CN209787544U - Metal-based copper-clad circuit board and computing equipment comprising same - Google Patents
Metal-based copper-clad circuit board and computing equipment comprising same Download PDFInfo
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- CN209787544U CN209787544U CN201821693398.1U CN201821693398U CN209787544U CN 209787544 U CN209787544 U CN 209787544U CN 201821693398 U CN201821693398 U CN 201821693398U CN 209787544 U CN209787544 U CN 209787544U
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- water
- circuit board
- metal
- cooled
- clad circuit
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 title claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 238000001816 cooling Methods 0.000 claims abstract description 65
- 239000011889 copper foil Substances 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 20
- 238000007731 hot pressing Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 39
- 238000009413 insulation Methods 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000003245 working effect Effects 0.000 abstract 1
- 238000004364 calculation method Methods 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
the utility model discloses a metal base covers copper circuit board and including the computing equipment of this circuit board, metal base covers copper circuit board includes: the first copper foil layer comprises a first surface and a second surface, and the second surface is connected with a plurality of working chips; the water-cooling base plate comprises a first water-cooling plate surface; and the first surface is in hot-pressing connection with the first water-cooling plate surface through the first insulating heat-conducting layer. The utility model discloses a metal base covers copper circuit board makes the radiating effect obtain further promotion, and its preparation simple process, and the cost of manufacture is low, covers copper circuit board's computing equipment's working property including this metal base also to have obtained the improvement.
Description
Technical Field
the utility model relates to a circuit board, specifically speaking relates to a metal base covers copper circuit board. The utility model discloses still relate to a computing equipment including foretell metal base copper-clad circuit board.
Background
The PCB board is printed circuit board, is the general name of circuit board commonly used, divide into according to the material: cardboard, semi-glass fiber board, metal substrate, etc. The PCB of the metal substrate is a type having a good heat dissipation property, and a general single-sided board is composed of three layers, i.e., a circuit layer (copper foil), an insulating layer, and a metal base layer. Although the heat dissipation performance of the metal-based PCB is improved to a certain extent compared with that of PCBs made of other materials, the requirements on heat dissipation and cost are higher and higher along with the rapid increase of the calculation speed and calculation amount of the computing equipment, and the conventional metal-based PCB cannot meet the requirements of modern computing equipment.
SUMMERY OF THE UTILITY MODEL
the utility model aims at providing a metal base covers copper circuit board and covers copper circuit board's computing equipment including this metal base, and metal base covers copper circuit board and makes the radiating effect obtain further promotion, and preparation simple process, and the cost of manufacture is low.
In order to achieve the above object, the copper-clad circuit board of the present invention comprises:
the first copper foil layer comprises a first surface and a second surface, and the second surface is connected with a plurality of working chips;
The water-cooling base plate comprises a first water-cooling plate surface; and
And the first surface is in hot-pressing connection with the first water-cooling plate surface through the first insulating heat-conducting layer.
The metal-based copper-clad circuit board further comprises:
The second copper foil layer comprises a third surface and a fourth surface, and the fourth surface is connected with a plurality of working chips; and
The second insulation heat conduction layer, wherein, the water-cooling base plate includes the second water-cooling face, the third surface with pass through between the second water-cooling face the second insulation heat conduction layer hot pressing connection.
In the metal-based copper-clad circuit board, the second water-cooling board surface is arranged opposite to the first water-cooling surface.
The metal-based copper-clad circuit board further comprises:
The third copper foil layer comprises a fifth surface and a sixth surface, and the sixth surface is connected with a plurality of working chips; and
The third insulating heat conduction layer, wherein, the water-cooling base plate includes the third water-cooling face, the fifth surface with pass through between the third water-cooling face the third insulating heat conduction layer hot pressing connection.
In the metal-based copper-clad circuit board, the third water-cooling board surface is vertical to the first water-cooling surface.
the metal-based copper-clad circuit board further comprises:
The fourth copper foil layer comprises a seventh surface and an eighth surface, and the eighth surface is connected with a plurality of working chips; and
And the fourth insulating heat conducting layer, wherein the water-cooled substrate comprises a fourth water-cooled plate surface, and the seventh surface is connected with the fourth water-cooled plate surface through the fourth insulating heat conducting layer in a hot-pressing manner.
