CN211184404U - PCBA circuit board with heat radiation structure - Google Patents
PCBA circuit board with heat radiation structure Download PDFInfo
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- CN211184404U CN211184404U CN201922054687.8U CN201922054687U CN211184404U CN 211184404 U CN211184404 U CN 211184404U CN 201922054687 U CN201922054687 U CN 201922054687U CN 211184404 U CN211184404 U CN 211184404U
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- circuit board
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Abstract
The utility model discloses a PCBA circuit board with heat radiation structure, which comprises a circuit board, the top of circuit board is provided with the dust cover, the equal fixedly connected with connecting plate in bottom of dust cover both sides, the top of connecting plate is run through and is provided with the fixed pin, the bottom of fixed pin runs through to the top of circuit board, the equal fixedly connected with electronic component body in both sides around the circuit board top both sides, the top fixedly connected with heat-conducting glue of electronic component body, the first fin of top fixedly connected with of heat-conducting glue. This practicality possesses the good advantage of radiating effect, and the radiating effect of having solved current PCBA circuit board is not good, can not dispel the heat to the electronic component who generates heat fast, burns out electronic component easily when electronic component's high temperature, and outside dust falls into electronic component's surface easily, causes the electronic component short circuit easily, to the not good problem of circuit board protection effect.
Description
Technical Field
The utility model relates to a PCBA circuit board heat dissipation technical field specifically is a PCBA circuit board with heat radiation structure.
Background
Printed circuit boards, also known as printed circuit boards (pcbs) and printed circuit boards (pcbs), often using acronyms, are important electronic components, support for electronic components, and providers of electronic component circuit connections.
The existing PCBA circuit board has poor heat dissipation effect, can not quickly dissipate heat of an electronic element which generates heat, easily burns the electronic element when the temperature of the electronic element is too high, and external dust easily falls into the surface of the electronic element, so that the electronic element is short-circuited, and the circuit board is not well protected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCBA circuit board with heat radiation structure possesses the good advantage of radiating effect, and the radiating effect of having solved current PCBA circuit board is not good, can not dispel the heat to the electronic component who generates heat fast, burns out electronic component easily when electronic component's temperature is too high, and outside dust falls into electronic component's surface easily, can cause the electronic component short circuit, to the not good problem of the protection effect of circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: a PCBA circuit board with a heat dissipation structure comprises a circuit board, wherein a dust cover is arranged at the top of the circuit board, connecting plates are fixedly connected to the bottoms of two sides of the dust cover, fixing pins penetrate through the top of the connecting plates, the bottoms of the fixing pins penetrate through the top of the circuit board, electronic element bodies are fixedly connected to the front side and the rear side of two sides of the top of the circuit board, heat-conducting glue is fixedly connected to the top of each electronic element body, first heat dissipation fins are fixedly connected to the tops of the heat-conducting glue, a protective layer is fixedly connected to the surface of the circuit board, the electronic element bodies are located in an inner cavity of the protective layer, silica gel gaskets are fixedly connected to the center and the bottom of the top of the circuit board, second heat dissipation fins are fixedly connected to the tops of the top silica gel gaskets, the bottom of second fin both sides all fixedly connected with fixed plate, the top of fixed plate is run through and is provided with the bolt, the bottom of bolt is run through to the top of circuit board, the equal fixedly connected with backup pad in both sides of bottom silica gel gasket bottom, the relative one side fixedly connected with heating panel of backup pad.
Preferably, the protective layer comprises a waterproof layer, the bottom of the waterproof layer is fixedly connected with the surface of the circuit board, the top of the waterproof layer is fixedly connected with a flame-retardant layer, the top of the flame-retardant layer is fixedly connected with an anti-static layer, and the top of the anti-static layer is fixedly connected with a corrosion-resistant layer.
Preferably, the waterproof layer is made of synthetic polymer waterproof material, and the flame-retardant layer is made of flame-retardant nylon.
Preferably, the antistatic layer is made of an antistatic high polymer material, and the corrosion-resistant layer is made of a Teflon material.
Preferably, the number of the heat dissipation plates is five, the heat dissipation plates are evenly distributed on one side opposite to the supporting plate, the tops of the heat dissipation plates are in contact with the bottom of the bottom silica gel gasket, and the heat dissipation plates are made of aluminum alloy materials.
