sets up 2 to 3 memory slots, every side of second CPU module is provided with 2 at least memory slots.

The utility model discloses a further improvement lies in, first CPU module set up in by the rear panel interface of mainboard body.

The utility model discloses a further improvement lies in, be provided with the radiator between first CPU module and the rear panel interface, the other radiator that also is provided with of second CPU module.

The utility model discloses a further improvement lies in, the fin direction of radiator with the air-out direction of memory slot parallels.

The utility model discloses a further improvement lies in, the interval between every two adjacent PCI-E slots in PCI-E slot module is 20.32mm.

The utility model discloses a further improvement lies in, PCI-E slot module includes ten PCI-E slots that set up side by side.

The utility model also provides a server, included quick-witted case and as above the dislocation set's double-circuit CPU mainboard, dislocation set's double-circuit CPU mainboard set up in quick-witted incasement.

Compared with the prior art, the beneficial effects of the utility model reside in that: the CPU module comprises a first CPU module, a second CPU module, a PCI-E slot module and the like, so that a double-channel CPU mainboard with higher calculation capacity and staggered arrangement is realized, when one CPU module is an 8-core CPU, the first CPU module and the second CPU module can easily reach 16 cores by operating simultaneously, and the execution efficiency is higher; on the basis, the first CPU module and the PCI-E slot module are respectively arranged on one side, close to the rear panel of the case, of the mainboard body, so that the space close to the rear panel of the case can be fully utilized to realize the fixation and installation of the first CPU module and the PCI-E slot module, the second CPU module is arranged on one side, far away from the rear panel of the case, of the mainboard body and is arranged in a staggered mode with the first CPU module, through the design that the front and back layout is staggered with each other, the heat dissipation pressure of the second CPU module on the first CPU module is effectively reduced, meanwhile, due to the staggered design, more operable spaces are provided for other modules and wiring, the heat dissipation efficiency is improved, the wiring and the expansion are facilitated, and the later maintenance of products is facilitated.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention;

fig. 2 is a schematic top view of an embodiment of the present invention;

fig. 3 is a schematic diagram of a back structure according to an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1, this embodiment provides a dual-channel CPU board with offset, which includes: the main board comprises a main board body 1, a first CPU module 2, a second CPU module 3 and a PCI-E slot module 4, wherein the first CPU module 2 and the PCI-E slot module 4 are respectively arranged on one side of the main board body 1 close to a rear panel of a case; the second CPU module 3 is disposed on a side of the main board body 1 away from the rear panel of the chassis, and is disposed in a staggered manner with the first CPU module 2.

In this embodiment, the main board body 1 is a main circuit board, the first CPU module 2 is preferably an integrated module where a main CPU is located, and the main CPU is preferably implemented by an intel processor; the second CPU module 3 is preferably an integrated module where the sub CPU is located, and may also be implemented by an intel processor; the PCI-E slot module 4 includes a plurality of PCI-E slots arranged side by side.

In this embodiment, the first CPU module 2 and the second CPU module 3 are connected by a signal line, so that a staggered dual-path CPU board with higher computing power is realized, and when one CPU module is an 8-core CPU, the first CPU module 2 and the second CPU module 3 in this embodiment can operate simultaneously to reach 16 cores easily, so that the execution efficiency is higher; on this basis, as shown in fig. 1 to 3, the first CPU module 2 and the PCI-E slot module 4 are respectively disposed on one side of the motherboard body 1 close to the rear panel of the chassis, so that the space close to the rear panel of the chassis can be fully utilized to fix and mount the first CPU module 2 and the PCI-E slot module 4, and the second CPU module 3 is disposed on one side of the motherboard body 1 away from the rear panel of the chassis and is disposed in a staggered manner with the first CPU module 2, so that the heat dissipation pressure of the second CPU module 3 on the first CPU module 2 is effectively reduced by the front-back layout and mutually staggered design, and meanwhile, due to the staggered design, more operable spaces are provided for other modules and routing, thereby improving the heat dissipation efficiency, facilitating routing and expansion, and facilitating the later maintenance of the product.

Preferably, as shown in fig. 1 and fig. 2, memory slots 5 are disposed on both sides of the first CPU module 2 and the second CPU module 3 in this embodiment; the Memory slots 5 are preferably DIMM slots which are fully called Dual-Inline-Memory-Modules, and in the embodiment, one CPU is preferably connected with 6 memories, and double CPUs are preferably connected with 12 Memory banks, so that 12 Memory slots are provided in total; preferably the memory slots 5 on both sides of the first CPU module 2 are symmetrically arranged side by side, the memory slots 5 on both sides of the second CPU module 3 are also symmetrically arranged side by side, and this symmetrical side by side design scheme can also facilitate wiring, i.e. each CPU module can be connected to the corresponding memory bank left and right, so as to further promote the rationality and reliability of the layout.