In the metal-based copper-clad circuit board, the fourth water-cooling board surface is arranged opposite to the third water-cooling surface.
in the metal-based copper-clad circuit board, the water-cooled substrate comprises a metal substrate and a liquid-cooled tube, and the liquid-cooled tube is packaged in the metal substrate.
In the metal-based copper-clad circuit board, the plurality of working chips are arranged along the first direction.
In the metal-based copper-clad circuit board, the copper sheets are arranged between the adjacent working chips.
in the metal-based copper-clad circuit board, the distance between adjacent working chips increases/decreases along the first direction.
in the metal-based copper-clad circuit board, the working chips are arranged in a plurality of rows along a second direction, and the first direction is perpendicular to the second direction.
The utility model discloses a computing equipment include the electrical unit, with the control unit that the electrical unit is connected and with the computational unit that control unit and electrical unit are connected, the computational unit is integrated on one or more calculation boards, wherein, the calculation board includes the metal-based covers copper circuit board.
the beneficial effects of the utility model reside in that, the utility model discloses a metal base covers copper circuit board adopts the water-cooling base plate to cover the base plate of copper circuit board as the individual layer, is showing and is reducing the thermal resistance, has not only improved system performance greatly, and the cost is lower.
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
Drawings
Fig. 1 is a schematic front view of a metal-based copper-clad circuit board according to an embodiment of the present invention;
3 FIG. 32 3 is 3a 3 schematic 3 sectional 3 view 3A 3- 3A 3 of 3 FIG. 31 3; 3
FIG. 3 is a schematic side view of an embodiment of the metal-based copper-clad circuit board of the present invention;
FIG. 4 is a schematic top view of a copper-clad metal-based circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic top view of a copper-clad metal-based circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic front view of a metal-based copper-clad circuit board according to an embodiment of the present invention;
fig. 7 is a block diagram of an embodiment of a computing device according to the present invention.
Wherein the reference numerals
20. 20a, 20b, 20c, 20 d: metal base copper-clad circuit board
110. 110a, 110b, 110 c: first copper foil layer
120a, 120b, 120 c: second copper foil layer
130b, 130 c: third copper foil layer
140 c: fourth copper foil layer
150 d: fifth copper foil layer
111. 111a, 111b, 111 c: first surface
112. 112a, 112b, 112 c: second surface
121a, 121b, 121 c: third surface
122a, 122b, 122 c: the fourth surface
131b, 131 c: fifth surface
132b, 132 c: the sixth surface
141 c: the seventh surface
142 c: eighth surface
210. 210a, 210b, 210 c: water-cooled base plate
211. 211a, 211b, 211 c: first water-cooling plate surface
212a, 212b, 212 c: second water-cooled plate surface
213b, 213 c: third water-cooled plate surface
214 c: fourth water-cooled plate surface
310. 310a, 310b, 310 c: first insulating heat conducting layer
320a, 320b, 320 c: second insulating heat-conducting layer
330b, 330 c: third insulating heat conducting layer
340 c: fourth insulating and heat conducting layer
400: working chip
500: copper sheet
10: computing device
11: power supply unit
12: control unit
13: computing unit
13A: calculating board
14: heat radiation unit
X: a first direction
Y: second direction
p1, p2, p 3: distance between each other
Detailed Description
The following detailed description of the embodiments of the present invention will be provided in conjunction with the accompanying drawings and specific embodiments for further understanding the objects, aspects and functions of the present invention, but not for limiting the scope of the appended claims.
References in the specification to "an embodiment," "another embodiment," "the present embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not intended to refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
where certain terms are used in the specification and following claims to refer to particular components or features, those skilled in the art will understand that various terms or numbers may be used by a skilled user or manufacturer to refer to the same component or feature. This specification and the claims that follow do not intend to distinguish between components or features that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "coupled" is intended to include any direct or indirect coupling.