Preferably, the two sides of the top of the circuit board are provided with fixing grooves matched with the fixing pins for use, and the two sides of the middle end of the top of the circuit board are provided with threaded holes matched with the bolts for use.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a circuit board, the dust cover, the protective layer, the waterproof layer, fire-retardant layer, the antistatic backing, the corrosion resistant layer, the fixed plate, radiator fan, the bolt, first fin, the connecting plate, a supporting plate, the second fin, the heating panel, the silica gel gasket, the cooperation of heat-conducting glue and fixed pin is used, the radiating effect of having solved current PCBA circuit board is not good, can not dispel the heat to the electronic component who generates heat fast, electronic component burns out electronic component easily when electronic component's high temperature, outside dust falls into electronic component's surface easily, can cause the electronic component short circuit, the problem that circuit board protection effect is not good.
2. The utility model can conveniently prevent dust from polluting electronic elements by arranging the dust cover, can conveniently install the dust cover by matching the connecting plate and the fixing pin, can conveniently dissipate the heat of the high-temperature electronic elements by arranging the first radiating fin, can conveniently conduct the heat by arranging the heat conducting glue, can conveniently dissipate the heat of the circuit board by matching the second radiating fin and the radiating fan, can conveniently conduct the heat of the circuit board by arranging the silica gel gasket, can conveniently dissipate the heat of the circuit board by arranging the radiating plate, can conveniently prevent the circuit board from being damaged by water by arranging the waterproof layer, can conveniently prevent the circuit board from burning due to external factors by arranging the flame-retardant layer, can conveniently prevent the electronic elements from being damaged by static by arranging the anti-static layer, and can conveniently prevent the electronic elements from being damaged by arranging the corrosion-resistant layer, it is possible to facilitate prevention of air corrosion of the circuit board.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a right view of the novel structure of the present invention;
FIG. 3 is a schematic view of the protective layer structure of the present invention;
fig. 4 is a schematic view of the top view structure of the present invention.
In the figure: the electronic component comprises a circuit board 1, a dust cover 2, a protective layer 3, a waterproof layer 31, a flame-retardant layer 32, an antistatic layer 33, an anti-corrosion layer 34, an electronic component body 4, a fixing plate 5, a heat radiation fan 6, a bolt 7, a first heat radiation fin 8, a connecting plate 9, a support plate 10, a groove 11, a second heat radiation fin 12, a heat radiation fin 13, a silica gel gasket 14, heat conduction glue 15 and a fixing pin 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses a circuit board 1, dust cover 2, protective layer 3, waterproof layer 31, fire-retardant layer 32, antistatic backing 33, corrosion-resistant layer 34, electronic component body 4, fixed plate 5, radiator fan 6, bolt 7, first fin 8, connecting plate 9, backup pad 10, second fin 12, heating panel 13, silica gel gasket 14, heat-conducting glue 15 and fixed pin 16 part are the general standard or the part that technical personnel in the field know, its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental approach.
Referring to fig. 1-4, a PCBA circuit board with a heat dissipation structure comprises a circuit board 1, fixing slots matched with fixing pins 16 are formed on two sides of the top of the circuit board 1, threaded holes matched with bolts 7 are formed on two sides of the middle end of the top of the circuit board 1, a dust cover 2 is arranged on the top of the circuit board 1, dust pollution to electronic components can be prevented conveniently by arranging the dust cover 2, connecting plates 9 are fixedly connected to the bottoms of two sides of the dust cover 2, fixing pins 16 are arranged on the tops of the connecting plates 9 in a penetrating manner, the dust cover 2 can be installed conveniently by matching the connecting plates 9 with the fixing pins 16, the bottoms of the fixing pins 16 penetrate the top of the circuit board 1, electronic component bodies 4 are fixedly connected to the front and back sides of two sides of the top of the circuit board 1, heat conductive glue 15, the heat conduction can be facilitated, the first heat sink 8 is fixedly connected to the top of the heat conducting adhesive 15, the heat dissipation of high-temperature electronic elements can be facilitated by arranging the first heat sink 8, the protective layer 3 is fixedly connected to the surface of the circuit board 1, the protective layer 3 comprises a waterproof layer 31, the bottom of the waterproof layer 31 is fixedly connected to the surface of the circuit board 1, the waterproof layer 31 is made of synthetic polymer waterproof material, the waterproof layer 31 can facilitate preventing the circuit board 1 from being damaged when encountering water, the flame retardant layer 32 is fixedly connected to the top of the waterproof layer 31, the flame retardant layer 32 is made of flame retardant nylon, the flame retardant layer 32 is arranged to facilitate preventing the circuit board 1 from burning due to external factors, the antistatic layer 33 is fixedly connected to the top of the flame retardant layer 32, the antistatic layer 33 is made of antistatic polymer material, and the electronic elements can be prevented from being damaged by, the top of the anti-static layer 33 