In this example, each side of the first CPU module 2 is provided with 2 to 3 memory slots 5, and two sides of the first CPU module 2 are provided with no more than 6 memory slots 5, so as to vacate enough space for the PCI-E slot module 4, in this example, the PCI-E slot module 4 includes ten PCI-E slots arranged side by side, and the distance between every two adjacent PCI-E slots in the PCI-E slot module 4 is 20.32mm, which not only can directly adopt a standard distance to implement the installation of ten PCI-E slots, but also cannot be implemented on the existing dual-CPU motherboard. Each side of the second CPU module 3 is provided with at least 2 memory slots 5, in fig. 1 and fig. 2 of this example, each side of the second CPU module 3 is provided with 3 memory slots 5, which is set for the purpose of reserving space to facilitate expansion, such as expanding a GPU card, etc., and of course, in practical application, the number of the memory slots 5 on both sides of the second CPU module 3 may be adjusted according to practical situations and requirements, and is not limited to only 6.

In this embodiment, the PCI-E slot of the PCI-E slot module 4 may also preferably be raised by using a raising card, so as to avoid collision with the second CPU module 3 and facilitate heat dissipation; as shown in fig. 1 to fig. 3, the present embodiment further includes a high-speed connector 8 and a low-speed connector 9, where the high-speed connector 8 is preferably disposed beside the second CPU module 3, that is, the remaining space on the side of the main board body 1 away from the rear panel of the chassis is used to implement the arrangement of various interfaces/connectors, so as to facilitate the expansion of various interfaces and functions; the high-speed connector 8 comprises any one or more of a USB connector, a PCI-E slot connector, a DIMM connector, a VGA interface, an M.2 connector and an SPI interface, the low-speed connector 9 comprises any one or more of a power switch interface, a TPM connector and an LED signal lamp interface, the high-speed connector 8 is connected to the first CPU module 2 and the second CPU module 3 through any one or more of a UPI signal line, a PCI-E signal line, a BMI signal line and a CH signal line, and the low-speed connector 9 is connected to the first CPU module 2 and the second CPU module 3 through a low-speed signal line.

As shown in fig. 1 and fig. 2, the first CPU module 2 is disposed beside the rear panel interface 6 of the motherboard body 1, and such a configuration can make full use of the position beside the rear panel interface 6, so as to implement dual-CPU staggered configuration, 12 memory slots, and 10 PCI-E slots on the basis of the width size of a standard easx motherboard, which is not done by a dual-CPU motherboard with the same size in the prior art, and this embodiment can be implemented because of the rationality of the overall layout; the standard EATX motherboard refers to Extended ATX motherboard, and its standard size is 12X 13 inches (304.8 mm X330.2 mm).

As shown in fig. 1 and fig. 2, in this embodiment, a heat sink 7 is disposed between the first CPU module 2 and the rear panel interface 6, so as to achieve the heat dissipation requirement of the first CPU module 2 and avoid excessive temperature rise; a radiator 7 is also arranged beside the second CPU module 3. More preferably, the fin direction of the heat radiator 7 is parallel to the air outlet direction of the memory slot 5, so that the air is guided and exhausted through the consistent heat radiating wind direction, and the heat radiating efficiency is improved.

The embodiment also provides a server, which comprises a case and the staggered double-path CPU main boards, wherein the staggered double-path CPU main boards are arranged in the case.

The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims (8)

1. The utility model provides a dislocation set's double-circuit CPU mainboard which characterized in that includes: the main board comprises a main board body, a first CPU module, a second CPU module and a PCI-E slot module, wherein the first CPU module and the PCI-E slot module are respectively arranged on one side of the main board body close to a rear panel of the case; the second CPU module is arranged on one side of the mainboard body, which is far away from the rear panel of the case, and is arranged in a staggered manner with the first CPU module;

a radiator is arranged between the first CPU module and the rear panel interface, a radiator is also arranged beside the second CPU module, and the direction of a fin of the radiator is parallel to the air outlet direction of the memory slot; and the PCI-E slot of the PCI-E slot module is heightened by adopting a heightening card.

2. The staggered dual-channel CPU motherboard as recited in claim 1, wherein both sides of said first and second CPU modules are provided with memory slots.

3. The staggered dual-CPU motherboard as recited in claim 2, wherein the memory slots on both sides of the first CPU module are symmetrically arranged side by side, and the memory slots on both sides of the second CPU module are also symmetrically arranged side by side.

4. The staggered double-circuit CPU main board as claimed in claim 2, wherein each side of the first CPU module is provided with 2 to 3 memory slots, and each side of the second CPU module is provided with at least 2 memory slots.

5. The misplaced dual-channel CPU board according to any one of claims 2 to 4, wherein the first CPU module is disposed beside a rear panel interface of the board body.

6. The misplaced dual CPU board according to any one of claims 1 to 4, wherein the spacing between every two adjacent PCI-E slots in the PCI-E slot module is 20.32mm.

7. The misplaced two-way CPU board of claim 6, wherein the PCI-E slot modules comprise ten PCI-E slots arranged side-by-side.

8. A server, comprising a chassis and the staggered dual CPU board of any one of claims 1 to 7, wherein the staggered dual CPU board is disposed in the chassis.

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