It should be noted that in the description of the present invention, the orientation or positional relationship indicated by the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. For the sake of clarity, the terms "first," "second," "third," "fourth," and the like, as used herein, are used to distinguish one element, region, or section from another, the same or similar element, region, or section, and are not intended to limit the particular element, region, or section.
As shown in fig. 1 and 2, fig. 1 is a front view structural diagram of an embodiment of the metal-based copper-clad circuit board of the present invention, and fig. 2 is a cross-sectional structural diagram of the metal-based copper-clad circuit board of fig. 1. The metal-based copper-clad circuit board 20 includes a first copper foil layer 110, a water-cooled substrate 210, and a first heat-insulating layer 310, wherein the first copper foil layer 110 includes a first surface 111 and a second surface 112, the first surface 111 and the second surface 112 are opposite surfaces of the first copper foil layer 110, the second surface 112 is connected to a plurality of working chips 400, and the water-cooled substrate 210 includes a first water-cooled board surface 211. As shown in fig. 2, the first surface 111 of the first copper foil layer 110 and the first water-cooling plate surface 211 of the water-cooling substrate 210 are thermally and thermally connected through a first insulating and heat conducting layer 310.
the utility model discloses an on the base plate of copper circuit board is covered as the metal base to the water-cooling board, the produced heat of each components and parts during operation that generate heat on the copper foil layer conducted to the water-cooling board through insulating heat-conducting layer, then derive the heat circulation through the liquid cooling pipe in the water-cooling board, not only showing and having reduced the thermal resistance, the whole heat dispersion of circuit board can obviously promote, and production and manufacturing process are simple, product cost is low.
In addition, as shown in fig. 1, the metal-based copper-clad circuit board 20 includes a first direction X and a second direction Y. The first direction X is perpendicular to the second direction Y. The plurality of working chips 400 are sequentially arranged along the first direction X. Further, along the first direction X, the distance between the adjacent active chips 400 gradually increases. As shown, pitch p1 is less than pitch p2, pitch p2 is less than pitch p3, and so on.
In other embodiments, the distance between adjacent active chips may gradually decrease. During specific implementation, the one end of working chip 400 of metal-based copper-clad circuit board 20 that arranges inseparabler corresponds with the higher one end of radiating efficiency in the radiating channel, the one end of working chip 400 that arranges sparsely sets up the lower one end of radiating efficiency in the radiating channel, for example, can set up the inseparabler one end of arranging in going into the wind gap, the one end of arranging sparsely sets up in the air outlet, thereby can balance the radiating effect of each working chip 400, guarantee the stability of the work of each working chip 400, thereby guarantee whole circuit job stabilization.
As shown in fig. 1, the working chips 400 may also be arranged in a plurality of rows arranged along the second direction Y, in this embodiment, the working chips 400 are arranged in two rows arranged along the second direction Y, and of course, the number of the rows may be adjusted as needed.
in an embodiment of the present invention, as shown in fig. 3, the metal-based copper-clad circuit board 20a includes a first copper foil layer 110a, a water-cooled substrate 210a and a first insulating heat-conducting layer 310a, wherein the second surface 112a of the first copper foil layer 110a is connected to a plurality of working chips 400, and the first surface 111a of the first copper foil layer 110a and the first water-cooled surface 211a of the water-cooled substrate 210a are thermally pressed and connected through the first insulating heat-conducting layer 310 a.
In addition, the metal-based copper-clad circuit board 20a further includes a second copper foil layer 120a and a second heat conduction insulating layer 320a, wherein the second copper foil layer 120a includes a third surface 121a and a fourth surface 122a, the third surface 121a and the fourth surface 122a are opposite surfaces of the second copper foil layer 120a, and the fourth surface 122a is connected with a plurality of working chips 400. The water-cooled substrate 210a includes a second water-cooled board surface 212a, and the third surface 121a of the second copper foil layer 120a and the second water-cooled board surface 212a of the water-cooled substrate 210a are thermally pressed and connected through a second insulating heat conduction layer 320 a. The first water-cooling plate surface 211a and the second water-cooling plate surface 212a are surfaces of the water-cooling substrate 210a that are disposed opposite to each other.