is fixedly connected with a corrosion-resistant layer 34, the corrosion-resistant layer 34 is made of Teflon material, the circuit board 1 can be conveniently prevented from air corrosion by arranging the corrosion-resistant layer 34, the electronic component body 4 is positioned in the inner cavity of the protective layer 3, the center and the bottom of the top of the circuit board 1 are both fixedly connected with a silica gel gasket 14, the heat of the circuit board 1 can be conveniently conducted by arranging the silica gel gasket 14, the top of the top silica gel gasket 14 is fixedly connected with a second radiating fin 12, the top of the second radiating fin 12 is provided with a groove 11, the inner wall of the groove 11 is fixedly connected with a radiating fan 6, the circuit board 1 can be conveniently radiated by matching the second radiating fin 12 and the radiating fan 6, the bottom of two sides of the second radiating fin 12 is both fixedly connected with a fixing plate 5, the top of the fixing plate 5 is provided with a bolt 7 in, the two sides of the bottom silica gel gasket 14 are fixedly connected with the supporting plate 10, one side opposite to the supporting plate 10 is fixedly connected with the heat dissipation plate 13, the heat dissipation plate 13 is arranged, the heat dissipation of the bottom of the circuit board 1 can be conveniently carried out, the number of the heat dissipation plates 13 is five, the heat dissipation plates 13 are uniformly distributed on one side opposite to the supporting plate 10, the top of each heat dissipation plate 13 is in contact with the bottom of the bottom silica gel gasket 14, the heat dissipation plates 13 are made of aluminum alloy materials, and the problems that the heat dissipation effect of the existing PCBA circuit board is poor and heat dissipation of a heating electronic element cannot be rapidly carried out are solved through matching use of the circuit board 1, the dust cover 2, the protective layer 3, the waterproof layer 31, the flame-retardant layer 32, the anti-static layer 33, the corrosion-resistant layer 34, the fixing plate 5, the heat dissipation fan 6, the bolts 7, the first heat, when the temperature of the electronic component is too high, the electronic component is easily burnt out, and external dust easily falls into the surface of the electronic component, which causes short circuit of the electronic component and has poor protection effect on the circuit board 1.
During the use, circuit board 1 during operation, start radiator fan 6 work through the controller, second fin 12 dispels the heat to the heat that circuit board 1 produced, radiator fan 6 accelerates the speed that second fin 12 dispels the heat, first fin 8 dispels the heat to electronic component body 4, can conduct the heat of electronic component body 4 to first fin 8 rapidly through heat conduction glue 15, heat dissipation plate 13 through the bottom dispels the heat to the bottom of circuit board 1, make the radiating effect better, can be rapid conduct circuit board 1's heat to second fin 12 and radiator plate 13 through silica gel gasket 14 on, protect circuit board 1 and electronic component 4 through protective layer 3, the life of circuit board 1 and electronic component body 4 has been increased.
In summary, the following steps: this PCBA circuit board with heat radiation structure, through circuit board 1, dust cover 2, protective layer 3, waterproof layer 31, fire-retardant layer 32, antistatic backing 33, corrosion-resistant layer 34, fixed plate 5, radiator fan 6, bolt 7, first fin 8, connecting plate 9, backup pad 10, second fin 12, radiator plate 13, silica gel gasket 14, the cooperation of heat-conducting glue 15 and fixed pin 16 is used, it is not good to have solved current PCBA circuit board's radiating effect, can not dispel the heat to the electronic component who generates heat fast, electronic component burns out electronic component easily when electronic component's temperature is too high, outside dust falls into electronic component's surface easily, can cause the electronic component short circuit, the problem that circuit board 1 protection effect is not good.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A PCBA circuit board with heat radiation structure, includes circuit board (1), its characterized in that: the heat-insulating protective cover is characterized in that a dust cover (2) is arranged at the top of the circuit board (1), connecting plates (9) are fixedly connected to the bottoms of the two sides of the dust cover (2), fixing pins (16) are arranged at the top of the connecting plates (9) in a penetrating manner, the bottoms of the fixing pins (16) are arranged at the top of the circuit board (1) in a penetrating manner, electronic element bodies (4) are fixedly connected to the front side and the rear side of the two sides of the top of the circuit board (1), heat-conducting glue (15) is fixedly connected to the top of the electronic element bodies (4), first radiating fins (8) are fixedly connected to the top of the heat-conducting glue (15), a protective layer (3) is fixedly connected to the surface of the circuit board (1), the electronic element bodies (4) are located in an inner cavity of the protective layer (3), silica gel gaskets (14) are fixedly connected to the, the top of second fin (12) is seted up fluted (11), the inner wall fixedly connected with radiator fan (6) of recess (11), the equal fixedly connected with fixed plate (5) in bottom of second fin (12) both sides, the top of fixed plate (5) is run through and is provided with bolt (7), the bottom of bolt (7) is run through to the top of circuit board (1), the equal fixedly connected with backup pad (10) in both sides of bottom silica gel gasket (14) bottom, one side fixedly connected with heating panel (13) that backup pad (10) is relative.
