CN213522936U

CN213522936U - Aluminum heat-dissipation backlight backboard

Info

Publication number: CN213522936U
Application number: CN202023032750.7U
Authority: CN
Inventors: 甘果
Original assignee: Shenzhen Yuanjin Photoelectric Technology Co ltd
Current assignee: Shenzhen Yuanjin Photoelectric Technology Co ltd
Priority date: 2020-12-16
Filing date: 2020-12-16
Publication date: 2021-06-22
Anticipated expiration: 2030-12-16

Abstract

The utility model discloses an aluminum heat-dissipation backlight backboard, which comprises a backboard, wherein a plurality of first mounting holes which are uniformly distributed are formed in the periphery of the backboard in a penetrating manner, a heat-dissipating plate is fixedly arranged on the surface of the other side of the backboard, a mounting groove is fixedly arranged at the top of the heat-dissipating plate, the mounting groove is fixedly arranged on the surface of the backboard, a plurality of second mounting holes are formed in the middle of the backboard in a penetrating manner, the second mounting holes penetrate through the heat-dissipating plate, and a clamping groove is formed in the surface of the backboard; the backboard is cooled through the cooling plate arranged on the backboard, and the integrated installation is favorable for improving the heat dissipation performance of the device, so that the practicability of the device is improved, and the backboard can be well fixed and a good printed circuit board can be well installed through the first mounting hole and the second mounting hole.

Description

Aluminum heat-dissipation backlight backboard

Technical Field

The utility model relates to a backplate field especially relates to aluminium heat dissipation backplate in a poor light.

Background

In a broad sense, the backplane is also a PCB (printed circuit board), and particularly, the backplane is a motherboard for carrying daughter boards or line cards, which can implement a custom function. The primary function of the backplane is to "carry" the circuit board and distribute power, signal, etc. functions to each daughter board in order to obtain the appropriate electrical connections and signal transmission.

The back plate is thicker and heavier than a conventional PCB plate, and accordingly the heat capacity of the back plate is larger. The heat dissipation performance is not good, and the normal use of backplate can be influenced to the high temperature in the use, for this reason we propose aluminium heat dissipation backplate.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides an aluminium heat dissipation backplate in a poor light is favorable to improving the thermal diffusivity of backplate, and the integrated design has the practicality that does benefit to the improvement device, improves the use ageing of device.

In order to solve the technical problem, the utility model provides a following technical scheme: aluminium heat dissipation backplate in a poor light, including the backplate, the backplate runs through the first mounting hole of seting up a plurality of evenly distributed all around, backplate opposite side surface fixed mounting has the heating panel, heating panel top fixed mounting has the mounting groove, mounting groove fixed mounting is in the backplate surface, the backplate middle part runs through and has seted up a plurality of second mounting holes, the second mounting hole runs through the heating panel, lie in the backplate surface between the first mounting hole and seted up the joint groove.

As an optimized technical scheme of the utility model, a plurality of air channels have been seted up on the heating panel, a plurality of logical grooves have been fixedly seted up at air channel middle part.

As an optimized technical scheme of the utility model, backplate, heating panel material are aluminium.

As an optimized technical proposal of the utility model, the surfaces of the back plate and the radiating plate are all electroplated with protective layers, and the protective layers are wear-resistant layers and oxidation-resistant layers.

Compared with the prior art, the utility model discloses the beneficial effect that can reach is:

1. the backboard is cooled through the cooling plate arranged on the backboard, and is integrally installed, so that the heat dissipation performance of the device is improved, the practicability of the device is improved, and the backboard can be well fixed and a printed circuit board can be well installed through the arranged first mounting hole and the second mounting hole;

2. through the air flow channel that sets up, be favorable to making the heat give off along the air flow channel, through the logical groove that sets up, when a heat is too high, the air current gathers together and discharges in other air flow channels, is favorable to improving the thermal diffusivity of device, is favorable to improving the use prescription of device.

Drawings

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is a back view of the overall structure of the present invention;

FIG. 3 is a front view of the overall structure of the present invention;

wherein: 1. a back plate; 2. a first mounting hole; 3. a heat dissipation plate; 4. mounting grooves; 5. a second mounting hole; 6. a clamping groove; 7. an air flow channel; 8. a through groove.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

Example (b):

as shown in fig. 1-3, the utility model provides an aluminum heat-dissipating back plate in a poor light, including backplate 1, backplate 1 runs through all around and has seted up a plurality of evenly distributed first mounting holes 2, backplate 1 another side surface is fixed with heating panel 3, heating panel 3 top fixed mounting has mounting groove 4, mounting groove 4 is fixed mounting in backplate 1 surface, backplate 1 middle part runs through and has seted up a plurality of second mounting holes 5, second mounting hole 5 runs through heating panel 3, lies in backplate 1 surface between first mounting hole 2 and has seted up joint groove 6; the backboard 1 is cooled through the cooling plate 3 arranged on the backboard 1, and the integrated installation is favorable for improving the heat dissipation performance of the device, so that the practicability of the device is improved, and the backboard 1 can be well fixed and well installed on a printed circuit board through the first installation hole 2 and the second installation hole 5.

In another embodiment, this embodiment discloses an airflow channel structure, as shown in fig. 1 and 2, a plurality of airflow channels 7 are formed on the heat dissipation plate 3, and a plurality of through grooves 8 are fixedly formed in the middle of the airflow channels 7; through the air channel 7 that sets up, be favorable to making the heat distribute along air channel 7, through the logical groove 8 that sets up, when a heat is too high, other air channels 7 interior airflows are gathered and are discharged together, are favorable to improving the thermal diffusivity of device, are favorable to improving the use prescription of device.

In another embodiment, the present embodiment discloses the material of the back plate and the heat dissipation plate, as shown in fig. 1-3, the material of the back plate 1 and the material of the heat dissipation plate 3 are both aluminum; through establishing backplate 1 and heating panel 3 into aluminium, be favorable to reducing backplate 1 dead weight, improve the practicality of device, aluminium thermal diffusivity preferred is favorable to improving the thermal diffusivity of device simultaneously, improves the use ageing of device.

In another embodiment, the present embodiment discloses a protective layer, as shown in fig. 1-3, the protective layer is electroplated on the surfaces of the back plate 1 and the heat dissipation plate 3, and the protective layer is an abrasion resistant layer and an oxidation resistant layer; through the protective layer that sets up on backplate 1 and heating panel 3, be favorable to improving the life of device, improve the use ageing of device.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Aluminium heat dissipation backplate in a poor light, including backplate (1), its characterized in that: backplate (1) runs through first mounting hole (2) of seting up a plurality of evenly distributed all around, backplate (1) opposite side surface fixed mounting has heating panel (3), heating panel (3) top fixed mounting has mounting groove (4), mounting groove (4) fixed mounting is in backplate (1) surface, backplate (1) middle part is run through and is seted up a plurality of second mounting holes (5), second mounting hole (5) run through heating panel (3), it has seted up joint groove (6) to lie in backplate (1) surface between first mounting hole (2).

2. The aluminum heat-dissipating back plate as claimed in claim 1, wherein: the heat dissipation plate (3) is provided with a plurality of air channels (7), and the middle parts of the air channels (7) are fixedly provided with a plurality of through grooves (8).

3. The aluminum heat-dissipating back plate as claimed in claim 1, wherein: the backboard (1) and the heat dissipation plate (3) are made of aluminum.

4. The aluminum heat-dissipating back plate as claimed in claim 1, wherein: protective layers are electroplated on the surfaces of the back plate (1) and the heat dissipation plate (3), and the protective layers are wear-resistant layers and oxidation-resistant layers.