In this embodiment, the two large-area surfaces of the water-cooled substrate are both attached with the copper foil through the insulating heat-conducting layer, so that the area of the layout and the arrangement of the circuit board can be further enlarged. When the layout wiring area is unchanged, the total volume of the circuit board can be reduced, and the metal-based copper-clad circuit board is favorable for being used in an environment with limited space.
in an embodiment of the present invention, as shown in fig. 4, the metal-based copper-clad circuit board 20b includes a first copper foil layer 110b, a second copper foil layer 120b, a water-cooled substrate 210b, a first heat-insulating layer 310b and a second heat-insulating layer 320b, wherein the second surface 112b of the first copper foil layer 110b and the fourth surface 122b of the second copper foil layer 120b are connected to a plurality of working chips 400, the first surface 111b of the first copper foil layer 110b and the first water-cooled surface 211b of the water-cooled substrate 210b are thermally pressed by the first heat-insulating layer 310a, and the third surface 121b of the second copper foil layer 120b and the second water-cooled surface 212b of the water-cooled substrate 210b are thermally pressed by the second heat-insulating layer 320 b.
In addition, the metal-based copper-clad circuit board 20b further includes a third copper foil layer 130b and a third thermal insulation layer 330b, wherein the third copper foil layer 130b includes a fifth surface 131b and a sixth surface 132b, the fifth surface 131b and the sixth surface 132b are opposite surfaces of the third copper foil layer 130b, and the sixth surface 132b is connected with a plurality of working chips 400. The water-cooled substrate 210b includes a third water-cooled board surface 213b, and the fifth surface 131b of the third copper foil layer 130b and the third water-cooled board surface 213b of the water-cooled substrate 210b are thermally pressed and connected through a third insulating heat conduction layer 330 b. The third water-cooling plate surface 213b is the other surface of the water-cooling substrate 210b excluding the first water-cooling plate surface 211b and the second water-cooling plate surface 212b, and for example, the third water-cooling plate surface 213b is a surface substantially perpendicular to the first water-cooling plate surface 211b and the second water-cooling plate surface 212 b.
In an embodiment of the present invention, as shown in fig. 5, the metal-based copper-clad circuit board 20c includes a first copper foil layer 110c, a second copper foil layer 120c, a third copper foil layer 130c, a water-cooled substrate 210c, a first heat-conducting insulating layer 310c, a second heat-conducting insulating layer 320c and a third heat-conducting insulating layer 330c, wherein the second surface 112c of the first copper foil layer 110c, the fourth surface 122c of the second copper foil layer 120c and the sixth surface 132c of the third copper foil layer 130c are respectively connected to a plurality of working chips 400, the first surface 111c of the first copper foil layer 110c and the first water-cooled surface 211c of the water-cooled substrate 210c are thermally connected by the first heat-conducting insulating layer 310c, the third surface 121c of the second copper foil layer 120c and the second water-cooled surface 212c of the water-cooled substrate 210c are thermally connected by the second heat-conducting insulating layer 320c, the fifth surface 131c of the third copper foil layer 130c and the third water-cooled surface 213c of the water-cooled substrate 210c are thermally connected by the The edge heat conductive layer 330c is thermocompression bonded.
