CN216491219U

CN216491219U - High-efficient radiating HDI circuit board

Info

Publication number: CN216491219U
Application number: CN202122855528.5U
Authority: CN
Inventors: 赵玲
Original assignee: Kunshan Datang Electronics Co ltd
Current assignee: Kunshan Datang Electronics Co ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-05-10
Anticipated expiration: 2031-11-22

Abstract

The utility model relates to the technical field of HDI circuit boards, and discloses an HDI circuit board with high-efficiency heat dissipation, which comprises a body, heat dissipation assemblies and control bolts, wherein a placing groove is formed in the upper surface of the body, the heat dissipation assemblies are placed in the placing groove, fixing grooves are formed in four corners of the body, the control bolts are arranged in the fixing grooves, and four groups of control bolts are respectively rotatably connected with the body.

Description

High-efficient radiating HDI circuit board

Technical Field

The utility model relates to the technical field of HDI circuit boards, in particular to an HDI circuit board capable of efficiently dissipating heat.

Background

The HDI circuit board is High Density interconnect's english abbreviation, and High Density Interconnect (HDI) is made and is the fastest field of developing in the printed circuit board trade, and current HDI circuit board thermal diffusivity is relatively poor, influences the life of HDI circuit board, and current HDI circuit board bottom stitch very easily damages to influence the practicality of HDI circuit board.

The existing HDI circuit board has the following problems: 1. the relatively poor heat dissipation of current HDI circuit board, after the produced high heat of HDI circuit board can't in time dispel the heat, just can cause the HDI circuit board to burn out, influences the life of HDI circuit board.

2. The existing HDI circuit board needs to be placed on the table plate firstly in the mounting process of the HDI circuit board, so that pins at the bottom of the HDI circuit board are extremely easy to damage, and the practicability of the HDI circuit board is influenced.

Therefore, an HDI circuit board capable of dissipating heat efficiently is designed.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides the HDI circuit board with high-efficiency heat dissipation, and solves the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a high-efficient radiating HDI circuit board, includes body, radiator unit and control bolt, the standing groove has been seted up to the body upper surface, has placed radiator unit in the standing groove, and body four corners department has all seted up the fixed slot, all is equipped with control bolt in the fixed slot of four places, and four group's control bolt rotate with the body respectively and are connected.

Further, a heat conducting plate is arranged in the placing groove and fixedly connected with the body.

Further, radiator unit includes bottom plate, heating panel and fin, has seted up the spout in the bottom plate, spout and heating panel looks gomphosis, and the heating panel upper surface is equipped with a plurality of groups of fin, and every group fin all with heating panel fixed connection.

Furthermore, four threaded holes are formed in the upper surface of the bottom plate, fixed blocks are arranged in the four threaded holes, fixing strips are arranged between two groups of fixed blocks on the same side of the bottom plate, and the two groups of fixed strips are movably connected with the four groups of fixed blocks through second fixing bolts respectively.

Furthermore, a fixing rod is inserted into the through hole formed in the radiating fin and is movably connected with the two groups of fixing strips through a first fixing bolt.

Furthermore, the control bolt includes threaded rod, baffle and handle, and the threaded rod top is equipped with the handle, handle and threaded rod fixed connection, and threaded rod side surface fixedly connected with two sets of baffles, two sets of baffles respectively with fixed slot looks gomphosis.

The utility model has the beneficial effects that: 1. the utility model discloses a, through having add radiator unit to this device, the thermal diffusivity that makes the body has obtained the promotion, and when the body during operation, the produced heat of body just can dispel the heat through radiator unit to the effectual life who promotes this device.

2. The utility model discloses a, through having add control bolt to this device, make the body can avoid body bottom stitch contact ground placing the in-process to avoid the stitch to damage, the effectual practicality that promotes this device.

Drawings

FIG. 1 is a schematic structural view of the present invention; FIG. 2 is a schematic structural view of the main body of the present invention; FIG. 3 is an exploded view of the heat sink assembly of the present invention; fig. 4 is a schematic structural view of a control bolt according to the present invention.

In the figure: 1. a body; 2. a heat dissipating component; 3. a control bolt; 4. a placement groove; 5. fixing grooves; 6. a heat conducting plate; 7. a base plate; 8. a chute; 9. a heat dissipation plate; 10. a heat sink; 11. fixing the rod; 12. a first fixing bolt; 13. a fixing strip; 14. a fixed block; 15. a second fixing bolt; 16. a threaded hole; 17. a threaded rod; 18. a baffle plate; 19. a handle.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, a high-efficient radiating HDI circuit board, including body 1, radiator unit 2 and control bolt 3, standing groove 4 has been seted up to body 1 upper surface, radiator unit 2 has been placed in standing groove 4, be equipped with heat-conducting plate 6 in the standing groove 4, heat-conducting plate 6 and body 1 fixed connection, heat-conducting plate 6 is used for the produced heat of integrated body 1, and body 1 four corners department has all seted up fixed slot 5, all is equipped with control bolt 3 in the fixed slot 5 of four places, four group's control bolt 3 rotate with body 1 respectively and are connected.