2. A PCBA circuit board with heat dissipating structure in accordance with claim 1, wherein: the protective layer (3) comprises a waterproof layer (31), the bottom of the waterproof layer (31) is fixedly connected with the surface of the circuit board (1), the top of the waterproof layer (31) is fixedly connected with a flame-retardant layer (32), the top of the flame-retardant layer (32) is fixedly connected with an anti-static layer (33), and the top of the anti-static layer (33) is fixedly connected with a corrosion-resistant layer (34).
3. A PCBA circuit board with heat dissipating structure in accordance with claim 2, wherein: the waterproof layer (31) is made of synthetic polymer waterproof material, and the flame-retardant layer (32) is made of flame-retardant nylon.
4. A PCBA circuit board with heat dissipating structure in accordance with claim 2, wherein: the antistatic layer (33) is made of an antistatic high polymer material, and the corrosion-resistant layer (34) is made of a Teflon material.
5. A PCBA circuit board with heat dissipating structure in accordance with claim 1, wherein: the quantity of heating panel (13) is five, and even distribution is in the relative one side of backup pad (10), the top of heating panel (13) contacts with the bottom of bottom silica gel gasket (14), the material of heating panel (13) is aluminum alloy material.
6. A PCBA circuit board with heat dissipating structure in accordance with claim 1, wherein: the fixing groove matched with the fixing pin (16) for use is formed in the two sides of the top of the circuit board (1), and the threaded hole matched with the bolt (7) for use is formed in the two sides of the middle end of the top of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922054687.8U CN211184404U (en) | 2019-11-25 | 2019-11-25 | PCBA circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922054687.8U CN211184404U (en) | 2019-11-25 | 2019-11-25 | PCBA circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211184404U true CN211184404U (en) | 2020-08-04 |
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ID=71800832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922054687.8U Expired - Fee Related CN211184404U (en) | 2019-11-25 | 2019-11-25 | PCBA circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211184404U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113260198A (en) * | 2021-06-02 | 2021-08-13 | 南京智能信通科技发展有限公司 | Circuit board device for communication equipment and installation method thereof |
| CN115038231A (en) * | 2021-03-05 | 2022-09-09 | 北京全路通信信号研究设计院集团有限公司 | Circuit board and manufacturing method thereof |
| CN117641714A (en) * | 2023-12-13 | 2024-03-01 | 同扬光电（江苏）有限公司 | Flexible circuit board with device protection function |
-
2019
- 2019-11-25 CN CN201922054687.8U patent/CN211184404U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115038231A (en) * | 2021-03-05 | 2022-09-09 | 北京全路通信信号研究设计院集团有限公司 | Circuit board and manufacturing method thereof |
| CN115038231B (en) * | 2021-03-05 | 2024-06-11 | 北京全路通信信号研究设计院集团有限公司 | Circuit board and manufacturing method thereof |
| CN113260198A (en) * | 2021-06-02 | 2021-08-13 | 南京智能信通科技发展有限公司 | Circuit board device for communication equipment and installation method thereof |
| CN113260198B (en) * | 2021-06-02 | 2022-06-28 | 南京智能信通科技发展有限公司 | Circuit board device for communication equipment and installation method thereof |
| CN117641714A (en) * | 2023-12-13 | 2024-03-01 | 同扬光电（江苏）有限公司 | Flexible circuit board with device protection function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200804 Termination date: 20201125 |
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| CF01 | Termination of patent right due to non-payment of annual fee |