In addition, the metal-based copper-clad circuit board 20c further includes a fourth copper foil layer 140c and a fourth thermal insulation layer 340c, wherein the fourth copper foil layer 140c includes a seventh surface 141c and an eighth surface 142c, the seventh surface 141c and the eighth surface 142c are opposite surfaces of the fourth copper foil layer 140c, and the eighth surface 142c is connected with the plurality of working chips 400. The water-cooled substrate 210c includes a fourth water-cooled board surface 214c, and the seventh surface 141c of the fourth copper foil layer 140c and the fourth water-cooled board surface 214c of the water-cooled substrate 210c are thermally pressed and connected through a fourth insulating heat conduction layer 340 c. The fourth water-cooling plate surface 214c is the other surface of the water-cooling substrate 210c excluding the first water-cooling plate surface 211c, the second water-cooling plate surface 212c and the third water-cooling plate surface 213c, and for example, the fourth water-cooling plate surface 214c is a surface substantially perpendicular to the first water-cooling plate surface 211c and the second water-cooling plate surface 212c and substantially parallel to the third water-cooling plate surface 213 c. As shown in the drawing, the first water-cooling plate surface 211c, the second water-cooling plate surface 212c, the third water-cooling plate surface 213c, and the fourth water-cooling plate surface 214c are, for example, four adjacent surfaces of the water-cooling substrate 210 c. Preferably, the outlet and the inlet of the liquid cooling tube of the water-cooled substrate 210c packaged in the metal matrix can be led out from the side surface, which refers to the narrow and short surface of the water-cooled substrate 210c excluding the first water-cooled plate surface 211c, the second water-cooled plate surface 212c, the third water-cooled plate surface 213c and the fourth water-cooled plate surface 214c, so as to fully utilize the larger surface of the water-cooled substrate 210 as much as possible to reduce the volume of the circuit board or to provide more working chips. Of course, according to actual needs, the outlet and inlet of the liquid cooling pipe may also be led out from any one or more of the first water cooling plate surface 211c, the second water cooling plate surface 212c, the third water cooling plate surface 213c and the fourth water cooling plate surface 214c, but the present invention is not limited thereto.
As shown in fig. 6, in another embodiment of the present invention, the metal-based copper-clad circuit board 20d includes a fifth copper foil layer 150d, a water-cooled substrate and a fifth insulating heat-conducting layer, wherein a plurality of working chips 400 are attached on the fifth copper foil layer 150d, and the fifth copper foil layer 150d can be thermally pressed on one or more surfaces of the water-cooled substrate through the fifth insulating heat-conducting layer. The difference between this embodiment and each of the above embodiments is that the metal-based copper-clad circuit board 20a further includes a plurality of copper sheets 500, the working chip 400 is, for example, various computing and control chips, along with the working efficiency of the working chip 400 is higher and higher, the heat productivity of the working chip 400 is also higher and higher, the utility model discloses set up the copper sheets 500 between adjacent working chips 400. The copper sheet 500 not only has good heat dissipation effect, but also can reduce the power loss of the circuit.
When the distance between the adjacent working chips 400 gradually increases or decreases, the size of the copper sheet 500 disposed between the working chips 400 also gradually increases or decreases.
In the above embodiments, the metal substrate of the water-cooled substrate may be made of aluminum material and the liquid-cooled tube of copper material, for example, but the substrate and the liquid-cooled tube may be made of other materials with good heat conductivity.
The utility model discloses a computing device can be the computing device that is used for virtual currency to dig the ore deposit, as shown in FIG. 7, the utility model discloses a computing device 10 includes electrical unit 11, the control unit 12, calculation unit 13, radiating element 14 and so on, and the control unit 12 is connected with electrical unit 11, and calculation unit 13 is connected with the control unit 12 and electrical unit 11. The power supply unit 11 provides power sources for the control unit 12 and the calculation unit 13, the calculation unit 13 is used for operating a specific algorithm to calculate data, the control unit 12 is used for receiving the calculation data of the calculation unit 13, analyzing, processing and outputting the calculation data so as to obtain corresponding virtual coins after communication with a remote server, and the heat dissipation unit 14 is used for dissipating heat for the calculation unit 13 to ensure normal operation of the calculation unit 13. The calculating unit 13 is integrated on one calculating board 13A, for example, but of course, the calculating unit 13 may also include a plurality of calculating boards 13A, as shown in fig. 5, and the calculating board 13A includes the metal-based copper-clad circuit board of any of the above embodiments.
It should be noted that the connection modes of the power supply unit, the control unit and the computing unit of the computing device are only examples of one specific embodiment, and other connection modes are not excluded, and the connection modes of the units of the computing device are not limited in the present invention.