Referring to fig. 3, the heat dissipating assembly 2 includes a bottom plate 7, a heat dissipating plate 9 and heat dissipating fins 10, wherein the bottom plate 7 is provided with a sliding slot 8, the sliding slot 8 is embedded with the heat dissipating plate 9, the bottom plate 7 is used for embedding the heat dissipating plate 9, the upper surface of the heat dissipating plate 9 is provided with a plurality of sets of heat dissipating fins 10, each set of heat dissipating fins 10 is fixedly connected with the heat dissipating plate 9, the heat dissipating fins 10 can maximize the heat dissipating area of the heat dissipating plate 9, thereby improving the heat dissipation of the device, the upper surface of the bottom plate 7 is provided with four threaded holes 16, the four threaded holes 16 are internally provided with fixed blocks 14, the same side of the bottom plate 7 is provided with fixed strips 13 between two groups of fixed blocks 14, the two groups of fixed strips 13 are respectively movably connected with the four groups of fixed blocks 14 through second fixed bolts 15, the heat sink 10 is provided with a through hole in which a fixed rod 11 is inserted, the fixing rod 11 is movably connected with the two groups of fixing strips 13 through a first fixing bolt 12, and the fixing strips 13 and the fixing rod 11 are used for fixing the position of the heat dissipation plate 9.

Referring to fig. 4, the control bolt 3 includes a threaded rod 17, a baffle 18 and a handle 19, the handle 19 is disposed on the top of the threaded rod 17, the handle 19 is fixedly connected to the threaded rod 17, two sets of baffles 18 are fixedly connected to the side surface of the threaded rod 17, the two sets of baffles 18 are respectively embedded in the fixing grooves 5, and the baffles 18 can prevent the threaded rod 17 from being separated from the body 1, so that pins at the bottom of the body 1 can be always protected during the placement of the body 1.

In summary, when the device is used, in the working process of the device, heat generated by the body 1 can be conducted into the bottom plate 7 through the heat conducting plate 6, the bottom plate 7 conducts the heat into the heat dissipation plate 9, the heat dissipation plate 9 transmits the heat to the heat dissipation fins 10, at the moment, the heat dissipation fins 10 dissipate the heat in the heat dissipation plate 9, and in the working process, a worker only needs to place the body 1 on a table, and due to the arrangement of the threaded rod 17, the threaded rod 17 can enable pins at the bottom of the body 1 not to be in contact with the table, so that the pins are prevented from being damaged.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a high-efficient radiating HDI circuit board, includes body (1), radiator unit (2) and control bolt (3), its characterized in that: the heat dissipation device is characterized in that a placing groove (4) is formed in the upper surface of the body (1), a heat dissipation assembly (2) is placed in the placing groove (4), fixing grooves (5) are formed in four corners of the body (1), control bolts (3) are arranged in the fixing grooves (5), and the four groups of control bolts (3) are respectively connected with the body (1) in a rotating mode.

2. An HDI circuit board with high efficiency heat dissipation according to claim 1, characterized in that: a heat-conducting plate (6) is arranged in the placing groove (4), and the heat-conducting plate (6) is fixedly connected with the body (1).

3. An HDI circuit board with high efficiency heat dissipation according to claim 1, characterized in that: radiating component (2) include bottom plate (7), heating panel (9) and fin (10), seted up spout (8) in bottom plate (7), spout (8) and heating panel (9) gomphosis mutually, heating panel (9) upper surface is equipped with a plurality of groups fin (10), every group fin (10) all with heating panel (9) fixed connection.

4. An HDI circuit board with high heat dissipation efficiency as recited in claim 3, wherein: the upper surface of the bottom plate (7) is provided with four threaded holes (16), fixed blocks (14) are arranged in the four threaded holes (16), fixed strips (13) are arranged between two groups of fixed blocks (14) on the same side of the bottom plate (7), and the two groups of fixed strips (13) are movably connected with the four groups of fixed blocks (14) through second fixing bolts (15).

5. An HDI circuit board with high heat dissipation efficiency as recited in claim 3, wherein: the radiating fin (10) is provided with through holes, fixing rods (11) are inserted into the through holes, and the fixing rods (11) are movably connected with the two groups of fixing strips (13) through first fixing bolts (12).

6. An HDI circuit board with high efficiency heat dissipation according to claim 1, characterized in that: the control bolt (3) comprises a threaded rod (17), baffle plates (18) and a handle (19), the handle (19) is arranged at the top of the threaded rod (17), the handle (19) is fixedly connected with the threaded rod (17), two sets of baffle plates (18) are fixedly connected to the side surface of the threaded rod (17), and the two sets of baffle plates (18) are respectively embedded with the fixing grooves (5).