Naturally, the present invention can be embodied in many other forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be made by one skilled in the art without departing from the spirit or essential attributes thereof, and it is intended that all such changes and modifications be considered as within the scope of the appended claims.
Claims (13)
1. A metal-based copper-clad circuit board, comprising:
The first copper foil layer comprises a first surface and a second surface, and the second surface is connected with a plurality of working chips;
The water-cooling base plate comprises a first water-cooling plate surface; and
And the first surface is in hot-pressing connection with the first water-cooling plate surface through the first insulating heat-conducting layer.
2. The metal-based copper-clad circuit board according to claim 1, further comprising:
The second copper foil layer comprises a third surface and a fourth surface, and the fourth surface is connected with a plurality of working chips; and
The second insulation heat conduction layer, wherein, the water-cooling base plate includes the second water-cooling face, the third surface with pass through between the second water-cooling face the second insulation heat conduction layer hot pressing connection.
3. The metal-based copper-clad circuit board according to claim 2, wherein the second water-cooled board surface is disposed opposite to the first water-cooled surface.
4. The metal-based copper-clad circuit board according to claim 1, further comprising:
The third copper foil layer comprises a fifth surface and a sixth surface, and the sixth surface is connected with a plurality of working chips; and
The third insulating heat conduction layer, wherein, the water-cooling base plate includes the third water-cooling face, the fifth surface with pass through between the third water-cooling face the third insulating heat conduction layer hot pressing connection.
5. The metal-based copper-clad circuit board according to claim 4, wherein the third water-cooled board surface is perpendicular to the first water-cooled surface.
6. The metal-based copper-clad circuit board according to claim 4, further comprising:
The fourth copper foil layer comprises a seventh surface and an eighth surface, and the eighth surface is connected with a plurality of working chips; and
And the fourth insulating heat conducting layer, wherein the water-cooled substrate comprises a fourth water-cooled plate surface, and the seventh surface is connected with the fourth water-cooled plate surface through the fourth insulating heat conducting layer in a hot-pressing manner.
7. The metal-based copper-clad circuit board according to claim 6, wherein the fourth water-cooled board surface is disposed opposite to the third water-cooled surface.
8. The metal-based copper-clad circuit board according to any one of claims 1 to 7, wherein the water-cooled substrate comprises a metal base and a liquid-cooled tube, and the liquid-cooled tube is encapsulated in the metal base.
9. the metal-based copper-clad circuit board according to any one of claims 1 to 7, wherein the working chip is a plurality of chips arranged in the first direction.
10. The metal-based copper-clad circuit board of claim 9, further comprising copper sheets disposed between adjacent working chips.
11. the metal-based copper-clad circuit board according to claim 10, wherein a distance between adjacent working chips increases/decreases in the first direction.
12. The metal-based copper-clad circuit board of claim 10, wherein the working chips are arranged in a plurality of rows along a second direction, and the first direction is perpendicular to the second direction.
13. A computing device comprising a power supply unit, a control unit connected to the power supply unit, and a computing unit connected to the control unit and the power supply unit, the computing unit being integrated on one or more computing boards, wherein the computing boards comprise the metal-based copper-clad circuit board of any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821693398.1U CN209787544U (en) | 2018-10-18 | 2018-10-18 | Metal-based copper-clad circuit board and computing equipment comprising same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821693398.1U CN209787544U (en) | 2018-10-18 | 2018-10-18 | Metal-based copper-clad circuit board and computing equipment comprising same |
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| Publication Number | Publication Date |
|---|---|
| CN209787544U true CN209787544U (en) | 2019-12-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275261A (en) * | 2018-10-18 | 2019-01-25 | 杭州嘉楠耘智信息科技有限公司 | Metal-based copper-clad circuit board and computing equipment comprising same |
-
2018
- 2018-10-18 CN CN201821693398.1U patent/CN209787544U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275261A (en) * | 2018-10-18 | 2019-01-25 | 杭州嘉楠耘智信息科技有限公司 | Metal-based copper-clad circuit board and computing equipment comprising same |
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